WO2008123433A1 - 電子材料用Ｃｕ－Ｎｉ－Ｓｉ系合金 - Google Patents

電子材料用Ｃｕ－Ｎｉ－Ｓｉ系合金 Download PDF

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Publication number
WO2008123433A1
WO2008123433A1 PCT/JP2008/056138 JP2008056138W WO2008123433A1 WO 2008123433 A1 WO2008123433 A1 WO 2008123433A1 JP 2008056138 W JP2008056138 W JP 2008056138W WO 2008123433 A1 WO2008123433 A1 WO 2008123433A1
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WO
WIPO (PCT)
Prior art keywords
mass
alloy
ratio
electronic material
based alloy
Prior art date
Application number
PCT/JP2008/056138
Other languages
English (en)
French (fr)
Inventor
Naohiko Era
Original Assignee
Nippon Mining & Metals Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining & Metals Co., Ltd. filed Critical Nippon Mining & Metals Co., Ltd.
Priority to EP08739256.9A priority Critical patent/EP2154257B1/en
Priority to US12/532,929 priority patent/US20100086435A1/en
Priority to CN2008800101895A priority patent/CN101646792B/zh
Priority to JP2009509224A priority patent/JP4418028B2/ja
Publication of WO2008123433A1 publication Critical patent/WO2008123433A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/02—Single bars, rods, wires, or strips

Abstract

　本発明の課題は、Ｃｕ－Ｎｉ－Ｓｉ系合金においてＣｒ添加の効果をより良く発揮させることで飛躍的に特性の向上即ち、高強度・高導電性のコルソン系合金を提供することである。 　Ｎｉ：１．０～４．５質量％、Ｓｉ：０．５０～１．２質量％、Ｃｒ：０．００３０～０．３質量％を含有し（但し、ＮｉとＳｉの重量比が３≦Ｎｉ／Ｓｉ≦５．５である。）、残部Ｃｕおよび不可避的不純物から構成される銅合金であって、材料中に分散する大きさが０．１μｍ以上５μｍ以下のＣｒ－Ｓｉ化合物について、その分散粒子中のＳｉに対するＣｒの原子濃度比が１～５であって、その分散密度が１×１０6個／ｍｍ2以下である電子材料用銅合金。
PCT/JP2008/056138 2007-03-30 2008-03-28 電子材料用Ｃｕ－Ｎｉ－Ｓｉ系合金 WO2008123433A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP08739256.9A EP2154257B1 (en) 2007-03-30 2008-03-28 Cu-ni-si-based alloy for electronic material
US12/532,929 US20100086435A1 (en) 2007-03-30 2008-03-28 Cu-Ni-Si SYSTEM ALLOY FOR ELECTRONIC MATERIALS
CN2008800101895A CN101646792B (zh) 2007-03-30 2008-03-28 电子材料用Cu-Ni-Si系合金
JP2009509224A JP4418028B2 (ja) 2007-03-30 2008-03-28 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系合金

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007094441 2007-03-30
JP2007-094441 2007-03-30

Publications (1)

Publication Number Publication Date
WO2008123433A1 true WO2008123433A1 (ja) 2008-10-16

Family

ID=39830918

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056138 WO2008123433A1 (ja) 2007-03-30 2008-03-28 電子材料用Ｃｕ－Ｎｉ－Ｓｉ系合金

Country Status (7)

Country Link
US (1) US20100086435A1 (ja)
EP (1) EP2154257B1 (ja)
JP (1) JP4418028B2 (ja)
KR (1) KR101211984B1 (ja)
CN (1) CN101646792B (ja)
TW (1) TWI395824B (ja)
WO (1) WO2008123433A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110017357A1 (en) * 2008-03-31 2011-01-27 Koji Sato Copper alloy material for electrical/electronic equipments, and electrical/electronic part
US20110017358A1 (en) * 2008-03-31 2011-01-27 Koji Sato Copper alloy material for electrical/electronic equipments, and electrical/electronic part
JP2012201958A (ja) * 2011-03-28 2012-10-22 Mitsubishi Shindoh Co Ltd 耐応力緩和特性と曲げ加工後の耐疲労特性およびばね特性に優れたＣｕ−Ｎｉ−Ｓｉ系銅合金板およびその製造方法
JP2015158009A (ja) * 2014-01-27 2015-09-03 古河電気工業株式会社 銅合金材およびその製造方法

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011068134A1 (ja) * 2009-12-02 2011-06-09 古河電気工業株式会社 低ヤング率を有する銅合金板材およびその製造法
WO2011125153A1 (ja) * 2010-04-02 2011-10-13 Jx日鉱日石金属株式会社 電子材料用Ｃｕ－Ｎｉ－Ｓｉ系合金
JP5045784B2 (ja) * 2010-05-14 2012-10-10 三菱マテリアル株式会社 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材
JP5714863B2 (ja) 2010-10-14 2015-05-07 矢崎総業株式会社 雌端子および雌端子の製造方法
JP5712585B2 (ja) * 2010-12-03 2015-05-07 三菱マテリアル株式会社 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材
US9159985B2 (en) * 2011-05-27 2015-10-13 Ostuka Techno Corporation Circuit breaker and battery pack including the same
JP5903842B2 (ja) 2011-11-14 2016-04-13 三菱マテリアル株式会社 銅合金、銅合金塑性加工材及び銅合金塑性加工材の製造方法
KR101274063B1 (ko) * 2013-01-22 2013-06-12 한국기계연구원 배향된 석출물을 가지는 금속복합재료 및 이의 제조방법
KR101709560B1 (ko) * 2013-09-27 2017-02-23 주식회사 엘지화학 낮은 저항의 전극 탭을 포함하는 이차전지
CN105385890A (zh) * 2015-11-27 2016-03-09 宁波博威合金材料股份有限公司 一种含镍、硅的青铜合金及其应用
CN105821238B (zh) * 2016-05-31 2018-01-02 黄河科技学院 一种铜合金材料及其制备方法
CN106191725B (zh) * 2016-06-24 2018-01-26 河南江河机械有限责任公司 高强度高导电铜合金纳米相析出工艺方法
CN108193080B (zh) * 2016-12-08 2019-12-17 北京有色金属研究总院 高强度、高导电耐应力松弛铜镍硅合金材料及其制备方法
CN109609801A (zh) * 2018-12-06 2019-04-12 宁波博威合金材料股份有限公司 高性能铜合金及其制备方法
CN115386766A (zh) * 2022-08-11 2022-11-25 中国科学院金属研究所 一种Cu-Ni-Si-Cr-Mg五元铜合金及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0349137B2 (ja) 1984-11-09 1991-07-26 Sanyo Electric Co
JPH0718356A (ja) * 1993-07-01 1995-01-20 Mitsubishi Electric Corp 電子機器用銅合金、その製造方法およびｉｃリードフレーム
JP2862942B2 (ja) 1990-03-20 1999-03-03 古河電気工業株式会社 コルソン合金の熱処理方法
JP2001207229A (ja) 2000-01-27 2001-07-31 Nippon Mining & Metals Co Ltd 電子材料用銅合金
JP2005113180A (ja) 2003-10-06 2005-04-28 Furukawa Electric Co Ltd:The 電子機器用銅合金とその製造方法
JP2005350696A (ja) * 2004-06-08 2005-12-22 Hitachi Cable Ltd 端子・コネクタ用銅合金の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3049137B2 (ja) * 1991-12-27 2000-06-05 株式会社神戸製鋼所 曲げ加工性が優れた高力銅合金及びその製造方法
CN101166840B (zh) * 2005-02-28 2012-07-18 古河电气工业株式会社 铜合金
CN1776997B (zh) * 2005-12-13 2010-05-05 江苏科技大学 大容量汽轮发电机转子铜合金槽楔及其制备方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0349137B2 (ja) 1984-11-09 1991-07-26 Sanyo Electric Co
JP2862942B2 (ja) 1990-03-20 1999-03-03 古河電気工業株式会社 コルソン合金の熱処理方法
JPH0718356A (ja) * 1993-07-01 1995-01-20 Mitsubishi Electric Corp 電子機器用銅合金、その製造方法およびｉｃリードフレーム
JP2001207229A (ja) 2000-01-27 2001-07-31 Nippon Mining & Metals Co Ltd 電子材料用銅合金
JP2005113180A (ja) 2003-10-06 2005-04-28 Furukawa Electric Co Ltd:The 電子機器用銅合金とその製造方法
JP2005350696A (ja) * 2004-06-08 2005-12-22 Hitachi Cable Ltd 端子・コネクタ用銅合金の製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2154257A4 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110017357A1 (en) * 2008-03-31 2011-01-27 Koji Sato Copper alloy material for electrical/electronic equipments, and electrical/electronic part
US20110017358A1 (en) * 2008-03-31 2011-01-27 Koji Sato Copper alloy material for electrical/electronic equipments, and electrical/electronic part
JP2012201958A (ja) * 2011-03-28 2012-10-22 Mitsubishi Shindoh Co Ltd 耐応力緩和特性と曲げ加工後の耐疲労特性およびばね特性に優れたＣｕ−Ｎｉ−Ｓｉ系銅合金板およびその製造方法
JP2015158009A (ja) * 2014-01-27 2015-09-03 古河電気工業株式会社 銅合金材およびその製造方法

Also Published As

Publication number Publication date
TWI395824B (zh) 2013-05-11
EP2154257A1 (en) 2010-02-17
KR101211984B1 (ko) 2012-12-13
TW200902732A (en) 2009-01-16
EP2154257B1 (en) 2016-10-05
US20100086435A1 (en) 2010-04-08
JPWO2008123433A1 (ja) 2010-07-15
CN101646792B (zh) 2012-02-22
JP4418028B2 (ja) 2010-02-17
EP2154257A4 (en) 2012-01-11
KR20090123017A (ko) 2009-12-01
CN101646792A (zh) 2010-02-10

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