WO2006106939A8 - 電子材料用Ｃｕ－Ｎｉ－Ｓｉ－Ｃｏ－Ｃｒ系銅合金及びその製造方法 - Google Patents

電子材料用Ｃｕ－Ｎｉ－Ｓｉ－Ｃｏ－Ｃｒ系銅合金及びその製造方法 Download PDF

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Publication number
WO2006106939A8
WO2006106939A8 PCT/JP2006/306876 JP2006306876W WO2006106939A8 WO 2006106939 A8 WO2006106939 A8 WO 2006106939A8 JP 2006306876 W JP2006306876 W JP 2006306876W WO 2006106939 A8 WO2006106939 A8 WO 2006106939A8
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WO
WIPO (PCT)
Prior art keywords
copper alloy
based copper
electronic material
formula
mass
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Application number
PCT/JP2006/306876
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English (en)
French (fr)
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WO2006106939A1 (ja
Inventor
尚彦 江良
深町　一彦
寛 桑垣
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日鉱金属株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日鉱金属株式会社 filed Critical 日鉱金属株式会社
Priority to US11/887,660 priority Critical patent/US8070893B2/en
Priority to AU2006231980A priority patent/AU2006231980B2/en
Priority to EP06730824A priority patent/EP1876250B1/en
Priority to CA2602529A priority patent/CA2602529C/en
Publication of WO2006106939A1 publication Critical patent/WO2006106939A1/ja
Publication of WO2006106939A8 publication Critical patent/WO2006106939A8/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)

Abstract

強度と導電率を飛躍的に向上させた、優れた特性を有する電子材料用Ｃｕ－Ｎｉ－Ｓｉ－Ｃｏ－Ｃｒ系銅合金を提供する。Ｎｉ：約０．５～約２．５質量％、Ｃｏ：約０．５～約２．５質量％、及びＳｉ：約０．３０～約１．２質量％、Ｃｒ：約０．０９～約０．５質量％を含有し、残部Ｃｕおよび不可避的不純物から構成される銅合金において、該合金組成中のＮｉとＣｏの合計量のＳｉに対する質量濃度比が約４≦［Ｎｉ＋Ｃｏ］／Ｓｉ≦約５、該合金組成中のＮｉとＣｏの質量濃度比が約０．５≦Ｎｉ／Ｃｏ≦約２であり、材料中に分散する大きさが１μｍ以上の介在物の個数（Ｐ）、そのうち、含有炭素濃度が１０質量％以上である介在物の個数（Ｐｃ）について、Ｐｃが約１５個／１０００μｍ2以下または、その比がＰｃ／Ｐ≦約０．３以下であることを特徴とする電子材料用Ｃｕ－Ｎｉ－Ｓｉ－Ｃｏ－Ｃｒ系銅合金。
PCT/JP2006/306876 2005-03-31 2006-03-31 電子材料用Ｃｕ－Ｎｉ－Ｓｉ－Ｃｏ－Ｃｒ系銅合金及びその製造方法 WO2006106939A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US11/887,660 US8070893B2 (en) 2005-03-31 2006-03-31 Cu—Ni—Si—Co—Cr copper alloy for electronic materials and method for manufacturing same
AU2006231980A AU2006231980B2 (en) 2005-03-31 2006-03-31 Cu-Ni-Si-Co-Cr based copper alloy for electronic material and method for production thereof
EP06730824A EP1876250B1 (en) 2005-03-31 2006-03-31 Cu-Ni-Si-Co-Cr BASED COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD FOR PRODUCTION THEREOF
CA2602529A CA2602529C (en) 2005-03-31 2006-03-31 Cu-ni-si-co-cr based copper alloy for electronic material and method for production thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005104474A JP4068626B2 (ja) 2005-03-31 2005-03-31 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ−Ｃｒ系銅合金及びその製造方法
JP2005-104474 2005-03-31

Publications (2)

Publication Number Publication Date
WO2006106939A1 WO2006106939A1 (ja) 2006-10-12
WO2006106939A8 true WO2006106939A8 (ja) 2009-08-27

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/306876 WO2006106939A1 (ja) 2005-03-31 2006-03-31 電子材料用Ｃｕ－Ｎｉ－Ｓｉ－Ｃｏ－Ｃｒ系銅合金及びその製造方法

Country Status (9)

Country Link
US (1) US8070893B2 (ja)
EP (1) EP1876250B1 (ja)
JP (1) JP4068626B2 (ja)
KR (1) KR100968717B1 (ja)
CN (1) CN100564559C (ja)
AU (1) AU2006231980B2 (ja)
CA (1) CA2602529C (ja)
RU (1) RU2375483C2 (ja)
WO (1) WO2006106939A1 (ja)

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JP4886463B2 (ja) 2006-10-20 2012-02-29 キヤノン株式会社 通信パラメータ設定方法、通信装置及び通信パラメータを管理する管理装置
JP4937815B2 (ja) 2007-03-30 2012-05-23 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
EP2194151B1 (en) * 2007-09-28 2014-08-13 JX Nippon Mining & Metals Corporation Cu-ni-si-co-base copper alloy for electronic material and process for producing the copper alloy
WO2009057697A1 (ja) * 2007-11-01 2009-05-07 The Furukawa Electric Co., Ltd. 電子機器用導体線材およびそれを用いた配線用電線
EP2248921A4 (en) * 2008-01-31 2011-03-16 Furukawa Electric Co Ltd COPPER ALLOY MATERIAL FOR ELECTRICAL / ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING COPPER ALLOY MATERIAL
JP5065478B2 (ja) * 2008-03-21 2012-10-31 古河電気工業株式会社 電気電子部品用銅合金材および製造方法
JP4440313B2 (ja) * 2008-03-31 2010-03-24 日鉱金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ−Ｃｒ系合金
JP4596490B2 (ja) * 2008-03-31 2010-12-08 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
JP5079574B2 (ja) * 2008-03-31 2012-11-21 Ｊｘ日鉱日石金属株式会社 熱間加工性に優れた高強度高導電性銅合金
EP2333127A4 (en) * 2008-08-05 2012-07-04 Furukawa Electric Co Ltd COPPER ALLOY MATERIAL FOR AN ELECTRICAL / ELECTRONIC COMPONENT
CN102112640B (zh) * 2008-08-05 2013-03-27 古河电气工业株式会社 电气/电子部件用铜合金材料的制造方法
JP2010222618A (ja) * 2009-03-23 2010-10-07 Nippon Mining & Metals Co Ltd Ｃｕ−Ｎｉ−Ｓｉ系銅合金圧延板及びそれを用いた電気部品
CN102549180A (zh) * 2009-09-28 2012-07-04 Jx日矿日石金属株式会社 电子材料用Cu－Ni－Si－Co系铜合金和其制造方法
TWI391952B (zh) * 2009-09-29 2013-04-01 Jx Nippon Mining & Metals Corp Cu-Ni-Si-Co based copper alloy for electronic materials and its manufacturing method
JP4677505B1 (ja) * 2010-03-31 2011-04-27 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
JP5451674B2 (ja) 2011-03-28 2014-03-26 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
JP4799701B1 (ja) 2011-03-29 2011-10-26 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金条及びその製造方法
JP5802150B2 (ja) * 2012-02-24 2015-10-28 株式会社神戸製鋼所 銅合金
CN102628119B (zh) * 2012-04-27 2013-06-19 常熟市兄弟玻璃模具有限公司 低镍高铁铜合金玻璃模具及其制造方法
JP6147351B2 (ja) * 2012-10-10 2017-06-14 ケイエムイー・ジャーマニー・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング・ウント・コンパニー・コマンデイトゲゼルシャフト 電気コンタクト部材のための材料
CN105400984A (zh) * 2015-11-13 2016-03-16 太仓荣中机电科技有限公司 一种性能均衡的电子合金材料
DE102016002604A1 (de) * 2016-03-03 2017-09-07 Wieland-Werke Ag Zinnhaltige Kupferlegierung, Verfahren zu deren Herstellung sowie deren Verwendung
JP6355671B2 (ja) * 2016-03-31 2018-07-11 Ｊｘ金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系銅合金条及びその製造方法
CN108193080B (zh) * 2016-12-08 2019-12-17 北京有色金属研究总院 高强度、高导电耐应力松弛铜镍硅合金材料及其制备方法
CN107326215A (zh) * 2017-08-15 2017-11-07 徐高杰 一种槽楔用铜合金的加工方法
CN111057971A (zh) * 2019-12-23 2020-04-24 深圳金斯达应用材料有限公司 一种微合金高精度铜合金电子材料及其制备方法
US11649527B2 (en) 2021-01-19 2023-05-16 Robert Bosch Gmbh Metal alloys for hydraulic applications
CN115198140A (zh) * 2021-04-13 2022-10-18 美的集团股份有限公司 一种铜合金及其应用

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Also Published As

Publication number Publication date
WO2006106939A1 (ja) 2006-10-12
AU2006231980B2 (en) 2009-06-04
EP1876250A4 (en) 2008-07-23
KR20070112868A (ko) 2007-11-27
AU2006231980A1 (en) 2006-10-12
EP1876250A1 (en) 2008-01-09
US8070893B2 (en) 2011-12-06
EP1876250B1 (en) 2012-05-23
CA2602529C (en) 2011-03-29
RU2375483C2 (ru) 2009-12-10
CN101151385A (zh) 2008-03-26
US20090025840A1 (en) 2009-01-29
CA2602529A1 (en) 2006-10-12
RU2007140308A (ru) 2009-05-10
JP4068626B2 (ja) 2008-03-26
JP2006283120A (ja) 2006-10-19
CN100564559C (zh) 2009-12-02
KR100968717B1 (ko) 2010-07-08

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