TW200706662A - Cu-Ni-Si-Zn-Sn based alloy strip excellent in thermal peeling resistance of Tin plating, and Tin plated strip thereof - Google Patents

Cu-Ni-Si-Zn-Sn based alloy strip excellent in thermal peeling resistance of Tin plating, and Tin plated strip thereof

Info

Publication number
TW200706662A
TW200706662A TW095110265A TW95110265A TW200706662A TW 200706662 A TW200706662 A TW 200706662A TW 095110265 A TW095110265 A TW 095110265A TW 95110265 A TW95110265 A TW 95110265A TW 200706662 A TW200706662 A TW 200706662A
Authority
TW
Taiwan
Prior art keywords
tin
strip
based alloy
peeling resistance
mass
Prior art date
Application number
TW095110265A
Other languages
Chinese (zh)
Other versions
TWI323287B (en
Inventor
Takaaki Hatano
Original Assignee
Nippon Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co filed Critical Nippon Mining Co
Publication of TW200706662A publication Critical patent/TW200706662A/en
Application granted granted Critical
Publication of TWI323287B publication Critical patent/TWI323287B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment

Abstract

To provide a Cu-Ni-Si-Zn-Sn based alloy strip improved in the thermal peeling resistance of tin plating, and to provide a tin plated strip thereof. The copper alloy strip contains, by mass, Ni of 1.0 to 4.5%, Si of 1/6 to 1/4 to the mass% of Ni, Zn of 0.1 to 2.0% and Sn of 0.05 to 2.0% Sn, and, if required, comprising one or more kinds selected from Ag, Cr, Co, Mn and Mo by 0.01 to 0.5% in total, wherein the total of P, As, Sb and Bi concentrations is regulated to be below 100 mass ppm, the total of Ca and Mg concentrations is regulated to be below 100 mass ppm, O and S concentrations are regulated to be below15 mass ppm, respectively, and further, its electric conductivity EC (%LACS) is controlled to the range in the following inequality: 50< EC+(22×[%Sn]+4.5×[%Zn])< 60 ([%I] represents the mass% concentration of the element I).
TW095110265A 2005-03-29 2006-03-24 Cu-Ni-Si-Zn-Sn based alloy strip excellent in thermal peeling resistance of Tin plating, and Tin plated strip thereof TW200706662A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005096487 2005-03-29

Publications (2)

Publication Number Publication Date
TW200706662A true TW200706662A (en) 2007-02-16
TWI323287B TWI323287B (en) 2010-04-11

Family

ID=37030538

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095110265A TW200706662A (en) 2005-03-29 2006-03-24 Cu-Ni-Si-Zn-Sn based alloy strip excellent in thermal peeling resistance of Tin plating, and Tin plated strip thereof

Country Status (3)

Country Link
KR (1) KR100774226B1 (en)
CN (1) CN100576366C (en)
TW (1) TW200706662A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI505900B (en) * 2012-06-19 2015-11-01 Murata Manufacturing Co Joint member
TWI561688B (en) * 2011-08-12 2016-12-11 Mitsubishi Materials Corp

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8698002B2 (en) * 2009-01-20 2014-04-15 Mitsubishi Shindoh Co., Ltd. Conductive member and method for producing the same
WO2011039875A1 (en) 2009-09-30 2011-04-07 Jx日鉱日石金属株式会社 Tin-plated cu-ni-si-based alloy strip having excellent resistance to heat separation of the tin-plating
CN103014409B (en) * 2011-09-21 2016-04-06 三菱伸铜株式会社 The Cu-Ni-Si series copper alloy of projection welding excellent and manufacture method thereof
CN105112715B (en) * 2015-09-08 2017-10-20 长沙中工新材料有限公司 The method that CuZnNiSi alloys and preparation method thereof and the alloy prepare band
CN105695797A (en) * 2016-04-20 2016-06-22 苏州市相城区明达复合材料厂 Bronze alloy for casting parts
DE102016008753B4 (en) * 2016-07-18 2020-03-12 Wieland-Werke Ag Copper-nickel-tin alloy, process for their production and their use
KR101900793B1 (en) * 2017-06-08 2018-09-20 주식회사 풍산 A method for tin plating copper alloy for electrical and electronic and car components, and tin plated copper alloy therefrom
CN115233131A (en) * 2022-06-17 2022-10-25 武汉凌云光电科技有限责任公司 Method for laser cladding and polishing after immersion tin plating of nonferrous metal

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0830235B2 (en) * 1991-04-24 1996-03-27 日鉱金属株式会社 Copper alloy for conductive spring
JP3391427B2 (en) * 1996-05-14 2003-03-31 三菱伸銅株式会社 Plated copper alloy sheet and connector manufactured from the sheet

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI561688B (en) * 2011-08-12 2016-12-11 Mitsubishi Materials Corp
TWI505900B (en) * 2012-06-19 2015-11-01 Murata Manufacturing Co Joint member

Also Published As

Publication number Publication date
CN1841570A (en) 2006-10-04
CN100576366C (en) 2009-12-30
TWI323287B (en) 2010-04-11
KR100774226B1 (en) 2007-11-07
KR20060105509A (en) 2006-10-11

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