TW200704790A - Sn-plated strip of cu-ni-si-zn-based alloy - Google Patents

Sn-plated strip of cu-ni-si-zn-based alloy

Info

Publication number
TW200704790A
TW200704790A TW095110264A TW95110264A TW200704790A TW 200704790 A TW200704790 A TW 200704790A TW 095110264 A TW095110264 A TW 095110264A TW 95110264 A TW95110264 A TW 95110264A TW 200704790 A TW200704790 A TW 200704790A
Authority
TW
Taiwan
Prior art keywords
mass
phase
less
based alloy
controlled
Prior art date
Application number
TW095110264A
Other languages
Chinese (zh)
Other versions
TWI363099B (en
Inventor
Takaaki Hatano
Original Assignee
Nippon Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co filed Critical Nippon Mining Co
Publication of TW200704790A publication Critical patent/TW200704790A/en
Application granted granted Critical
Publication of TWI363099B publication Critical patent/TWI363099B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment

Abstract

To improve the heat resistance of a Sn-plated strip of a Cu-Ni-Si-Zn-based alloy without increasing a manufacturing cost. A base metal of the Sn-plated strip is a copper-based alloy including 1.0-4.5 mass% Ni, 1/6 to 1/4 Si with respect to mass% of Ni, 0.1-2.0 mass% Zn, and further 0.1-2.0 mass% Sn, as needed. The Sn-plated strip employs the copper-based alloy as the base metal, and has a plated film composed of respective layers of a Sn phase, a Sn-Cu alloy phase and a Cu phase from the surface toward the base metal. The thickness of the Sn phase is controlled to 0.1 to 1.5 mum, the thickness of the Sn-Cu alloy phase to 0.1 to 1.5 mum, and the thickness of the Cu phase to 0.8 mum or less. The concentrations of Si and Zn on the Sn phase surface are controlled to 1.0 mass% or less and 3.0 mass% or less respectively. Furthermore, a C concentration in an interface between the plated layer and the base metal is controlled to 0.1 mass% or less, and an O concentration is controlled to 1 mass% or less, as needed.
TW095110264A 2005-03-29 2006-03-24 Sn-plated strip of cu-ni-si-zn-based alloy TW200704790A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005096475 2005-03-29

Publications (2)

Publication Number Publication Date
TW200704790A true TW200704790A (en) 2007-02-01
TWI363099B TWI363099B (en) 2012-05-01

Family

ID=37029910

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095110264A TW200704790A (en) 2005-03-29 2006-03-24 Sn-plated strip of cu-ni-si-zn-based alloy

Country Status (3)

Country Link
KR (1) KR100774225B1 (en)
CN (1) CN1840718B (en)
TW (1) TW200704790A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4402132B2 (en) * 2007-05-18 2010-01-20 日鉱金属株式会社 Reflow Sn plating material and electronic component using the same
KR101245911B1 (en) * 2008-05-30 2013-03-20 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 Sn OR Sn ALLOY PLATED FILM, COMPOSITE MATERIAL HAVING SAME AND COMPOSITE MATERIAL PRODUCTION METHOD
KR101356258B1 (en) 2009-09-30 2014-01-28 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 Tin-plated cu-ni-si-based alloy strip having excellent resistance to heat separation of the tin-plating
CN101784165B (en) * 2010-03-19 2014-11-05 中兴通讯股份有限公司 Treatment method of corrosion-resistant weldable coating layer of printed circuit board
JP5281031B2 (en) * 2010-03-31 2013-09-04 Ｊｘ日鉱日石金属株式会社 Cu-Ni-Si alloy with excellent bending workability

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0830235B2 (en) * 1991-04-24 1996-03-27 日鉱金属株式会社 Copper alloy for conductive spring
JP3728776B2 (en) * 1995-08-10 2005-12-21 三菱伸銅株式会社 High-strength copper alloy that does not generate smut during plating pretreatment process
JP3391427B2 (en) * 1996-05-14 2003-03-31 三菱伸銅株式会社 Plated copper alloy sheet and connector manufactured from the sheet
DE10025106A1 (en) * 2000-05-20 2001-11-22 Stolberger Metallwerke Gmbh Electrically conductive metal tape and connectors from it
JP4112426B2 (en) * 2003-05-14 2008-07-02 三菱伸銅株式会社 Method for manufacturing plating material

Also Published As

Publication number Publication date
TWI363099B (en) 2012-05-01
CN1840718A (en) 2006-10-04
KR100774225B1 (en) 2007-11-07
CN1840718B (en) 2011-04-27
KR20060105477A (en) 2006-10-11

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