EP2695958A3 - Copper alloy sheet - Google Patents
Copper alloy sheet Download PDFInfo
- Publication number
- EP2695958A3 EP2695958A3 EP13005149.3A EP13005149A EP2695958A3 EP 2695958 A3 EP2695958 A3 EP 2695958A3 EP 13005149 A EP13005149 A EP 13005149A EP 2695958 A3 EP2695958 A3 EP 2695958A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- copper alloy
- alloy sheet
- stress relaxation
- resistance characteristic
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title abstract 3
- 229910009038 Sn—P Inorganic materials 0.000 abstract 2
- 238000002441 X-ray diffraction Methods 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 238000005096 rolling process Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/10—Sockets for co-operation with pins or blades
- H01R13/11—Resilient sockets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007205630A JP4324627B2 (en) | 2007-08-07 | 2007-08-07 | Copper alloy sheet with excellent strength-ductility balance |
JP2007232641A JP4210703B1 (en) | 2007-09-07 | 2007-09-07 | Copper alloy sheet with excellent stress relaxation resistance and bending workability |
JP2007252036A JP4210705B1 (en) | 2007-09-27 | 2007-09-27 | Copper alloy sheet with excellent stress relaxation resistance and press punchability |
JP2007252037A JP4210706B1 (en) | 2007-09-27 | 2007-09-27 | Copper alloy sheet with excellent stress relaxation resistance |
EP08791572.4A EP2184371B1 (en) | 2007-08-07 | 2008-07-24 | Copper alloy sheet |
PCT/JP2008/063320 WO2009019990A1 (en) | 2007-08-07 | 2008-07-24 | Copper alloy sheet |
Related Parent Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP08791572.4A Division-Into EP2184371B1 (en) | 2007-08-07 | 2008-07-24 | Copper alloy sheet |
EP08791572.4A Division EP2184371B1 (en) | 2007-08-07 | 2008-07-24 | Copper alloy sheet |
Publications (3)
Publication Number | Publication Date |
---|---|
EP2695958A2 EP2695958A2 (en) | 2014-02-12 |
EP2695958A3 true EP2695958A3 (en) | 2014-07-02 |
EP2695958B1 EP2695958B1 (en) | 2018-12-26 |
Family
ID=40341225
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP13005147.7A Active EP2695956B1 (en) | 2007-08-07 | 2008-07-24 | Copper alloy sheet |
EP08791572.4A Active EP2184371B1 (en) | 2007-08-07 | 2008-07-24 | Copper alloy sheet |
EP13005148.5A Active EP2695957B1 (en) | 2007-08-07 | 2008-07-24 | Copper alloy sheet |
EP13005149.3A Active EP2695958B1 (en) | 2007-08-07 | 2008-07-24 | Copper alloy sheet |
Family Applications Before (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP13005147.7A Active EP2695956B1 (en) | 2007-08-07 | 2008-07-24 | Copper alloy sheet |
EP08791572.4A Active EP2184371B1 (en) | 2007-08-07 | 2008-07-24 | Copper alloy sheet |
EP13005148.5A Active EP2695957B1 (en) | 2007-08-07 | 2008-07-24 | Copper alloy sheet |
Country Status (5)
Country | Link |
---|---|
US (1) | US20110223056A1 (en) |
EP (4) | EP2695956B1 (en) |
KR (1) | KR101227315B1 (en) |
CN (1) | CN101743333A (en) |
WO (1) | WO2009019990A1 (en) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4615628B2 (en) * | 2008-10-22 | 2011-01-19 | 古河電気工業株式会社 | Copper alloy material, electrical and electronic component, and method for producing copper alloy material |
CN101440445B (en) | 2008-12-23 | 2010-07-07 | 路达(厦门)工业有限公司 | Leadless free-cutting aluminum yellow brass alloy and manufacturing method thereof |
JP4831258B2 (en) * | 2010-03-18 | 2011-12-07 | 三菱マテリアル株式会社 | Sputtering target and manufacturing method thereof |
JP5714863B2 (en) * | 2010-10-14 | 2015-05-07 | 矢崎総業株式会社 | Female terminal and method for manufacturing female terminal |
KR20140025607A (en) * | 2011-08-04 | 2014-03-04 | 가부시키가이샤 고베 세이코쇼 | Copper alloy |
JP5117604B1 (en) * | 2011-08-29 | 2013-01-16 | Jx日鉱日石金属株式会社 | Cu-Ni-Si alloy and method for producing the same |
JP5126436B1 (en) * | 2012-02-17 | 2013-01-23 | 日立電線株式会社 | Rolled copper foil |
US9002499B2 (en) * | 2012-03-20 | 2015-04-07 | GM Global Technology Operations LLC | Methods for determining a recovery state of a metal alloy |
JP5470483B1 (en) * | 2012-10-22 | 2014-04-16 | Jx日鉱日石金属株式会社 | Copper alloy sheet with excellent conductivity and stress relaxation properties |
JP5417523B1 (en) * | 2012-12-28 | 2014-02-19 | 三菱マテリアル株式会社 | Copper alloy for electronic and electrical equipment, copper alloy sheet for electronic and electrical equipment, conductive parts and terminals for electronic and electrical equipment |
KR101274063B1 (en) * | 2013-01-22 | 2013-06-12 | 한국기계연구원 | A metal matrix composite with two-way shape precipitation and method for manufacturing thereof |
JP5417539B1 (en) * | 2013-01-28 | 2014-02-19 | 三菱マテリアル株式会社 | Copper alloy for electronic and electrical equipment, copper alloy sheet for electronic and electrical equipment, conductive parts and terminals for electronic and electrical equipment |
JP5604549B2 (en) * | 2013-03-18 | 2014-10-08 | 三菱マテリアル株式会社 | Copper alloy for electronic and electrical equipment, copper alloy sheet for electronic and electrical equipment, conductive parts and terminals for electronic and electrical equipment |
JP5501495B1 (en) * | 2013-03-18 | 2014-05-21 | 三菱マテリアル株式会社 | Copper alloy for electronic and electrical equipment, copper alloy sheet for electronic and electrical equipment, conductive parts and terminals for electronic and electrical equipment |
CN103421983B (en) * | 2013-08-23 | 2015-08-19 | 苏州长盛机电有限公司 | A kind of preparation method of pack fong |
CN103526070A (en) * | 2013-09-29 | 2014-01-22 | 苏州市凯业金属制品有限公司 | Silicon bronze alloy metal tube |
JP6050738B2 (en) * | 2013-11-25 | 2016-12-21 | Jx金属株式会社 | Copper alloy sheet with excellent conductivity, moldability and stress relaxation properties |
CN104046813B (en) * | 2014-06-05 | 2016-06-29 | 锐展(铜陵)科技有限公司 | A kind of preparation method of automobile electric wire cable copper alloy with high strength and high conductivity line |
DE102015221859A1 (en) * | 2014-11-06 | 2016-05-12 | Hirschmann Car Communication Gmbh | Contact pin made of copper wire |
WO2016171054A1 (en) * | 2015-04-24 | 2016-10-27 | 古河電気工業株式会社 | Copper alloy sheet material, and method for producing same |
CN104928528A (en) * | 2015-07-06 | 2015-09-23 | 苏州科茂电子材料科技有限公司 | Conductive copper alloy material and preparing method thereof |
CN105063418B (en) * | 2015-07-24 | 2017-04-26 | 宁波金田铜业(集团)股份有限公司 | Preparation method of low-alloying copper belt |
CN105400989A (en) * | 2015-11-13 | 2016-03-16 | 太仓荣中机电科技有限公司 | Electronic alloy material containing rare earth elements |
KR101627696B1 (en) * | 2015-12-28 | 2016-06-07 | 주식회사 풍산 | Copper alloy material for car and electrical and electronic components and process for producing same |
CN107046763B (en) * | 2016-02-05 | 2019-12-24 | Jx金属株式会社 | Copper foil for flexible printed board and copper-clad laminate using same |
CN106987739B (en) * | 2017-04-05 | 2018-10-26 | 浙江大学 | Copper alloy and preparation method thereof for high ferro contact line |
CN107723499A (en) * | 2017-09-20 | 2018-02-23 | 宁波兴敖达金属新材料有限公司 | The tellurium silver chromium-bronze material of lead-free free-cutting high-strength high-plasticity high conductivity |
JP6648088B2 (en) | 2017-10-19 | 2020-02-14 | Jx金属株式会社 | Rolled copper foil for negative electrode current collector of secondary battery, secondary battery negative electrode and secondary battery using the same, and method of producing rolled copper foil for negative electrode current collector of secondary battery |
EP3531510B1 (en) * | 2018-02-23 | 2023-01-04 | Borgwarner Inc. | Contact assembly for high-current applications |
CN109022900B (en) * | 2018-08-17 | 2020-05-08 | 宁波博威合金材料股份有限公司 | Copper alloy with excellent comprehensive performance and application thereof |
EP3878024A1 (en) * | 2018-11-06 | 2021-09-15 | Lisa Dräxlmaier GmbH | Cell connector for electric-conductively connecting round cells of a battery for a motor vehicle, and method for producing a battery for a motor vehicle |
CN110066942B (en) * | 2019-04-28 | 2020-12-29 | 中南大学 | Ultrahigh-strength high-toughness high-conductivity copper-nickel-tin alloy and preparation method thereof |
CN110306077B (en) * | 2019-07-24 | 2021-12-03 | 宁波兴业盛泰集团有限公司 | Corrosion-resistant copper alloy for electric connector and preparation method thereof |
CN110885937B (en) * | 2019-12-19 | 2021-04-13 | 福州大学 | Cu-Ti-Ge-Ni-X copper alloy material and preparation method thereof |
CN114318055B (en) * | 2022-01-07 | 2022-12-09 | 江西省科学院应用物理研究所 | High-strength, high-conductivity and high-toughness copper alloy and preparation method thereof |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0859065A1 (en) * | 1997-02-18 | 1998-08-19 | Dowa Mining Co., Ltd. | Copper base alloys and terminals using the same |
JP2001262255A (en) * | 2000-03-17 | 2001-09-26 | Sumitomo Metal Mining Co Ltd | Copper based alloy bar for terminal and its producing method |
US20020108685A1 (en) * | 2000-12-18 | 2002-08-15 | Dowa Mining Co., Ltd. | Copper-base alloys having improved punching properties on press and a process for producing them |
US20050092404A1 (en) * | 2003-11-05 | 2005-05-05 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Softening-resistant copper alloy and method of forming sheet of the same |
EP1612285A1 (en) * | 2004-07-01 | 2006-01-04 | Dowa Mining Co., Ltd. | Copper-based alloy and method of manufacturing the same |
EP1630239A1 (en) * | 2004-08-30 | 2006-03-01 | Dowa Mining Co., Ltd. | Copper alloy and method of manufacturing the same |
JP2006213999A (en) * | 2005-02-07 | 2006-08-17 | Kobe Steel Ltd | Method for producing copper alloy sheet having excellent stress relaxation resistance |
WO2006132317A1 (en) * | 2005-06-08 | 2006-12-14 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy, copper alloy plate, and process for producing the same |
JP2006342389A (en) * | 2005-06-08 | 2006-12-21 | Kobe Steel Ltd | Copper alloy sheet for electrical connection part |
EP1801249A1 (en) * | 2005-12-22 | 2007-06-27 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy having excellent stress relaxation property |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5816044A (en) * | 1981-07-23 | 1983-01-29 | Mitsubishi Electric Corp | Copper alloy |
JPS6039142A (en) * | 1983-08-11 | 1985-02-28 | Mitsubishi Electric Corp | Copper alloy |
JPS60245753A (en) * | 1984-05-22 | 1985-12-05 | Nippon Mining Co Ltd | High strength copper alloy having high electric conductivity |
JPS6299430A (en) * | 1985-10-26 | 1987-05-08 | Dowa Mining Co Ltd | Copper alloy for terminal or connector and its manufacture |
JPS62227052A (en) * | 1986-03-28 | 1987-10-06 | Dowa Mining Co Ltd | Copper-base alloy for terminal and connector and its production |
JP2844120B2 (en) | 1990-10-17 | 1999-01-06 | 同和鉱業株式会社 | Manufacturing method of copper base alloy for connector |
US5387293A (en) * | 1991-01-17 | 1995-02-07 | Dowa Mining Co., Ltd. | Copper base alloys and terminals using the same |
JP3510469B2 (en) * | 1998-01-30 | 2004-03-29 | 古河電気工業株式会社 | Copper alloy for conductive spring and method for producing the same |
JP3748709B2 (en) | 1998-04-13 | 2006-02-22 | 株式会社神戸製鋼所 | Copper alloy sheet excellent in stress relaxation resistance and method for producing the same |
JP3344700B2 (en) * | 1998-06-01 | 2002-11-11 | 株式会社神戸製鋼所 | High-strength, high-conductivity copper alloy sheet for leadframes with excellent heat treatment during press punching |
JP2000129377A (en) * | 1998-10-28 | 2000-05-09 | Sumitomo Metal Mining Co Ltd | Copper-base alloy for terminal |
JP2000256814A (en) * | 1999-03-03 | 2000-09-19 | Sumitomo Metal Mining Co Ltd | Manufacture of copper-based alloy bar for terminal |
JP4056175B2 (en) | 1999-05-13 | 2008-03-05 | 株式会社神戸製鋼所 | Copper alloy plate for lead frames, terminals, connectors, switches or relays with excellent press punchability |
JP2000328157A (en) | 1999-05-13 | 2000-11-28 | Kobe Steel Ltd | Copper alloy sheet excellent in bending workability |
JP4396874B2 (en) * | 2000-03-17 | 2010-01-13 | 住友金属鉱山株式会社 | Manufacturing method of copper base alloy strip for terminal |
JP3744810B2 (en) | 2001-03-30 | 2006-02-15 | 株式会社神戸製鋼所 | Copper alloy for terminal / connector and manufacturing method thereof |
JP3798260B2 (en) | 2001-05-17 | 2006-07-19 | 株式会社神戸製鋼所 | Copper alloy for electric and electronic parts and electric and electronic parts |
JP4087307B2 (en) | 2003-07-09 | 2008-05-21 | 日鉱金属株式会社 | High strength and high conductivity copper alloy with excellent ductility |
JP3962751B2 (en) * | 2004-08-17 | 2007-08-22 | 株式会社神戸製鋼所 | Copper alloy sheet for electric and electronic parts with bending workability |
JP4117327B2 (en) * | 2006-07-21 | 2008-07-16 | 株式会社神戸製鋼所 | Copper alloy sheet for electrical and electronic parts with excellent press punchability |
-
2008
- 2008-07-24 US US12/672,092 patent/US20110223056A1/en not_active Abandoned
- 2008-07-24 KR KR1020107002597A patent/KR101227315B1/en active IP Right Grant
- 2008-07-24 EP EP13005147.7A patent/EP2695956B1/en active Active
- 2008-07-24 EP EP08791572.4A patent/EP2184371B1/en active Active
- 2008-07-24 WO PCT/JP2008/063320 patent/WO2009019990A1/en active Application Filing
- 2008-07-24 CN CN200880024723A patent/CN101743333A/en active Pending
- 2008-07-24 EP EP13005148.5A patent/EP2695957B1/en active Active
- 2008-07-24 EP EP13005149.3A patent/EP2695958B1/en active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0859065A1 (en) * | 1997-02-18 | 1998-08-19 | Dowa Mining Co., Ltd. | Copper base alloys and terminals using the same |
JP2001262255A (en) * | 2000-03-17 | 2001-09-26 | Sumitomo Metal Mining Co Ltd | Copper based alloy bar for terminal and its producing method |
US20020108685A1 (en) * | 2000-12-18 | 2002-08-15 | Dowa Mining Co., Ltd. | Copper-base alloys having improved punching properties on press and a process for producing them |
US20050092404A1 (en) * | 2003-11-05 | 2005-05-05 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Softening-resistant copper alloy and method of forming sheet of the same |
EP1612285A1 (en) * | 2004-07-01 | 2006-01-04 | Dowa Mining Co., Ltd. | Copper-based alloy and method of manufacturing the same |
EP1630239A1 (en) * | 2004-08-30 | 2006-03-01 | Dowa Mining Co., Ltd. | Copper alloy and method of manufacturing the same |
JP2006213999A (en) * | 2005-02-07 | 2006-08-17 | Kobe Steel Ltd | Method for producing copper alloy sheet having excellent stress relaxation resistance |
WO2006132317A1 (en) * | 2005-06-08 | 2006-12-14 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy, copper alloy plate, and process for producing the same |
JP2006342389A (en) * | 2005-06-08 | 2006-12-21 | Kobe Steel Ltd | Copper alloy sheet for electrical connection part |
EP1801249A1 (en) * | 2005-12-22 | 2007-06-27 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy having excellent stress relaxation property |
Also Published As
Publication number | Publication date |
---|---|
EP2695956A2 (en) | 2014-02-12 |
EP2695957B1 (en) | 2018-11-28 |
EP2184371B1 (en) | 2016-11-30 |
EP2695956A3 (en) | 2014-06-18 |
KR101227315B1 (en) | 2013-01-28 |
EP2184371A1 (en) | 2010-05-12 |
EP2184371A4 (en) | 2013-05-01 |
EP2695957A2 (en) | 2014-02-12 |
WO2009019990A1 (en) | 2009-02-12 |
US20110223056A1 (en) | 2011-09-15 |
EP2695958A2 (en) | 2014-02-12 |
CN101743333A (en) | 2010-06-16 |
KR20100031138A (en) | 2010-03-19 |
EP2695958B1 (en) | 2018-12-26 |
EP2695956B1 (en) | 2018-12-19 |
EP2695957A3 (en) | 2014-07-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2695958A3 (en) | Copper alloy sheet | |
EP2339039A3 (en) | Copper alloy sheet for electric and electronic part | |
EP2508632A4 (en) | Copper alloy sheet | |
WO2008123433A1 (en) | Cu-ni-si-based alloy for electronic material | |
TW200706660A (en) | Copper alloy having high strength and superior bending workability, and method for manufacturing copper alloy plates | |
MY141247A (en) | Copper alloy having bendability and stress relaxation property | |
WO2010035258A3 (en) | Discrete metallic copper nanoparticles | |
TW200706661A (en) | Cu-Zn-Sn alloy for electrical and electronic equipment | |
EP2426224A3 (en) | Copper alloy with high strength, high electrical conductivity, and excellent bendability | |
TW200710234A (en) | Copper alloy for electronic material | |
WO2010138492A3 (en) | Dentifrice composition | |
WO2009091127A3 (en) | Grain oriented electrical steel having excellent magnetic properties and manufacturing method for the same | |
EP1997920A3 (en) | Copper alloy for electric and electronic equipments | |
WO2008006071A3 (en) | Blends of fullerene derivatives, and uses thereof in electronic devices | |
WO2008089822A3 (en) | Antimicrobial composition comprising zinc oxide, barium sulphate and silver ions | |
MY144826A (en) | Copper alloy strip material for electrical or electronic part and method for manufacturing the same | |
TWI340129B (en) | Dispersion powders containing fatty acid anhydrides | |
IL194256A0 (en) | Compositions and methods to add value to plant products, increasing the commercial quality, resistance to external factors and polyphenol content thereof | |
MY170901A (en) | Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar | |
MX2016000027A (en) | Copper alloy for electronic and electrical equipment, copper alloy thin sheet for electronic and electrical equipment, and conductive component for electronic and electrical equipment, terminal. | |
CN105189795A8 (en) | Aluminum alloy plate for high-strength alumite material and method for producing same, and aluminum alloy plate having high-strength alumite coating film attached thereto | |
WO2011087818A3 (en) | Electrically conductive polymer compositions | |
WO2007100929A3 (en) | Method and apparatus for indicating directionality in integrated circuit manufacturing | |
MX342116B (en) | Copper-alloy plate for terminal/connector material, and method for producing copper-alloy plate for terminal/connector material. | |
WO2004089992A8 (en) | Modified acacia and use thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AC | Divisional application: reference to earlier application |
Ref document number: 2184371 Country of ref document: EP Kind code of ref document: P |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR |
|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: C22F 1/08 20060101ALI20140527BHEP Ipc: H01R 13/03 20060101ALI20140527BHEP Ipc: C22C 9/02 20060101ALI20140527BHEP Ipc: H01R 13/11 20060101ALI20140527BHEP Ipc: C22C 9/00 20060101ALI20140527BHEP Ipc: C22C 9/06 20060101AFI20140527BHEP Ipc: H01R 43/16 20060101ALI20140527BHEP |
|
17P | Request for examination filed |
Effective date: 20150102 |
|
RBV | Designated contracting states (corrected) |
Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: EXAMINATION IS IN PROGRESS |
|
17Q | First examination report despatched |
Effective date: 20170324 |
|
INTG | Intention to grant announced |
Effective date: 20180611 |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: GRANT OF PATENT IS INTENDED |
|
GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
GRAJ | Information related to disapproval of communication of intention to grant by the applicant or resumption of examination proceedings by the epo deleted |
Free format text: ORIGINAL CODE: EPIDOSDIGR1 |
|
GRAL | Information related to payment of fee for publishing/printing deleted |
Free format text: ORIGINAL CODE: EPIDOSDIGR3 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: EXAMINATION IS IN PROGRESS |
|
GRAR | Information related to intention to grant a patent recorded |
Free format text: ORIGINAL CODE: EPIDOSNIGR71 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: GRANT OF PATENT IS INTENDED |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE PATENT HAS BEEN GRANTED |
|
INTC | Intention to grant announced (deleted) | ||
AC | Divisional application: reference to earlier application |
Ref document number: 2184371 Country of ref document: EP Kind code of ref document: P |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR |
|
INTG | Intention to grant announced |
Effective date: 20181119 |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: FG4D |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: EP |
|
REG | Reference to a national code |
Ref country code: AT Ref legal event code: REF Ref document number: 1081516 Country of ref document: AT Kind code of ref document: T Effective date: 20190115 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R096 Ref document number: 602008058538 Country of ref document: DE |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: FG4D |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LV Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181226 Ref country code: FI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181226 Ref country code: LT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181226 Ref country code: NO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190326 Ref country code: HR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181226 Ref country code: BG Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190326 |
|
REG | Reference to a national code |
Ref country code: NL Ref legal event code: MP Effective date: 20181226 |
|
REG | Reference to a national code |
Ref country code: LT Ref legal event code: MG4D |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190327 Ref country code: SE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181226 |
|
REG | Reference to a national code |
Ref country code: AT Ref legal event code: MK05 Ref document number: 1081516 Country of ref document: AT Kind code of ref document: T Effective date: 20181226 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181226 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: PT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190426 Ref country code: PL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181226 Ref country code: CZ Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181226 Ref country code: ES Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181226 Ref country code: IT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181226 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: RO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181226 Ref country code: SK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181226 Ref country code: IS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190426 Ref country code: EE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181226 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R097 Ref document number: 602008058538 Country of ref document: DE |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181226 Ref country code: AT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181226 |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed |
Effective date: 20190927 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181226 Ref country code: MC Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181226 |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 20190724 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: TR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181226 |
|
REG | Reference to a national code |
Ref country code: BE Ref legal event code: MM Effective date: 20190731 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20190724 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20190731 Ref country code: LI Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20190731 Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20190724 Ref country code: BE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20190731 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20190724 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: CY Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181226 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: HU Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO Effective date: 20080724 Ref country code: MT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181226 |
|
P01 | Opt-out of the competence of the unified patent court (upc) registered |
Effective date: 20230523 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20230531 Year of fee payment: 16 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 20240611 Year of fee payment: 17 |