JP4056175B2 - Copper alloy plate for lead frames, terminals, connectors, switches or relays with excellent press punchability - Google Patents
Copper alloy plate for lead frames, terminals, connectors, switches or relays with excellent press punchability Download PDFInfo
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Description
【０００１】
【発明の属する技術分野】
本発明は銅合金板、特にリードフレーム、端子、コネクタ、スイッチ、リレーなどの電子部品に用いるに好適なプレス打ち抜き性が優れた銅合金板に関するものである。
【０００２】
【従来の技術】
各種電子部品に、各種銅及び銅合金が用いられている。近年、電子部品の軽薄短小化の流れが急速に進展している。それに伴い、リードフレーム、端子、コネクタ、スイッチ、リレーなどに用いられる銅合金板は、高強度、高導電率はもちろんのこと、微細な形状にスタンピング加工されるため優れたプレス打抜き性が要求されることが多くなってきている。
なかでもＣｕ−Ｆｅ−Ｐ系合金は、高強度、高耐熱性及び高導電率を兼備する合金としてこれらの用途に広く用いられている。しかし、これらの特性とプレス打抜き性との両立は難しいのが現状であった。
【０００３】
【発明が解決しようとする課題】
従来、プレス打抜き性向上の方法として、Ｐｂ、Ｃａなどの微量成分添加、あるいは破断の起点となる化合物を分散させるなど、化学成分に着目することが常套手段であった。しかしこのような方法は、微量成分の制御が困難であったり、他の特性を劣化させたり、コストアップにつながるなどの問題を有していた。
本発明は従来技術の上記問題点に鑑みてなされたもので、Ｃｕ−Ｆｅ−Ｐ系合金の優れた強度、導電率等を保持しながら、優れたプレス打抜き性を持つ銅合金板を得ることを目的とする。
【０００４】
【課題を解決するための手段】
本発明者は、前記課題を解決するためにＣｕ−Ｆｅ−Ｐ系合金板について鋭意研究した結果、結晶方位の集積度を制御することによりプレス打抜き性を向上できることを見い出し、本発明をなすに至った。
すなわち、本発明に係るリードフレーム、端子、コネクタ、スイッチ又はリレー用銅合金板は、Ｆｅ：０．２〜０．４質量％、Ｐ：０．００５〜０．２質量％を含み、残部Ｃｕと不可避不純物からなり、さらに板表面における｛２００｝面からのＸ線回折強度をＩ{200}、｛３１１｝面からのＸ線回折強度をＩ{311}、｛２２０｝面からのＸ線回折強度をＩ{220}としたとき、下記式を満たすことを特徴とする。
［Ｉ{200}＋Ｉ{311}］／Ｉ{220}＜０．４
【０００５】
なお、上記の銅合金板は、Ｚｎ：０．０１〜１０質量％、Ｓｎ：０．０１〜５質量％のいずれか一方又は双方を含有することができる。さらに、上記の銅合金板は、Ｂ、Ｃ、Ｓ、Ｃａ、Ｖ、Ｇａ、Ｇｅ、Ｎｂ、Ｍｏ、Ｈｆ、Ｔａ、Ｂｉ、Ｐｂの各元素０．０００１〜０．１質量％（２種以上添加する場合は合計で０．１質量％以下）、Ｂｅ、Ｍｇ、Ａｌ、Ｓｉ、Ｔｉ、Ｃｒ、Ｍｎ、Ｎｉ、Ｃｏ、Ｚｒ、Ａｇ、Ｃｄ、Ｉｎ、Ｓｂ、Ｔｅ、Ａｕの各元素０．００１〜１質量％のうちから選ばれた、１種又は２種以上の元素を合計で１質量％以下含有することができる。
【０００６】
【発明の実施の形態】
次に、本発明に係る銅合金の成分及び結晶方位等の限定理由について説明する。
（Ｆｅ及びＰ）
これらの成分は、共存した状態でＦｅとＰの金属間化合物を形成することにより、導電率を大幅に低下させることなく強度を向上させる効果がある。Ｆｅが０．００５質量％未満又は／及びＰが０．００５質量％未満ではその効果がなく、Ｆｅが０．５質量％を超え又は／及びＰが０．２質量％を超えると熱間加工性が著しく低下する。従って、両成分はＦｅ：０．００５〜０．５質量％、Ｐ：０．００５〜０．２質量％とする。なお、Ｆｅ、Ｐは結晶方位指数（［Ｉ{200}＋Ｉ{311}］／Ｉ{220}）を下げ、プレス打ち抜き性を向上させる作用がある。
【０００７】
（Ｚｎ）
Ｚｎは、はんだ耐熱剥離性及び耐マイグレーション性を向上させる作用があるが、０．０１質量％未満ではその効果が十分ではない。１０質量％を超えると導電率が低下するだけでなく、はんだ付け性が低下するとともに、耐応力腐食割れ感受性が高くなり好ましくない。従って、Ｚｎは０．０１〜１０質量％とする。なお、Ｚｎは結晶方位指数を下げ、プレス打ち抜き性を向上させる作用をもつ。
（Ｓｎ）
Ｓｎは、固溶強化により強度を向上させる成分である。０．０１質量％未満ではその効果が十分ではなく、５質量％を超えるとその効果が飽和するとともに、熱間及び冷間加工性が劣化する。従って、Ｓｎは０．０１〜５質量％とする。なお、Ｓｎは結晶方位指数を下げ、プレス打ち抜き性を向上させる作用をもつ。
【０００８】
（副成分）
Ｂ、Ｃ、Ｓ、Ｃａ、Ｖ、Ｇａ、Ｇｅ、Ｎｂ、Ｍｏ、Ｈｆ、Ｔａ、Ｂｉ、Ｐｂの各元素はプレス打抜き性を一層向上させる役割を有する。これらの元素は、０．０００１質量％未満ではその効果がなく、０．１質量％を超えると熱間加工性が劣化する。また、Ｂｅ、Ｍｇ、Ａｌ、Ｓｉ、Ｔｉ、Ｃｒ、Ｍｎ、Ｎｉ、Ｃｏ、Ｚｒ、Ａｇ、Ｃｄ、Ｉｎ、Ｓｂ、Ｔｅ、Ａｕの各元素はプレス打抜き性を向上させる役割を有し、加えてＦｅ−Ｐ化合物との共存により強度を一層向上させる。これらの元素は、０．００１質量％未満ではその効果がなく、１質量％を超えると熱間及び冷間加工性が劣化するとともに導電率も低下する。従って、上記Ｂ〜Ｐｂについては各元素０．０００１〜０．１質量％（２種以上添加する場合は合計で０．１質量％以下）、上記Ｂｅ〜Ａｕについては各元素０．００１〜１質量％とし、両方合計で１質量％以下とする。
【０００９】
（結晶方位）
ＦｅとＰを含有する銅合金板は、再結晶しその粒径が大きくなるに従って板表面への｛２００｝、｛３１１｝面の集積割合が増し、圧延すると｛２２０｝面の集積割合が増してくる。本発明に係る銅合金板は、例えば熱間圧延、冷間圧延、析出焼鈍、仕上げ冷間圧延及び歪み取り焼鈍という工程で製造されるが、この製造工程において、例えば析出焼鈍（焼鈍温度、時間）とその後の冷間圧延工程（加工率）を調整することで、この集積割合を制御することができる。具体的には焼鈍温度は４７５℃以下、析出焼鈍後の累計加工率は５５％以上が好ましい条件である。なお、この集積割合はその後の再結晶を伴わない歪み取り焼鈍によっては大きく変化しない。また、ＦｅとＰの含有量、さらにはそれ以外の元素の含有量も集積割合に影響する。
本発明では、これらの集積割合がプレス打抜き性と強い相関を持ち、板表面へのこれらの集積割合を制御することによりプレス打抜き性を向上できるとの知見をもとに、前記式に示すとおり、適正な結晶方位指数の範囲を求めたものである。なお、結晶方位指数の値は板の曲げ加工性にも関係し、この値が余り小さくなると板の曲げ加工性が悪下することから、この値は０．１以上が望ましい。
【００１０】
【実施例】
次に、本発明の実施例について、比較例とともに以下に説明する。
表１に示す化学組成の銅合金を、クリプトル炉にて木炭被覆下で大気溶解し、ブックモールドに鋳造し、５０×８０×２００ｍｍの鋳塊を作製した。この鋳塊を９３０℃に加熱し熱間圧延後、直ちに水中急冷し厚さ１５ｍｍの熱延材とした。この熱延材の表面の酸化スケールを除去するため、表面をグラインダで切削した。これを冷間圧延した後、４２５℃で２時間の析出焼鈍を施し、さらに６０％の冷間加工率の仕上げ冷間圧延により板厚０．２５ｍｍに調整した。この材料に３５０℃で２０秒の歪み取り焼鈍を施した後、試験に供した。
【００１１】
【表１】
また、上記工程以外に、種々の結晶方位集積割合の銅合金板を得るため、Ｎｏ．３の組成の合金については、析出焼鈍温度を４２５℃の他に４５０℃（Ｎｏ．3-2）、５００℃（Ｎｏ．3-5）の条件にて製作した。また析出焼鈍後の冷間加工率も６０％の他に３０％（Ｎｏ．3-6）、４０％（Ｎｏ．3-7）、５０％（Ｎｏ．3-3）及び７０％（Ｎｏ．3-4）の条件にて製作した。いずれの条件によっても、最終板厚は０．２５ｍｍに調整した。
【００１３】
これらの供試材について、引張強さ、耐力、導電率、ばり高さ及び結晶方位を下記要領にて調査した。その結果を表２及び表３に示す。また、耐応力腐食割れ性についても下記要領で評価した。
＜引張強さ、耐力＞
ＪＩＳ Ｚ ２２４１に記載の方法に準じた。なお、耐力はオフセット法で永久伸び０．２％を採用した。試験片は、ＪＩＳ Ｚ ２２０１の５号試験片を用いた。
＜導電率＞
ＪＩＳ Ｈ ０５０５に記載の方法に準じた。電気抵抗の測定はダブルブリッジを用いた。
＜ばり高さ＞
金型クリアランスを１０％とし、２５０ｓｐｍの打抜き速度で、長さ３０ｍｍ、幅０．５ｍｍのリードを打抜き、ばり高さをＳＥＭ観察にて測定した。
＜結晶方位＞
最終製品状態（０．２５ｍｍ厚さ）の銅合金板表面にＸ線を入射させ、各回折面からの強度を測定した。表面からの測定深さは入射角によって変化するが、最大で約２０〜３０μｍの深さまでの結晶方位データが得られる。その中から曲げ加工性と相関が強い｛２００｝、｛３１１｝及び｛２２０｝面の回折強度の割合を比較し、結晶方位指数を求めた。なお、Ｘ線照射の条件は、Ｘ線の種類：Ｃｕ Ｋ−α１、管電圧：４０ｋＶ、管電流：２００ｍＡであり、試料を平面内で回転させながら測定した。
＜耐応力腐食割れ性＞
トンプソン氏の方法（D.H.Thompson:Materials Research & Standards 1(1961),108)に準じて試験を行った。試験片寸法を０．２５ｍｍｔ×１２．７ｍｍｗ×１５０ｍｍｌとし、図１（ａ）に示すようにループ状に結んだ後、１４質量％のアンモニア水飽和蒸気中に暴露した。結びを解いたときの試験片両端の距離を測定し、下記式にて応力緩和率を測定した。２０時間以内に応力緩和率が５０％以上になったものを耐応力腐食割れ性が劣ると評価した。
応力緩和率（％）＝［（ｌ１−ｌ２）／ｌ１×１００
ｌ１：アンモニア暴露前の試験片両端の距離
ｌ２：アンモニア暴露後の試験片両端の距離
【００１４】
【表２】
【表３】
表２に示すＮｏ．１〜１８はいずれの特性も良好である。このうち、Ｎｏ．１とＮｏ．２はＦｅとＰが低めであり、強度がやや低く、結晶方位指数が高めで、ばりがやや大きい。逆に、Ｎｏ．４と５はＦｅとＰが高めであるため、強度がやや高く、結晶方位指数が低めで、ばりが小さい。またＮｏ．3-2、3-3は結晶方位指数が高めであり、ばりがやや大きくなっている。
一方、表３に示す比較例のＮｏ．１９はＦｅとＰが低いため、強度が低く、結晶方位指数が高いため、ばりが大きい。比較例Ｎｏ．２０はＦｅとＰが高いため、熱間圧延で割れが発生した。比較例Ｎｏ．２１はＺｎが多いため、耐応力腐食割れ性が低く、導電率も低くなっている。比較例Ｎｏ．２２、Ｎｏ．２３はＳｎ又はＰｂ含有量が高く、熱間圧延で割れが発生した。Ｎｏ．２４はＦｅ含有量が高く、熱間圧延で微小割れが発生するとともに、導電率も低くなっている。Ｎｏ．3-5、3-6、3-7は結晶方位指数が高く、ばりが大きい。
【００１７】
【発明の効果】
本発明によれば、優れた強度及び導電率等を保持しながら、優れたプレス打抜き性を持つリードフレーム、端子、コネクタ、スイッチ、リレーなどの電子部品用の銅合金板を得ることができる。
【図面の簡単な説明】
【図１】 耐応力腐食割れ性試験の方法を説明する図である。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a copper alloy plate, particularly a copper alloy plate excellent in press punching suitable for use in electronic parts such as lead frames, terminals, connectors, switches and relays.
[0002]
[Prior art]
Various copper and copper alloys are used for various electronic components. In recent years, the trend of making electronic parts lighter, thinner, and smaller is rapidly progressing. Along with that, copper alloy plates used for lead frames, terminals, connectors, switches, relays, etc. are stamped into fine shapes as well as high strength and high conductivity, so excellent press punchability is required. There is a lot to be done.
Among these, Cu—Fe—P alloys are widely used in these applications as alloys having high strength, high heat resistance, and high electrical conductivity. However, at present, it is difficult to achieve both these characteristics and press punchability.
[0003]
[Problems to be solved by the invention]
Conventionally, as a method for improving the press punchability, it has been a conventional means to pay attention to chemical components such as addition of trace components such as Pb and Ca, or dispersion of a compound serving as a starting point of fracture. However, such a method has problems that it is difficult to control trace components, deteriorate other characteristics, and lead to an increase in cost.
The present invention has been made in view of the above-mentioned problems of the prior art, and obtains a copper alloy plate having excellent press punchability while maintaining the excellent strength, conductivity and the like of a Cu-Fe-P alloy. With the goal.
[0004]
[Means for Solving the Problems]
As a result of diligent research on the Cu—Fe—P alloy plate in order to solve the above problems, the present inventor has found that press punchability can be improved by controlling the degree of accumulation of crystal orientations, and the present invention is made. It came.
That is, the copper alloy plate for a lead frame, terminal, connector, switch or relay according to the present invention contains Fe: 0.2-0.4 mass %, P: 0.005-0.2 mass %, and the balance Cu In addition, the X-ray diffraction intensity from the {200} plane on the plate surface is I {200}, the X-ray diffraction intensity from the {311} plane is I {311}, and the X-ray from the {220} plane. When the diffraction intensity is I {220}, the following formula is satisfied.
[I {200} + I {311}] / I {220} <0.4
[0005]
In addition, said copper alloy plate can contain any one or both of Zn: 0.01-10 mass % and Sn: 0.01-5 mass %. Furthermore, said copper alloy board is 0.0001-0.1 mass % (two or more types) of each element of B, C, S, Ca, V, Ga, Ge, Nb, Mo, Hf, Ta, Bi, and Pb. In the case of adding 0.1 mass % or less in total, Be, Mg, Al, Si, Ti, Cr, Mn, Ni, Co, Zr, Ag, Cd, In, Sb, Te, and Au elements 0. selected from among 001-1 mass%, it can contain more than 1 wt% of one or more elements in total.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
Next, the reasons for limiting the components and crystal orientation of the copper alloy according to the present invention will be described.
(Fe and P)
These components have the effect of improving the strength without significantly reducing the conductivity by forming an intermetallic compound of Fe and P in the coexisting state. If Fe is less than 0.005% by mass or / and P is less than 0.005% by mass , the effect is not obtained. If Fe exceeds 0.5% by mass or / and P exceeds 0.2% by mass , hot working is performed. Remarkably deteriorates. Therefore, both components shall be Fe: 0.005-0.5 mass %, P: 0.005-0.2 mass %. Fe and P have the effect of lowering the crystal orientation index ([I {200} + I {311}] / I {220}) and improving the press punchability.
[0007]
(Zn)
Zn has the effect of improving the heat resistance peelability and migration resistance of solder, but the effect is not sufficient if it is less than 0.01% by mass. If it exceeds 10% by mass, not only the electrical conductivity is lowered, but also solderability is lowered, and the stress corrosion cracking susceptibility is increased, which is not preferable. Therefore, Zn is 0.01-10 mass %. Zn has the effect of lowering the crystal orientation index and improving press punchability.
(Sn)
Sn is a component that improves the strength by solid solution strengthening. If the amount is less than 0.01% by mass , the effect is not sufficient. If the amount exceeds 5% by mass , the effect is saturated, and hot workability and cold workability deteriorate. Therefore, Sn is set to 0.01 to 5% by mass . Sn has a function of lowering the crystal orientation index and improving press punchability.
[0008]
(Subcomponent)
Each element of B, C, S, Ca, V, Ga, Ge, Nb, Mo, Hf, Ta, Bi, and Pb has a role of further improving press punchability. These elements, no effect thereof is less than 0.0001 mass%, degrades hot workability exceeds 0.1 mass%. In addition, each element of Be, Mg, Al, Si, Ti, Cr, Mn, Ni, Co, Zr, Ag, Cd, In, Sb, Te, and Au has a role of improving press punchability. The strength is further improved by coexistence with the Fe-P compound. If these elements are less than 0.001% by mass , the effect is not obtained. If they exceed 1% by mass , the hot and cold workability deteriorates and the conductivity also decreases. Therefore, 0.0001 to 0.1% by mass of each element for B to Pb (a total of 0.1% by mass or less when two or more elements are added), and 0.001 to 1 for each element of Be to Au. The total mass is 1% by mass or less.
[0009]
(Crystal orientation)
The copper alloy sheet containing Fe and P recrystallizes, and as the grain size increases, the accumulation ratio of {200} and {311} faces on the sheet surface increases, and rolling increases the accumulation ratio of {220} faces. Come. The copper alloy sheet according to the present invention is manufactured by, for example, processes such as hot rolling, cold rolling, precipitation annealing, finish cold rolling, and strain relief annealing. In this manufacturing process, for example, precipitation annealing (annealing temperature, time) ) And the subsequent cold rolling process (processing rate), the accumulation ratio can be controlled. Specifically, the annealing temperature is preferably 475 ° C. or less, and the cumulative processing rate after precipitation annealing is preferably 55% or more. Note that this accumulation ratio does not change greatly depending on the subsequent strain relief annealing without recrystallization. Further, the contents of Fe and P, and further the contents of other elements influence the accumulation ratio.
In the present invention, these accumulation ratios have a strong correlation with press punchability, and the press punchability can be improved by controlling these accumulation ratios on the plate surface, as shown in the above formula. The range of the proper crystal orientation index was obtained. Note that the value of the crystal orientation index is also related to the bending workability of the plate. If this value is too small, the bending workability of the plate is degraded.
[0010]
【Example】
Next, examples of the present invention will be described below together with comparative examples.
A copper alloy having the chemical composition shown in Table 1 was melted in the atmosphere under a charcoal coating in a kryptor furnace, and cast into a book mold to produce a 50 × 80 × 200 mm ingot. The ingot was heated to 930 ° C., hot-rolled, and immediately quenched in water to obtain a hot-rolled material having a thickness of 15 mm. In order to remove the oxide scale on the surface of the hot rolled material, the surface was cut with a grinder. This was cold-rolled and then subjected to precipitation annealing at 425 ° C. for 2 hours and further adjusted to a plate thickness of 0.25 mm by finish cold rolling at a cold working rate of 60%. This material was subjected to strain relief annealing at 350 ° C. for 20 seconds and then subjected to a test.
[0011]
[Table 1]
In addition to the above steps, in order to obtain copper alloy sheets having various crystal orientation accumulation ratios, The alloy having the composition 3 was manufactured under the conditions of the precipitation annealing temperature of 450 ° C. (No. 3-2) and 500 ° C. (No. 3-5) in addition to 425 ° C. Also, the cold working rate after precipitation annealing is 30% (No. 3-6), 40% (No. 3-7), 50% (No. 3-3) and 70% (No. 3) in addition to 60%. Produced under the conditions of 3-4). Regardless of the conditions, the final plate thickness was adjusted to 0.25 mm.
[0013]
About these test materials, tensile strength, yield strength, electrical conductivity, flash height, and crystal orientation were investigated in the following manner. The results are shown in Tables 2 and 3. Moreover, the stress corrosion cracking resistance was also evaluated in the following manner.
<Tensile strength, yield strength>
The method described in JIS Z 2241 was followed. In addition, the proof stress employ | adopted permanent elongation 0.2% by the offset method. As the test piece, a JIS Z 2201 No. 5 test piece was used.
<Conductivity>
The method described in JIS H 0505 was followed. A double bridge was used to measure the electrical resistance.
<Burr height>
The die clearance was 10%, a lead having a length of 30 mm and a width of 0.5 mm was punched at a punching speed of 250 spm, and the flash height was measured by SEM observation.
<Crystal orientation>
X-rays were incident on the copper alloy plate surface in the final product state (0.25 mm thickness), and the intensity from each diffraction surface was measured. The measurement depth from the surface varies depending on the incident angle, but crystal orientation data up to a depth of about 20 to 30 μm can be obtained. Among them, the ratio of the diffraction intensities of {200}, {311} and {220} planes having a strong correlation with bending workability was compared, and the crystal orientation index was obtained. The X-ray irradiation conditions were X-ray type: Cu K-α1, tube voltage: 40 kV, tube current: 200 mA, and measurement was performed while rotating the sample in a plane.
<Stress corrosion cracking resistance>
The test was performed according to the method of Thompson (DHThompson: Materials Research & Standards 1 (1961), 108). The test piece size was set to 0.25 mmt × 12.7 mmw × 150 mm, and the test piece was looped as shown in FIG. 1A, and then exposed to 14% by mass of ammonia water saturated steam. The distance between both ends of the test piece when the knot was broken was measured, and the stress relaxation rate was measured by the following formula. Those having a stress relaxation rate of 50% or more within 20 hours were evaluated as having poor stress corrosion cracking resistance.
Stress relaxation rate (%) = [(l 1 −l 2 ) / l 1 × 100
l 1 : Distance between both ends of test piece before exposure to ammonia l 2 : Distance between both ends of test piece after exposure to ammonia
[Table 2]
[Table 3]
No. 2 shown in Table 2. Nos. 1 to 18 have good characteristics. Of these, No. 1 and No. No. 2 has lower Fe and P, slightly lower strength, higher crystal orientation index, and slightly larger flash. Conversely, no. Since Fe and P are high in 4 and 5, the strength is slightly high, the crystal orientation index is low, and the flash is small. No. In 3-2 and 3-3, the crystal orientation index is higher and the beam is slightly larger.
On the other hand, No. of the comparative example shown in Table 3. No. 19 is low in Fe and P, has low strength, and has a high crystal orientation index. Comparative Example No. Since No. 20 had high Fe and P, cracks occurred during hot rolling. Comparative Example No. Since No. 21 contains a large amount of Zn, the stress corrosion cracking resistance is low, and the conductivity is also low. Comparative Example No. 22, no. No. 23 had a high Sn or Pb content, and cracking occurred during hot rolling. No. No. 24 has a high Fe content, microcracks are generated by hot rolling, and the electrical conductivity is also low. No. 3-5, 3-6, and 3-7 have high crystal orientation indices and large flashes.
[0017]
【The invention's effect】
According to the present invention, it is possible to obtain a copper alloy plate for electronic parts such as lead frames, terminals, connectors, switches, and relays having excellent press punchability while maintaining excellent strength and conductivity.
[Brief description of the drawings]
FIG. 1 is a diagram for explaining a method of a stress corrosion cracking resistance test.
Claims (4)
［Ｉ{200}＋Ｉ{311}］／Ｉ{220}＜０．４Fe: 0.2 to 0.4 mass%, P: 0.005 to 0.2 mass%, Zn: 0.01 to 10 mass%, consisting of the balance Cu and inevitable impurities, and further {200 on the plate surface } When the X-ray diffraction intensity from the plane is I {200}, the X-ray diffraction intensity from the {311} plane is I {311}, and the X-ray diffraction intensity from the {220} plane is I {220} A lead alloy, terminal, connector, switch or relay copper alloy plate having excellent press punching characteristics characterized by satisfying the formula.
[I {200} + I {311}] / I {220} <0.4
［Ｉ{200}＋Ｉ{311}］／Ｉ{220}＜０．４Fe: 0.2-0.4% by mass, P: 0.005-0.2% by mass, Sn: 0.01-5% by mass, consisting of the balance Cu and inevitable impurities, and further {200 on the plate surface } When the X-ray diffraction intensity from the plane is I {200}, the X-ray diffraction intensity from the {311} plane is I {311}, and the X-ray diffraction intensity from the {220} plane is I {220} A lead alloy, terminal, connector, switch or relay copper alloy plate having excellent press punching characteristics characterized by satisfying the formula.
[I {200} + I {311}] / I {220} <0.4
［Ｉ{200}＋Ｉ{311}］／Ｉ{220}＜０．４Fe: 0.2 to 0.4 mass%, P: 0.005 to 0.2 mass%, Zn: 0.01 to 10 mass%, Sn: 0.01 to 5 mass%, the remainder being inevitable with Cu X-ray diffraction intensity from {200} plane on the plate surface is I {200}, X-ray diffraction intensity from {311} plane is I {311}, X-ray diffraction intensity from {220} plane A lead alloy, terminal, connector, switch, or relay copper alloy plate excellent in press punching characteristics, characterized by satisfying the following formula when I {220}.
[I {200} + I {311}] / I {220} <0.4
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| JP13338999A JP4056175B2 (en) | 1999-05-13 | 1999-05-13 | Copper alloy plate for lead frames, terminals, connectors, switches or relays with excellent press punchability |
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