JPH0784631B2 - Copper alloy for electronic devices - Google Patents
Copper alloy for electronic devicesInfo
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- JPH0784631B2 JPH0784631B2 JP61252644A JP25264486A JPH0784631B2 JP H0784631 B2 JPH0784631 B2 JP H0784631B2 JP 61252644 A JP61252644 A JP 61252644A JP 25264486 A JP25264486 A JP 25264486A JP H0784631 B2 JPH0784631 B2 JP H0784631B2
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- copper alloy
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Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は強度、導電率及び耐熱性が優れ、メッキ性、モ
ールド性及びボンディング性が良好で、半導体用リード
フレーム等に適した電子機器用銅合金に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention has excellent strength, electrical conductivity and heat resistance, good plating properties, moldability and bonding properties, and is suitable for electronic equipment such as lead frames for semiconductors. It relates to a copper alloy.
一般に電子機器用銅合金、特に半導体用リードフレーム
には、次の諸特性が要求されている。In general, copper alloys for electronic devices, especially lead frames for semiconductors are required to have the following characteristics.
（１）電気及び熱の良導体であること。(1) Must be a good conductor of electricity and heat.
（２）耐熱性が良いこと。(2) Good heat resistance.
（３）ハンダメッキ性が良いこと。(3) Good solder plating.
（４）樹脂とのモールド性が良いこと。(4) Good moldability with resin.
（５）半導体素子及びワイヤーとのボンディング性が良
いこと。(5) Good bonding property with the semiconductor element and the wire.
このような特性を満足する材料として従来からCu−0.15
wt％Sn−Ｐ合金やCu−0.1wt％Fe−Ｐ合金（以下wt％を
％と略記）が用いられている。Conventionally, Cu-0.15 has been used as a material that satisfies these characteristics.
A wt% Sn-P alloy or a Cu-0.1 wt% Fe-P alloy (hereinafter wt% is abbreviated as%) is used.
近年半導体を始め、電子機器の発展に伴って、これに用
いる材料の要求特性が高くなり、特に半導体産業では、
一層優れたリードフレームの開発が強く望まれている。In recent years, with the development of electronic devices, starting with semiconductors, the required characteristics of the materials used for them have increased, and especially in the semiconductor industry,
There is a strong demand for the development of even better lead frames.
本発明はこれに鑑み種々検討の結果、強度、耐熱性、モ
ールド性、ハンダ付け性等を改善した電子機器用銅合金
を開発したものである。As a result of various studies in view of the above, the present invention has developed a copper alloy for electronic devices, which has improved strength, heat resistance, moldability, solderability and the like.
即ち本発明合金は、Mg0.0005〜0.3％、Cr0.01〜1.0％を
含み、更にB0.0005〜0.3％、Ca0.0005〜0.3％、Y0.0005
〜0.3％、希土類元素（RE）0.0005〜0.3％、V0.0005〜
0.005〜0.3％、Hf0.0005〜0.3％、Ga0.0005〜0.3％、Ga
0.0005〜0.3％、Ge0.0005〜0.3％、In0.0005〜0.3％、A
g0.0005〜0.3％、Zr0.0005〜0.3％、Sb0.0005〜0.3％、
Bi0.0005〜0.3％、Te0.0005〜0.3％、Nb0.0005〜0.3
％、Ti0.001〜0.8％、Mn0.001〜0.8％、Zn0.001〜0.8
％、Sn0.001〜0.8％、Si0.001〜0.8％、Ni0.001〜0.8
％、Fe0.003〜0.8％、Co0.001〜0.8％、Al0.001〜0.8％
の範囲内で少なくとも１種以上を合計0.003〜0.8％含
み、かつO2含有量を20ppm以下、Ｐ含有量を50ppm以下、
Ｓ含有量を20ppm以下、析出物の大きさを10μｍ以下に
制限し、残部Cuと不可避的不純物からなることを特徴と
するものである。That is, the alloy of the present invention contains Mg0.0005-0.3%, Cr0.01-1.0%, further B0.0005-0.3%, Ca0.0005-0.3%, Y0.0005.
~ 0.3%, rare earth element (RE) 0.0005 ~ 0.3%, V0.0005 ~
0.005-0.3%, Hf0.0005-0.3%, Ga0.0005-0.3%, Ga
0.0005-0.3%, Ge0.0005-0.3%, In0.0005-0.3%, A
g0.0005-0.3%, Zr0.0005-0.3%, Sb0.0005-0.3%,
Bi0.0005-0.3%, Te0.0005-0.3%, Nb0.0005-0.3
%, Ti0.001 to 0.8%, Mn0.001 to 0.8%, Zn0.001 to 0.8
%, Sn0.001 to 0.8%, Si0.001 to 0.8%, Ni0.001 to 0.8
%, Fe0.003-0.8%, Co0.001-0.8%, Al0.001-0.8%
Within the range of 0.003 to 0.8% of at least one kind in total, O 2 content of 20 ppm or less, P content of 50 ppm or less,
The S content is limited to 20 ppm or less, the size of the precipitate is limited to 10 μm or less, and the balance is Cu and inevitable impurities.
本発明合金において、Mgの添加は強度及び耐熱性を向上
させると共に、脱O2作用を示し、鋳造性や熱間加工性を
良好にし、かつCr元素の効果的な分散析出を促進させ
る。しかしてMg含有量を0.0005〜0.3％と限定したの
は、含有量が下限未満では効果が少なく、上限を越える
と導電性、鋳造性及び加工性を悪化するためである。ま
たCrの添加はCu基中にCrを析出させて強度耐熱性を向上
させるためである。しかしてCr含有量を0.01〜1.0％と
限定したのは、下限未満ではその効果が得られず、上限
を越えると粗大析出物を生じ易く、加工性、メッキ性及
びハンダ付け性を損なうためである。In the present invention alloy, the addition of Mg is improves the strength and heat resistance, represents a leaving O 2 act, to better castability and hot workability, and to promote effective dispersion precipitation of Cr element. However, the Mg content is limited to 0.0005 to 0.3% because if the content is less than the lower limit, the effect is small, and if it exceeds the upper limit, the conductivity, castability and workability deteriorate. The addition of Cr is to precipitate Cr in the Cu group and improve strength and heat resistance. Therefore, the reason for limiting the Cr content to 0.01 to 1.0% is that if the lower limit is not reached, the effect cannot be obtained, and if it exceeds the upper limit, coarse precipitates tend to occur, and workability, plating properties, and solderability are impaired. is there.
また下記元素の何れか１種以上を添加するのは、強度及
び耐熱性を更に向上せしめると共に、脱O2作用により製
造性を良好にし、ハンダと銅との接合界面の経時劣化を
抑制して信頼性を向上させるためである。しかしてこれ
等元素の単独の含有量を下記の範囲に限定し、かつ１種
以上の合計含有量を0.003〜0.8％と限定したのは、何れ
も下限未満では効果が小さく、上限を越えると導電性を
低下するばかりか、製造性を悪化し、モールド性やボン
ディング性を大きく低下させるためである。The addition of any one or more of the following elements further improves the strength and heat resistance, improves the manufacturability by deoxidizing O 2, and suppresses the deterioration of the joint interface between the solder and copper over time. This is to improve reliability. However, the content of each of these elements alone is limited to the following range, and the total content of one or more kinds is limited to 0.003 to 0.8%. This is because not only the conductivity is deteriorated, but also the manufacturability is deteriorated and the moldability and the bondability are greatly deteriorated.
B0.0005〜0.3％、Ca0.0005〜0.3％、Y0.0005〜0.3％、R
E0.0005〜0.3％、V0.0005〜0.3％、Hf0.0005〜0.3％、G
a0.0005〜0.3％、Ge0.0005〜0.3％、In0.0005〜0.3％、
Ag0.0005〜0.3％、Zr0.0005〜0.3％、Sb0.0005〜0.3
％、Bi0.0005〜0.3％、Te0.0005〜0.3％、Nb0.0005〜0.
3％、Ti0.001〜0.8％、Mn0.001〜0.8％、Zn0.001〜0.8
％、Sn0.001〜0.8％、Si0.001〜0.8％、Ni0.001〜0.8
％、Fe0.001〜0.8％、Co0.001〜0.8％、Al0.001〜0.8％ 次にO2含有量を20ppm以下に制限したのは、O2が過剰に
含まれると本発明合金の成分、特にCrの均一な析出分散
に有害で、粗大な析出物を作り易く、強度の向上を阻害
するばかりか、メッキ密着性やハンダ付け性を劣化さ
せ、更には成型加工性も劣化させ、電子機器に要求され
る精密な加工部品において実用上特に有害なためで、望
ましくは10ppm以下に制限するとよい。Ｐ含有量を50ppm
以下に制限したのは、Ｐが過剰に含まれると、本発明合
金の特徴である高導電性を著しく損なうと共に、半田と
の界面に濃縮してハンダ付け性を悪化するためで、望ま
しくは10ppm以下に制限するとよい。またＳ含有量を20p
pm以下に制限したのは、Ｓが過剰に含まれると、粒界や
最終凝固部に凝縮して熱間圧延性を大きく悪化させるた
めで、望ましくは5ppm以下に制限するとよい。更に析出
物の大きさを10μ以下に制限したのは、析出物の大きさ
はメッキ密着性やハンダ付け性を大きく左右し、析出物
の大きさが10μを越えると、その影響が大きく、望まし
くは５μ以下に制限するとよい。B0.0005-0.3%, Ca0.0005-0.3%, Y0.0005-0.3%, R
E0.0005 to 0.3%, V0.0005 to 0.3%, Hf0.0005 to 0.3%, G
a0.0005-0.3%, Ge0.0005-0.3%, In0.0005-0.3%,
Ag0.0005-0.3%, Zr0.0005-0.3%, Sb0.0005-0.3
%, Bi0.0005-0.3%, Te0.0005-0.3%, Nb0.0005-0.
3%, Ti 0.001 to 0.8%, Mn 0.001 to 0.8%, Zn 0.001 to 0.8
%, Sn0.001 to 0.8%, Si0.001 to 0.8%, Ni0.001 to 0.8
%, Fe 0.001 to 0.8%, Co 0.001 to 0.8%, Al 0.001 to 0.8% Next, the O 2 content was limited to 20 ppm or less because the composition of the alloy of the present invention when O 2 is excessively contained. , Which is particularly harmful to the uniform precipitation and dispersion of Cr, makes it easy to form coarse precipitates, hinders the improvement of strength, and also deteriorates the plating adhesion and solderability, and also deteriorates the molding processability. This is because it is particularly harmful in practice in the precision machined parts required for equipment, so it is desirable to limit it to 10 ppm or less. P content of 50ppm
The reason for limiting below is that if P is contained excessively, the high conductivity, which is a characteristic of the alloy of the present invention, is significantly impaired, and it is concentrated at the interface with the solder to deteriorate the solderability. You should limit to the following. In addition, S content is 20p
The reason for limiting to pm or less is that if S is excessively contained, it condenses at grain boundaries and the final solidified portion and greatly deteriorates hot rolling property, and it is desirable to limit to 5 ppm or less. Furthermore, the reason for limiting the size of the precipitates to 10μ or less is that the size of the deposits greatly affects the plating adhesion and solderability, and when the size of the deposits exceeds 10μ, the effect is large, and it is desirable. Is preferably limited to 5 μ or less.
黒鉛ルツボを用いてタフピッチ銅を大気中と真空中で溶
解し、それぞれMgとCrを添加し、次いでその他の合金元
素を添加した後、金型に鋳造し、第１表に示す合金組成
からなる厚さ25mm、巾120mm、長さ150mmの鋳塊を得た。Tough pitch copper is melted in air and vacuum using graphite crucible, Mg and Cr are added respectively, and then other alloying elements are added, and then cast in a die, and the alloy composition shown in Table 1 is obtained. An ingot having a thickness of 25 mm, a width of 120 mm and a length of 150 mm was obtained.
これ等鋳塊について、その表面を一面あたり2.5mm面削
した後、加熱して850℃にて熱間圧延し、次いで冷間圧
延と中間焼鈍し、これを350℃で仕上げ焼鈍した。これ
について導電率、引張強さ、耐熱性、メッキ性、酸化膜
剥離性、熱間加工性及びハンダ接合強度を調べた。これ
等の結果を従来合金（Cu−0.15％Sn−Ｐ合金及びCu−0.
1％Fe−Ｐ合金）と比較して第２表に示す。Each of these ingots was chamfered by 2.5 mm per surface, heated, hot-rolled at 850 ° C., then cold-rolled and intermediate annealed, and finish-annealed at 350 ° C. The conductivity, tensile strength, heat resistance, plating property, oxide film peeling property, hot workability, and solder joint strength were examined. The results of these are the conventional alloys (Cu-0.15% Sn-P alloy and Cu-0.
It is shown in Table 2 in comparison with 1% Fe-P alloy).
導電率はJIS−H0505に基づき、引張り強さはJIS−Z2241
に基づいて測定した。耐熱性は上記板材を450℃で５分
間加熱した後、荷重500grのビッカース硬さを測定して
比較した。メッキ性は上記板材より30mm平方のサンプル
を切出し、表面脱脂、酸洗（表面厚さ0.3μ溶解）後、
厚さ５μのAgメッキを行ない、これを加熱処理（450
℃、５分間）して表面のフクレの有無を調べ、フクレ０
個のものを◎印、２個以下のものを○印、３〜６個のも
のを△印、それ以上のものを×印で表わした。熱間加工
性については、850℃の熱間圧延時における表面割れを
調べ、割れを発生したものを×印、割れを発生しないも
のを○印で表わした。酸化膜剥離性は、モールド性及び
ボンディング性に大きな影響を及ぼすもので、上記板材
よりサンプルを切出し、表面正常化処理した後、大気中
420℃に１分間加熱して表面に酸化膜を形成し、セロテ
ープによる剥離試験を行ない、全く剥離が見られないも
のを◎印、ほとんど剥離が見られないものを○印、全面
に剥離が見られたものを×印で表わした。またハンダ接
合強度は直径9mmの部分にリード線を共晶ハンドにより
ハンダ付けし、これを150℃で600時間エージングしてか
らプル試験による接合強度を求めた。Electrical conductivity is based on JIS-H0505, tensile strength is JIS-Z2241
It was measured based on. The heat resistance was compared by heating the above plate material at 450 ° C. for 5 minutes and then measuring the Vickers hardness under a load of 500 gr. For the plating property, a 30 mm square sample is cut out from the above plate material, and after degreasing and pickling the surface (dissolving surface thickness 0.3μ),
A 5μ thick Ag plating is applied and heat treated (450
Check for blisters on the surface at 0 ° C for 5 minutes, and remove blisters.
Individual ones are represented by ⊚, two or less are represented by ∘, 3 to 6 are represented by Δ, and more are represented by x. Regarding hot workability, surface cracks during hot rolling at 850 ° C. were examined, and those with cracks were indicated by x, and those without cracks were indicated by o. Oxide film peelability has a great influence on moldability and bondability. After cutting a sample from the above plate and subjecting it to surface normalization,
An oxide film is formed on the surface by heating at 420 ° C for 1 minute, and a peeling test with cellophane tape is performed. When no peeling is observed at all, ◎ is marked, when almost no peeling is seen, at ○, peeling is observed on the entire surface The obtained ones are represented by X marks. Regarding the solder joint strength, a lead wire was soldered to a portion with a diameter of 9 mm by a eutectic hand, and this was aged at 150 ° C for 600 hours, and then the joint strength was determined by a pull test.
第１表及び第２表から明らかなように、本発明合金No.1
〜13は何れも従来合金No.21、22と比較し、ほぼ同等の
導電性、メッキ性及び熱間加工性を示し、かつはるかに
優れた強度、耐熱性、ハンダ接合性および酸化膜剥離性
を示すことが判る。 As is clear from Tables 1 and 2, the alloy No. 1 of the present invention
All of ~ 13 have almost the same conductivity, plating property and hot workability as the conventional alloy Nos. 21 and 22, and have far superior strength, heat resistance, solder bondability and oxide film peeling property. It can be seen that
これに対し、本発明で規定する合金組成より外れる比較
合金No.14〜20では試験した特性の何れか一つ以上が劣
ることが判る。即ちMg含有量やその他の合金元素の多い
比較合金No.14、18では鋳造性が悪く、健全な鋳塊が得
られなかったり、熱間圧延で割れを生じたりして供試材
を得ることができなかった。またCr含有量が多すぎる比
較合金No.16では導電率の低下が著しく、メッキ密着
性、酸化膜剥離性、熱間加工性等も劣る。On the other hand, it is understood that Comparative Alloys Nos. 14 to 20, which deviate from the alloy composition specified in the present invention, are inferior in any one or more of the tested characteristics. That is, in the comparative alloys No. 14 and 18 with a large amount of Mg content and other alloy elements, the castability is poor, a sound ingot cannot be obtained, or cracks occur in hot rolling to obtain a test material. I couldn't. Further, in Comparative Alloy No. 16 having an excessively high Cr content, the conductivity is remarkably lowered, and the plating adhesion, oxide film peeling property, hot workability, etc. are also inferior.
またO2含有量、Ｐ含有量又はＳ含有量が多すぎる比較合
金No.17、19、20ではメッキ密着性、酸化膜剥離性及び
ハンダ接合性が劣る。Further, Comparative Alloys Nos. 17, 19 and 20 having too much O 2 , P or S content are inferior in plating adhesion, oxide film peeling property and soldering bondability.
なお本発明合金においてMgや選択添加元素の含有は脱Ｓ
作用を付与するものであり、これにより製造性が向上す
る。In addition, in the alloy of the present invention, the inclusion of Mg and selective additive elements does not remove S.
It imparts a function, which improves manufacturability.
このように本発明によれば優れた強度、耐熱性及びボン
ディング性を合せ持つもので、電子機器用材料として近
年の電子機器の小型化、高密度化に対応できる等工業上
顕著な効果を奏するものである。As described above, according to the present invention, it has excellent strength, heat resistance, and bondability, and has industrially remarkable effects such as being compatible with recent electronic device miniaturization and high density as a material for electronic devices. It is a thing.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 志賀 章二 栃木県日光市清滝町500番地 古河電気工 業株式会社日光電気精銅所内 (56)参考文献 特開 昭60−194030（ＪＰ，Ａ) 特開 昭48−71323（ＪＰ，Ａ) 特開 昭58−123862（ＪＰ，Ａ) 特開 昭60−245752（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shoji Shiga 500 Kiyotaki Town, Nikko City, Tochigi Prefecture Furukawa Electric Co., Ltd. Nikko Denki Copper Works (56) References JP-A-60-194030 (JP, A) JP-A-48-71323 (JP, A) JP-A-58-123862 (JP, A) JP-A-60-245752 (JP, A)
Claims (1)
み、更にB0.0005〜0.3wt％、Ca0.0005〜0.3wt％、Y0.00
05〜0.3wt％、希土類元素0.0005〜0.3wt％、V0.0005〜
0.3wt％、Hf0.0005〜0.3wt％、Ga0.0005〜0.3wt％、Ge
0.0005〜0.3wt％、In0.0005〜0.3wt％、Ag0.0005〜0.3w
t％、Zr0.0005〜0.3wt％、Sb0.0005〜0.3wt％、Bi0.000
5〜0.3wt％、Te0.0005〜0.3wt％、Nb0.0005〜0.3wt％、
Ti0.001〜0.8wt％、Mn0.001〜0.8wt％、Zn0.001〜0.8wt
％、Sn0.001〜0.8wt％、Si0.001〜0.8wt％、Ni0.001〜
0.8wt％、Fe0.003〜0.8wt％、Co0.001〜0.8wt％、Al0.0
01〜0.8wt％の範囲内で、少なくとも１種以上を合計0.0
03〜0.8wt％含み、かつO2含有量を20ppm以下、Ｐ含有量
を50ppm以下、Ｓ含有量を20ppm以下、析出物の大きさを
10μｍ以下に制限し、残部Cuと不可避的不純物からなる
電子機器用銅合金。Claims 1. It contains Mg 0.0005 to 0.3 wt%, Cr 0.01 to 1.0 wt%, and further contains B0.0005 to 0.3 wt%, Ca 0.0005 to 0.3 wt%, Y0.00.
05-0.3wt%, rare earth element 0.0005-0.3wt%, V0.0005-
0.3wt%, Hf0.0005-0.3wt%, Ga0.0005-0.3wt%, Ge
0.0005-0.3wt%, In0.0005-0.3wt%, Ag0.0005-0.3w
t%, Zr0.0005 to 0.3wt%, Sb0.0005 to 0.3wt%, Bi0.000
5 ~ 0.3wt%, Te0.0005 ~ 0.3wt%, Nb0.0005 ~ 0.3wt%,
Ti0.001-0.8wt%, Mn0.001-0.8wt%, Zn0.001-0.8wt
%, Sn0.001-0.8wt%, Si0.001-0.8wt%, Ni0.001-
0.8wt%, Fe0.003-0.8wt%, Co0.001-0.8wt%, Al0.0
Within the range of 01-0.8wt%, at least one or more total 0.0
Wherein 03～0.8Wt%, and O 2 content of the 20ppm or less, 50 ppm or less P content, 20ppm or less of S content, the size of the precipitates
A copper alloy for electronic devices, which is limited to 10 μm or less and contains the balance Cu and unavoidable impurities.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61252644A JPH0784631B2 (en) | 1986-10-23 | 1986-10-23 | Copper alloy for electronic devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61252644A JPH0784631B2 (en) | 1986-10-23 | 1986-10-23 | Copper alloy for electronic devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63109130A JPS63109130A (en) | 1988-05-13 |
| JPH0784631B2 true JPH0784631B2 (en) | 1995-09-13 |
Family
ID=17240219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61252644A Expired - Fee Related JPH0784631B2 (en) | 1986-10-23 | 1986-10-23 | Copper alloy for electronic devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0784631B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1327017C (en) * | 2004-07-22 | 2007-07-18 | 同济大学 | Novel elastic conductive alloy and its preparing method |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63109132A (en) * | 1986-10-28 | 1988-05-13 | Furukawa Electric Co Ltd:The | High-strength conductive copper alloy and its production |
| JPH01306534A (en) * | 1988-05-31 | 1989-12-11 | Yazaki Corp | Copper alloy conductor for thin wire |
| KR100631041B1 (en) | 2005-03-04 | 2006-10-04 | 주식회사 풍산 | free cutting brass alloy having an improved of machinability and workability |
| JP4709296B2 (en) | 2009-04-17 | 2011-06-22 | 日立電線株式会社 | Method for manufacturing diluted copper alloy material |
| KR101185548B1 (en) * | 2010-02-24 | 2012-09-24 | 주식회사 풍산 | Copper alloy having high strength and high conductivity, and method for manufacture the same |
| JP5569330B2 (en) * | 2010-10-20 | 2014-08-13 | 日立金属株式会社 | Cable for music / video |
| CN102181744A (en) * | 2011-04-27 | 2011-09-14 | 东莞市嘉盛铜材有限公司 | High-performance beryllium-copper alloy and preparation method thereof |
| JP5772338B2 (en) * | 2011-07-21 | 2015-09-02 | 日立金属株式会社 | Soft dilute copper alloy wire, soft dilute copper alloy sheet and soft dilute copper alloy stranded wire |
| JP2013040384A (en) * | 2011-08-17 | 2013-02-28 | Hitachi Cable Ltd | Wiring material and plate material using soft dilute copper alloy |
| US9165750B2 (en) * | 2012-01-23 | 2015-10-20 | Jx Nippon Mining & Metals Corporation | High purity copper—manganese alloy sputtering target |
| CN104004938B (en) * | 2014-05-24 | 2016-02-10 | 安徽永杰铜业有限公司 | A kind of red copper and castmethod |
| CN105132734A (en) * | 2015-07-13 | 2015-12-09 | 南通长江电器实业有限公司 | High-strength and high-electric-conductivity copper alloy material |
| CN110747365B (en) * | 2019-11-14 | 2021-01-15 | 中南大学 | High-plasticity high-strength high-conductivity CuCrZr copper alloy and preparation method thereof |
| CN113186421A (en) * | 2021-05-04 | 2021-07-30 | 宁波华成阀门有限公司 | Corrosion-resistant copper alloy and valve preparation method |
| CN115198135B (en) * | 2022-07-07 | 2023-06-16 | 浙江鸿越铜业有限公司 | Alloy copper bar and processing technology thereof |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4871323A (en) * | 1971-12-28 | 1973-09-27 | ||
| JPS6058783B2 (en) * | 1982-01-20 | 1985-12-21 | 日本鉱業株式会社 | Method for manufacturing copper alloy for lead material of semiconductor equipment |
| JPS59193233A (en) * | 1983-04-15 | 1984-11-01 | Toshiba Corp | Copper alloy |
| JPS6045698A (en) * | 1983-08-19 | 1985-03-12 | 株式会社協立有機工業研究所 | Papermaking method for performing internal sizing of amphoteric starch |
| JPS60194030A (en) * | 1984-03-15 | 1985-10-02 | Mitsubishi Metal Corp | Copper alloy for lead material for semiconductor device |
| JPS60221541A (en) * | 1984-04-07 | 1985-11-06 | Kobe Steel Ltd | Copper alloy superior in hot workability |
| JPS60245752A (en) * | 1984-05-22 | 1985-12-05 | Nippon Mining Co Ltd | High strength copper alloy having high electric conductivity |
-
1986
- 1986-10-23 JP JP61252644A patent/JPH0784631B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1327017C (en) * | 2004-07-22 | 2007-07-18 | 同济大学 | Novel elastic conductive alloy and its preparing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63109130A (en) | 1988-05-13 |
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| LAPS | Cancellation because of no payment of annual fees |