KR20130136183A - Copper alloy element and the method for production same - Google Patents

Abstract

The present invention relates to a copper alloy element and a manufacturing method for the element and more specifically, the invention is to manufacture the copper alloy element containing copper (Cu), iron (Fe), manganese (Mn) and phosphorus (P) with improved tensile strength and electrical conductivity. The copper alloy element containing copper (Cu), iron (Fe), manganese (Mn) and phosphorus (P) is provided with excellent electrical conductivity and tensile strength more than existing copper alloy by differently comprising the composition. The copper alloy element has excellent flame resistance and is used for lead frame materials for semiconductors, transistor, alloy, pipes required for high strength. The copper alloy element is used for electrical parts such as connectors and switches required for more excellent tensile strength, electrical conductivity and flame resistance than existing copper alloy. The copper alloy element has high rigidity and conductivity without surface defects and lowering the conductivity by comprising Cu-Fe-P alloy with manganese (Mn). [Reference numerals] (S1) Casting step;(S2) Hot rolling step;(S3) First annealing step;(S4) Cold rolling step;(S5) Second annealing step;(S6) Final rolling step

Description

Copper alloy member and manufacturing method {COPPER ALLOY ELEMENT AND THE METHOD FOR PRODUCTION SAME}

The present invention has a high electrical conductivity while increasing or maintaining the tensile strength by producing a copper alloy in a composition containing copper (Cu), iron (Fe), manganese (Mn) and phosphorus (P), copper (Cu ), By varying the ratio of the composition of the copper alloy containing iron (Fe), manganese (Mn) and phosphorus (P), has a superior tensile strength and electrical conductivity than conventional copper alloys, as well as excellent softening properties. It can be applied to semiconductor leadframe materials, transistor materials, copper tubes, and pipes, which require high electrical conductivity and high strength, and connectors, switches, and switches that require higher tensile strength, electrical conductivity, and softening resistance than conventional copper alloys. It can be applied to the same electronic parts, Cu-Fe-P-based alloys, including manganese (Mn), there is no surface defect does not drop the conductivity, as well as high strength and high conductivity copper alloy member and its manufacturing method Technology.

Generally, Cu-Fe-P-based alloys are used as copper alloys for semiconductor lead frames. For example, copper alloys containing 0.05 to 0.15 wt% of iron (Fe) and 0.025 to 0.04 wt% of phosphorus (P). (C19210) and copper alloy (CDA194) containing 2.1 to 2.6 wt% of iron (Fe) have been widely used as a lead frame material for semiconductors because of excellent strength and conductivity among copper alloys.

In recent years, as the leadframe has been miniaturized, there is a need for workability in addition to electrical conductivity, and development of a alloy having high strength while maintaining high conductivity has been required.

Cu-Fe-P-based alloys have high conductivity, but for high strength, Cu-Fe-P-based alloys have increased the content of Fe and P or added third elements such as Sn, Mg, and Ca. However, when the amount of these elements is increased, the strength is increased, but on the contrary, the conductivity is lowered. Therefore, it is difficult to use them in parts applied to industrial fields.

In order to solve this problem, patents have been filed for obtaining strength and electrical conductivity required in leadframe materials.

First, in Japanese Patent Laid-Open No. 13-178670, the total amount of Fe or Ni and P is 0.05 to 2.0% by weight, Zn is 5% by weight or more, Sn is 0.1 to 3.30% by weight, and the balance is made of Cu. Fe or Ni to P atomic weight ratio (Fe / P, Ni / P, Fe + Ni) / P is 0.2 to 3.0, the particle size is controlled to 35㎛ or less, Fe-P compound less than 0.2㎛ is uniform Disperse copper alloys have been disclosed.

Next, Japanese Patent Laid-Open No. 63-161134 discloses a copper alloy containing 0.01 to 0.3 wt% of Fe, 0.4 wt% or less of Z, 1.5 wt% of Zn, 0.2 to 1.5 wt% of Sn, and the balance of Cu. This has been disclosed.

However, the above patents maintain high strength, but they do not have the electrical conductivity required as the lead frame material, and also have the problem of lack of flame resistance.

Therefore, copper alloys are manufactured with a composition containing copper (Cu), iron (Fe), manganese (Mn) and phosphorus (P) to have high electrical conductivity while increasing or maintaining tensile strength, and copper (Cu) and iron Copper alloy member and its manufacture which have superior tensile strength and electrical conductivity as well as excellent softening resistance as compared with the existing copper alloy by varying the composition ratio of copper alloy containing (Fe), manganese (Mn) and phosphorus (P). The development of the method is urgently required.

Therefore, the present invention has been conceived to solve the above problems, by increasing the tensile strength by manufacturing a copper alloy with a composition containing copper (Cu), iron (Fe), manganese (Mn) and phosphorus (P). Another object is to provide a copper alloy member having a high electrical conductivity while maintaining the same, and a method of manufacturing the same.

Another object of the present invention is to vary the composition of the copper alloy containing copper (Cu), iron (Fe), manganese (Mn) and phosphorus (P), thereby having excellent tensile strength and electrical conductivity than conventional copper alloys. Of course, the present invention provides a copper alloy member having excellent softening properties and a method of manufacturing the same.

Another object of the present invention is to provide a copper alloy member that can be applied to a lead frame material for a semiconductor, a transistor material, a copper tube, and a pipe that requires high electrical conductivity and high strength, and a method of manufacturing the same.

Another object of the present invention is to provide a copper alloy member and a method for manufacturing the same, which can be applied to electronic components such as connectors and switches requiring tensile strength, electrical conductivity and softening resistance superior to those of conventional copper alloys.

Another object of the present invention is to include a manganese (Mn) in the Cu-Fe-P-based alloy to provide a copper alloy member having high strength and high conductivity as well as not dropping the conductivity without surface defects, and a method of manufacturing the same.

Copper alloy member according to an embodiment of the present invention for achieving the above object is 0.05 to 0.30% by weight of iron (Fe), 0.05 to 0.20% by weight of manganese (Mn), 0.015 to 0.10% by weight of phosphorus (P) ) And the remainder copper (Cu) and other unavoidable impurities.

In the present invention, the composition of the iron (Fe), manganese (Mn), phosphorus (P), copper (Cu) contains at least one of Zn, Sn, Al, Ni in 1.0% by weight or less It is characterized by.

In the present invention, the copper alloy member is characterized by having a tensile strength of 40 kgf / mm 2 or more, and an electrical conductivity of 50% IACS or more.

In the present invention, the particle size of the Mn-P and Fe-P precipitates in the composition of the iron (Fe), manganese (Mn), phosphorus (P), copper (Cu) is 10㎛ to 30㎛ And the size of the precipitate is 2 or less per 2 mm 2.

In addition, the method for manufacturing a rolled material of copper alloy according to an embodiment of the present invention for achieving the above object is 0.05 to 0.30% by weight of iron, 0.05 to 0.20% by weight of manganese, 0.015 to 0.10% by weight of phosphorus, balance Casting the billet to include copper; Hot rolling the cast alloy at 800 ° C. to 1000 ° C .; First annealing the hot rolled alloy at annealing for 1 to 10 hours at 400 ° C. to 600 ° C .; Cold rolling the intermediate annealing the primary annealed alloy at a reduction ratio of 30 to 70%; Secondary annealing the cold rolled alloy at a temperature of 500 ° C. to 800 ° C. for 30 to 600 seconds; Final cold rolling to finish roll the secondary annealed alloy to 20 to 40%; .

In addition, the copper tube manufacturing method of the copper alloy according to an embodiment of the present invention for achieving the above object is 0.05 to 0.3% by weight of iron (Fe), 0.05 to 0.2% by weight of manganese (Mn), 0.015 to 0.10% by weight Casting phosphorus (P) and copper (Cu) billets of the balance; A hot extrusion step of hot extruding said billet to obtain an element pipe; A cold tube rolling step of cold rolling the hot-extruded element pipe to obtain a tube material; Cold drawing the cold rolled tube; A level winding step of winding the cold drawn tube member in the form of a coil; Heat-treating the pipe wound in the form of a coil; .

As described above, the copper alloy member and the manufacturing method thereof according to the present invention has the following effects.

First, the present invention has high electrical conductivity while increasing or maintaining tensile strength by manufacturing copper alloy with a composition containing copper (Cu), iron (Fe), manganese (Mn) and phosphorus (P).

Second, by varying the ratio of the composition of the copper alloy containing copper (Cu), iron (Fe), manganese (Mn) and phosphorus (P), the present invention has superior tensile strength and electrical conductivity than conventional copper alloy Of course, the softening properties are also excellent.

Third, the present invention can be applied to lead frame materials for semiconductors, transistor materials, copper tubes, and pipes that require high electrical conductivity and high strength.

Fourth, the present invention can be applied to electronic components, such as connectors and switches, which require superior tensile strength, electrical conductivity, and softening resistance than conventional copper alloys.

Fifth, the present invention includes manganese (Mn) in the Cu-Fe-P-based alloy does not reduce the conductivity without surface defects, as well as high strength and high conductivity.

1 is a process flow diagram illustrating a method for manufacturing a rolled material of copper alloy according to an embodiment of the present invention.
Figure 2 is a process flow diagram illustrating a copper tube manufacturing method of a copper alloy according to an embodiment of the present invention.
Figure 3 is a scanning electron microscope (SEM) photographs that can confirm that the Mn-P precipitates appeared in the copper alloy member according to an embodiment of the invention.

Looking at a preferred embodiment of the present invention together with the accompanying drawings as follows, when it is determined that the detailed description of the known art or configuration related to the present invention may unnecessarily obscure the subject matter of the present invention The detailed description will be omitted, and the following terms are terms defined in consideration of functions in the present invention, which may vary according to intentions or customs of users or operators, and the definitions describe the copper alloy member and the manufacturing method of the present invention. It should be made based on the contents throughout the specification.

Hereinafter, the copper alloy member of the present invention and a manufacturing method thereof will be described in detail.

Copper alloy member of the present invention is 0.05 to 0.30% by weight of iron (Fe), 0.05 to 0.20% by weight of manganese (Mn), 0.015 to 0.10% by weight of phosphorus (P), and the balance of copper (Cu) And other unavoidable impurities. Here, the composition of the iron (Fe), manganese (Mn), phosphorus (P), copper (Cu) contains at least one of Zn, Sn, Al, Ni in 1.0% by weight or less, the copper alloy member Has a tensile strength of 40 kgf / mm 2 or more and an electrical conductivity of 50% IACS or more.

1 is a process flow diagram illustrating a method for manufacturing a rolled material of copper alloy according to an embodiment of the present invention, Figure 2 is a process flow diagram showing a method for manufacturing a copper tube of copper alloy according to an embodiment of the present invention.

As shown in FIG. 1, the process flow of manufacturing a rolled material of copper alloy is as follows.

First step S1 is a casting step, in which a billet is cast so as to include 0.05 to 0.30 wt% iron, 0.05 to 0.20 wt% manganese, 0.015 to 0.10 wt% phosphorus, and the balance copper.

The next step S2 is a hot rolling step, in which the cast alloy is hot rolled at 800 ° C to 1000 ° C. Here, when the hot rolling exceeds 1000 ℃, rather than the formation of precipitates, the same phenomenon appears even below 800 ℃.

The next step S3 is a first annealing step, in which the hot rolled alloy is first annealed by annealing for 1 to 10 hours at 400 ° C to 600 ° C. Here, the appropriate conditions during the first annealing is in the 1 to 10 hours at 400 ℃ to 600 ℃ in excess of 600 ℃ and more than 10 hours, directly affect the strength, rather than at high temperature and long time the electrical conductivity is reduced Demonstrate the ability to do so. If the temperature is less than 400 ° C and less than 1 hour, sedimentation or recrystallization is insufficient.

The next step S4 is a cold rolling step, which is cold rolling to intermediate-roll the primary annealed alloy at a reduction ratio of 30 to 70%. Here, the upper limit of the rolling reduction rate during cold rolling is not particularly defined, but a good result is usually obtained in the range of the processing rate of 85% or less, and the high processing rate increases the load on the rolling mill or the like. In secondary cold rolling, when the cold working rate is 70% or more, the amount of distortion in the material increases, and the bending workability decreases. On the other hand, if the cold working rate is 20% or less, sufficient strength effect cannot be obtained.

The next step S5 is a secondary annealing step, in which the cold rolled alloy is second annealed at 500 ° C. to 800 ° C. for 30 to 600 seconds.

Next step S6 is a final rolling step, which is the final cold rolling to finish rolling the secondary annealing alloy to 20 to 40%.

As shown in FIG. 2, the process flow of manufacturing a copper tube of a copper alloy is as follows.

First step S11 is a casting step, in which 0.05 to 0.30% by weight of iron (Fe), 0.05 to 0.2% by weight of manganese (Mn), 0.015 to 0.10% by weight of phosphorus (P), and the balance of copper The billet is cast to be (Cu).

The next step S12 is a hot extrusion step, in which the billet is hot extruded to hot extrusion to obtain an element pipe.

The next step S13 is a cold tube rolling step, in which the hot extruded element pipe is cold rolled to obtain a tube material by cold tube rolling.

The next step S14 is a cold drawing step, in which the cold drawn tube is cold drawn.

The next step S15 is a level winding step, in which the cold drawn tube is wound in the form of a coil.

Next step S16 is a heat treatment step, the heat treatment of the pipe wound in the coil form.

FIG. 3 is a scanning electron microscope (SEM) photograph showing that Mn-P precipitates appeared in a copper alloy according to an embodiment of the present invention. FIG.

As shown in Figure 3, the particle size of the Mn-P precipitates in the composition of the iron (Fe), manganese (Mn), phosphorus (P), copper (Cu) is 10㎛ to 30㎛, The size of precipitate is 2 or less per 2mm <2>. Mn-P precipitates in Cu bases are formed to improve electrical conductivity and strength.Mn is less than 0.05% by weight, and it is difficult to form precipitates. It is difficult to secure 50% IACS, which is the required level of the material for lead frame, which requires characteristics as the electrical conductivity is lowered beyond the deposition amount.

[Example]

Example 1

The alloy shown in Table 1 was melted in a high frequency melting furnace to produce an ingot having a thickness of 22 mm, a width of 40 mm, and a length of 180 mm. After heating this ingot at 870 degreeC for 1 hour, it hot-rolled to thickness 10mm, face-faced each 1 mm each, and cold-rolled to 1.5 mm. This rolled material was heat-treated at the temperature of 480 degreeC, and the annealing process was performed in order to remove distortion, and it rolled to 0.25 mm and obtained the cold rolled material shown in Table 2.

The manufacturing process according to the above embodiment of the present invention is not limited thereto, and cold rolling, aging treatment, and surface cleaning (after pickling) may be performed after hot rolling, as is usually performed in a factory to correspond to the quality required by individual customers. Processes such as polishing), tensile annealing, tension leveling and the like can be selected and combined correspondingly as necessary.

Table 2 shows the test results of the tensile strength (TS) and the electrical conductivity (E.C) by cutting the test piece obtained through the composition and manufacturing process.

Comparative Examples 1 and 2 (Cu-Fe-P-Sn-based) and Comparative Examples 3 and 4 (Cu-Fe-P-based) prepared a specimen by preparing a copper alloy having the specifications and components shown in Table 1.

 Honey. = Balance, balance division sample Component (% by weight) Cu Fe P Mn Sn Example 1 One Honey. 0.12 0.04 0.07 - Example 2 2 Honey. 0.10 0.08 0.10 - Example 3 3 Honey. 0.14 0.07 0.12 - Example 4 4 Honey. 0.15 0.10 0.10 - Comparative Example 1 Cu-Fe-P series
Sn addition
5 Honey. 0.15 0.05 - 0.13 Comparative Example 2 6 Honey. 0.10 -  - 0.08 Comparative Example 3 C19210 7 Honey. 0.10 0.05 - - Comparative Example 4 8 Honey. 0.12 0.04 -  -

Tensile strength (TS), electrical Conductivity (EC, electric conductivity), and the results of each test are shown in Table 2. In this case, the electrical conductivity (E.C) is the international annealed copper standard, and the electrical conductivity is measured based on 100% pure copper.

Tensile strength (elongation) according to KS B 0802, electrical conductivity related to electrical conductivity according to KS D 0240, tensile strength (elongation), electrical conductivity is measured according to the standard, softening hardness is 450 ℃ x 5min hardness It is measured.

division sample
number TS
(kgf / mm2) EC
(% IACS) Hardness
(Hv) Softening hardness
(450 ℃ x5min) Surface defects Example 1 One 46 78 136 126 X Example 2 2 50 81 142 129 X Example 3 3 53 78 152 134 X Example 4 4 54 75 153 138 X Comparative Example 1 5 54 60 154 134 X Comparative Example 2 6 49 69 140 120 X Comparative Example 3 7 45 88 129 108 X Comparative Example 4 8 43 90 122 103 X

As can be seen in Table 2, Samples 1 to 4 prepared according to the Examples are excellent in tensile strength, conductivity and conductivity, in particular in the case of softening hardness, unlike Samples 5 to 8 prepared according to Comparative Examples 1 to 4 Shows excellent flame retardant properties compared to Comparative Examples 7,8. In addition, good surface conditions were observed in Examples 1 to 4.

As described above, the copper alloy member and the method of manufacturing the same can be applied to semiconductor leadframe materials, transistor materials, copper tubes, pipes, as well as to electronic components such as connectors, switches, and the like.

Best Mode for Carrying Out the Invention In the drawings and specification, there have been disclosed preferred embodiments and the terminology used herein is for the purpose of describing the present invention only and not for limiting the scope of the present invention. Therefore, those skilled in the art will appreciate that various modifications and equivalent embodiments may be possible without departing from the scope of the invention.

Claims (6)

0.05 to 0.30% by weight of iron (Fe), 0.05 to 0.20% by weight of manganese (Mn), 0.015 to 0.10% by weight of phosphorus (P), the balance of copper (Cu) and other unavoidable impurities Copper alloy member comprising a. The method of claim 1,
Copper alloy member, characterized in that the composition of the iron (Fe), manganese (Mn), phosphorus (P), copper (Cu) at least one of Zn, Sn, Al, Ni is 1.0% by weight or less . The method of claim 1,
The copper alloy member has a tensile strength of 40 kgf / mm2 or more, and an electrical conductivity of 50% IACS or more. The method of claim 1,
In the composition of the iron (Fe), manganese (Mn), phosphorus (P), copper (Cu), the particle size of the Mn-P and Fe-P precipitates is 10㎛ to 30㎛, the size of the precipitate Copper alloy member, characterized in that less than 2 per 2mm2. In the method of manufacturing a rolled material of copper alloy,
Casting a billet such that 0.05 to 0.30 wt% iron, 0.05 to 0.20 wt% manganese, 0.015 to 0.10 wt% phosphorus, and the balance copper are included;
Hot rolling the cast alloy at 800 ° C. to 1000 ° C .;
First annealing the hot rolled alloy at annealing for 1 to 10 hours at 400 ° C. to 600 ° C .;
Cold rolling the intermediate annealing the primary annealed alloy at a reduction ratio of 30 to 70%;
Secondary annealing the cold rolled alloy at a temperature of 500 ° C. to 800 ° C. for 30 to 600 seconds;
Final cold rolling to finish roll the secondary annealed alloy to 20 to 40%; Rolled material manufacturing method of a copper alloy, characterized in that it comprises a. In the copper tube manufacturing method of copper alloy,
Billets are cast so that 0.05 to 0.30% by weight of iron (Fe), 0.05 to 0.20% by weight of manganese (Mn), 0.015 to 0.10% by weight of phosphorus (P), and the balance are copper (Cu) Making a step;
A hot extrusion step of hot extruding said billet to obtain an element pipe;
A cold tube rolling step of cold rolling the hot-extruded element pipe to obtain a tube material;
Cold drawing the cold rolled tube;
A level winding step of winding the cold drawn tube member in the form of a coil; Heat-treating the pipe wound in the form of a coil; Copper tube manufacturing method of the copper alloy comprising a.

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