TW200706661A - Cu-Zn-Sn alloy for electrical and electronic equipment - Google Patents

Cu-Zn-Sn alloy for electrical and electronic equipment

Info

Publication number
TW200706661A
TW200706661A TW095125880A TW95125880A TW200706661A TW 200706661 A TW200706661 A TW 200706661A TW 095125880 A TW095125880 A TW 095125880A TW 95125880 A TW95125880 A TW 95125880A TW 200706661 A TW200706661 A TW 200706661A
Authority
TW
Taiwan
Prior art keywords
mass
concentration
copper alloy
electrical
electronic equipment
Prior art date
Application number
TW095125880A
Other languages
Chinese (zh)
Other versions
TWI327173B (en
Inventor
Takaaki Hatano
Toshihiro Niimi
Yasunobu Ishikawa
Kazuhiro Taki
Original Assignee
Nippon Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co filed Critical Nippon Mining Co
Publication of TW200706661A publication Critical patent/TW200706661A/en
Application granted granted Critical
Publication of TWI327173B publication Critical patent/TWI327173B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/60—Compounds characterised by their crystallite size
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/40—Electric properties
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C2202/00—Physical properties

Abstract

To provide an inexpensive copper alloy sufficient in both electric conductivity as well as strength and capable of coping with size reduction in the electrical and electronic equipment components. It is possible to inexpensively obtain a copper alloy which has an electric conductivity of not less than 35%IACS and a tensile strength of not less than 410 Mpa and is sustainable to 180 DEG closed bending in parallel way and normal way by adjusting grain shape and crystal orientation of the grains to suitable ranges. The copper alloy contains 2 to 12 mass% Zn and 0.1 to 1.0 mass% Sn, the Sn mass% concentration ([%Sn]) and the Zn mass% concentration ([%Zn]) are controlled so as to satisfy the relationship: 0.5 ≤ [%Sn]+0.16[%Zn] ≤ 2.0, the balance comprises copper and inevitable impurities thereof, the S concentration in the inevitable impurities is not more than 30 mass ppm, and the O concentration is not larger than 50 mass ppm.
TW095125880A 2005-07-15 2006-07-14 Cu-Zn-Sn alloy for electrical and electronic equipment TW200706661A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005207556 2005-07-15

Publications (2)

Publication Number Publication Date
TW200706661A true TW200706661A (en) 2007-02-16
TWI327173B TWI327173B (en) 2010-07-11

Family

ID=37609650

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095125880A TW200706661A (en) 2005-07-15 2006-07-14 Cu-Zn-Sn alloy for electrical and electronic equipment

Country Status (3)

Country Link
KR (1) KR100792653B1 (en)
CN (1) CN1897171B (en)
TW (1) TW200706661A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI491325B (en) * 2012-04-10 2015-07-01 Jx Nippon Mining & Metals Corp A rolled copper foil, a copper clad laminate, a flexible printed wiring board, and a method of manufacturing the same

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5339995B2 (en) * 2009-04-01 2013-11-13 Ｊｘ日鉱日石金属株式会社 Cu-Zn-Sn alloy plate and Cu-Zn-Sn alloy Sn plating strip
JP5140171B2 (en) * 2011-03-18 2013-02-06 Ｊｘ日鉱日石金属株式会社 Copper alloy strip used for battery tab material for charging
JP5148023B2 (en) * 2011-04-15 2013-02-20 株式会社小松ライト製作所 Thermal protector and battery using the same
JP6029296B2 (en) * 2012-03-08 2016-11-24 Ｊｘ金属株式会社 Cu-Zn-Sn-Ca alloy for electrical and electronic equipment
JP6111028B2 (en) * 2012-03-26 2017-04-05 Ｊｘ金属株式会社 Corson alloy and manufacturing method thereof
JP5130406B1 (en) * 2012-03-29 2013-01-30 Ｊｘ日鉱日石金属株式会社 Cu-Zn-Sn copper alloy strip
WO2014115307A1 (en) * 2013-01-25 2014-07-31 三菱伸銅株式会社 Copper-alloy plate for terminal/connector material, and method for producing copper-alloy plate for terminal/connector material
JP2015086452A (en) * 2013-11-01 2015-05-07 株式会社オートネットワーク技術研究所 Copper alloy wire, copper alloy twisted wire, coated cable, wire harness and manufacturing method of copper alloy wire
JP6101750B2 (en) * 2015-07-30 2017-03-22 三菱マテリアル株式会社 Copper alloy for electronic and electrical equipment, copper alloy sheet for electronic and electrical equipment, conductive parts and terminals for electronic and electrical equipment
KR20220107184A (en) * 2019-11-29 2022-08-02 미쓰비시 마테리알 가부시키가이샤 Copper alloy, copper alloy plastic processing material, electronic/electrical device parts, terminal, bus bar, heat dissipation board
CN114507828B (en) * 2022-02-17 2022-12-02 贵溪奥泰铜业有限公司 Phosphor bronze alloy with excellent conductivity and production method thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3105392B2 (en) * 1994-03-18 2000-10-30 同和鉱業株式会社 Manufacturing method of copper base alloy for connector
JP3520046B2 (en) * 2000-12-15 2004-04-19 古河電気工業株式会社 High strength copper alloy
CN1177946C (en) * 2001-09-07 2004-12-01 同和矿业株式会社 Copper alloy for connector use and producing method thereof
CN1624177A (en) * 2004-12-08 2005-06-08 昆明贵金属研究所 High compact, non-segregation wear-resisting copper alloy and its preparation process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI491325B (en) * 2012-04-10 2015-07-01 Jx Nippon Mining & Metals Corp A rolled copper foil, a copper clad laminate, a flexible printed wiring board, and a method of manufacturing the same

Also Published As

Publication number Publication date
KR20070009433A (en) 2007-01-18
CN1897171B (en) 2012-11-28
TWI327173B (en) 2010-07-11
KR100792653B1 (en) 2008-01-09
CN1897171A (en) 2007-01-17

Similar Documents

Publication Publication Date Title
TW200706661A (en) Cu-Zn-Sn alloy for electrical and electronic equipment
EP2508632A4 (en) Copper alloy sheet
WO2008099892A1 (en) Copper alloy sheet for electrical and electronic parts excelling in strength and formability
TW200706508A (en) Method for producing an electronic component passivated by lead free glass
EP3020836A3 (en) Copper alloy for electronic device, method for producing it, and rolled copper alloy for electronic device
TW200611985A (en) Copper-zinc-silicon alloy, its use and its production
TW200619401A (en) Copper alloy thin films, copper alloy sputtering targets and flat panel displays
MY142123A (en) Copper alloy
TW200504229A (en) Copper alloy with high strength and high conductivity
TW200704789A (en) Sn-plated copper alloy bar having excellent fatigue characteristics
MY170901A (en) Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar
EP2088214A4 (en) Copper alloy plate for electrical and electronic components
WO2009048008A1 (en) Lead-free, free-machining brass having excellent castability
ATE471391T1 (en) CU-NI-SI BASED COPPER ALLOY FOIL MATERIAL AND PRODUCTION METHOD THEREOF
MY167861A (en) Leadless free-cutting copper alloy and method for producing the same
CN103469004B (en) A kind of Pb-free copper-alloy material
ATE431435T1 (en) CORROSION-RESISTANT COPPER ALLOY WITH MAGNESIUM AND USE THEREOF
IN2014MN01997A (en)
CN102851534A (en) Rare earth copper alloy for electronic materials
MX2010003995A (en) Copper tin nickel phosphorus alloys with improved strength and formability.
CN103849793B (en) One electrically uses copper alloy composite sheet
CN104451404A (en) Stainless steel alloy for electronic material with balanced properties
WO2008146540A1 (en) Gold alloy
CN104561643A (en) Microalloy for electronic material
TW200741018A (en) Copper alloy having excellent hot workability