IN2014MN01997A - - Google Patents

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Publication number
IN2014MN01997A
IN2014MN01997A IN1997MUN2014A IN2014MN01997A IN 2014MN01997 A IN2014MN01997 A IN 2014MN01997A IN 1997MUN2014 A IN1997MUN2014 A IN 1997MUN2014A IN 2014MN01997 A IN2014MN01997 A IN 2014MN01997A
Authority
IN
India
Prior art keywords
mass
particle diameter
relationship
stress relaxation
precipitate
Prior art date
Application number
Inventor
Keiichiro Oishi
Takashi Hokazono
Michio Takasaki
Yosuke Nakasato
Original Assignee
Mitsubishi Shindo Kk
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Shindo Kk, Mitsubishi Materials Corp filed Critical Mitsubishi Shindo Kk
Publication of IN2014MN01997A publication Critical patent/IN2014MN01997A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)

Abstract

32This copper alloy plate for a terminal/connector material: contains 4.5 12.0 mass% of Zn 0.40 0.9 mass% of Sn 0.01 0.08 mass% of P and 0.20 0.85 mass% of Ni with inevitable impurities and Cu constituting the remainder thereof; satisfies the relationship 7=Ni/P=40 when satisfying the relationship 11=Zn+7.5×Sn+16×P+3.5×Ni=19 and containing 0.35 0.85 mass% of Ni; has an average crystal particle diameter of 2.0 8.0µm; has an average particle diameter of the circular or elliptical precipitate of 4.0 25.0nm or contains a proportion of the number of precipitate particles having a particle diameter of 4.0 25.0nm among the precipitate particles of 70% or higher; has a conductivity of 29% IACS or higher; in terms of stress relaxation resistance properties exhibits a percentage of stress relaxation after 1000 hours at 150°C of 30% or lower; has a bending workability when W bending of R/t=0.5; exhibits excellent solder wettability; and has a Young s modulus of 100×10N/mm or higher.
IN1997MUN2014 2013-01-25 2013-03-19 IN2014MN01997A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2013/051602 WO2014115307A1 (en) 2013-01-25 2013-01-25 Copper-alloy plate for terminal/connector material, and method for producing copper-alloy plate for terminal/connector material
PCT/JP2013/057808 WO2014115342A1 (en) 2013-01-25 2013-03-19 Copper-alloy plate for terminal/connector material, and method for producing copper-alloy plate for terminal/connector material

Publications (1)

Publication Number Publication Date
IN2014MN01997A true IN2014MN01997A (en) 2015-08-14

Family

ID=51227122

Family Applications (1)

Application Number Title Priority Date Filing Date
IN1997MUN2014 IN2014MN01997A (en) 2013-01-25 2013-03-19

Country Status (8)

Country Link
US (3) US9957589B2 (en)
KR (1) KR20140127911A (en)
CN (1) CN104271783B (en)
IN (1) IN2014MN01997A (en)
MX (1) MX342116B (en)
SG (1) SG11201406611QA (en)
TW (1) TWI454585B (en)
WO (2) WO2014115307A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014115307A1 (en) * 2013-01-25 2014-07-31 三菱伸銅株式会社 Copper-alloy plate for terminal/connector material, and method for producing copper-alloy plate for terminal/connector material
KR101957618B1 (en) * 2014-11-07 2019-03-12 스미토모 긴조쿠 고잔 가부시키가이샤 Copper alloy target
US9883588B2 (en) * 2014-12-12 2018-01-30 Nippon Steel & Sumitomo Metal Corporation Oriented copper plate, copper-clad laminate, flexible circuit board, and electronic device
JP2016132816A (en) * 2015-01-21 2016-07-25 三菱マテリアル株式会社 Copper alloy for electronic and electrical device, copper alloy thin sheet for electronic and electrical device and conductive component and terminal for electronic and electrical device
KR102116006B1 (en) 2018-08-03 2020-05-27 (주)엠티에이 Platform for growing carbon materials having large area and method for growing carbon materials using the same

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Also Published As

Publication number Publication date
TWI454585B (en) 2014-10-01
CN104271783B (en) 2016-10-26
US20150318068A1 (en) 2015-11-05
CN104271783A (en) 2015-01-07
US20160104550A1 (en) 2016-04-14
WO2014115342A1 (en) 2014-07-31
US9957589B2 (en) 2018-05-01
TW201430150A (en) 2014-08-01
SG11201406611QA (en) 2014-11-27
WO2014115307A1 (en) 2014-07-31
MX2014012441A (en) 2015-01-14
US10020088B2 (en) 2018-07-10
US20150122380A1 (en) 2015-05-07
MX342116B (en) 2016-09-14
KR20140127911A (en) 2014-11-04

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