TW201612326A - Copper alloy plate and method for manufacturing copper alloy plate - Google Patents

Copper alloy plate and method for manufacturing copper alloy plate

Info

Publication number
TW201612326A
TW201612326A TW104109813A TW104109813A TW201612326A TW 201612326 A TW201612326 A TW 201612326A TW 104109813 A TW104109813 A TW 104109813A TW 104109813 A TW104109813 A TW 104109813A TW 201612326 A TW201612326 A TW 201612326A
Authority
TW
Taiwan
Prior art keywords
copper alloy
alloy plate
mass
precipitates
stress
Prior art date
Application number
TW104109813A
Other languages
Chinese (zh)
Other versions
TWI540213B (en
Inventor
Keiichiro Oishi
Kouichi SUZAKI
Michio Takasaki
Takashi Hokazono
Original Assignee
Mitsubishi Shindo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Shindo Kk filed Critical Mitsubishi Shindo Kk
Publication of TW201612326A publication Critical patent/TW201612326A/en
Application granted granted Critical
Publication of TWI540213B publication Critical patent/TWI540213B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)

Abstract

The object is to provide a copper alloy plate having superior properties in stress corrosion cracking resistance, stress relaxation, tensile strength, proof stress, electric conductivity, bendability, and solder wettability. The copper alloy plate includes 4 to 14 mass % of Zn, 0.1 to 1 mass % of Sn, 0.005 to 0.08 mass % of P, 1.0 to 2.4 mass % of Ni, and the balance Cu and inevitable impurities. The composition satisfies the relationships of 7 ≤ [Zn]+3*[Sn]+2*[Ni] ≤ 18, 0 ≤ [Zn]-0.3*[Sn]-1.8*[Ni] ≤ 11, 0.3 ≤ (3*[Ni]+0.5*[Sn])/[Zn] ≤ 1.6, 1.8 ≤ [Ni]/[Sn] ≤ 10, 16 ≤ [Ni]/[P] ≤ 250. The average crystal grain size of the plate is 2 to 9 [mu]m. The average grain size of circular or elliptical precipitates is 3 to 75 nm, or the ratio of numbers of precipitates having grain sizes of 3 to 75 nm among the circular or elliptical precipitates is 70% or more. The electric conductivity is 24% IACS or more, and the stress relaxation resistance at 150 DEG C for 1000 hours is 25% or less.
TW104109813A 2014-09-26 2015-03-26 Copper alloy plate and method for manufacturing copper alloy plate TWI540213B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014196430 2014-09-26

Publications (2)

Publication Number Publication Date
TW201612326A true TW201612326A (en) 2016-04-01
TWI540213B TWI540213B (en) 2016-07-01

Family

ID=55580717

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104109813A TWI540213B (en) 2014-09-26 2015-03-26 Copper alloy plate and method for manufacturing copper alloy plate

Country Status (4)

Country Link
KR (1) KR101777987B1 (en)
CN (1) CN106460097B (en)
TW (1) TWI540213B (en)
WO (1) WO2016047175A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107331444A (en) * 2017-06-20 2017-11-07 江苏亨通线缆科技有限公司 Track traffic synthetic earth cable
US11926889B2 (en) 2019-08-06 2024-03-12 Mitsubishi Materials Corporation Copper alloy plate, copper alloy plate with plating film, and methods for producing these

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108411150B (en) * 2018-01-22 2019-04-05 公牛集团股份有限公司 Sleeve high-performance copper alloy material and manufacturing method
JP6713074B1 (en) * 2019-04-16 2020-06-24 Ｄｏｗａメタルテック株式会社 Copper alloy sheet and method for producing the same
CN115852200A (en) * 2022-11-29 2023-03-28 宁波金田铜业(集团)股份有限公司 Brass strip and preparation method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3744810B2 (en) 2001-03-30 2006-02-15 株式会社神戸製鋼所 Copper alloy for terminal / connector and manufacturing method thereof
JP2007056365A (en) 2005-07-27 2007-03-08 Mitsui Mining & Smelting Co Ltd Copper-zinc-tin alloy and manufacturing method therefor
JP5040140B2 (en) * 2006-03-31 2012-10-03 Ｄｏｗａメタルテック株式会社 Cu-Ni-Si-Zn-based copper alloy
EP2757167B1 (en) * 2011-09-16 2018-05-30 Mitsubishi Shindoh Co., Ltd. Copper alloy sheet and production method for copper alloy sheet
JP5153949B1 (en) 2012-03-30 2013-02-27 Ｊｘ日鉱日石金属株式会社 Cu-Zn-Sn-Ni-P alloy
JP5572753B2 (en) * 2012-12-26 2014-08-13 三菱マテリアル株式会社 Copper alloy for electronic and electrical equipment, copper alloy sheet for electronic and electrical equipment, conductive parts and terminals for electronic and electrical equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107331444A (en) * 2017-06-20 2017-11-07 江苏亨通线缆科技有限公司 Track traffic synthetic earth cable
US11926889B2 (en) 2019-08-06 2024-03-12 Mitsubishi Materials Corporation Copper alloy plate, copper alloy plate with plating film, and methods for producing these

Also Published As

Publication number Publication date
CN106460097B (en) 2018-04-24
TWI540213B (en) 2016-07-01
KR101777987B1 (en) 2017-09-26
KR20160146943A (en) 2016-12-21
CN106460097A (en) 2017-02-22
WO2016047175A1 (en) 2016-03-31

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