MX2018011711A - Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relays. - Google Patents

Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relays.

Info

Publication number
MX2018011711A
MX2018011711A MX2018011711A MX2018011711A MX2018011711A MX 2018011711 A MX2018011711 A MX 2018011711A MX 2018011711 A MX2018011711 A MX 2018011711A MX 2018011711 A MX2018011711 A MX 2018011711A MX 2018011711 A MX2018011711 A MX 2018011711A
Authority
MX
Mexico
Prior art keywords
electronic
electrical equipment
copper alloy
busbar
relays
Prior art date
Application number
MX2018011711A
Other languages
Spanish (es)
Inventor
Maki Kazunari
Matsunaga Hirotaka
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority claimed from PCT/JP2017/012993 external-priority patent/WO2017170733A1/en
Publication of MX2018011711A publication Critical patent/MX2018011711A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • C21D9/46—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for sheet metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/02—Single bars, rods, wires, or strips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/14—Terminal arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/54—Contact arrangements
    • H01H50/56—Contact spring sets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members

Abstract

The present invention is characterized by: including at least 0.15 mass% and less than 0.35 mass% Mg and at least 0.0005 mass% and less than 0.01 mass% P, with the remainder being Cu and unavoidable impurities; the conductivity exceeding 75% IACS; the Mg content [Mg] (mass%) and the P content [P] (mass%) fulfilling the relationship [Mg] + 20 x [P] < 0.5; the H content being no more than 10 mass ppm; the O content being no more than 100 mass ppm; the S content being no more than 50 mass ppm; and the C content being no more than 10 mass ppm.
MX2018011711A 2016-03-30 2017-03-29 Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relays. MX2018011711A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016069079 2016-03-30
JP2017063258A JP6226097B2 (en) 2016-03-30 2017-03-28 Copper alloy for electronic and electrical equipment, copper alloy sheet material for electronic and electrical equipment, electronic and electrical equipment parts, terminals, bus bars, and movable pieces for relays
PCT/JP2017/012993 WO2017170733A1 (en) 2016-03-30 2017-03-29 Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relays

Publications (1)

Publication Number Publication Date
MX2018011711A true MX2018011711A (en) 2018-12-19

Family

ID=60045499

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2018011711A MX2018011711A (en) 2016-03-30 2017-03-29 Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relays.

Country Status (6)

Country Link
EP (1) EP3438299B1 (en)
JP (1) JP6226097B2 (en)
KR (1) KR102327539B1 (en)
CN (1) CN108431256A (en)
MX (1) MX2018011711A (en)
TW (1) TWI709651B (en)

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US10676803B2 (en) 2015-09-09 2020-06-09 Mitsubishi Materials Corporation Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar
WO2017170699A1 (en) 2016-03-30 2017-10-05 三菱マテリアル株式会社 Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relays
WO2017170733A1 (en) 2016-03-30 2017-10-05 三菱マテリアル株式会社 Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relays
JP7180102B2 (en) * 2018-03-30 2022-11-30 三菱マテリアル株式会社 Copper alloys for electronic and electrical equipment, copper alloy sheet materials for electronic and electrical equipment, parts for electronic and electrical equipment, terminals and bus bars
JP6780187B2 (en) 2018-03-30 2020-11-04 三菱マテリアル株式会社 Copper alloys for electronic / electrical equipment, copper alloy strips for electronic / electrical equipment, parts for electronic / electrical equipment, terminals, and busbars
MX2020009869A (en) 2018-03-30 2020-10-12 Mitsubishi Materials Corp Copper alloy for electronic/electric device, copper alloy sheet/strip material for electronic/electric device, component for electronic/electric device, terminal, and busbar.
JP7180101B2 (en) * 2018-03-30 2022-11-30 三菱マテリアル株式会社 Copper alloys for electronic and electrical equipment, copper alloy sheet materials for electronic and electrical equipment, parts for electronic and electrical equipment, terminals and bus bars
JP6863409B2 (en) * 2018-12-26 2021-04-21 三菱マテリアル株式会社 Copper alloy plate, copper alloy plate with plating film and manufacturing method of these
MX2021007760A (en) 2018-12-26 2021-08-05 Mitsubishi Materials Corp Copper alloy plate, plating film-attached copper alloy plate, and methods respectively for manufacturing these products.
CN110172609A (en) * 2019-05-16 2019-08-27 红河学院 A kind of high-strength high-conductivity copper magnesium system alloy and preparation method thereof
JP7024925B2 (en) * 2019-11-29 2022-02-24 三菱マテリアル株式会社 Copper alloys, plastic working materials for copper alloys, parts for electronic and electrical equipment, terminals, bus bars, heat dissipation boards
CN114761590B9 (en) * 2019-11-29 2023-12-08 三菱综合材料株式会社 Copper alloy, copper alloy plastic working material, electronic/electrical device module, terminal, bus bar, and heat dissipating substrate
JP7443737B2 (en) * 2019-12-10 2024-03-06 三菱マテリアル株式会社 Copper alloy plate, copper alloy plate with plating film, and manufacturing method thereof

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JP3796784B2 (en) * 1995-12-01 2006-07-12 三菱伸銅株式会社 Copper alloy thin plate for manufacturing connectors and connectors manufactured with the thin plates
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Also Published As

Publication number Publication date
EP3438299A1 (en) 2019-02-06
TW201807204A (en) 2018-03-01
CN108431256A (en) 2018-08-21
TWI709651B (en) 2020-11-11
KR20180125446A (en) 2018-11-23
EP3438299A4 (en) 2019-12-18
JP2017186662A (en) 2017-10-12
EP3438299B1 (en) 2023-05-03
JP6226097B2 (en) 2017-11-08
KR102327539B1 (en) 2021-11-16

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