EP3438299A4 - Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relays - Google Patents
Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relays Download PDFInfo
- Publication number
- EP3438299A4 EP3438299A4 EP17775267.2A EP17775267A EP3438299A4 EP 3438299 A4 EP3438299 A4 EP 3438299A4 EP 17775267 A EP17775267 A EP 17775267A EP 3438299 A4 EP3438299 A4 EP 3438299A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- electronic
- electrical equipment
- copper alloy
- busbar
- relays
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title 2
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
- C21D9/46—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for sheet metals
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/02—Single bars, rods, wires, or strips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H50/00—Details of electromagnetic relays
- H01H50/14—Terminal arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H50/00—Details of electromagnetic relays
- H01H50/54—Contact arrangements
- H01H50/56—Contact spring sets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electromagnetism (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016069079 | 2016-03-30 | ||
JP2017063258A JP6226097B2 (en) | 2016-03-30 | 2017-03-28 | Copper alloy for electronic and electrical equipment, copper alloy sheet material for electronic and electrical equipment, electronic and electrical equipment parts, terminals, bus bars, and movable pieces for relays |
PCT/JP2017/012993 WO2017170733A1 (en) | 2016-03-30 | 2017-03-29 | Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relays |
Publications (3)
Publication Number | Publication Date |
---|---|
EP3438299A1 EP3438299A1 (en) | 2019-02-06 |
EP3438299A4 true EP3438299A4 (en) | 2019-12-18 |
EP3438299B1 EP3438299B1 (en) | 2023-05-03 |
Family
ID=60045499
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP17775267.2A Active EP3438299B1 (en) | 2016-03-30 | 2017-03-29 | Copper alloy plate strip for electronic and electrical equipment, component, terminal, busbar and movable piece for relays |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP3438299B1 (en) |
JP (1) | JP6226097B2 (en) |
KR (1) | KR102327539B1 (en) |
CN (1) | CN108431256A (en) |
MX (1) | MX2018011711A (en) |
TW (1) | TWI709651B (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3348659B1 (en) | 2015-09-09 | 2020-12-23 | Mitsubishi Materials Corporation | Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar |
FI3438299T3 (en) | 2016-03-30 | 2023-05-23 | Mitsubishi Materials Corp | Copper alloy plate strip for electronic and electrical equipment, component, terminal, busbar and movable piece for relays |
WO2017170699A1 (en) | 2016-03-30 | 2017-10-05 | 三菱マテリアル株式会社 | Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relays |
JP7180101B2 (en) * | 2018-03-30 | 2022-11-30 | 三菱マテリアル株式会社 | Copper alloys for electronic and electrical equipment, copper alloy sheet materials for electronic and electrical equipment, parts for electronic and electrical equipment, terminals and bus bars |
JP6780187B2 (en) | 2018-03-30 | 2020-11-04 | 三菱マテリアル株式会社 | Copper alloys for electronic / electrical equipment, copper alloy strips for electronic / electrical equipment, parts for electronic / electrical equipment, terminals, and busbars |
TWI770375B (en) | 2018-03-30 | 2022-07-11 | 日商三菱綜合材料股份有限公司 | Copper alloy for electronic and electrical device, copper alloy sheet strip for electronic and electrical device, part for electronic and electrical device, terminal, and bus bar |
JP7180102B2 (en) * | 2018-03-30 | 2022-11-30 | 三菱マテリアル株式会社 | Copper alloys for electronic and electrical equipment, copper alloy sheet materials for electronic and electrical equipment, parts for electronic and electrical equipment, terminals and bus bars |
US11781234B2 (en) | 2018-12-26 | 2023-10-10 | Mitsubishi Materials Corporation | Copper alloy plate, plating film-attached copper alloy plate, and methods respectively for manufacturing these products |
JP6863409B2 (en) * | 2018-12-26 | 2021-04-21 | 三菱マテリアル株式会社 | Copper alloy plate, copper alloy plate with plating film and manufacturing method of these |
CN110172609A (en) * | 2019-05-16 | 2019-08-27 | 红河学院 | A kind of high-strength high-conductivity copper magnesium system alloy and preparation method thereof |
TW202130826A (en) * | 2019-11-29 | 2021-08-16 | 日商三菱綜合材料股份有限公司 | Copper alloy, copper alloy plastic-processed material, component for electronic and electric devices, terminal, bus bar, and heat dissipation substrate |
US20220403485A1 (en) * | 2019-11-29 | 2022-12-22 | Mitsubishi Materials Corporation | Copper alloy, copper alloy plastic working material, electronic/electrical device component, terminal, busbar, and heat-diffusing substrate |
JP7443737B2 (en) | 2019-12-10 | 2024-03-06 | 三菱マテリアル株式会社 | Copper alloy plate, copper alloy plate with plating film, and manufacturing method thereof |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05311283A (en) * | 1992-05-01 | 1993-11-22 | Mitsubishi Shindoh Co Ltd | Cu alloy extra fine wire excellent in wire drawability and repeated bendability |
JP2014025089A (en) * | 2012-07-24 | 2014-02-06 | Mitsubishi Shindoh Co Ltd | Cu-Mg-P BASED COPPER ALLOY SHEET HAVING EXCELLENT SPRING CRITICAL VALUE CHARACTERISTIC AND FATIGUE RESISTANCE AFTER BENDING, AND METHOD FOR PRODUCING THE SAME |
JP2014047378A (en) * | 2012-08-30 | 2014-03-17 | Mitsubishi Shindoh Co Ltd | Cu-Mg-P BASED COPPER ALLOY Sn PLATED SHEET |
US20140209221A1 (en) * | 2012-04-04 | 2014-07-31 | Mitsubishi Shindoh Co., Ltd. | Cu-Mg-P-BASED COPPER ALLOY SHEET HAVING EXCELLENT FATIGUE RESISTANCE CHARACTERISTIC AND METHOD OF PRODUCING THE SAME |
JP2015045083A (en) * | 2013-07-31 | 2015-03-12 | 三菱マテリアル株式会社 | Copper alloy for electronic and electrical apparatuses, copper alloy plastic processing material for electronic and electrical apparatuses, part for electronic and electrical apparatuses and terminal |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3778318A (en) | 1969-02-24 | 1973-12-11 | Cooper Range Co | Copper base composition |
JP3796784B2 (en) * | 1995-12-01 | 2006-07-12 | 三菱伸銅株式会社 | Copper alloy thin plate for manufacturing connectors and connectors manufactured with the thin plates |
JP4756197B2 (en) * | 2005-08-23 | 2011-08-24 | Dowaメタルテック株式会社 | Cu-Mg-P-based copper alloy and method for producing the same |
CN1924048A (en) * | 2005-08-31 | 2007-03-07 | 上海科泰铜业有限公司 | High conductivity copper-magnesium alloy for automobile electrical equipment |
JP5311283B2 (en) | 2009-03-11 | 2013-10-09 | 住友電気工業株式会社 | Nonaqueous electrolyte battery and manufacturing method thereof |
JP4516154B1 (en) * | 2009-12-23 | 2010-08-04 | 三菱伸銅株式会社 | Cu-Mg-P copper alloy strip and method for producing the same |
JP4563508B1 (en) * | 2010-02-24 | 2010-10-13 | 三菱伸銅株式会社 | Cu-Mg-P-based copper alloy strip and method for producing the same |
JP5848169B2 (en) | 2012-03-14 | 2016-01-27 | Dowaメタルテック株式会社 | Silver plating material |
JP6076724B2 (en) | 2012-12-06 | 2017-02-08 | 古河電気工業株式会社 | Copper alloy material and method for producing the same |
JP6140032B2 (en) * | 2013-08-30 | 2017-05-31 | Dowaメタルテック株式会社 | Copper alloy sheet, method for producing the same, and current-carrying component |
JP5847787B2 (en) * | 2013-11-26 | 2016-01-27 | Jx日鉱日石金属株式会社 | Copper alloy sheet with excellent conductivity and stress relaxation properties |
CN107208189B (en) * | 2015-09-09 | 2020-08-04 | 三菱综合材料株式会社 | Copper alloy, copper alloy plastic working material, assembly, terminal, and bus bar |
CN107709585B (en) * | 2015-09-09 | 2020-12-04 | 三菱综合材料株式会社 | Copper alloy for electronic and electrical equipment, copper alloy plastic working material for electronic and electrical equipment, module for electronic and electrical equipment, terminal, and bus bar |
-
2017
- 2017-03-28 JP JP2017063258A patent/JP6226097B2/en active Active
- 2017-03-29 KR KR1020187020683A patent/KR102327539B1/en active IP Right Grant
- 2017-03-29 MX MX2018011711A patent/MX2018011711A/en unknown
- 2017-03-29 EP EP17775267.2A patent/EP3438299B1/en active Active
- 2017-03-29 CN CN201780005496.3A patent/CN108431256A/en active Pending
- 2017-03-30 TW TW106110852A patent/TWI709651B/en active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05311283A (en) * | 1992-05-01 | 1993-11-22 | Mitsubishi Shindoh Co Ltd | Cu alloy extra fine wire excellent in wire drawability and repeated bendability |
US20140209221A1 (en) * | 2012-04-04 | 2014-07-31 | Mitsubishi Shindoh Co., Ltd. | Cu-Mg-P-BASED COPPER ALLOY SHEET HAVING EXCELLENT FATIGUE RESISTANCE CHARACTERISTIC AND METHOD OF PRODUCING THE SAME |
JP2014025089A (en) * | 2012-07-24 | 2014-02-06 | Mitsubishi Shindoh Co Ltd | Cu-Mg-P BASED COPPER ALLOY SHEET HAVING EXCELLENT SPRING CRITICAL VALUE CHARACTERISTIC AND FATIGUE RESISTANCE AFTER BENDING, AND METHOD FOR PRODUCING THE SAME |
JP2014047378A (en) * | 2012-08-30 | 2014-03-17 | Mitsubishi Shindoh Co Ltd | Cu-Mg-P BASED COPPER ALLOY Sn PLATED SHEET |
JP2015045083A (en) * | 2013-07-31 | 2015-03-12 | 三菱マテリアル株式会社 | Copper alloy for electronic and electrical apparatuses, copper alloy plastic processing material for electronic and electrical apparatuses, part for electronic and electrical apparatuses and terminal |
Non-Patent Citations (1)
Title |
---|
See also references of WO2017170733A1 * |
Also Published As
Publication number | Publication date |
---|---|
EP3438299A1 (en) | 2019-02-06 |
JP2017186662A (en) | 2017-10-12 |
KR102327539B1 (en) | 2021-11-16 |
EP3438299B1 (en) | 2023-05-03 |
TWI709651B (en) | 2020-11-11 |
CN108431256A (en) | 2018-08-21 |
JP6226097B2 (en) | 2017-11-08 |
TW201807204A (en) | 2018-03-01 |
KR20180125446A (en) | 2018-11-23 |
MX2018011711A (en) | 2018-12-19 |
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