JP5311860B2 - Copper alloy plate with Sn plating for PCB male terminals with excellent Pb-free solderability - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To produce a PCB male terminal excellent in Pb-free solderability and having sufficient strength and electric conductivity from a copper alloy plate on both sides of which Sn is plated before blanking. <P>SOLUTION: The copper alloy plate with Sn plating for PCB male terminals for producing the PCB male terminals has Sn plated layers on both surfaces and has shear-cut end faces by press blanking on both end faces. The copper alloy contains 0.05-2.6 mass% Fe, 0.01-0.2 mass% P, and one or two of 0.01-5 mass% Zn and 0.01-2 mass% Ni, and the balance Cu with inevitable impurities. Alternatively, the copper alloy contains 0.01-2 mass% Ni, 0.01-0.2 mass% P, and the balance Cu with inevitable impurities. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a copper alloy plate with Sn plating used for manufacturing a PCB male terminal to be soldered to a PCB (printed circuit board) mounted on an automobile or the like.

The PCB male terminal is formed into a square wire cross section (rectangular cross section) by press punching from a copper alloy plate, and is subjected to appropriate plastic deformation by press processing as necessary, penetrating through the terminal holding hole of the PCB (substrate). It solders to this PCB (refer patent document 1). For the soldering of the PCB, an immersion soldering method in which the PCB is immersed in a molten solder bath, or a jet jet soldering method in which a jet of solder is supplied to a soldering location is used. The immersion soldering method can solder a PCB having a large number of soldering points, and has extremely high economic efficiency. Jet soldering is performed when soldering a PCB having a higher mounting density with high reliability. In any of the soldering methods, since the solder bath is used in a circulating manner, care must be taken in operation so that impurities from the PCB do not enter. Further, in order to increase the reliability of the soldered portion, it is necessary that the soldered portion of the PCB male terminal and the PCB substrate are uniformly wetted by the solder and the solidified solder fillet is formed in an appropriate shape.
Conventionally, a brass plate with Sn plating is often used as a copper alloy plate for a PCB male terminal. When Zn contained in the brass melts into the solder bath and the Zn concentration of the solder bath increases, the solderability is hindered.

JP 2000-243495 A

When using a pre-plated material (copper alloy plate with Sn plating on both surfaces before punching) as the copper alloy plate for PCB male terminals, both ends of the PCB terminal (shear cut surface) when press punching is performed The copper alloy material is exposed. At the time of the press punching process, Sn covering portions by Sn sagging from the Sn plating portion on the surface are also formed on both end surfaces, but the both end surfaces cannot be completely covered with Sn. When the copper alloy material is exposed on the end face, the Pb-free solderability deteriorates, and the bonding reliability between the PCB terminal and the substrate decreases.
In addition, Pb-free solders such as Sn-Ag-based and Sn-Ag-Cu-based solders have been used instead of conventional Sn-Pb-based solders due to environmental issues, and the demand for Pb-free soldering has increased. These Pb-free solders have a problem that wettability is inferior to that of conventional Sn-Pb solders.

  On the other hand, when a post-plated material (copper alloy plate on which Sn plating has been performed after punching) is used as the copper alloy plate for PCB male terminals, the entire soldered portion including the shear cut surface is covered with Sn plating. , Pb-free solderability can be maintained, and the bonding reliability between the PCB terminal and the substrate is high. However, the post-plating material is expensive to manufacture, and generally has a problem that the Sn plating is thick (approximately 2 μm) and the frictional resistance during fitting is large. In addition, since the post-plating material is likely to have unevenness in the Sn plating thickness, in order to prevent a portion having a particularly small plating thickness from being formed in a part and lowering the solderability by Pb-free solder, as a whole The Sn plating is formed thicker.

In view of the above problems, the present invention is based on the premise that a pre-plated material excellent in production cost is used as a copper alloy plate for PCB male terminals to be Pb-free soldered to a PCB, and is excellent in Pb-free solderability. At the same time, an object of the present invention is to manufacture a PCB male terminal having sufficient strength and conductivity as a PCB male terminal.

The copper alloy plate with Sn plating for PCB male terminals excellent in Pb-free solderability according to the present invention is premised on the pre-plating, and the composition of the copper alloy is (1) Fe: 0.05 to 2.6. Including one or two of mass%, P: 0.01 to 0.2 mass%, Zn: 0.01 to 5 mass% and Ni: 0.01 to 2 mass%, from the remaining Cu and inevitable impurities Or (2) Ni: 0.01-2% by mass, P: 0.01-0.2% by mass, consisting of the balance Cu and unavoidable impurities, if necessary, Zn: 0.01-5% by mass %including.
The copper alloys of the above (1) and (2) utilize precipitation strengthening by Fe or Ni and P intermetallic compounds, and in order to improve Pb-free solderability, a predetermined amount of Zn or Ni It also has common technical features in that it includes (or both).

If necessary, the copper alloy further includes Sn: 3 mass% or less, and as other accessory components, one or more of Al, Co, Cr, Mg, Mn, Si, Ti, Zr, Each element is contained in an amount of 0.001 to 0.2% by mass, and 0.001 to 0.6% by mass in total.
Since the Sn-plated copper alloy plate is premised on pre-plating, the punched end surface becomes a shear cut surface where the copper alloy material is exposed when press punching is performed. Therefore, the PCB terminal has Sn plating layers on both surfaces, and has shear cut surfaces by press punching on both end faces.
In the present invention, the Sn plating layer includes pure Sn and an Sn-based alloy.

The Sn-plated copper alloy plate according to the present invention maintains excellent Pb-free solderability even if it is a pre-plated material by containing a predetermined amount of Zn and / or Ni in the copper alloy material. can do.
Moreover, the copper alloy board with Sn plating which concerns on this invention is equipped with the intensity | strength and electrical conductivity which are not insufficient as a PCB male terminal.

  The composition of the copper alloy according to the present invention is basically an Fe-P system or Ni-P system, both of which improve the strength by precipitation of an intermetallic compound of Fe or Ni and P, and a predetermined amount of Zn or It is characterized in that Pb-free solderability is improved by including Ni or both. Hereinafter, the composition of the copper alloy according to the present invention will be described separately for the Fe-P system and the Ni-P system.

(Fe-P system)
The composition of the Fe-P based copper alloy includes Fe: 0.05 to 2.6 mass%, P: 0.01 to 0.2 mass%, and Zn: 0.01 to 5 mass%, and Ni: 0. .01 to 2% by mass of 1 or 2%, consisting of the balance Cu and inevitable impurities, and if necessary, Sn: 3% by mass or less, and other subcomponents such as Al, Co, Cr, One or more of Mg, Mn, Si, Ti, and Zr are contained in an amount of 0.001 to 0.2% by mass for each element, and 0.001 to 0.6% by mass in total.

  In this composition, Fe precipitates as Fe or Fe—P intermetallic compounds, and improves the strength and heat resistance of the copper alloy plate. When the Fe content is less than 0.05% by mass, the amount of precipitation is small and it is difficult to ensure the strength. On the other hand, when Fe exceeds 2.6% by mass, coarse crystal precipitate particles of Fe or Fe-P are generated, There is a risk of bending workability being impaired. It should be noted that the strength is required to be 130 MHv (micro Vickers hardness) or more so as not to be deformed when inserted into the substrate as a male terminal and to prevent deformation during handling after insertion. Therefore, the Fe content is set to 0.05 to 2.6% by mass, desirably 0.07 to 2.4% by mass.

  P has a deoxidizing effect and forms an intermetallic compound with Fe to improve strength and heat resistance. When P is less than 0.01% by mass, the amount of precipitation is small and it is difficult to ensure the strength. On the other hand, when P exceeds 0.2% by mass, hot workability is inferior and Fe—P coarse precipitates are present. There is a possibility that particles are formed and the workability and the like are deteriorated. Therefore, the P content is 0.01 to 0.2% by mass, preferably 0.02 to 0.18% by mass, and more preferably 0.025 to 0.15% by mass.

Ni and Zn have the effect of suppressing Cu oxidation over time at the punched end face and maintaining excellent Pb-free solderability.
When the Zn content is less than 0.01% by mass, oxidation of Cu of the copper alloy material exposed to the punched end surface progresses with time, and when soldering the PCB terminal to the substrate, the oxide film is removed by flux. It is difficult to develop an oxidation inhibiting effect. On the other hand, if it exceeds 5% by mass, the amount of Zn that dissolves into the Pb-free solder covering the PCB terminal during soldering increases. If the Zn content in the Pb-free solder increases, the solder viscosity decreases, the amount of solder held in the soldering part before the solder solidifies, and the shape of the solidified solder is appropriate In addition, the reliability of the soldered portion is lowered. In addition, the amount of Zn entering the soldering bath increases, and the renewal time of the solder bath is shortened. Therefore, the Zn content is 0.01 to 5% by mass, preferably 0.03 to 3.0% by mass, and more preferably 0.05 to 2.5% by mass.

  When the content of Ni is less than 0.01% by mass, the effect of suppressing oxidation over time is hardly exhibited as in the case of Zn. Conversely, if the Ni content exceeds 2% by mass, it contributes to the improvement of Pb-free solderability due to the oxidation inhibiting effect, but it is difficult to ensure the conductivity of the copper alloy. This conductivity is preferably higher than that of a conventionally used brass material (Cu-30 wt% Zn), and 30% IACS or more is necessary. Furthermore, Ni precipitates as P or Fe and Ni—P, Ni—Fe—P intermetallic compounds, and contributes to the improvement of the strength of the copper alloy sheet. Therefore, the Ni content is 0.01 to 2% by mass, preferably 0.025 to 1.5% by mass.

Sn is an element that contributes to strength improvement, and is added as appropriate. However, if it exceeds 3% by mass, it is difficult to ensure conductivity, so it is selectively added in a range of 3% by mass or less. In order to improve the strength, addition of 0.01% by mass or more is desirable. A desirable addition amount is 0.03 to 2.5% by mass, and more desirably 0.03 to 2.3% by mass.
Al, Co, Cr, Mg, Mn, Si, Ti, and Zr are elements that contribute to improvement in strength and heat resistance, and are added as necessary within a range that does not impair solderability. When the content is less than 0.001% by mass of each element, the effect of improving the strength and heat resistance is small, and when it exceeds 0.2% by mass, the solderability is deteriorated. Further, when two or more of these elements are added, if the total content is less than 0.001% by mass, the effect of improving strength and heat resistance is small, and if it exceeds 0.6% by mass, Pb-free soldering is performed. Deteriorate the sex. Accordingly, the content of these elements is 0.001 to 0.2% by mass in the case where two or more elements are included, and 0.001 to 0.6% by mass in total. Desirably, they are 0.005-0.1 mass% and 0.005-0.4 mass%, respectively.

(Ni-P series)
The composition of the Ni-P-based copper alloy includes Ni: 0.05-2% by mass, P: 0.01-0.2% by mass, and consists of the balance Cu and inevitable impurities. If necessary, Zn: 0.01-5% by mass or / and Sn: 0.01-3% by mass, as other subcomponents, one or more of Al, Co, Cr, Mg, Mn, Si, Ti, Zr Each element is contained in an amount of 0.001 to 0.2% by mass, and 0.001 to 0.6% by mass in total.

In this composition, Ni precipitates as a Ni-P intermetallic compound, contributes to improving the strength of the copper alloy plate, suppresses Cu oxidation over time at the punched end face, and maintains excellent Pb-free solderability. Has an effect. The reason why the content is specified to be 0.05 to 2% by mass is the same as that of the Fe-P system, and the desirable content range is also 0.025 to 1.5% by mass.
Regarding P, Zn, Sn, and Al, Co, Cr, Mg, Mn, Si, Ti, and Zr, the effect is the same as that of the Fe-P system, and the content range (also desirable range) and so on. The reason specified in is also the same.

  Sn plating on the surface of the copper alloy plate has an effect of improving Pb-free solderability and electrical reliability after time (maintaining low contact resistance). As the Sn plating, any of reflow Sn plating, molten Sn plating, electro-gloss Sn plating, and the like can be used. In addition, Sn plating referred to in the present invention includes Sn-based alloy plating, such as Sn-Cu alloy plating, Sn-Bi alloy plating, Sn-Zn alloy plating, Sn-Ag alloy plating, etc. Includes Sn-based alloy plating.

  The surface coating layer structure of the copper alloy plate with Sn plating according to the present invention may have another surface coating layer on the base of the Sn plating layer. When Sn plating is performed on a copper alloy plate material, the plating structure is usually composed of an Sn layer and a Cu-Sn intermetallic compound layer in this order from the upper surface layer (see JP 2002-298963 A). In addition, it has a surface coating layer structure (see Japanese Patent Application Laid-Open Nos. 2004-68026 and 2005-226097) composed of a Sn layer, a Cu—Sn intermetallic compound layer, and a Ni layer in this order from the surface layer. Also good. The thickness of each coating layer is 0.01 to 2 μm for the Sn layer, desirably 0.02 to 1 μm, 0.01 to 1 μm for the Cu—Sn intermetallic compound layer, and 1 μm or less (including zero) for the Ni layer. desirable.

  Further, as a base material of the Sn-plated copper alloy plate according to the present invention, a characteristic surface disclosed in JP 2006-77307 A, JP 2006-183068 A, JP 2007-258156 A, etc. A copper alloy plate having a form (surface roughness (unevenness) larger than usual by dull rolling or the like) can also be used. In this case, the surface of the copper alloy plate is subjected to Ni plating as necessary, followed by Cu plating and Sn plating, and after reflow treatment, Sn flash plating is further performed as necessary. Thereby, the surface coating layer which consists of Sn layer, Cu-Sn intermetallic compound layer, and also Ni layer (when Ni plating is performed) is formed.

  The copper alloy plate with Sn plating according to the present invention has a Cu-Sn intermetallic compound layer as an underlayer of the Sn plating layer, or further has a Ni layer, so that only Pb-free solderability that is a problem is maintained. In addition, electrical reliability after the passage of time, heat-resistant peelability, and low insertion force can be imparted, which is more suitable as a material for PCB male terminals. When a copper alloy plate having the characteristic surface form is used, a lower insertion force can be realized.

  No. shown in Table 1. A copper alloy having a composition of 1 to 30 was melted under a charcoal coating in the air in a small electric furnace to produce an ingot having a thickness of 50 mm, a width of 80 mm, and a length of 180 mm. The front and back surfaces of the produced ingot were each cut by 5 mm, and then hot rolled at 930 ° C. to obtain a plate material having a thickness of 12 mmt. Further, the front and back surfaces of the plate material were each cut by about 1 mm. In addition, No. Since 20 and 24 had hot cracking, the process after hot rolling was canceled.

These plate materials were cold-rolled and then annealed, followed by appropriate cold-rolling and annealing, and the final finish cold-rolling to a thickness of 0.64 mm. Any annealing is performed within the range of 200 ° C. to 600 ° C. × 0.5 to 10 hours, and Fe—P, Ni—P compounds, etc. are deposited (in the case of Fe—P or Ni—P), and after annealing. The average particle size of the recrystallized grains was selected to be 50 μm or less, or the conditions for not recrystallizing.
The plate material after finish cold rolling was subjected to low temperature annealing in the range of about 20 to 300 seconds. The annealing conditions at this time were selected such that the hardness after low-temperature annealing was 65% to 95% with respect to the hardness before finishing low-temperature annealing.

Test pieces were collected from the obtained copper alloy plate, and subjected to bending workability test, hardness measurement, and conductivity measurement in the following manner. The results are shown in Table 3 below. However, No. evaluated as defective in the bending test. 18 (all other than No. 18 evaluated as good) canceled the other tests.
[Bending workability]
A specimen having a width of 10 mm and a length of 30 mm is cut out so that the length direction is parallel to the rolling direction of the plate material (LD) and perpendicular direction (TD), and the bending line is perpendicular to the length direction. Scissors using a B-type bending jig defined in the CESM0002 metal material W bending test, and using a universal testing machine RH-30 manufactured by Shimadzu Corporation, R / t = 2 (R: bending radius, After 90 ° W bending was performed at t: plate thickness), the presence or absence of cracks in the bent portion was observed, and those without cracks were evaluated as good and those with cracks were evaluated as defective.
[Hardness measurement]
Using a micro Vickers hardness tester, the hardness at 500 gf was measured based on the provisions of JISZ2244.
[Conductivity measurement]
The conductivity was measured based on JISH0505.

Next, no. For copper alloy plates other than 18, 20, and 24, Cu plating and reflow Sn plating (Sn plating and reflow treatment) were performed under the conditions shown in Table 2, and a pure Sn layer having an average thickness of 0.5 μm and an average thickness A copper alloy plate with Sn plating having a surface coating layer composed of a 0.4 μm Cu—Sn intermetallic compound layer was produced. The measuring method of pure Sn layer thickness and Cu-Sn intermetallic compound layer thickness is shown below.
[Measurement of pure Sn layer thickness]
The Sn plating thickness is measured using a fluorescent X-ray film thickness meter. Then, after dipping in a stripping solution containing p-nitrophenol and caustic soda as main components for 10 minutes and stripping the pure Sn layer, the amount of Sn in the Cu-Sn intermetallic compound layer is measured using a fluorescent X-ray film thickness meter. taking measurement. The pure Sn layer thickness was calculated by subtracting the amount of Sn in the Cu—Sn intermetallic compound layer from the Sn plating thickness.
[Cu-Sn intermetallic compound layer thickness measurement]
The Cu-Sn intermetallic compound layer thickness was measured by cutting the cross section of the plate with a microtome and measuring the cut surface with SEM observation.

Then, the test piece was extract | collected from each copper plating plate with Sn plating, and Pb free solderability evaluation was performed in the following way. The results are shown in Table 3.
[Pb-free solderability evaluation]
A test piece (0.64 mmw × 30 mml) was punched and subjected to wet aging with a wet tester (aging condition: 85 ° C. × 85% RH × 48 Hr), and a test piece (temporal test piece) was punched without wet aging. The immediately following test piece (non-aging test piece) was evaluated for solderability.
The soldering conditions were: commercially available Sn-3 mass% Ag-0.5 mass% Cu solder was held at 260 ± 5 ° C. and melted, and each test piece was immersed at a rate of 25 mm / sec, an immersion depth of 12 mm, and an immersion time of 5 sec. Soaked in molten solder. A solder checker (manufactured by Resuka Co., Ltd .; SAT5100 type) was used as a soldering apparatus. An inactive flux (α100; Nippon Alpha Metals Co., Ltd.) was used as the flux, and the wetting time was measured for the time-lapse test pieces and the non-time-lapse test pieces. The solderability was evaluated as ◯ (good) when the wetting time was less than 2 sec, and x (defective) when it was 2 sec or longer. Appearance evaluation is performed on the end surface and the plating surface of the wet aging test piece. For the end surface, the solder adhesion area ratio is less than 70% x (defect), 70% or more ○ (good), 95% or more ◎ (excellent). ), With respect to the plated surface, x (defect) is observed when dewetting or pits are observed, △ (slightly defective) is observed when the solder surface is rough, and ○ (good) when it is not observed. It was evaluated.

As shown in Table 3, no . Nos. 1 to 12 have excellent solder wettability immediately after punching and after wet aging, have a high solder adhesion area ratio at the punched end face, and are excellent in Pb-free solderability. Further, the hardness is 130 MHv or higher, the strength is high, and the conductivity is 30% IACS or higher.
In contrast, no. Since 14, 15, 23, 29, and 30 do not contain Zn or Ni, or the content is less than that of the present invention, Pb-free solderability is inferior. No. No. 16 is inferior in Pb-free solderability due to excessive Zn content. 27 and 28 are further inferior in electrical conductivity. No. Nos. 17, 19, 23, and 25 have Fe, Ni, or P content less than that of the present invention, so that the hardness is low and sufficient strength is not obtained. No. 13, 21, 22, and 26 have a low electrical conductivity because of excessive Ni or Sn.

No. of Example 1 A copper alloy plate having a thickness of 0.64 mmt was obtained in the same manner as in Example 1 using a copper alloy having a composition of 1. No. in Table 4 Nos. 33 and 34 were subjected to temper rolling with a dull roll in accordance with the disclosure of Japanese Patent Application Laid-Open No. 2007-258156 to roughen (uneven) the copper alloy sheet surface.
Subsequently, Ni plating is performed (or not performed) under the conditions shown in Table 2, Cu plating is (or is not performed), Sn plating (however, No. 36 is molten Sn plating) is performed. Reflow processing was further performed except for 35 and 36. No. No. 33 was further subjected to Sn flash plating (0.05 μm) in accordance with the disclosure of Japanese Patent Application Laid-Open No. 2007-258156.

Next, with respect to the obtained copper alloy plate with Sn plating, the thicknesses of the pure Sn layer, the Cu—Sn alloy layer, the Ni layer and the Ni—Sn layer were measured as described above and below, and Pb-free solderability, contact Tests of reliability, heat resistance peelability and friction coefficient were conducted as described above and below, and the results shown in Table 4 were obtained.
In addition, No. described in the remarks column as equivalent to post-plating. 37 and 38 are pre-plated materials as in the other embodiments, but the Sn plating thickness is equivalent to that of the conventional post-plated material.

[Ni layer thickness measurement]
The Ni layer thickness was measured using a fluorescent X-ray film thickness meter.
[Ni-Sn layer thickness measurement]
The Ni—Sn intermetallic compound layer thickness was measured by cutting the cross section of the plate with a microtome and measuring the cut surface with SEM observation.
[Heat-resistant peelability evaluation]
The heat-resistant peelability evaluation was performed by heating a strip-shaped test piece subjected to soldering test at 180 ° C. in the atmosphere for 48 hours, then bending back at 180 °, and evaluating by a tape peeling test at the bent back portion. The case where peeling occurred was marked as x (defect), and the case where peeling did not occur was marked as o (good).

[Contact reliability evaluation]
The contact reliability was measured by a four probe method using a gold probe (1.0 mmφ) at a release voltage of 20 mV and a current of 10 mA. The measurement load is 300 gf (sliding state). In the evaluation, a contact resistance of 1 mΩ or less was evaluated as ◎ (excellent), a contact resistance of 3 mΩ or less was evaluated as ◯ (good), and 3 mΩ was evaluated as x (defect).
[Friction coefficient evaluation]
The friction coefficient is an autograph that is obtained by contacting the tin plate of the female side tongue and the male side tongue piece, which has been tinned with a radius (inner diameter) of 1.5 mm, and pulling the male side tongue piece horizontally. Measured. At this time, the contact pressure was a load (N = 300 gf) applied to the shaft to which the female tongue piece was attached, and the pulling speed of the male tongue piece was 80 m / min. The coefficient of friction (μ) is obtained by dividing the force (F) applied in the horizontal direction measured by the load cell by the load (N) as in the following equation.
μ = F / N
A friction coefficient μ of less than 0.6 was evaluated as ○ (good), and 0.6 or more was evaluated as × (bad).

From Table 4, No. Nos. 31 to 36 are excellent in Pb-free solderability immediately after punching, which is a problem, and after wet aging. In addition, contact reliability after a lapse of time, solder heat resistance peelability, and low insertion force (friction coefficient) are realized.
On the other hand, no. Nos. 37 to 40 also have excellent Pb-free solderability immediately after punching and after wet aging, as well as excellent solder heat release properties. However, no. No. 37 has a pure Sn layer thickness equivalent to that of the post-plating material, and therefore has a large friction coefficient. In No. 38, since the Cu—Sn alloy layer does not exist as a barrier layer (Ni—Sn layer is formed), the contact reliability is further inferior. No. 39 also has poor contact reliability because the Cu—Sn alloy layer does not exist as a barrier layer. No. No. 40 is inferior in contact reliability because the Cu—Sn alloy layer is as thin as less than 0.01 μm.
In this way, by selecting an appropriate plating configuration (known per se), not only Pb-free solderability, which is a problem, but also improvement in contact reliability and solder heat resistance peelability after aging and low insertion force ( Friction coefficient) can be realized.

Claims (4)

Have a shear cut surface by press stamping to both end surfaces having a Sn plating layer on both surfaces, the PCB male Sn-plated copper alloy sheet with terminals for producing PCB male terminal to attach Pb-free solder in PCB, Copper alloy is Fe: 0.05-2.6% by mass, P: 0.01-0.2% by mass, Zn: 0.01-5% by mass and Ni: 0.01-2% by mass Or the copper alloy board with Sn plating for PCB male terminals which is excellent in Pb-free solderability characterized by including 2 types and remainder Cu and an unavoidable impurity. Have a shear cut surface by press stamping to both end surfaces having a Sn plating layer on both surfaces, the PCB male Sn-plated copper alloy sheet with terminals for producing PCB male terminal to attach Pb-free solder in PCB, For PCB male terminal excellent in Pb-free solderability, characterized in that the copper alloy contains Ni: 0.01-2 mass%, P: 0.01-0.2 mass%, and consists of the balance Cu and inevitable impurities Copper alloy plate with Sn plating. Furthermore, Zn: 0.01-5 mass% is contained, The copper alloy board with Sn plating for PCB male terminals excellent in Pb free solderability described in Claim 2 characterized by the above-mentioned. Further Co, Mn, 1 or two or more of Si, the elements 0.001 to 0.2 wt%, of the preceding claims, characterized in that it comprises 0.001 to 0.6 mass% in total The copper alloy board with Sn plating for PCB male terminals excellent in Pb free solderability described in any one.