CN114318055B - High-strength, high-conductivity and high-toughness copper alloy and preparation method thereof - Google Patents
High-strength, high-conductivity and high-toughness copper alloy and preparation method thereof Download PDFInfo
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Abstract
The invention relates to the field of alloy materials, in particular to a high-strength, high-conductivity and high-toughness copper alloy and a preparation method thereof, wherein the copper alloy is prepared from the following raw materials in percentage by mass: 0.3 to 0.5 percent of Sn; be 0.5-1.0%; 2 to 3.5 percent of Ni; 0.03 to 0.07 percent of Cr; 0.1 to 0.3 percent of Bi and 0.3 to 0.8 percent of Hf; nanometer Y 2 O 3 0.1 to 0.5 percent of particles; the balance being copper and unavoidable impurity elements. The invention introduces proper amount of Sn, be, ni, cr, bi, hf and nano Y 2 O 3 The particles and the optimization of the preparation process are cooperated, so that the copper alloy can be endowed with high strength, the mechanical property of the copper alloy is obviously improved, and the conductivity of the copper alloy is also obviously improved.
Description
Technical Field
The invention relates to the field of alloy materials, in particular to a high-strength, high-conductivity and high-toughness copper alloy and a preparation method thereof.
Background
Copper and copper alloy have excellent characteristics of good electric conduction, heat conduction, corrosion resistance and the like, so that the copper and copper alloy are widely applied to various industries, such as conductor materials of high-intensity magnetic fields, heat exchange materials, lead frame materials, contact wires and the like, and the requirements on the comprehensive performance of copper and copper alloy are higher and higher along with the development of high and new technology industries. High strength and high conductivity copper alloys are required to have both high strength and high conductivity, however, pure metals with high conductivity are generally very soft, such as copper, silver, aluminum, and the like. The balance between the high strength and the high conductivity of the currently used copper alloy is always the trade-off, so how to balance the high strength and the high conductivity of the copper alloy is the problem to be solved in the current high performance copper alloy material.
Disclosure of Invention
In order to solve the problems, the invention provides a high-strength, high-conductivity and high-toughness copper alloy and a preparation method thereof.
In order to realize the purpose, the invention adopts the technical scheme that:
a high-strength high-conductivity high-toughness copper alloy is prepared from the following raw materials in percentage by mass:
0.3 to 0.5 percent of Sn; be 0.5-1.0%; 2 to 3.5 percent of Ni; 0.03 to 0.07 percent of Cr; 0.1 to 0.3 percent of Bi and 0.3 to 0.8 percent of Hf; nanometer Y 2 O 3 0.1 to 0.5 percent of particles; the balance being copper and unavoidable impurity elements.
Preferably, the material is prepared from the following raw materials in percentage by mass:
0.3 percent of Sn; be 0.5%; 2 to 3.5 percent of Ni; 0.03 percent of Cr; 0.1% of Bi and 0.3% of Hf; nanometer Y 2 O 3 0.1% of particles; the balance being copper and unavoidable impurity elements.
Preferably, the material is prepared from the following raw materials in percentage by mass:
0.5 percent of Sn; 1.0% of Be; 3.5 percent of Ni; 0.07 percent of Cr; 0.8 percent of Hf in percentage of 0.3 percent of Bi0.3 percent; nanometer Y 2 O 3 0.5% of particles; the balance being copper and unavoidable impurity elements.
Preferably, the material is prepared from the following raw materials in percentage by mass:
0.4% of Sn; be 0.75%; 2.75 percent of Ni; 0.05 percent of Cr; 0.2% of Bi and 0.55% of Hf; nanometer Y 2 O 3 0.3% of particles; the balance being copper and unavoidable impurity elements.
The invention also provides a preparation method of the high-strength, high-conductivity and high-toughness copper alloy, which comprises the following steps:
s1, putting prepared main component elements of copper, sn, be, ni, cr, bi and Hf into an induction furnace with a pulse electric field device, smelting under the protection of pure argon, preserving heat for 15min after raw materials are completely molten, placing the furnace in a room temperature environment, continuously stirring, and adding nano Y into an alloy melt by using an external method when the alloy melt is molten 2 O 3 The particles are then inserted into the melt with the electrode of the pulse electric field for melt pulse electric field treatment, the treatment time of the pulse electric field is 50-200 s, the pulse frequency is 10-35 Hz, and the pulse current density is 10-25A/mm 2 The pulse width is 100-200 mus, after the pulse electric field treatment, the residual slag on the surface is removed, the mixture is poured into a mold and cooled to the room temperature, and alloy cast ingots are obtained;
s2, placing the obtained alloy ingot into a heat treatment furnace for homogenization treatment under the protection of pure argon, wherein the homogenization treatment temperature is 950-1000 ℃, the pressure is 0.2-0.4 GPa, the heat preservation time is 1-2 hours, and then cooling to room temperature along with the furnace;
s3, heating the homogenized alloy cast ingot to 900-1000 ℃ for hot rolling, wherein the total deformation amount of the hot rolling is 60-80%, the final rolling temperature is 800-950 ℃, and the alloy material after final rolling is immediately subjected to water quenching treatment;
s4, milling the surface of the copper alloy material subjected to hot rolling, removing surface oxide skin, and then carrying out rolling deformation at room temperature, wherein the total rolling deformation amount is 80-90%;
s5, placing the copper alloy material rolled at the room temperature for the first time into a heat treatment furnace, carrying out primary aging treatment under the protection of pure argon, wherein the aging temperature is 450-550 ℃, the aging time is 3-4 h, and then cooling to the room temperature in an air cooling mode;
s6, milling the surface of the copper alloy material subjected to primary aging treatment, removing surface oxide skin, and then performing rolling deformation at room temperature, wherein the total rolling deformation amount is 30-50%;
and S7, carrying out cryogenic treatment on the copper alloy material rolled at the secondary room temperature under the static magnetic field condition, wherein the magnetic field intensity is 0.1-2T, cooling from the room temperature at the cooling rate of 0.1-20 ℃/min for 1-60 h, taking out, carrying out natural aging at the room temperature, and recovering to the room temperature to obtain the copper alloy material.
The invention has the following beneficial effects:
the invention introduces proper amount of Sn, be, ni, cr, bi, hf and nano Y 2 O 3 Particles and the optimization of the preparation process can endow the copper alloy with high contentThe strength, the mechanical property of the copper alloy is obviously improved, and the conductivity of the copper alloy is also obviously improved.
Detailed Description
In order that the objects and advantages of the invention will be more clearly understood, the invention is further described in detail below with reference to examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Example 1
A preparation method of a high-strength, high-conductivity and high-toughness copper alloy comprises the following steps:
s1, preparing the following main components in percentage by mass:
0.3 percent of Sn; be 0.5%; 2 to 3.5 percent of Ni; 0.03 percent of Cr; 0.1 percent of Bi and 0.3 percent of Hf; nanometer Y 2 O 3 0.1% of particles; the balance of copper and inevitable impurity elements; adopting Cu, be, hf, ni and Cr metal blocks with the purity of more than or equal to 99.9wt% and Sn-Bi-Cu alloy;
placing the prepared main component elements of copper, sn, be, ni, cr, bi and Hf into an induction furnace with a pulse electric field device, smelting under the protection of pure argon, preserving heat for 15min after the raw materials are completely melted, placing the alloy in a room temperature environment, continuously stirring, and adding nano Y into the alloy melt by using an external method when the alloy melt is molten 2 O 3 Particle, inserting electrode of pulse electric field into melt, and performing melt pulse electric field treatment with pulse electric field treatment time of 200s, pulse frequency of 10Hz, and pulse current density of 10A/mm 2 The pulse width is 100 mu s, after the pulse electric field treatment, the residual slag on the surface is removed, the mixture is poured into a mold and cooled to the room temperature, and alloy cast ingots are obtained;
s2, placing the obtained alloy ingot into a heat treatment furnace for homogenization treatment under the protection of pure argon, wherein the homogenization treatment temperature is 950 ℃, the pressure is 0.2GPa, the heat preservation time is 2 hours, and then cooling to room temperature along with the furnace;
s3, heating the homogenized alloy cast ingot to 900 ℃ for hot rolling, wherein the total deformation of the hot rolling is 60%, the finish rolling temperature is 800 ℃, and immediately performing water quenching treatment on the alloy material after the finish rolling;
s4, milling the surface of the copper alloy material subjected to hot rolling, removing surface oxide skin, and then carrying out rolling deformation at room temperature, wherein the total rolling deformation amount is 80-90%;
s5, placing the copper alloy material rolled at the room temperature for the first time into a heat treatment furnace, carrying out primary aging treatment under the protection of pure argon, wherein the aging temperature is 450 ℃, the aging time is 4 hours, and then cooling to the room temperature in an air cooling mode;
s6, milling the surface of the copper alloy material subjected to primary aging treatment, removing surface oxide skin, and then performing rolling deformation at room temperature, wherein the total rolling deformation is 30%;
and S7, carrying out cryogenic treatment on the copper alloy material rolled at the secondary room temperature under the static magnetic field condition, wherein the magnetic field intensity is 1T, cooling from the room temperature at the rate of 10 ℃/min for 2h, taking out, carrying out temperature return at the room temperature, carrying out natural aging, and recovering to the room temperature to obtain the copper alloy material.
The copper alloy obtained by the preparation method is tested, and the performance is as follows: the tensile strength is 750-770 MPa, the yield strength is 650-680 MPa, the elongation is 13-15%, and the elastic modulus E is 137-142 KN/mm 2 The conductivity was 71.6% IACS.
Example 2
A preparation method of a high-strength, high-conductivity and high-toughness copper alloy comprises the following steps:
s1, preparing the following main components in percentage by mass:
0.5 percent of Sn; be 1.0%; 3.5 percent of Ni; 0.07 percent of Cr; 0.3 percent of Bi and 0.8 percent of Hf; nanometer Y 2 O 3 0.5% of particles; the balance of copper and inevitable impurity elements; adopting Cu, be, hf, ni and Cr metal blocks with the purity of more than or equal to 99.9wt% and Sn-Bi-Cu alloy;
placing the prepared main component elements of copper, sn, be, ni, cr, bi and Hf into an induction furnace with a pulse electric field device, smelting under the protection of pure argon, preserving heat for 15min after the raw materials are completely melted, placing the alloy in a room temperature environment, continuously stirring, and adding nano Y into the alloy melt by using an external method when the alloy melt is molten 2 O 3 Particles, then inserting electrodes of a pulsed electric field into the meltIn the body, melt pulse electric field treatment is carried out, the pulse electric field treatment time is 50s, the pulse frequency is 35Hz, and the pulse current density is 25A/mm 2 The pulse width is 200 mus, after the pulse electric field treatment, the residual slag on the surface is removed, the mixture is poured into a mold and cooled to the room temperature, and an alloy ingot is obtained;
s2, placing the obtained alloy ingot into a heat treatment furnace for homogenization treatment under the protection of pure argon, wherein the homogenization treatment temperature is 1000 ℃, the pressure is 0.4GPa, the heat preservation time is 1h, and then cooling to room temperature along with the furnace;
s3, heating the homogenized alloy cast ingot to 1000 ℃ for hot rolling, wherein the total deformation of the hot rolling is 80%, the final rolling temperature is 950 ℃, and immediately performing water quenching treatment on the finally rolled alloy material;
s4, milling the surface of the copper alloy material subjected to hot rolling, removing surface oxide skin, and then carrying out rolling deformation at room temperature, wherein the total rolling deformation is 90%;
s5, placing the copper alloy material rolled at the room temperature for the first time into a heat treatment furnace, carrying out primary aging treatment under the protection of pure argon, wherein the aging temperature is 550 ℃, the aging time is 3 hours, and then cooling to the room temperature in an air cooling mode;
s6, milling the surface of the copper alloy material subjected to primary aging treatment, removing surface oxide skin, and then performing rolling deformation at room temperature, wherein the total rolling deformation is 50%;
and S7, carrying out cryogenic treatment on the copper alloy material subjected to secondary room temperature rolling under the static magnetic field condition, wherein the magnetic field intensity is 1T, cooling from room temperature at the cooling rate of 10 ℃/min for 2h, taking out, carrying out temperature return under the room temperature condition, carrying out natural aging, and recovering to room temperature to obtain the copper alloy material.
The copper alloy prepared in the above way is tested, and the properties are as follows: the tensile strength is 760 to 780MPa, the yield strength is 660 to 690MPa, the elongation is 16 to 17 percent, and the elastic modulus E is 139 to 145KN/mm 2 The conductivity was 73.1% IACS.
Example 3
A preparation method of a high-strength, high-conductivity and high-toughness copper alloy comprises the following steps:
s1, preparing the following main components in percentage by mass:
0.4 percent of Sn; be 0.75%; 2.75 percent of Ni; 0.05 percent of Cr; 0.2 percent of Bi and 0.55 percent of Hf; nanometer Y 2 O 3 0.3% of particles; the balance of copper and inevitable impurity elements; adopting Cu, be, hf, ni and Cr metal blocks with the purity of more than or equal to 99.9wt% and Sn-Bi-Cu alloy;
placing the prepared main component elements of copper, sn, be, ni, cr, bi and Hf into an induction furnace with a pulse electric field device, smelting under the protection of pure argon, preserving heat for 15min after the raw materials are completely molten, placing in a room temperature environment, continuously stirring, and adding nano Y into the molten alloy by using an external addition method when the molten alloy is molten 2 O 3 Granulating, inserting pulsed electric field electrode into the melt, and performing pulsed electric field treatment on the melt for 125s at a pulse frequency of 22.5Hz and a pulse current density of 17.5A/mm 2 After the pulse width is 150 microseconds, removing residual slag on the surface after pulse electric field treatment, pouring into a mold, and cooling to room temperature to obtain an alloy ingot;
s2, under the protection of pure argon, placing the obtained alloy ingot into a heat treatment furnace for homogenization treatment, wherein the homogenization treatment temperature is 975 ℃, the pressure is 0.3GPa, the heat preservation time is 1.5h, and then cooling to room temperature along with the furnace;
s3, heating the homogenized alloy ingot to 950 ℃ for hot rolling, wherein the total hot rolling deformation is 70%, the final rolling temperature is 875 ℃, and immediately performing water quenching treatment on the finally rolled alloy material;
s4, milling the surface of the copper alloy material subjected to hot rolling, removing surface oxide skin, and then carrying out rolling deformation at room temperature, wherein the total rolling deformation is 85%;
s5, placing the copper alloy material rolled at the room temperature for the first time into a heat treatment furnace, carrying out primary aging treatment under the protection of pure argon, wherein the aging temperature is 500 ℃, the aging time is 3.5 hours, and then cooling to the room temperature in an air cooling mode;
s6, milling the surface of the copper alloy material subjected to the primary aging treatment, removing surface oxide skin, and then performing room-temperature rolling deformation, wherein the total rolling deformation is 40%;
and S7, carrying out cryogenic treatment on the copper alloy material rolled at the secondary room temperature under the static magnetic field condition, wherein the magnetic field intensity is 1T, cooling from the room temperature at the rate of 10 ℃/min for 2h, taking out, carrying out temperature return at the room temperature, carrying out natural aging, and recovering to the room temperature to obtain the copper alloy material.
The copper alloy obtained by the preparation method is tested, and the performance is as follows: the tensile strength is 760 to 780MPa, the yield strength is 680 to 690MPa, the elongation is 16 to 18 percent, and the elastic modulus E is 139 to 143KN/mm 2 The conductivity was 75.3% IACS.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of the present invention, and these improvements and modifications should also be construed as the protection scope of the present invention.
Claims (4)
1. The high-strength high-conductivity high-toughness copper alloy is characterized by being prepared from the following raw materials in percentage by mass:
0.3 to 0.5 percent of Sn; be 0.5-1.0%; 2 to 3.5 percent of Ni; 0.03 to 0.07 percent of Cr; 0.1 to 0.3 percent of Bi and 0.3 to 0.8 percent of Hf; nanometer Y 2 O 3 0.1 to 0.5 percent of particles; the balance of copper and inevitable impurity elements;
when the high-strength, high-conductivity and high-toughness copper alloy is prepared, the method comprises the following steps:
s1, putting prepared main component elements of copper, sn, be, ni, cr, bi and Hf into an induction furnace with a pulse electric field device, smelting under the protection of pure argon, preserving heat for 15min after raw materials are completely molten, placing the furnace in a room temperature environment, continuously stirring, and adding nano Y into an alloy melt by using an external method when the alloy melt is molten 2 O 3 The particles are then inserted into the melt with the electrode of the pulse electric field for melt pulse electric field treatment, the treatment time of the pulse electric field is 50-200 s, the pulse frequency is 10-35 Hz, and the pulse current density is 10-25A/mm 2 Pulse width of 100-200 mus, removing residual slag on surface after pulse electric field treatment, pouring into mould, coolingCooling to room temperature to obtain an alloy cast ingot;
s2, placing the obtained alloy ingot into a heat treatment furnace for homogenization treatment under the protection of pure argon, wherein the homogenization treatment temperature is 950-1000 ℃, the pressure is 0.2-0.4 GPa, the heat preservation time is 1-2 hours, and then cooling to room temperature along with the furnace;
s3, heating the homogenized alloy cast ingot to 900-1000 ℃ for hot rolling, wherein the total hot rolling deformation is 60-80%, the final rolling temperature is 800-950 ℃, and the alloy material after final rolling is immediately subjected to water quenching treatment;
s4, milling the surface of the copper alloy material subjected to hot rolling, removing surface oxide skin, and then carrying out rolling deformation at room temperature, wherein the total rolling deformation amount is 80-90%;
s5, placing the copper alloy material rolled at the room temperature for the first time into a heat treatment furnace, carrying out primary aging treatment under the protection of pure argon, wherein the aging temperature is 450-550 ℃, the aging time is 3-4 h, and then cooling to the room temperature in an air cooling mode;
s6, milling the surface of the copper alloy material subjected to the primary aging treatment, removing surface oxide skin, and then performing rolling deformation at room temperature, wherein the total rolling deformation is 30-50%;
and S7, carrying out cryogenic treatment on the copper alloy material subjected to secondary room temperature rolling under the static magnetic field condition, wherein the magnetic field intensity is 0.1-2T, cooling from room temperature at the cooling rate of 0.1-20 ℃/min for 1-60 h, taking out, carrying out temperature return under the room temperature condition, carrying out natural aging, and recovering to room temperature to obtain the copper alloy material.
2. The high-strength high-conductivity high-toughness copper alloy as claimed in claim 1, which is prepared from the following raw materials in percentage by mass:
0.3 percent of Sn; 0.5 percent of Be; 2 to 3.5 percent of Ni; 0.03 percent of Cr; 0.1 percent of Bi and 0.3 percent of Hf; nanometer Y 2 O 3 0.1% of particles; the balance being copper and unavoidable impurity elements.
3. The high-strength high-conductivity high-toughness copper alloy as claimed in claim 1, which is prepared from the following raw materials in percentage by mass:
0.5 percent of Sn; be 1.0%; 3.5 percent of Ni; 0.07 percent of Cr; 0.3 percent of Bi0.8 percent of Hf; nanometer Y 2 O 3 0.5% of particles; the balance being copper and unavoidable impurity elements.
4. The high-strength high-conductivity high-toughness copper alloy as claimed in claim 1, which is prepared from the following raw materials in percentage by mass:
0.4% of Sn; be 0.75%; 2.75 percent of Ni; 0.05 percent of Cr; 0.2% of Bi and 0.55% of Hf; nanometer Y 2 O 3 0.3% of particles; the balance being copper and unavoidable impurity elements.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1930314A (en) * | 2004-03-12 | 2007-03-14 | 住友金属工业株式会社 | Copper alloy and process for producing the same |
| CN101743333A (en) * | 2007-08-07 | 2010-06-16 | 株式会社神户制钢所 | copper alloy sheet |
| CN102918172A (en) * | 2010-02-24 | 2013-02-06 | 株式会社豊山 | High-strength and highly conductive copper alloy, and method for manufacturing same |
| JP2014019888A (en) * | 2012-07-13 | 2014-02-03 | Furukawa Electric Co Ltd:The | High strength copper alloy material, and method of manufacturing the same |
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| JP4441467B2 (en) * | 2004-12-24 | 2010-03-31 | 株式会社神戸製鋼所 | Copper alloy with bending workability and stress relaxation resistance |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1930314A (en) * | 2004-03-12 | 2007-03-14 | 住友金属工业株式会社 | Copper alloy and process for producing the same |
| CN101743333A (en) * | 2007-08-07 | 2010-06-16 | 株式会社神户制钢所 | copper alloy sheet |
| CN102918172A (en) * | 2010-02-24 | 2013-02-06 | 株式会社豊山 | High-strength and highly conductive copper alloy, and method for manufacturing same |
| JP2014019888A (en) * | 2012-07-13 | 2014-02-03 | Furukawa Electric Co Ltd:The | High strength copper alloy material, and method of manufacturing the same |
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