CN112725654B - High-strength, high-conductivity and high-toughness copper-titanium alloy for integrated circuit and preparation method thereof - Google Patents

High-strength, high-conductivity and high-toughness copper-titanium alloy for integrated circuit and preparation method thereof Download PDF

Info

Publication number
CN112725654B
CN112725654B CN202011537632.3A CN202011537632A CN112725654B CN 112725654 B CN112725654 B CN 112725654B CN 202011537632 A CN202011537632 A CN 202011537632A CN 112725654 B CN112725654 B CN 112725654B
Authority
CN
China
Prior art keywords
copper
percent
titanium alloy
conductivity
strength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202011537632.3A
Other languages
Chinese (zh)
Other versions
CN112725654A (en
Inventor
晏弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuxi Riyue Alloy Materials Co ltd
Original Assignee
Wuxi Riyue Alloy Materials Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuxi Riyue Alloy Materials Co ltd filed Critical Wuxi Riyue Alloy Materials Co ltd
Priority to CN202011537632.3A priority Critical patent/CN112725654B/en
Publication of CN112725654A publication Critical patent/CN112725654A/en
Application granted granted Critical
Publication of CN112725654B publication Critical patent/CN112725654B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making alloys
    • C22C1/02Making alloys by melting
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Abstract

The invention discloses a high-strength, high-conductivity and high-toughness copper-titanium alloy for an integrated circuit, which comprises the following elements in percentage by weight: 2.9 to 3.4 percent of titanium, 0.17 to 0.23 percent of iron, 0.15 to 0.20 percent of aluminum, 0.03 to 0.10 percent of boron, and the balance of copper and inevitable impurities; the preparation method of the high-strength, high-conductivity and high-toughness copper-titanium alloy comprises the following steps: (1) preparing materials; (2) vacuum melting to form a copper-titanium alloy melt; (3) casting to form a cast ingot; (4) cold rolling to obtain a plate; (5) and (5) aging treatment. The alloy has the advantages of high strength, good conductivity and strong toughness, and is mainly used for integrated circuits, in particular large-scale and ultra-large-scale integrated circuit frames and various electronic product connectors.

Description

High-strength, high-conductivity and high-toughness copper-titanium alloy for integrated circuit and preparation method thereof
Technical Field
The invention relates to the technical field of metal materials, in particular to a high-strength, high-conductivity and high-toughness copper-titanium alloy for an integrated circuit and a preparation method thereof.
Background
Lead frame materials for integrated circuits and semiconductors at home and abroad are classified into two major types, iron-nickel alloy (Fe42Ni) and copper alloy. The iron-nickel alloy has high strength and softening temperature, but low electric conductivity and thermal conductivity, and is mainly used for ceramic and glass packaging. Copper alloy lead frames have been consumed in 90% of the total amount since the twenty-first century because of its excellent electrical conductivity and low cost.
In addition to high strength and high conductivity, copper alloys used for lead frames, various terminals of electronic devices, connectors, and the like are required to have high density packaging and high reliability, and electronic components are required to have a high density of packaging due to the rapid progress of the reduction in pitch by increasing the number of leads on connectors for various terminals. Therefore, a material used for electronic parts is also required to have excellent workability.
Of these alloys, the CuTi age-hardening type alloys are representative, with Ti addition levels generally most preferably in the range of 3.0% to 4.5% by weight. For example: cu-3.5Ti alloy, Cu-3.5Ti-0.2Cr alloy, Cu-6Ti-1Al alloy, etc. Typical processes for these alloys are generally: the processing technology of ingot casting, hot rolling, solution treatment, cold rolling and aging treatment is relatively complex, and the performance of the product is directly influenced by the quality of the processing technology.
In order to improve the performance of the product, a number of patents propose methods of adding different trace elements: for example, more than 0.35 wt% of Sn is added on the CuTi alloy matrix to strengthen the alloy, wherein the Cu-1.6% wtTi-2.5% wtSn alloy has the best precipitation strengthening effect; 0.5-0.7 wt% of Fe is added into the Cu-4.0 wt% of Ti alloy, so that the plasticity and the wear resistance of the alloy can be improved; adding Ni element such as Cu-0.58 wt% Ti-2.06 wt% Ni on CuTi alloy matrix can realize obvious precipitation hardening effect; adding at least one of the following elements into the CuTi alloy matrix: 0.01-0.5 wt% (Cr, V, Zr, B, P) of the rare earth metal oxide can delay the growth of crystal grains in the recrystallization annealing process; 0.3-1.0 wt% of Zn is added into the CuTi alloy matrix, so that the castability of the alloy can be improved; 0.1-0.5 wt% of Mg is added into the CuTi alloy matrix, so that the stress relaxation resistance of the alloy can be improved. Although the addition of these trace elements improves the properties of gold to some extent, the addition of these trace elements is not enough to make the properties of the alloy leap forward without changing the processing technology of the alloy, and cannot reach a sufficient degree in terms of strength, conductivity and toughness.
Disclosure of Invention
In view of the above problems in the prior art, the applicant of the present invention provides a high strength, high conductivity and high toughness copper-titanium alloy for integrated circuits and a preparation method thereof. The alloy has the advantages of high strength, good conductivity and strong toughness, and is mainly used for integrated circuits, in particular large-scale and ultra-large-scale integrated circuit frames and various electronic product connectors.
The technical scheme of the invention is as follows:
the high-strength, high-conductivity and high-toughness copper-titanium alloy for the integrated circuit comprises the following elements in percentage by weight: 2.9 to 3.4 percent of titanium, 0.17 to 0.23 percent of iron, 0.15 to 0.20 percent of aluminum, 0.03 to 0.10 percent of boron, and the balance of copper and inevitable impurities.
Electrolytic titanium which provides Ti element; electrolytic iron which provides an Fe element; electrolyzing aluminum to provide Al element; elemental boron, providing element B; TU2 is oxygen free copper, providing the Cu element.
A preparation method of the high-strength, high-conductivity and high-toughness copper-titanium alloy comprises the following steps:
(1) preparing materials: weighing raw materials, wherein the raw materials comprise the following chemical components in percentage by weight: 2.9 to 3.4 percent of titanium, 0.17 to 0.23 percent of iron, 0.15 to 0.20 percent of aluminum, 0.03 to 0.10 percent of boron, and the balance of copper and inevitable impurities;
(2) vacuum smelting: putting the raw materials weighed in the step (1) into vacuum smelting equipment, and carrying out vacuum smelting to form a copper-titanium alloy melt;
(3) casting: casting the copper-titanium alloy melt obtained in the step (2) into a flat ingot, and rapidly cooling the flat ingot to room temperature by water to achieve the purpose of solution treatment;
(4) cold rolling: cold-rolling the slab ingot obtained in the step (3) into a plate with the thickness of 0.2-0.4 mm;
(5) aging treatment: and (4) ageing the plate obtained in the step (4) at the temperature of 350-450 ℃ for 5-15 hours.
In the step (2), the vacuum smelting equipment is a vacuum induction furnace.
In the step (3), the vacuum melting conditions are as follows: the vacuum degree is 10-10-2Pa, the temperature is 1200-1500 ℃, and the temperature is kept for 20-30 min.
The beneficial technical effects of the invention are as follows:
the invention adds a trace amount of Fe, Al and B elements on a CuTi alloy matrix. Fe acts in the alloy as: fe element is easy to form intermetallic compound with Ti, and ultrafine high-melting-point compound particles are suspended in the melt to form dispersed crystalline core, so that the crystalline grains become more and smaller, thereby refining the crystalline grains and improving the wear resistance of the alloy; because the atomic radius of iron is smaller than that of copper, the surface defect of a new phase of crystal grains in the growth process of copper or copper alloy is easily filled, and a film which can prevent the crystal grains from continuously growing is generated, thereby playing the role of refining the crystal grains. Meanwhile, Fe can reduce the hardness of the Cu-Ti alloy after solution treatment, improve the plasticity, obviously prevent the crystal grains from growing during heating and inhibit the crystal boundary reaction in the aging process; the Al plays a role in the alloy: in the aging process, Al element and the matrix form AlCu2Ti phase, thereby reducing the content of Ti atoms in the matrix and greatly improving the conductivity of the alloy; b has the following functions in the alloy: the B element positioned at the grain boundary inhibits the discontinuous precipitation of beta-Cu 4Ti at the grain boundary, thereby reducing the possibility of the initiation and the propagation of the intergranular cracks of the alloy and improving the ductility and the hardness of the alloy on the premise of not influencing the conductivity. The addition of the trace elements can greatly improve the overall performance of the copper-titanium alloy, so that the copper-titanium alloy has high strength, good conductivity and toughness.
The alloy composition of the invention is reasonable, the prepared copper alloy has the advantages of high strength, good conductivity, strong toughness and the like, and the copper alloy can be used for integrated circuits, in particular large-scale and ultra-large-scale integrated circuit frames and various electronic product connectors. The preparation method of the copper alloy eliminates the hot rolling procedure, so that the processing procedure is simpler.
Detailed Description
The present invention will be described in detail with reference to examples.
Example 1
A preparation method of a high-strength, high-conductivity and high-toughness copper-titanium alloy comprises the following steps:
(1) preparing materials: weighing raw materials, wherein the raw materials comprise the following chemical components in percentage by weight: 3.0% of titanium, 0.18% of iron, 0.16% of aluminum, 0.05% of boron, and the balance of copper and inevitable impurities; electrolytic titanium which provides Ti element; electrolytic iron which provides an Fe element; electrolyzing aluminum to provide Al element; elemental boron, providing element B; TU2 oxygen free copper, providing Cu element;
(2) vacuum smelting: putting the raw materials weighed in the step (1) into vacuum melting equipment for vacuum melting, wherein the vacuum degree is 0.5Pa, and the temperature is 1250 ℃ and is kept for 25min to form a copper-titanium alloy melt;
(3) casting: casting the copper-titanium alloy melt obtained in the step (2) into a flat ingot, and rapidly cooling the flat ingot to room temperature by water to achieve the purpose of solution treatment; obtaining an ingot with the thickness of 40mm and the width of 105 mm;
(4) cold rolling: cold-rolling the cast ingot obtained in the step (3) into a plate with the thickness of 0.3 mm;
(5) aging treatment: and (4) ageing the plate obtained in the step (4) at the temperature of 400 ℃ for 10 hours to obtain the copper-titanium alloy. The results of the performance tests are shown in table 1.
Example 2
A preparation method of a high-strength, high-conductivity and high-toughness copper-titanium alloy comprises the following steps:
(1) preparing materials: weighing raw materials, wherein the raw materials comprise the following chemical components in percentage by weight: 3.2% of titanium, 0.2% of iron, 0.18% of aluminum, 0.07% of boron, and the balance of copper and inevitable impurities; electrolytic titanium which provides Ti element; electrolytic iron which provides an Fe element; electrolyzing aluminum to provide Al element; elemental boron, providing element B; TU2 oxygen free copper, providing Cu element;
(2) vacuum smelting: putting the raw materials weighed in the step (1) into vacuum melting equipment for vacuum melting, wherein the vacuum degree is 10Pa, and the temperature is 1250 ℃ and is kept for 30min to form a copper-titanium alloy melt;
(3) casting: casting the copper-titanium alloy melt obtained in the step (2) into a flat ingot, and rapidly cooling the flat ingot to room temperature by water to achieve the purpose of solution treatment; obtaining an ingot with the thickness of 40mm and the width of 105 mm;
(4) cold rolling: cold-rolling the cast ingot obtained in the step (3) into a plate with the thickness of 0.3 mm;
(5) aging treatment: and (4) aging the plate obtained in the step (4) at the temperature of 420 ℃ for 8 hours to obtain the copper-titanium alloy. The results of the performance tests are shown in table 1.
Example 3
A preparation method of a high-strength, high-conductivity and high-toughness copper-titanium alloy comprises the following steps:
(1) preparing materials: weighing raw materials, wherein the raw materials comprise the following chemical components in percentage by weight: 3.4% of titanium, 0.22% of iron, 0.20% of aluminum, 0.09% of boron, and the balance of copper and inevitable impurities; electrolytic titanium which provides Ti element; electrolytic iron which provides an Fe element; electrolyzing aluminum to provide Al element; elemental boron, providing element B; TU2 oxygen free copper, providing Cu element;
(2) vacuum smelting: putting the raw materials weighed in the step (1) into vacuum melting equipment for vacuum melting, keeping the vacuum degree at 0.01Pa and the temperature at 1350 ℃ for 20min to form a copper-titanium alloy melt;
(3) casting: casting the copper-titanium alloy melt obtained in the step (2) into a flat ingot, and rapidly cooling the flat ingot to room temperature by water to achieve the purpose of solution treatment; obtaining an ingot with the thickness of 40mm and the width of 105 mm;
(4) cold rolling: cold-rolling the cast ingot obtained in the step (3) into a plate with the thickness of 0.2 mm;
(5) aging treatment: and (4) aging the plate obtained in the step (4) at the temperature of 450 ℃ for 8 hours to obtain the copper-titanium alloy. The results of the performance tests are shown in table 1.
TABLE 1
As can be seen from Table 1, the properties of the copper-titanium alloys obtained in examples 1 to 3, compared with the existing C70250 copper alloy, have achieved the strength and conductivity of the C70250 copper alloy, and in terms of the processing technique, hot rolling and solution treatment are eliminated, so that the processing technique is simpler and more convenient.

Claims (4)

1. The high-strength, high-conductivity and high-toughness copper-titanium alloy for the integrated circuit is characterized by comprising the following elements in percentage by weight: 2.9 to 3.4 percent of titanium, 0.17 to 0.23 percent of iron, 0.15 to 0.20 percent of aluminum, 0.03 to 0.10 percent of boron, and the balance of copper and inevitable impurities;
the preparation method of the high-strength, high-conductivity and high-toughness copper-titanium alloy comprises the following steps:
(1) preparing materials: weighing raw materials, wherein the raw materials comprise the following chemical components in percentage by weight: 2.9 to 3.4 percent of titanium, 0.17 to 0.23 percent of iron, 0.15 to 0.20 percent of aluminum, 0.03 to 0.10 percent of boron, and the balance of copper and inevitable impurities;
(2) vacuum smelting: putting the raw materials weighed in the step (1) into vacuum smelting equipment, and carrying out vacuum smelting to form a copper-titanium alloy melt;
(3) casting: casting the copper-titanium alloy melt obtained in the step (2) into a flat ingot, and rapidly cooling the flat ingot to room temperature by water;
(4) cold rolling: cold-rolling the slab ingot obtained in the step (3) into a plate with the thickness of 0.2-0.4 mm;
(5) aging treatment: and (5) carrying out aging treatment on the plate obtained in the step (4) at the temperature of 350-.
2. The high-strength, high-conductivity and high-toughness copper-titanium alloy for integrated circuits according to claim 1, wherein titanium is electrolyzed, and Ti element is provided; electrolytic iron which provides an Fe element; electrolyzing aluminum to provide Al element; elemental boron, providing element B; TU2 is oxygen free copper, providing the Cu element.
3. The high-strength high-conductivity high-toughness copper-titanium alloy for the integrated circuit according to claim 1, wherein in the step (2), the vacuum melting equipment is a vacuum induction furnace.
4. The high-strength high-conductivity high-toughness copper-titanium alloy for the integrated circuit according to claim 1, wherein in the step (2), the vacuum melting conditions are as follows: the vacuum degree is 10-10-2And keeping the temperature for 20-30min at the Pa and the temperature of 1200-1500 ℃.
CN202011537632.3A 2020-12-23 2020-12-23 High-strength, high-conductivity and high-toughness copper-titanium alloy for integrated circuit and preparation method thereof Active CN112725654B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011537632.3A CN112725654B (en) 2020-12-23 2020-12-23 High-strength, high-conductivity and high-toughness copper-titanium alloy for integrated circuit and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011537632.3A CN112725654B (en) 2020-12-23 2020-12-23 High-strength, high-conductivity and high-toughness copper-titanium alloy for integrated circuit and preparation method thereof

Publications (2)

Publication Number Publication Date
CN112725654A CN112725654A (en) 2021-04-30
CN112725654B true CN112725654B (en) 2021-12-24

Family

ID=75604994

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011537632.3A Active CN112725654B (en) 2020-12-23 2020-12-23 High-strength, high-conductivity and high-toughness copper-titanium alloy for integrated circuit and preparation method thereof

Country Status (1)

Country Link
CN (1) CN112725654B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113278844B (en) * 2021-05-18 2022-05-27 国工恒昌新材料沧州有限公司 High-strength high-elasticity copper-titanium alloy and manufacturing method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04221032A (en) * 1990-12-21 1992-08-11 Nikko Kyodo Co Ltd High strength and high conductivity copper alloy for die for plastic molding and its manufacture
CN102140594A (en) * 2011-03-11 2011-08-03 无锡日月合金材料有限公司 High-strength, high-conductivity and high-toughness copper alloy and preparation method thereof
JP2014173145A (en) * 2013-03-08 2014-09-22 Mitsubishi Materials Corp Copper alloy-plasticized material for electronic/electric appliances, component for electronic/electric appliances, and terminal
CN104674054A (en) * 2015-03-12 2015-06-03 天津理工大学 High-strength copper-titanium alloy and preparation method thereof
JP2015190044A (en) * 2014-03-28 2015-11-02 Dowaメタルテック株式会社 Cu-Ti-BASED COPPER ALLOY SHEET MATERIAL, MANUFACTURING METHOD THEREFOR, AND ELECTRIFICATION COMPONENT

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6250426A (en) * 1985-08-29 1987-03-05 Furukawa Electric Co Ltd:The Copper alloy for electronic appliance
CN111992684A (en) * 2020-07-07 2020-11-27 宁波博威新材料有限公司 Preparation method of titanium bronze alloy cast ingot

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04221032A (en) * 1990-12-21 1992-08-11 Nikko Kyodo Co Ltd High strength and high conductivity copper alloy for die for plastic molding and its manufacture
CN102140594A (en) * 2011-03-11 2011-08-03 无锡日月合金材料有限公司 High-strength, high-conductivity and high-toughness copper alloy and preparation method thereof
JP2014173145A (en) * 2013-03-08 2014-09-22 Mitsubishi Materials Corp Copper alloy-plasticized material for electronic/electric appliances, component for electronic/electric appliances, and terminal
JP2015190044A (en) * 2014-03-28 2015-11-02 Dowaメタルテック株式会社 Cu-Ti-BASED COPPER ALLOY SHEET MATERIAL, MANUFACTURING METHOD THEREFOR, AND ELECTRIFICATION COMPONENT
CN104674054A (en) * 2015-03-12 2015-06-03 天津理工大学 High-strength copper-titanium alloy and preparation method thereof

Also Published As

Publication number Publication date
CN112725654A (en) 2021-04-30

Similar Documents

Publication Publication Date Title
CN105714148B (en) A kind of high-strength adonic of spinodal decomposition type
CN110284018B (en) Environment-friendly high-missile-resistance corrosion-resistant copper alloy and production method of plate and strip thereof
CN110951990B (en) Cu-Ni-Co-Fe-Si-Zr-Zn copper alloy material and preparation method thereof
EP3647440B1 (en) Aluminum alloy and preparation method therefor
CN107829000B (en) Die-casting aluminum alloy material and preparation method thereof
CN111809079B (en) High-strength high-conductivity copper alloy wire material and preparation method thereof
CN100532599C (en) Fatigue resistant Cu-Ti alloy and producing method thereof
CN112725654B (en) High-strength, high-conductivity and high-toughness copper-titanium alloy for integrated circuit and preparation method thereof
CN111411255B (en) Copper alloy for electronic component and preparation method thereof
CN111411256B (en) Copper-zirconium alloy for electronic components and preparation method thereof
CN111020280B (en) Cu-Al-Hf-Ti-Zr copper alloy material and preparation method thereof
JP5135914B2 (en) Manufacturing method of high-strength copper alloys for electrical and electronic parts
JP4197717B2 (en) Copper alloy plate for electrical and electronic parts with excellent plating properties
JP2005325390A (en) Cu-Ni-Si-Mg-BASED COPPER ALLOY STRIP
CN112251627A (en) High-strength high-conductivity Cu-Sc alloy and preparation method thereof
CN109735741B (en) Multiphase reinforced copper alloy for electronic packaging and preparation method thereof
CN110004320B (en) High-strength high-conductivity Cu-Ag-Sc alloy and preparation method thereof
CN112725655B (en) High-strength high-conductivity copper-chromium alloy for high-power device and preparation method thereof
CN111636011A (en) High-strength high-conductivity copper-nickel-silicon alloy with good formability and preparation method thereof
JP4287878B2 (en) Cu-Ni-Si-Mg copper alloy strip
CN112359246B (en) Cu-Ti-P-Ni-Er copper alloy material and preparation method thereof
CN113943875B (en) Cu-Sn-P copper alloy material with high tin content and preparation method thereof
JP3941308B2 (en) Copper alloy with excellent hot workability
CN113528899B (en) High-heat-conductivity and high-strength aluminum alloy sheet and preparation method thereof
CN113046594B (en) High-strength high-thermal-conductivity copper alloy material roller sleeve and preparation method thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant