CN107046763B - Copper foil for flexible printed board and copper-clad laminate using same - Google Patents
Copper foil for flexible printed board and copper-clad laminate using same Download PDFInfo
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- CN107046763B CN107046763B CN201710049631.6A CN201710049631A CN107046763B CN 107046763 B CN107046763 B CN 107046763B CN 201710049631 A CN201710049631 A CN 201710049631A CN 107046763 B CN107046763 B CN 107046763B
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- copper foil
- copper
- flexible printed
- printed board
- clad laminate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
Abstract
The present invention relates to a copper foil for a flexible printed board, a copper-clad laminate using the same, a flexible printed board, and an electronic device, wherein the copper foil for a flexible printed board is excellent In bendability and etching properties, and a solution is provided for a copper foil for a flexible printed board, wherein the copper foil for a flexible printed board contains 0.001 ~ 0.05.05 mass% of Ag and 0.003 ~ 0.825.825 mass% of 1 or more additive elements selected from P, Ti, Sn, Ni, Be, Zn, In, and Mg In total relative to tough pitch copper specified In JIS-H3100(C1100) or oxygen-free copper In JIS-H3100(C1011), and has an average crystal grain diameter of 0.5 ~ 4.0 [ mu ] m and a tensile strength of 235 ~ 290 MPa.
Description
Technical Field
The present invention relates to a copper foil suitable for use in a wiring member such as a flexible printed circuit board, a copper-clad laminate using the copper foil, a flexible wiring board, and an electronic device.
Background
A flexible printed circuit board (flexible wiring board, hereinafter referred to as "FPC") is widely used for a bending portion and a movable portion of an electronic circuit because of its flexibility. For example, FPCs are used in removable portions of disk-type related devices such as HDDs, DVDs, and CD-ROMs, and in bending portions of folding mobile phones.
The FPC is obtained by etching a Copper Clad Laminate (hereinafter, referred to as a CCL) obtained by laminating a Copper foil and a resin to form a wiring, and covering the wiring with a resin layer called a Coverlay (Coverlay). In the stage before the cover layer is laminated, the surface of the copper foil is etched as a part of a surface modification step for improving the adhesion between the copper foil and the cover layer. In addition, thinning etching may be performed to reduce the thickness of the copper foil and improve bendability.
However, as electronic devices are reduced in size, thickness, and performance, it is required to mount FPCs with high density inside the devices, but in order to perform high-density mounting, it is necessary to fold and store the FPCs inside the reduced-size devices, that is, high bendability is required.
On the other hand, copper foils improved in high cycle flexibility typified by IPC flexibility have been developed (patent documents 1 and 2).
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 2010-100887
Patent document 2: japanese patent laid-open No. 2009-111203.
Disclosure of Invention
Problems to be solved by the invention
However, as described above, in order to mount an FPC at high density, it is necessary to improve the bending properties represented by MIT folding endurance, and the conventional copper foil has a problem that the improvement of the bending properties is not sufficient.
Further, with the miniaturization, thinness, and high performance of electronic devices, the circuit width and pitch (space) width of FPCs have been miniaturized to about 20 ~ 30 μm, and there is a problem in that when a circuit is formed by etching, the etching factor and the linearity of the circuit are easily deteriorated, and thus there is a demand for solving the problem.
The present invention has been made to solve the above problems, and an object thereof is to provide a copper foil for a flexible printed board having excellent bendability and etching properties, and a copper-clad laminate, a flexible printed board, and an electronic device using the same.
Means for solving the problems.
The inventors of the present invention have conducted various studies and found that: by making the recrystallized grains of the copper foil finer, the strength can be improved and the bendability can be improved. The reason for this is that the finer the crystal grain, the higher the strength and the higher the bendability according to the Hall-Petch (Hall-Petch) rule. However, if the crystal grains are made finer, the strength becomes too high, the bending rigidity becomes large, and the spring back becomes large, and thus the method is not suitable for the flexible printed board application. Therefore, the range of the grain diameter is also specified.
Further, by making the crystal grain size finer to about 1/10 of the circuit width of about 20 ~ 30 μm in recent FPC, the etching factor and the circuit linearity when forming a circuit by etching can be improved.
That is, the Copper foil for a flexible printed board of the present invention contains 0.001 ~ 0.05.05 mass% of Ag and 0.003 ~ 0.825.825 mass% In total of 1 or more kinds of additive elements selected from the group consisting of P, Ti, Sn, Ni, Be, Zn, In and Mg In relation to Tough Pitch Copper (Tough-Pitch Copper) of the specification defined In JIS-H3100(C1100) or oxygen-free Copper of JIS-H3100(C1011), has an average crystal grain diameter of 0.5 ~ 4.0 μm, and has a tensile strength of 235 ~ 290 MPa.
In the copper foil for a flexible printed board of the present invention, it is preferable that the copper foil is a rolled copper foil, the average crystal grain size after heat treatment at 300 ℃ for 30 minutes is 0.5 ~.0 μm, and the tensile strength is 235 ~ MPa.
Preferably, a copper-clad laminate obtained by laminating a polyimide resin film having a thickness of 25 μm on one surface of the copper foil is bent by 180 degrees in close contact with the copper foil so that the copper foil is outside with a bending radius of 0.05mm, and then the bent portion is restored to 0 degree, and after repeating the above test 3 times, no crack is visually observed when the copper foil is observed at a magnification of 200.
The copper-clad laminate of the present invention is obtained by laminating the copper foil for a flexible printed board and a resin layer.
The flexible printed circuit board of the present invention uses the copper-clad laminate, and a circuit is formed on the copper foil.
It is preferable that L/S of the loop is 40/40 ~ 15/15(μm/μm). The L/S (line width and pitch) of the loop is a ratio of a width (L: line width) of a wiring constituting the loop to a spacing (S: pitch) between adjacent wirings, L is a minimum value of L in the loop, and S is a minimum value of S in the loop.
It should be noted that L and S do not have to be the same value as long as they are 15 ~ 40 μm, and values such as L/S =20.5/35 and 35/17 may be used.
The electronic device of the present invention is formed using the flexible printed circuit board.
Effects of the invention
According to the present invention, a copper foil for a flexible printed board excellent in bendability and etching properties can be obtained.
Drawings
Fig. 1 is a diagram illustrating a method of testing the bendability of a CCL.
Detailed Description
Hereinafter, embodiments of the copper foil according to the present invention will be described. In the present invention,% represents% by mass unless otherwise specified.
< composition >
The copper foil of the present invention contains 0.001 ~ 0.05.05 mass% of Ag and 0.003 ~ 0.825.825 mass% In total of 1 or more kinds of additive elements selected from the group consisting of P, Ti, Sn, Ni, Be, Zn, In and Mg In relation to tough pitch copper In accordance with the specification defined In JIS-H3100(C1100) or oxygen-free copper In accordance with JIS-H3100 (C1011).
As described above, in the present invention, the strength is improved and the bendability is improved by making the crystal grains of the copper foil after recrystallization finer.
However, in order to more reliably refine the crystal grains, it is preferable to perform recrystallization annealing only once in the initial stage of cold rolling, and thereafter not perform recrystallization annealing. As a result, a large amount of work strain is introduced by cold rolling, and dynamic recrystallization occurs, thereby reliably realizing grain refinement.
In order to increase the work strain in the cold rolling, η = ln (thickness before the final cold rolling/thickness after the final cold rolling) =3.5 ~ 7.5.5 is preferable as the work degree in the final cold rolling (finish rolling performed after the final annealing in the entire steps of repeating annealing and rolling).
When η is less than 3.5, accumulation of strain during processing is small, and nuclei of recrystallized grains become small, so that recrystallized grains tend to become coarse, and when η is greater than 7.5, strain is excessively accumulated, which becomes a driving force for grain growth, and grains tend to become coarse, and η =5.5 ~ 7.5.5 is more preferable.
Further, if Ag and the above-mentioned additive elements are contained as the additive elements for refining the crystal grains, the dislocation density at the time of cold rolling increases, and the refinement of the crystal grains can be reliably achieved.
Among them, Ag reduces the sensitivity of the recrystallized grain diameter with respect to the recrystallization annealing conditions. That is, as described later, although heat treatment for curing the resin is performed during CCL lamination, the temperature, time variation, and temperature increase rate of heat treatment actually vary depending on the manufacturing apparatus, the manufacturer, and the like. Therefore, there is a concern that the grain size of the recrystallized grains of the copper foil becomes large due to the heat treatment. Therefore, by containing Ag, even if the heat treatment conditions during CCL lamination change, the crystal grains can be stably refined.
If the content of Ag is less than 0.001 mass%, it becomes difficult to refine the crystal grains. If the content of Ag is more than 0.05 mass%, the recrystallization temperature may rise and recrystallization may not occur when the copper foil is laminated with a resin, and the strength may become too high and the bendability of the copper foil and CCL may deteriorate.
If the total content of the above-mentioned additive elements is less than 0.003 mass%, it is difficult to refine crystal grains, and if it exceeds 0.825 mass%, the electrical conductivity may be lowered. Further, the recrystallization temperature may be increased so that the copper foil and the CCL may not be recrystallized when laminated with a resin, and the strength may be excessively increased so that the bendability of the copper foil and the CCL may be deteriorated.
< average grain size >
The average crystal grain diameter of the copper foil is 0.5 ~ 4.0.0 μm, if the average crystal grain diameter is less than 0.5 μm, the strength becomes too high, the bending rigidity becomes large, the resilience becomes large, and the copper foil is not suitable for the use of a flexible printed circuit board, if the average crystal grain diameter is more than 4.0 μm, the crystal grains cannot be refined, the strength is difficult to be improved, the bendability is improved, and the etching factor and the circuit linearity are deteriorated, and the etching performance is lowered.
In order to avoid errors in the measurement of the average crystal grain size, it is preferable to observe the foil surface in a visual field of 100. mu. m.times.100. mu.m for 3 visual fields or more. For the observation of the foil surface, the average crystal grain diameter can be determined based on JIS H0501 using SIM (Scanning Ion Microscope) or SEM (Scanning Electron Microscope).
The twin crystal was measured as the respective crystal grains.
< Tensile Strength (TS) >
The tensile strength of the copper foil is 235 ~ 290MPa as described above, the tensile strength is improved by making the crystal grains finer, if the tensile strength is less than 235MPa, the strength is difficult to improve and the bendability is improved, and if the tensile strength is more than 290MPa, the strength becomes too high and the bending rigidity becomes large and the resilience becomes large, and thus it is not suitable for the use as a flexible printed board.
The tensile strength was measured by a tensile test according to IPC-TM650, in which the test piece width was 12.7mm, the room temperature (15 ~ 35 ℃ C.), the tensile rate was 50.8mm/min, and the gauge length was 50mm, in a direction parallel to the rolling direction of the copper foil.
< Heat treatment at 300 ℃ for 30 minutes >
The copper foil may have an average crystal grain diameter of 0.5 ~ 4.0.0 μm and a tensile strength of 235 ~ 290MPa after being heat-treated at 300 ℃ for 30 minutes.
In the case where the copper foil according to the present invention is used for a flexible printed circuit board, in the CCL obtained by laminating the copper foil and a resin, the crystal grains may be coarsened by recrystallization because the heat treatment for curing the resin is performed at 200 ~ 400 ℃.
Therefore, the average crystal grain diameter and tensile strength of the copper foil change before and after lamination with the resin. Therefore, the copper foil for a flexible printed board according to claim 1 of the present application defines a copper foil in a state of having been subjected to a curing heat treatment of a resin after a copper-clad laminate is formed by laminating a resin.
On the other hand, the copper foil for a flexible printed board according to claim 2 of the present application defines a state when the copper foil before being laminated with a resin is subjected to the above-mentioned heat treatment. The heat treatment at 300 ℃ for 30 minutes is similar to the temperature condition for curing heat treatment of the resin in the lamination of CCL.
The copper foil of the present invention can be produced, for example, as follows. First, the additive is added to a copper ingot, melted, cast, hot-rolled, cold-rolled, and annealed, and the final cold-rolled is performed to produce a foil.
< copper-clad laminate and Flexible printed Circuit Board >
Further, a Copper Clad Laminate (CCL) including two layers of a copper foil and a resin substrate can be obtained by (1) casting a resin precursor (for example, a polyimide precursor called varnish) and applying heat to polymerize the resin precursor, and (2) laminating a base film on the copper foil of the present invention using the same kind of thermoplastic adhesive as the base film. Further, a Copper Clad Laminate (CCL) comprising three layers of a copper foil, a resin substrate, and an adhesive layer therebetween can be obtained by laminating a base film coated with an adhesive on the copper foil of the present invention. These CCLs are recrystallized by heat treatment of copper foil during production.
A circuit is formed by using a photolithography technique, and the circuit is plated as necessary, and a cover lay film is laminated to obtain a flexible printed circuit board (flexible wiring board).
Therefore, the copper-clad laminate of the present invention is obtained by laminating a copper foil and a resin layer. The flexible printed circuit board of the present invention is formed by forming a circuit on a copper foil of a copper-clad laminate.
Examples of the resin layer include, but are not limited to, PET (polyethylene terephthalate), PI (polyimide), LCP (liquid crystal polymer), and PEN (polyethylene naphthalate). Further, as the resin layer, a resin film of them can be used.
As a method for laminating the resin layer and the copper foil, a material for forming the resin layer may be applied to the surface of the copper foil and heated to form a film. Further, a resin film may be used as the resin layer, and the following adhesive may be used between the resin film and the copper foil, or the resin film may be thermally laminated on the copper foil without using an adhesive. However, from the viewpoint of not applying excessive heat to the resin film, it is preferable to use an adhesive.
When a film is used as the resin layer, the film may be laminated on a copper foil via an adhesive layer. In this case, an adhesive having the same composition as the film is preferably used. For example, when a polyimide film is used as the resin layer, a polyimide adhesive is preferably used as the adhesive layer. The polyimide adhesive referred to herein is an adhesive containing an imide bond, and includes polyetherimide and the like.
The present invention is not limited to the above embodiments. The copper alloy in the above embodiment may contain other components as long as the effects of the present invention are achieved.
For example, the surface of the copper foil may be subjected to a surface treatment by roughening treatment, rust-proofing treatment, heat-resisting treatment, or a combination thereof.
Examples
The present invention will be described in further detail with reference to examples, but the present invention is not limited thereto.
Elements shown in table 1 were added to electrolytic copper having a purity of 99.9% or more, respectively, and cast in an Ar atmosphere to obtain ingots. The oxygen content in the ingot was less than 15 ppm. The ingot was subjected to homogenizing annealing at 900 ℃, hot rolling to a thickness of 30mm, then cold rolling to a thickness of 14mm, then primary annealing, and then surface cutting to finish cold rolling at a working degree η shown in table 1 to obtain a foil having a final thickness of 17 μm. The obtained foil was subjected to a heat treatment at 300 ℃ for 30 minutes to obtain a copper foil sample.
Evaluation of copper foil samples >
1. Electrical conductivity of
The conductivity (% IACS) at 25 ℃ was measured by the 4-terminal method in accordance with JIS H0505 for each copper foil sample after the heat treatment.
The conductivity is good as long as the conductivity is 75% IACS or more.
2. Particle size
The surface of each copper foil sample after the heat treatment was observed by SEM (Scanning Electron Microscope), and the average particle diameter was determined according to JIS H0501. The twin crystal was measured as the respective crystal grains. The measurement area is 100. mu. m.times.100. mu.m of the surface.
3. Bending Property of copper foil (MIT folding endurance)
For each copper foil sample after the heat treatment, the number of MIT folding endurance (number of reciprocal folding) was measured in accordance with JIS P8115. Wherein, the R of the bending clamp is 0.38, and the load is 500 g.
The copper foil has good bendability as long as the number of MIT folding endurance is 75 or more.
4. Tensile strength of copper foil
The tensile strength of each copper foil sample after the heat treatment was measured under the above-mentioned conditions by a tensile test according to IPC-TM 650.
Evaluation of CCL >
Bendability of CCL
One surface of the copper foil sample (copper foil before heat treatment) which was not subjected to the above heat treatment after the final cold rolling was subjected to copper roughening plating. As the copper roughening plating bath, electroplating was carried out for 1 to 5 seconds at a bath temperature of 20 to 40 ℃ and a current density of 30 to 70A/dm2 using a composition of 10 to 25g/L Cu and 20 to 100g/L sulfuric acid, and the amount of copper deposited was 20g/dm 2.
A polyimide film (product name "ユ ー ピ レ ッ ク ス VT" manufactured by yu xing co., ltd., thickness 25 μm) was laminated on the roughened plating surface of the copper foil sample, and heat-treated at 300 ° c. × 30 minutes by heating and pressing (4MPa) to obtain a CCL sample by pasting. The CCL sample used in the bending test had dimensions of 50mm in the rolling direction (longitudinal direction) and 12.7mm in the width direction.
As shown in fig. 1, the CCL sample 30 was sandwiched between a lower mold 10a and an upper mold 10b of a compression tester 10 (product name "オ ー ト グ ラ フ AGS" manufactured by shimadzu corporation) by folding the sample in two at the center in the longitudinal direction so that a 0.1mm thick plate 20 (titanium copper plate of the standard specified in JIS-H3130 (C1990)) was sandwiched with the copper foil surface on the outer side.
In this state, the upper mold 10b is lowered to fold the CCL sample 30 so that the folded portion is in close contact with the plate 20 (fig. 1 (a)). Immediately after taking out the CCL sample 30 from the compression tester 10, the presence or absence of cracking on the copper foil surface was visually confirmed at a magnification of 200 times with a microscope (product name "ワ ン シ ョ ッ ト 3D measurement マ イ ク ロ ス コ ー プ VR-3000" manufactured by キ ー エ ン ス corporation) for the folded end 30s of the double-folded "horizontal V" shape. The bent tip portion 30s corresponds to 180-degree close bending with a bending radius of 0.05 mm.
When the rupture was confirmed, the test was terminated, and the number of times the compression of fig. 1(a) was performed was defined as the number of times the CCL was bent.
If no fracture is detected, as shown in fig. 1(b), the CCL sample 30 is placed between the lower die 10a and the upper die 10b of the compression tester 10 so that the bent tip 30s faces upward, and the upper die 10b is lowered in this state to spread the bent tip 30 s.
Thereafter, the bending of fig. 1(a) is repeated to visually confirm the presence or absence of breakage of the bent tip portion 30s in the same manner, and the step of fig. 1(a) ~ (b) is repeated in the same manner to determine the number of times of bending.
The number of times the CCL is bent is 3 or more, the bendability of the CCL is good.
6. Etching property
Short stripe-shaped loops of L/S (line width/pitch) =40/40 μm, 35/35 μm, 25/25 μm, 20/20 μm, and 15/15 μm were formed on the copper foil portion of the above CCL sample. For comparison, a circuit was formed on a commercially available rolled copper foil (tough pitch copper foil) in the same manner. Then, the etching factor (the ratio of the etching depth to the average etching width above and below) and the linearity of the circuit were visually evaluated by a microscope and evaluated according to the following criteria. The evaluation need only be o.
O: compared with the commercial rolled copper foil, the etching factor and the linearity of the circuit are good
And (delta): the etching factor and the linearity of the circuit are equivalent to those of a commercially available rolled copper foil
X: the etching factor and the linearity of the circuit were inferior to those of commercially available rolled copper foil.
The results obtained are shown in table 1.
[ Table 1]
As is clear from Table 1, the copper foil of each example having an average crystal grain size of 0.5 ~ 4.0.0. mu.m and a tensile strength of 235 ~ 290MPa was excellent in bendability and etching properties.
On the other hand, in comparative examples 1, 3 and 6 in which the degree of working η in the final cold rolling was less than 3.5, the average crystal grain size of the copper foil was more than 4.0 μm, the tensile strength was less than 235MPa, and the bendability of the copper foil and CCL was poor. In comparative example 6, the average crystal grain size of the copper foil was 4.5 μm, which is slightly larger than 4.0 μm, and the etching property was good.
In the case of comparative example 2 containing Ag but not containing the additive element and in the case of comparative example 5 in which the total content of the additive element is less than the lower limit value, the recrystallized grains are insufficiently refined by the additive element, the average grain size of the copper foil is much larger than 4.0 μm and coarsened, the tensile strength is less than 235MPa, and the copper foil is poor in bendability and etching properties.
In the case of comparative example 4 in which the total content of the added elements is greater than the upper limit value, the conductivity is poor.
In the case of comparative example 7 in which the content of Ag was more than 0.05 mass%, the recrystallization temperature became high so that recrystallization did not occur in the heat treatment performed at 300 ℃, the electrical conductivity was decreased, and the tensile strength became high to more than 290 MPa. Therefore, the bendability of the copper foil and the CCL is significantly deteriorated.
Claims (7)
1. The copper foil for flexible printed board contains tough pitch copper in accordance with the standard prescribed in JIS-H3100-C1100 or oxygen-free copper in accordance with JIS-H3100-C1011
0.001 ~ 0.05.05 mass% of Ag, and 0.003 ~ 0.825.825 mass% In total of 1 or more kinds of additive elements selected from the group consisting of P, Ti, Sn, Ni, Be, Zn, In and Mg,
the copper foil has an average crystal grain diameter of 0.5 ~.0 [ mu ] m and a tensile strength of 235 ~ MPa.
2. The copper foil for flexible printed substrates according to claim 1, wherein the copper foil is a rolled copper foil,
the average crystal grain diameter after heat treatment at 300 ℃ for 30 minutes was 0.5 ~ 4.0.0 μm, and the tensile strength was 235 ~ 290 MPa.
3. The copper foil for flexible printed boards according to claim 1 or 2, wherein the following test is carried out: a copper-clad laminate obtained by laminating a polyimide resin film having a thickness of 25 μm on one surface of the copper foil is bent in close contact with 180 degrees so that the copper foil is outside with a bending radius of 0.05mm, and then the bent portion is restored to 0 degree,
after repeating the above test 3 times, cracks were not visually observed when the copper foil was observed at a magnification of 200.
4. A copper-clad laminate obtained by laminating the copper foil for a flexible printed board according to claim 1 ~ 3 and a resin layer.
5. A flexible printed board using the copper-clad laminate according to claim 4, wherein a circuit is formed on the copper foil.
6. The flexible printed substrate of claim 5, wherein the L/S of the loop is 15/40 ~ 40/15,
l is the width of the wiring constituting the circuit, and L is the minimum value of L in the circuit, L is 15 ~ 40 μm,
s means the interval between adjacent wires, and S takes the minimum value of S in the loop, S being 15 ~ 40 μm.
7. An electronic device using the flexible printed substrate according to claim 5 or 6.
Applications Claiming Priority (4)
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| JP2016-020759 | 2016-02-05 | ||
| JP2016020759 | 2016-02-05 | ||
| JP2016-063233 | 2016-03-28 | ||
| JP2016063233A JP6392268B2 (en) | 2016-02-05 | 2016-03-28 | Copper foil for flexible printed circuit board, copper-clad laminate using the same, flexible printed circuit board, and electronic device |
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| CN107046763A CN107046763A (en) | 2017-08-15 |
| CN107046763B true CN107046763B (en) | 2019-12-24 |
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| JP6774457B2 (en) * | 2018-05-16 | 2020-10-21 | Ｊｘ金属株式会社 | Copper foil for flexible printed circuit boards, copper-clad laminates using it, flexible printed circuit boards, and electronic devices |
| JP6944963B2 (en) * | 2019-03-05 | 2021-10-06 | Ｊｘ金属株式会社 | Rolled copper foil for flexible printed circuit boards, flexible copper-clad laminates and flexible printed circuit boards |
| JP7186141B2 (en) * | 2019-07-10 | 2022-12-08 | Ｊｘ金属株式会社 | Copper foil for flexible printed circuit boards |
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| EP1681360A1 (en) * | 2003-09-19 | 2006-07-19 | Sumitomo Metal Industries Limited | Copper alloy and method for production thereof |
| CN101180412A (en) * | 2005-07-07 | 2008-05-14 | 株式会社神户制钢所 | Copper alloy with high strength and excellent processability in bending and process for producing copper alloy sheet |
| CN101268206A (en) * | 2005-09-30 | 2008-09-17 | 古河电气工业株式会社 | Copper alloy for an electric connecting device |
| CN101743333A (en) * | 2007-08-07 | 2010-06-16 | 株式会社神户制钢所 | copper alloy sheet |
| JP2013129889A (en) * | 2011-12-22 | 2013-07-04 | Furukawa Electric Co Ltd:The | Copper alloy material and method for producing the same |
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- 2017-01-23 CN CN201710049631.6A patent/CN107046763B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59136368A (en) * | 1983-01-26 | 1984-08-04 | Toshiba Chem Corp | Electrically-conductive adhesive |
| EP1681360A1 (en) * | 2003-09-19 | 2006-07-19 | Sumitomo Metal Industries Limited | Copper alloy and method for production thereof |
| CN101180412A (en) * | 2005-07-07 | 2008-05-14 | 株式会社神户制钢所 | Copper alloy with high strength and excellent processability in bending and process for producing copper alloy sheet |
| CN101268206A (en) * | 2005-09-30 | 2008-09-17 | 古河电气工业株式会社 | Copper alloy for an electric connecting device |
| CN101743333A (en) * | 2007-08-07 | 2010-06-16 | 株式会社神户制钢所 | copper alloy sheet |
| JP2013129889A (en) * | 2011-12-22 | 2013-07-04 | Furukawa Electric Co Ltd:The | Copper alloy material and method for producing the same |
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Address after: No. 10-4, erdingmu, tiger gate, Tokyo port, Japan Patentee after: JX Metal Co.,Ltd. Address before: Tokyo, Japan Patentee before: JX Metal Co.,Ltd. |
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