CN107046768B - Copper foil for flexible printed board, copper-clad laminate using same, flexible printed board, and electronic device - Google Patents

Copper foil for flexible printed board, copper-clad laminate using same, flexible printed board, and electronic device Download PDF

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CN107046768B
CN107046768B CN201710050041.5A CN201710050041A CN107046768B CN 107046768 B CN107046768 B CN 107046768B CN 201710050041 A CN201710050041 A CN 201710050041A CN 107046768 B CN107046768 B CN 107046768B
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copper foil
flexible printed
copper
circuit
printed board
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CN107046768A (en
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坂东慎介
冠和树
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JX Nippon Mining and Metals Corp
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JX Nippon Mining and Metals Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

The copper foil for flexible printed circuit board comprises 99.0 mass% or more of Cu and the balance of inevitable impurities, and has an average crystal grain diameter of 0.5 ~ 4.0.0 [ mu ] m and a tensile strength of 235 ~ 290 MPa.

Description

Copper foil for flexible printed board, copper-clad laminate using same, flexible printed board, and electronic device
Technical Field
The present invention relates to a copper foil suitable for use in a wiring member such as a flexible printed circuit board, and a copper-clad laminate, a flexible wiring board, and an electronic device using the same.
Background
A flexible printed circuit board (flexible wiring board, hereinafter referred to as "FPC") has flexibility and is widely used for a bending portion or a movable portion of an electronic circuit. For example, FPCs are used in movable parts of optical disk-related devices such as HDDs, DVDs, and CD-ROMs, and in bending parts of flip phones.
The FPC is obtained by etching a Copper Clad Laminate (CCL) in which a Copper foil and a resin are laminated to form a wiring, and coating the wiring with a resin layer called a coverlay (cover lay). In the previous stage of laminating the cover layer, etching of the copper foil surface is performed as part of a surface modification process for improving the adhesion between the copper foil and the cover layer. In order to reduce the thickness of the copper foil and improve the flexibility, reduced-thickness (reduced-thickness) etching may be performed.
However, as electronic devices are reduced in size, thickness, and performance, it is required to mount FPCs in these devices at high density, but in order to perform high-density mounting, it is necessary to bend and store the FPCs in the reduced-size devices, that is, high flexibility is required.
On the other hand, copper foils improved in high cycle flexibility, as represented by IPC flexibility, have been developed (patent documents 1 and 2).
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 2010-100887
Patent document 2: japanese patent laid-open No. 2009-111203.
Disclosure of Invention
Technical problem to be solved by the invention
However, in order to mount an FPC at high density as described above, it is necessary to improve the flexibility such as MIT folding endurance, and the conventional copper foil has a problem that the improvement of the flexibility is not sufficient.
Further, with the miniaturization, thinness, and high performance of electronic devices, the circuit width and pitch width of FPCs have been reduced to about 20 ~ 30 μm, and there is a problem that the etching coefficient and circuit linearity are easily deteriorated when forming circuits by etching, and it is also necessary to solve this problem.
The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a copper foil for a flexible printed board having excellent bendability and etching properties, and a copper-clad laminate, a flexible printed board, and an electronic device using the same.
Means for solving the technical problem
The present inventors have conducted various studies and found that strength can be improved and bendability can be improved by refining crystal grains after recrystallization of a copper foil. This is because the finer the crystal grains, the higher the strength and the higher the bendability according to the Hall-Petch principle. However, if the crystal grains are made finer, the strength becomes too high, the bending rigidity becomes too high, and the kickback becomes too large, which is not suitable for the flexible printed board application. Therefore, the range of crystal particle size is specified.
Further, by making the crystal grain size fine to about 1/10 of the circuit width of about 20 ~ 30 μm of the recent FPC, the etching coefficient and the circuit linearity when forming a circuit by etching can be improved.
That is, the copper foil for a flexible printed board of the present invention contains 99.0 mass% or more of Cu and the balance unavoidable impurities, and has an average crystal grain diameter of 0.5 ~.0 μm and a tensile strength of 235 ~ MPa.
The copper foil for flexible printed boards of the present invention is preferably made of tough pitch copper prescribed in JIS-H3100(C1100) or oxygen-free copper prescribed in JIS-H3100 (C1011).
Preferably, the alloy further contains 1 or more additional elements selected from the group consisting of P, Ti, Sn, Ni, Be, Zn, In and Mg In a total amount of 0.003 ~ 0.825.825 mass%.
Preferably, the average crystal grain size after the heat treatment at 300 ℃ for 30 minutes is 0.5 ~ 4.0.0 μm, and the tensile strength is 235 ~ 290 MPa.
Preferably, after repeating the following test 3 times, the copper foil was observed at 200 times, and no cracks were visually observed: a copper-clad laminate obtained by laminating a polyimide resin film having a thickness of 25 μm on one surface of the copper foil was subjected to close-fitting bending (close-fitting) at 180 degrees with a bending radius of 0.05mm and the copper foil positioned outside, and then the bent portion was returned to 0 degree.
The copper-clad laminate of the present invention is obtained by laminating the copper foil for a flexible printed board and a resin layer.
The flexible printed circuit board of the present invention is obtained by forming a circuit on the copper foil using the copper-clad laminate.
It is preferable that the L/S of the circuit is 40/40 ~ 15/15(μm/μm), and it should be noted that the L/S (line and space) of the circuit is a ratio of a width of a wiring constituting the circuit (L: line width) to a space of an adjacent wiring (S: space), L is a minimum value of L in the circuit, and S is a minimum value of S in the circuit.
L and S do not have to be the same value as long as they are 15 ~ 40 μm, and may be, for example, 20.5/35 or 35/17.
The electronic device of the present invention is obtained by using the above flexible printed circuit board.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, a copper foil for a flexible printed board excellent in bendability and etching properties can be obtained.
Drawings
Fig. 1 is a diagram illustrating a method of testing the bendability of the CCL.
Detailed Description
Hereinafter, embodiments of the copper foil of the present invention will be described. In the present invention,% represents mass% unless otherwise specified.
< composition >
The copper foil of the present invention contains 99.0 mass% or more of Cu, and the balance is inevitable impurities.
As described above, in the present invention, the strength is improved and the bendability is improved by making the crystal grains of the copper foil after recrystallization finer.
However, in the case of the above-described pure copper-based composition, since it is difficult to refine the crystal grains, it is possible to achieve refinement of the crystal grains by introducing a large amount of working strain by cold rolling and causing dynamic recrystallization by performing recrystallization annealing only once in the initial stage of cold rolling and not performing recrystallization annealing thereafter.
In order to increase the work strain in the cold rolling, it is preferable that η ═ ln (thickness before the final cold rolling/thickness after the final cold rolling) be 3.5 ~ 7.5.5 as the degree of work in the final cold rolling (finish rolling performed after the final annealing in the entire process of repeating annealing and rolling).
When η is less than 3.5, accumulation of strain during processing is small, and nuclei of recrystallized grains become small, so that recrystallized grains tend to become coarse, and when η is more than 7.5, strain is excessively accumulated, which becomes a driving force for grain growth, and grains tend to become coarse, and further preferably η is 5.5 ~ 7.5.5.
Further, when 1 or more additional elements selected from the group consisting of P, Ti, Sn, Ni, Be, Zn, In and Mg are contained as 0.003 ~ 0.825.825 mass% In total as an additional element for refining crystal grains In relation to the above composition, the crystal grains can Be more easily refined.
If the total content of the above-mentioned additive elements is less than 0.003 mass%, the crystal grains are difficult to be refined, and if it exceeds 0.825 mass%, the electric conductivity may be lowered. There are also the following situations: the recrystallization temperature rises, so that recrystallization does not occur when the copper foil is laminated with a resin, the strength becomes too high, and the bendability of the copper foil and the CCL deteriorates.
As a method for refining crystal grains after recrystallization of the copper foil, in addition to a method of adding an additive element, there can be mentioned: a method of performing double rolling (simultaneous casting), a method of using a pulse current when performing electro-crystallization in the case of an electrolytic copper foil, or a method of adding an appropriate amount of thiourea, animal glue, or the like to an electrolyte in the case of an electrolytic copper foil.
The copper foil of the present invention may have a composition comprising Tough Pitch Copper (TPC) prescribed in JIS-H3100(C1100) or Oxygen Free Copper (OFC) prescribed in JIS-H3100 (C1011).
The TPC or OFC may have a composition containing the additive element.
< average crystal particle diameter >
The copper foil has an average crystal grain size of 0.5 ~ 4.0.0 μm, and if the average crystal grain size is less than 0.5 μm, the strength becomes too high, the flexural rigidity becomes too high, and the kickback becomes too large, and thus the copper foil is not suitable for flexible printed circuit board applications, and if the average crystal grain size exceeds 4.0 μm, the crystal grains cannot be made finer, and it is difficult to improve the strength and bendability, and the etching coefficient and circuit linearity are deteriorated, and the etching performance is lowered.
In order to avoid errors, the foil surface was observed over 3 fields of view at 100 μm × 100 μm to measure the average crystal grain size. For the observation of the foil surface, the average crystal particle size can be determined according to JIS H0501 using SIM (Scanning ion Microscope) or SEM (Scanning Electron Microscope).
In which the twins are measured as separate grains.
< Tensile Strength (TS) >)
The tensile strength of the copper foil is 235 ~ 290MPa, the tensile strength is improved by making the crystal grains finer as described above, the strength is difficult to improve and the bendability is improved when the tensile strength is lower than 235MPa, and the strength is too high and the bending rigidity is too large and the backlash is too large when the tensile strength exceeds 290MPa, which makes the copper foil unsuitable for use in flexible printed circuit boards.
The tensile strength was measured in a direction parallel to the rolling direction (or MD direction) of the copper foil by a tensile test according to IPC-TM650 at a test piece width of 12.7mm, a room temperature (15 ~ 35 ℃), a tensile rate of 50.8 mm/min, and a gauge length of 50 mm.
< Heat treatment at 300 ℃ for 30 minutes >
After the copper foil is heat-treated at 300 ℃ for 30 minutes, the average crystal grain size may be 0.5 ~ 4.0.0 μm, and the tensile strength may be 235 ~ 290 MPa.
In the case where the copper foil of the present invention is used for a flexible printed circuit board, the CCL obtained by laminating the copper foil and the resin is subjected to a heat treatment for curing the resin at 200 ~ 400 ℃ and therefore, crystal grains may be coarsened by recrystallization.
Therefore, the average crystal grain size and the tensile strength of the copper foil change before and after lamination with the resin. Therefore, the copper foil for flexible printed boards according to claim 1 of the present application is defined as: and a copper foil in a state of being subjected to curing heat treatment of the resin after forming a copper-clad laminate laminated with the resin.
On the other hand, the copper foil for flexible printed boards according to claim 4 of the present application is defined as: the copper foil before lamination with the resin is subjected to the above-described heat treatment. The heat treatment at 300 ℃ for 30 minutes is a heat treatment simulating a temperature condition under which a resin is subjected to a curing heat treatment when CCL is laminated.
The copper foil of the present invention can be produced, for example, as follows. First, a foil can be produced by adding the above additives to a copper ingot, melting and casting the mixture, then performing hot rolling, cold rolling and annealing, and performing the above final cold rolling.
< copper-clad laminate and flexible printed board >
The copper foil of the present invention is coated with (1) a resin precursor (for example, a polyimide precursor called varnish) cast and polymerized by heating, and (2) a base film is laminated to the copper foil of the present invention using the same kind of thermoplastic adhesive as the base film, thereby obtaining a Copper Clad Laminate (CCL) composed of 2 layers of the copper foil and the resin substrate. Further, by laminating a base film coated with an adhesive on the copper foil of the present invention, a Copper Clad Laminate (CCL) comprising 3 layers of a copper foil, a resin substrate, and an adhesive layer therebetween can be obtained. In the production of these CCLs, the copper foil is heat-treated to be recrystallized.
A circuit is formed on the substrate by using a photolithography technique, and if necessary, plating is performed on the circuit to laminate a cover film, thereby obtaining a flexible printed board (flexible wiring board).
Therefore, the copper-clad laminate of the present invention is obtained by laminating a copper foil and a resin layer. The flexible printed board of the present invention is obtained by forming a circuit on a copper foil of a copper-clad laminate.
Examples of the resin layer include, but are not limited to, PET (polyethylene terephthalate), PI (polyimide), LCP (liquid crystal polymer), and PEN (polyethylene naphthalate). In addition, resin films of them can be used as the resin layer.
As a method for laminating the resin layer and the copper foil, a material for forming the resin layer may be applied to the surface of the copper foil and heated to form a film. Further, a resin film may be used as the resin layer, and the following adhesive may be used between the resin film and the copper foil, or the resin film may be thermally pressure-bonded to the copper foil without using the adhesive. Among them, an adhesive is preferably used from the viewpoint of not applying excessive heat to the resin film.
When a film is used as the resin layer, the film may be laminated on a copper foil via an adhesive layer. In this case, an adhesive having the same composition as the film is preferably used. For example, when a polyimide film is used as the resin layer, a polyimide adhesive is preferably used as the adhesive layer. The polyimide adhesive referred to herein is an adhesive containing an imide bond, and includes polyetherimide and the like.
The present invention is not limited to the above embodiments. The copper alloy according to the above embodiment may contain other components as long as the effects of the present invention are exhibited.
For example, a surface treatment based on roughening treatment, rust prevention treatment, heat resistance treatment, or a combination thereof may be performed on the surface of the copper foil.
Examples
The present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples. Elements shown in table 1 were added to electrolytic copper having a purity of 99.9% or more, respectively, and cast in an Ar atmosphere to obtain ingots. The oxygen content in the ingot was less than 15 ppm. The ingot was subjected to homogenizing annealing at 900 ℃, then hot-rolled to a thickness of 30mm, then cold-rolled to a thickness of 14mm, then annealed 1 time, and then the surface was shaved, and finally cold-rolled at a working degree η shown in table 1 to obtain a foil having a final thickness of 17 μm. The obtained foil was subjected to a heat treatment at 300 ℃ for 30 minutes to obtain a copper foil sample.
Evaluation of copper foil samples
1. Electrical conductivity of
The conductivity (% IACS) at 25 ℃ was measured by a four-terminal method in accordance with JIS H0505 for each copper foil sample after the heat treatment.
When the electrical conductivity is 75% IACS or more, the electrical conductivity is good.
2. Particle size
The surface of each copper foil sample after the heat treatment was observed by SEM (scanning electron microscope), and the average particle diameter was determined according to JIS H0501. In which the twins are measured as separate grains. The measurement region was defined as 100. mu. m.times.100. mu.m of the surface.
3. Bendability of copper foil (MIT folding endurance)
For each copper foil sample after the heat treatment, the number of MIT folding endurance (number of reciprocal bending) was measured according to JIS P8115. Wherein the bending jig has an R of 0.38 and a load of 500 g.
When the number of MIT folding endurance is 75 or more, the copper foil has good flexibility.
4. Tensile strength of copper foil
Tensile strength was measured under the above conditions by a tensile test according to IPC-TM650 for each copper foil sample after the above heat treatment.
Evaluation of CCL >
5. Flexibility of CCL
After the final cold rolling, a copper foil sample (copper foil before heat treatment) which had not been subjected to the above heat treatment was subjected to roughening copper plating on one surface. Cu was used as the roughening copper plating bath: 10-25g/L, sulfuric acid: 20-100g/L, at bath temperature of 20-40 deg.C and current density of 30-70A/dm2Then, the plating was carried out for 1 to 5 seconds so that the amount of copper deposited was 20g/dm2。
A polyimide film (product name "UPILEX VT" manufactured by yu sheng co., ltd., thickness 25 μm) was laminated on the roughened plated surface of the copper foil sample, and heat treatment was performed at 300 ℃ for 30 minutes by a hot press (4MPa) to bond the films, thereby obtaining a CCL sample. The CCL sample used in the bending test had dimensions of 50mm in the rolling direction (longitudinal direction) and 12.7mm in the width direction.
As shown in fig. 1, the CCL sample 30 was sandwiched between a 0.1 mm thick plate 20 (titanium copper plate defined in JIS-H3130 (C1990)) with the copper foil surface on the outer side, folded in two at the center in the longitudinal direction, and placed between a lower mold 10a and an upper mold 10b of a compression tester 10 (product name "AUTOGRAPH AGS" manufactured by shimadzu corporation).
In this state, upper mold 10b is lowered, and CCL sample 30 is bent so that the folded portion is in close contact with plate 20 (fig. 1 (a)). The CCL sample 30 was immediately taken out from the compression tester 10, and the presence or absence of cracking on the copper foil surface was visually checked at a magnification of 200 times using a microscope (product name "One-shot 3D measurement microscope VR-3000" manufactured by KEYENCE CORPORATION) for the bent tip portion 30s in the shape of a "horizontal V" in the folded portion, and it was noted that the bent tip portion 30s was tightly bent at 180 degrees corresponding to a bending radius of 0.05 mm.
When the rupture was confirmed, the test was terminated, and the number of times the compression in fig. 1(a) was performed was counted as the number of times the CCL was bent.
If no fracture is detected, as shown in fig. 1(b), the CCL sample 30 is placed between the lower die 10a and the upper die 10b of the compression tester 10 so that the bent tip portion 30s faces upward, and the upper die 10b is lowered in this state to open the bent tip portion 30 s.
Then, the bending of fig. 1(a) is performed again, and the presence or absence of the breakage at the bent tip portion 30s is similarly checked by visual observation, and thereafter, the process of fig. 1(a) ~ (b) is similarly repeated to determine the number of times of bending.
If the number of times of bending of the CCL is 3 or more, the bendability of the CCL is good.
6. Etching property
In the copper foil portion of the CCL sample, a stripe-shaped circuit having an L/S (line width/pitch) of 40/40 μm, 35/35 μm, 25/25 μm, 20/20 μm, and 15/15 μm was formed. For comparison, a circuit was formed in the same manner as a commercially available rolled copper foil (tough pitch copper foil). Then, the etching coefficient (the ratio of the etching depth to the average etching width above and below) and the linearity of the circuit were visually evaluated by a microscope and evaluated based on the following criteria. The evaluation was good.
O: compared with the rolled copper foil on the market, the etching coefficient and the linearity of the circuit are good
And (delta): the etching coefficient and the linearity of the circuit were equivalent to those of a rolled copper foil on the market
X: the etching coefficient and the linearity of the circuit were inferior to those of the rolled copper foil on the market
The results are shown in Table 1.
[ Table 1]
As is clear from table 1, the copper foils in the examples had an average crystal grain size of 0.5 ~.0 μm and a tensile strength of 235 ~ MPa, and the copper foils were excellent in bending properties and etching properties in this case, it is noted that example 1 was subjected to double-layer rolling in the last 1 pass of the final cold rolling.
On the other hand, in comparative examples 1 and 4, in which the final cold rolling degree η is less than 3.5, the average crystal grain size of the copper foil exceeds 4.0 μm, the tensile strength is less than 235MPa, and the bendability of the copper foil and CCL is poor. In comparative example 4, the average crystal grain size of the copper foil was 4.5 μm slightly larger than 4.0. mu.m, and hence the etching property was good.
In comparative example 3, in which the total content of the additive elements is less than the lower limit, the recrystallized grains of the additive elements are insufficiently refined, the average crystal grain size of the copper foil is significantly larger than 4.0 μm, the copper foil is coarsened, the tensile strength is less than 235MPa, and the bendability and the etching ability of the copper foil and the CCL are poor. In comparative example 2, when the total content of the additive elements exceeds the upper limit, the conductivity is poor.
In comparative example 5, when the total content of the additive elements exceeds the upper limit, the recrystallization temperature becomes high, recrystallization does not occur in the heat treatment at 300 ℃, the electrical conductivity decreases, and the tensile strength becomes high and exceeds 290 MPa. Therefore, the bendability of the copper foil and the CCL is greatly deteriorated.

Claims (9)

1. A copper foil for flexible printed board, which comprises 99.0 mass% or more of Cu and the balance of unavoidable impurities,
an average crystal grain size of 0.5 ~ 4.0.0 μm and a tensile strength of 235 ~ 290MPa,
the number of reciprocating bending times, which is the number of MIT bending resistance times measured according to JIS P8115, is 75 to 129, wherein R of a bending jig is 0.38mm, and a load is 500 g.
2. The copper foil for flexible printed boards according to claim 1,
it is formed of tough pitch copper prescribed in JIS-H3100-alloy designation C1100 or oxygen-free copper prescribed in JIS-H3100-alloy designation C1011.
3. The copper foil for flexible printed boards according to claim 1 or 2, wherein,
and 1 or more additional elements selected from P, Ti, Sn, Ni, Be, Zn, In and Mg In a total amount of 0.003 ~ 0.825.825 mass%.
4. The copper foil for flexible printed boards according to claim 1 or 2, wherein,
the average crystal particle size after heat treatment at 300 ℃ for 30 minutes was 0.5 ~ 4.0.0 μm, and the tensile strength was 235 ~ 290 MPa.
5. The copper foil for flexible printed boards according to claim 1 or 2, wherein,
after repeating the following test 3 times, no cracks were visually observed when the copper foil was observed at 200 times: a copper-clad laminate obtained by laminating a polyimide resin film having a thickness of 25 μm on one surface of the copper foil was bent tightly at 180 degrees with a bending radius of 0.05mm so that the copper foil was positioned outside, and then the bent portion was returned to 0 degree.
6. A copper-clad laminate obtained by laminating the copper foil for a flexible printed board according to claim 1 ~ 5 and a resin layer.
7. A flexible printed board obtained by forming a circuit on the copper foil using the copper-clad laminate according to claim 6.
8. The flexible printed substrate of claim 7, the circuit having L and S of 15 ~ 40 μm, wherein L is the width of the wires making up the circuit and L is the minimum value of L in the circuit, S is the spacing of adjacent wires and S is the minimum value of S in the circuit.
9. An electronic device using the flexible printed substrate according to claim 7 or 8.
CN201710050041.5A 2016-02-05 2017-01-23 Copper foil for flexible printed board, copper-clad laminate using same, flexible printed board, and electronic device Active CN107046768B (en)

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JP2016063232A JP6294376B2 (en) 2016-02-05 2016-03-28 Copper foil for flexible printed circuit board, copper-clad laminate using the same, flexible printed circuit board, and electronic device

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JP6774457B2 (en) * 2018-05-16 2020-10-21 Ｊｘ金属株式会社 Copper foil for flexible printed circuit boards, copper-clad laminates using it, flexible printed circuit boards, and electronic devices
JP7186141B2 (en) * 2019-07-10 2022-12-08 Ｊｘ金属株式会社 Copper foil for flexible printed circuit boards

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