CN107046768A - Flexible printed board copper foil, copper clad layers stack, flexible printed board and electronic device using it - Google Patents
Flexible printed board copper foil, copper clad layers stack, flexible printed board and electronic device using it Download PDFInfo
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- CN107046768A CN107046768A CN201710050041.5A CN201710050041A CN107046768A CN 107046768 A CN107046768 A CN 107046768A CN 201710050041 A CN201710050041 A CN 201710050041A CN 107046768 A CN107046768 A CN 107046768A
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- copper foil
- flexible printed
- printed board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The technical problem of the present invention is to provide bendability and the excellent flexible printed board copper foil of etching.The solution of the present invention is a kind of flexible printed board copper foil, and the copper foil that it is the Cu comprising more than 99.0 mass %, surplus is inevitable impurity, average crystal particle diameter is 0.5 ~ 4.0 μm, and tensile strength is 235 ~ 290MPa.
Description
Technical field
Copper clad layers stack the present invention relates to the copper foil for the wiring part for being suitable for flexible printed board etc., using it,
Flexible distributing board and electronic device.
Background technology
Flexible printed board (flexible distributing board, hereinafter referred to as " FPC ") has flexibility, therefore is widely used in the curved of electronic circuit
Pars convoluta or movable part.For example, the movable part of the CD related device in HDD, DVD and CD-ROM etc., or clamshell handset
In bending section etc., FPC has been used.
FPC is by the way that by the copper clad layers stack of copper foil and laminated resin, (Copper Clad Laminate, are called in the following text
CCL) etch to form wiring, and be coated to and obtain thereon with the resin bed of referred to as coating (cover lay).Covered in stacking
The previous stage of cap rock, as a ring of the surface-modification processes of the adhesion for improving copper foil and coating, carries out copper foil
The etching on surface.In addition, in order to reduce the thickness of copper foil to improve flexibility, also carrying out subtracting thickness (Minus meat sometimes) etching.
But, with the small-sized, slim of electronic device, high performance, it is desirable to installed to high-density in these device insides
FPC, still, in order to carry out high-density installation, it is necessary to be stored after the device inside of miniaturization bends FPC, that is, needs high
Bendability.
On the other hand, someone develops the copper foil (patent that the high circulation flexibility using IPC flexibilitys as representative is improved
Document 1,2).
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2010-100887 publications
Patent document 2：Japanese Unexamined Patent Publication 2009-111203 publications.
The content of the invention
The invention technical problem to be solved
However, in order to install FPC to high-density, it is necessary to improve the bendability using MIT folding resistances as representative as described above, conventional
Copper foil exist bendability improvement it is still insufficient the problem of.
In addition, with the small-sized, slim of electronic device, high performance, FPC circuit width, spacing width also miniaturization
There is etching coefficient to 20 ~ 30 μm or so, when forming circuit by etching and the problem of circuit linearity is easily deteriorated, also need
Solve this problem.
The present invention is in order to solve the above-mentioned technical problem to complete, it is therefore intended that provide bendability and excellent soft of etching
Property printed base plate copper foil, copper clad layers stack, flexible printed board and electronic device using it.
Scheme for solving technical problem
Present inventor has performed various researchs, as a result find, by making the crystal grain miniaturization after copper foil recrystallization, can improve strong
Spend to improve bendability.Because, according to Hall-Petch principles, it is miniaturization that crystal grain, which is cured, and intensity is higher, and bendability also becomes
It is high.But, if making excessive grain miniaturization, intensity becomes too high, and bending rigidity is excessive, recoils excessive and is unsuitable for flexibility
Printed base plate purposes.Therefore, the scope of crystal particle diameter is defined.
In addition, by making crystal particle diameter miniaturization to about 1/10 left side of 20 ~ 30 μm or so the circuit widths of FPC in recent years
The right side, can also improve etching coefficient when forming circuit by etching, circuit linearity.
That is, it comprising more than 99.0 mass % Cu, surplus is inevitable that flexible printed board of the invention is with copper foil
The copper foil of impurity, average crystal particle diameter is 0.5 ~ 4.0 μm, and tensile strength is 235 ~ 290MPa.
In the flexible printed board copper foil of the present invention, tough pitch copper or JIS- preferably as specified in JIS-H3100 (C1100)
H3100 (C1011) oxygen-free copper is formed.
Preferably, also containing 1 in P, Ti, Sn, Ni, Be, Zn, In and Mg for adding up to 0.003 ~ 0.825 mass %
Plant the addition element of the above.
Preferably, the above-mentioned average crystal particle diameter at 300 DEG C after the heat treatment of 30 minutes is 0.5 ~ 4.0 μm, and above-mentioned
Tensile strength is 235 ~ 290MPa.
Preferably, after following experiments is repeated 3 times, visually confirm when observing above-mentioned copper foil with 200 times less than crackle：Will
Copper clad layers stack obtained by the polyimide resin film of 25 μm of thickness is laminated with the one side of above-mentioned copper foil with bending radius
0.05mm and the mode for making above-mentioned copper foil be located at outside carry out 180 degree contiguity bending (adherence song げ, contact-bending),
Then bending section is made to be returned to 0 degree.
The copper clad layers stack of the present invention is to obtain above-mentioned flexible printed board copper foil and resin layer stackup.
The flexible printed board of the present invention is to be formed circuit using above-mentioned copper clad layers stack on above-mentioned copper foil and obtained.
Preferably, the L/S of foregoing circuit is 40/40 ~ 15/15 (μm/μm).It should be noted that, the L/S of circuit (line width/
Spacing, line and space) be constitute circuit wiring width (L：Line width) and adjacent wiring interval (S：Spacing)
The ratio between.L uses the minimum value of L in circuit, and S uses the minimum value of S in circuit.
It should be noted that, as long as L and S is 15 ~ 40 μm, the two is not necessarily identical value.For example, it is also possible to be set to L/
The value of S=20.5/35,35/17 etc..
The electronic device of the present invention is obtained using above-mentioned flexible printed board.
The effect of invention
According to the present invention it is possible to obtain bendability and the excellent flexible printed board copper foil of etching.
Brief description of the drawings
Fig. 1 is the figure for the pliability test method for showing CCL.
Embodiment
Hereinafter, the embodiment to the copper foil of the present invention is illustrated.It should be noted that, as long as without special theory in the present invention
Bright, then % represents quality %.
＜ constitutes ＞
The copper foil of the present invention includes more than 99.0 mass % Cu, and surplus is inevitable impurity.
As described above, improving intensity to improve bendability by making the crystal grain miniaturization after copper foil recrystallization in the present invention.
But, in the case of the composition of above-mentioned fine copper system, crystal grain is difficult to miniaturization, therefore the initial stage when cold rolling only enters
Row primary recrystallization is annealed, later without recrystallization annealing, so as to introduce processing strain in large quantities by cold rolling, is occurred
Dynamic recrystallization, realizes the miniaturization of crystal grain.
In addition, in order to increase it is cold rolling in processing strain, as final cold rolling (be repeated annealing and rolling it is whole
The finish rolling carried out after last annealing in process) in degree of finish, preferably η=ln (thicknesss of slab before final cold rolling/final
Thickness of slab after cold rolling)=3.5 ~ 7.5.
When η is less than 3.5, the accumulation of strain during processing is few, and the core of recrystal grain tails off, therefore it is brilliant to there is recrystallization
Grain becomes thick tendency.When η is more than 7.5, there is grain coarsening big in excessive strain accumulation, the driving force as grain growth
Tendency.Further preferred η=5.5 ~ 7.5.
In addition, as making the addition element of crystal grain miniaturization, relative to above-mentioned composition, containing adding up to 0.003 ~ 0.825
Addition element more than quality % 1 in P, Ti, Sn, Ni, Be, Zn, In and Mg kind, then can more easily realize crystalline substance
The miniaturization of grain.These addition element increase dislocation density when cold rolling, so the fine of crystal grain can more easily be realized
Change.In addition, if the initial stage when cold rolling only carries out primary recrystallization annealing, later without recrystallization annealing, then it can pass through
It is cold rolling to introduce processing strain in large quantities, occur dynamic recrystallization, more reliably realize the miniaturization of crystal grain.
If total content of above-mentioned addition element is less than 0.003 mass %, crystal grain is difficult to miniaturization, if more than 0.825 matter
% is measured, then electrical conductivity may be reduced.Also there are following situations：Recrystallization temperature rises, so as to not occur to tie again during with laminated resin
Crystalline substance, intensity becomes too high, copper foil and CCL bendability deterioration.
It should be noted that, as the method for the crystal grain miniaturization after recrystallizing copper foil, the side except adding addition element
Outside method, it can also enumerate：Carry out the method for pairing (overlapping calendering), when carrying out electroluminescent crystallization in the case of electrolytic copper foil
Add the side of appropriate thiocarbamide or animal glue etc. in the electrolytic solution using the method for pulse current or in the case of electrolytic copper foil
Method.
The copper foil of the present invention can be tough pitch copper (TPC) or JIS-H3100 (C1011) as specified in JIS-H3100 (C1100)
Oxygen-free copper (OFC) formation composition.
Alternatively, it is also possible to contain the composition of above-mentioned addition element relative to above-mentioned TPC or OFC.
＜ average crystal particle diameters ＞
The average crystal particle diameter of copper foil is 0.5 ~ 4.0 μm.If average crystal particle diameter is less than 0.5 μm, intensity becomes too high, bending resistance
Rigidity is excessive, recoils excessive and is unsuitable for flexible printed board purposes.If average crystal particle diameter is more than 4.0 μm, it can not realize
The miniaturization of crystal grain, it is difficult to improve intensity to improve bendability, while etching coefficient, circuit linearity are deteriorated, etching reduction.
In order to avoid error, paper tinsel surface is observed more than 3 visual fields with the visual field of 100 μm of 100 μ m, to carry out average crystalline substance
The measure of body particle diameter.In the observation on paper tinsel surface, SIM (scanning ion microscope, Scanning Ion can be used
Microscope) or SEM (SEM, Scanning Electron Microscope), according to JIS H 0501
Obtain average crystal particle diameter.
Wherein, twin crystal is considered as into separated crystal grain to be measured.
＜ tensile strengths (TS) ＞
The tensile strength of copper foil is 235 ~ 290MPa.As described above, by making crystal grain miniaturization improve tensile strength.If stretching
Intensity is less than 235MPa, then is difficult to improve intensity to improve bendability.If tensile strength became more than 290MPa, intensity
Height, bending rigidity is excessive, recoils excessive and is unsuitable for flexible printed board purposes.
For tensile strength, by the tension test according to IPC-TM650, with test film width 12.7mm, room temperature (15 ~
35 DEG C), draw speed 50.8mm/ minutes, gauge length 50mm, it is enterprising in parallel with the rolling direction of copper foil (or MD directions) direction
Tension test is gone.
＜ heat treatment ＞ of 30 minutes at 300 DEG C
After the heat treatment for carrying out 30 minutes to copper foil at 300 DEG C, average crystal particle diameter can be 0.5 ~ 4.0 μm, and tensile strength
Can be 235 ~ 290MPa.
The copper foil of the present invention can be used for flexible printed board, now, the CCL by copper foil and laminated resin be 200 ~
400 DEG C are carried out for making the heat treatment of resin solidification, therefore crystal grain is possible to the coarsening because of recrystallization.
Therefore, with laminated resin before and after, the average crystal particle diameter and tensile strength of copper foil change.So, this
The flexible printed board of application claim 1 is defined as with copper foil：Formed with it is after the copper clad layers stack after laminated resin, be subjected to
The copper foil of the state of the solidification heat treatment of resin.
On the other hand, the flexible printed board of the application claim 4 is defined as with copper foil：Pair with the copper before laminated resin
Paper tinsel has carried out state during above-mentioned heat treatment.The heat treatment of 30 minutes at 300 DEG C is entered when being and simulating CCL stacking to resin
The heat treatment of the temperature conditionss of row solidification heat treatment.
The copper foil of the present invention can for example be prepared as follows.First, above-mentioned additive is added into copper ingot to be melted
After melting, casting, carry out hot rolling, cold rolling and annealing, and above-mentioned final cold rolling is carried out, it is possible thereby to prepare paper tinsel.
＜ copper clad layers stack and flexible printed board ＞
In addition, on the copper foil of the present invention, resin precursor (such as the polyimide precursor for being referred to as varnish) is cast and heated by (1)
It polymerize it, thus (2) are obtained copper foil of the base membrane layer together in the present invention by copper using the thermoplastic adhesive of the same race with basement membrane
The copper clad layers stack (CCL) of this 2 layers composition of paper tinsel and resin base material.In addition, scribbling bonding by laminated on the copper foil of the present invention
The basement membrane of agent, the available copper clad layers stack (CCL) being made up of copper foil, resin base material and this 3 layers of adhesive linkage therebetween.Preparing
During these CCL, copper foil is heat-treated and recrystallized.
Circuit is formed on them using photoetching technique, implements plating on circuit as needed, laminated covering layer film,
It can thus be concluded that arriving flexible printed board (flexible distributing board).
Therefore, copper clad layers stack of the invention is to obtain copper foil and resin layer stackup.In addition, the flexible printing of the present invention
Substrate is to form circuit on the copper foil of copper clad layers stack and obtain.
As resin bed, can enumerating PET (polyethylene terephthalate), PI (polyimides), LCP, (liquid crystal gathers
Compound), PEN (PEN), but not limited to this.In addition, their resin film can be used as resin bed.
As resin bed and the laminating method of copper foil, it can be coated with to form the material of resin bed and be added on the surface of copper foil
Hot film forming.In addition, it is possible to use resin film as resin bed, and between resin film and copper foil use following bonding agent, or
Resin film hot pressing is connected on copper foil without using bonding agent.Wherein, from the viewpoint of heat never unnecessary to resin film application,
Preferably use bonding agent.
When using film as resin bed, the film can be laminated on copper foil across bond layer.Now, preferably use with
The bonding agent of film identical component.For example, during using polyimide film as resin bed, preferably bond layer also uses polyimides
It is bonding agent.It should be noted that, polyimide adhesive said here refers to the bonding agent for including imide bond, also including poly-
Etherimide etc..
It should be noted that, the invention is not restricted to above-mentioned embodiment.As long as in addition, play the present invention action effect, on
Other compositions can also be contained by stating the copper alloy of embodiment.
For example, can implement on the surface of copper foil based on roughening treatment, antirust treatment, resistance to heat treatment or combinations thereof
Surface treatment.
Embodiment
Then, embodiment is enumerated so that the present invention is described in more detail, but the invention is not restricted to them.In purity 99.9%
The element shown in table 1 is added in cathode copper above respectively, casts under an ar atmosphere, has obtained ingot bar.Oxygen content in ingot bar
Less than 15ppm.The ingot bar is carried out after homogenizing annealing at 900 DEG C, carrying out hot rolling makes thickness be changed into 30mm, then carries out cold
14mm thickness is rolled, scraping is carried out to surface after 1 annealing has been carried out afterwards, is carried out with the degree of finish η shown in table 1 final
It is cold rolling, obtain the paper tinsel of 17 μm of final thickness.The heat treatment of 300 DEG C × 30 minutes is applied to the paper tinsel of gained, copper foil sample has been obtained
Product.
The evaluation ＞ of ＜ A. copper foil samples
1. electrical conductivity
For each copper foil sample after above-mentioned heat treatment, according to JIS H 0505,25 DEG C of conductance is determined by four-terminal method
Rate (%IACS).
If electrical conductivity is in more than 75%IACS, electric conductivity is good.
2. particle diameter
Each sample copper surfaces after above-mentioned heat treatment are observed using SEM (SEM), are asked according to JIS H 0501
Average grain diameter is gone out.Wherein, twin crystal is considered as into separated crystal grain to be measured.Mensuration region is set to the μ of 100 μ m 100 on surface
m。
3. the bendability (MIT folding resistances) of copper foil
For each copper foil sample after above-mentioned heat treatment, MIT folding numbers (cyclic bending is determined according to JIS P 8115
Number).Wherein, the R of bending fixture is 0.38, and load is 500g.
If MIT folding numbers are more than 75 times, the bendability of copper foil is good.
4. the tensile strength of copper foil
For each copper foil sample after above-mentioned heat treatment, determined under these conditions by the tension test according to IPC-TM650
Tensile strength.
＜ B. CCL evaluation ＞
5. CCL bendability
After final cold rolling, it is roughened in the one side of copper foil sample (copper foil before heat treatment) for not carrying out above-mentioned heat treatment
Copper facing.Cu is used as roughening copper plating solution：10-25g/L, sulfuric acid：20-100g/L composition, it is close in 20-40 DEG C of bath temperature, electric current
Spend 30-70A/dm2Lower progress is electroplated for 1-5 seconds, and it is 20g/dm to make copper adhesion amount2。
In the roughening surfacing upper strata laminated polyimide film (ProductName of Ube Industries, Ltd of copper foil sample
" UPILEX VT ", 25 μm of thickness), the heat treatment for applying 300 DEG C × 30 minutes with hot press (4MPa) is obtained with being fitted
CCL samples.The size of the CCL samples used in bend test is 50mm in rolling direction (length direction), and width is
12.7mm。
As shown in figure 1, by the CCL samples 30 to make copper-clad surface clamp the thick (JIS- of plate 20 of 0.1 mm in the way of outside
Titanium copper plate specified in H3130 (C1990)), in the central doubling of length direction, it is configured at (the Shimadzu system of compression test 10
Make made ProductName " AUTOGRAPH AGS ") lower mould 10a and upper mould 10b between.
In this condition decline mould 10b, CCL samples 30 are bent into (Fig. 1 in the way of doubled over portion is close contact in plate 20
(a)).At once CCL samples 30 are taken out from compression test 10, to the curved apex portion 30s of " horizontal V words " shape of doubled over portion,
Use microscope (KEYENCE CORPORATION ProductName " One-shot 3D measuring microscope VR-3000 ", with 200
Multiplying power again visually confirms that copper-clad surface has crack-free.It should be noted that, curved apex portion 30s is equivalent to bending radius 0.05mm's
180 degree contiguity bending.
Terminate experiment when confirming rupture, the number of times for the compression for carrying out Fig. 1 (a) is calculated as to CCL number of bends.
Unconfirmed to during rupture, shown in such as Fig. 1 (b), CCL samples 30 are matched somebody with somebody in the way of upward by curved apex portion 30s
It is placed between the lower mould 10a of compression test 10 and upper mould 10b, in this condition declines mould 10b, opens curved apex portion
30s。
Then, Fig. 1 (a) bending is carried out again, confirms that curved apex portion 30s has crack-free likewise by visually.
After, similarly repeatedly Fig. 1 (a) ~ (b) process, determines number of bends.
If CCL number of bends is more than 3 times, CCL bendability is good.
6. etching
L/S (line width/spacing)=40/40 μm, 35/35 μm, 25/25 μm, 20/20 μ is formed in the foil section of above-mentioned CCL samples
The circuit of m and 15/15 μm of bar shaped.As a comparison, being identically formed circuit with commercially available rolled copper foil (tough copper foil).Then,
Etching coefficient (ratio represented by (etch depth/average etch width) up and down of circuit) and circuit are visually confirmed with microscope
Linearity, evaluated according to following benchmark.If being evaluated as zero, well.
○：Compared with commercially available rolled copper foil, the linearity of etching coefficient and circuit is good
△：Compared with commercially available rolled copper foil, the linearity of etching coefficient and circuit is equal
×：Compared with commercially available rolled copper foil, the linearity of etching coefficient and circuit is poor
Acquired results are shown in table 1.
[table 1]
As by the institute of table 1, clearly, the average crystal particle diameter of copper foil is 0.5 ~ 4.0 μm in each embodiment, and tensile strength be 235 ~
290MPa, bendability and etching in this case is excellent.It should be noted that, embodiment 1 is in last 1 road of final cold rolling
Pairing has been carried out in secondary.
On the other hand, the degree of finish η of final cold rolling is less than 3.5, in this case, the average crystalline substance of copper foil in comparative example 1,4
Body particle diameter is more than 4.0 μm, and tensile strength is less than 235MPa, and copper foil and CCL bendability are poor.It should be noted that, the feelings of comparative example 4
Under condition, the average crystal particle diameter of copper foil is 4.5 μm more slightly larger than 4.0 μm, therefore etching is good.
Total content of addition element is less than lower limit in comparative example 3, in this case, the recrystallization based on addition element is brilliant
The miniaturization of grain is insufficient, and the average crystal particle diameter of the copper foil significantly coarsening more than 4.0 μm, tensile strength is less than 235MPa,
Copper foil and CCL bendability and etching are poor.Total content of addition element exceedes higher limit in comparative example 2, in this case
Electrical conductivity is poor.
Total content of addition element exceedes higher limit in comparative example 5, and in this case recrystallization temperature is uprised, at 300 DEG C
Heat treatment in do not recrystallize, electrical conductivity reduction, while tensile strength is uprised, more than 290MPa.Therefore, copper foil and CCL
Bendability significantly deteriorate.
Claims (9)
1. flexible printed board copper foil, the copper that it is the Cu comprising more than 99.0 mass %, surplus is inevitable impurity
Paper tinsel, wherein,
Average crystal particle diameter is 0.5 ~ 4.0 μm, and tensile strength is 235 ~ 290MPa.
2. the flexible printed board copper foil described in claim 1,
Its tough pitch copper or JIS-H3100 (C1011) as specified in JIS-H3100 (C1100) oxygen-free copper are formed.
3. the flexible printed board copper foil described in claim 1 or 2, wherein,
Also contain and add up to more than 0.003 ~ 0.825 mass % 1 in P, Ti, Sn, Ni, Be, Zn, In and Mg kind adding
Added elements.
4. the flexible printed board copper foil any one of claim 1 ~ 3, wherein,
The average crystal particle diameter at 300 DEG C after the heat treatment of 30 minutes is 0.5 ~ 4.0 μm, and the tensile strength is
235~290MPa。
5. the flexible printed board copper foil any one of claim 1 ~ 4, wherein,
After following experiments is repeated 3 times, visually confirm when observing the copper foil with 200 times less than crackle：Will be in the copper foil
One side on 25 μm of thickness of stacking polyimide resin film obtained by copper clad layers stack is with bending radius 0.05mm and makes described
The mode that copper foil is located at outside carries out 180 degree contiguity bending, bending section is returned to 0 degree.
6. copper clad layers stack, its be by the flexible printed board copper foil and resin any one of claim 1 ~ 5 layer by layer
Fold and obtain.
7. flexible printed board, it is the copper clad layers stack described in usage right requirement 6, form circuit on the copper foil and
.
8. the flexible printed board described in claim 7, the L/S of the circuit is 40/40 ~ 15/15 (μm/μm).
9. electronic device, it uses the flexible printed board described in claim 7 or 8.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-020758 | 2016-02-05 | ||
| JP2016020758 | 2016-02-05 | ||
| JP2016063232A JP6294376B2 (en) | 2016-02-05 | 2016-03-28 | Copper foil for flexible printed circuit board, copper-clad laminate using the same, flexible printed circuit board, and electronic device |
| JP2016-063232 | 2016-03-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107046768A true CN107046768A (en) | 2017-08-15 |
| CN107046768B CN107046768B (en) | 2019-12-31 |
Family
ID=59543594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710050041.5A Active CN107046768B (en) | 2016-02-05 | 2017-01-23 | Copper foil for flexible printed board, copper-clad laminate using same, flexible printed board, and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107046768B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110505755A (en) * | 2018-05-16 | 2019-11-26 | 捷客斯金属株式会社 | Flexible printed base plate copper foil, the copper clad layers stack for having used the copper foil, flexible printed base plate and electronic equipment |
| CN112210689A (en) * | 2019-07-10 | 2021-01-12 | 捷客斯金属株式会社 | Copper foil for flexible printed substrate |
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| CN103748251A (en) * | 2011-08-23 | 2014-04-23 | Jx日矿日石金属株式会社 | Rolled copper foil |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110505755A (en) * | 2018-05-16 | 2019-11-26 | 捷客斯金属株式会社 | Flexible printed base plate copper foil, the copper clad layers stack for having used the copper foil, flexible printed base plate and electronic equipment |
| CN110505755B (en) * | 2018-05-16 | 2022-11-22 | 捷客斯金属株式会社 | Copper foil for flexible printed board, copper-clad laminate using same, flexible printed board, and electronic device |
| CN112210689A (en) * | 2019-07-10 | 2021-01-12 | 捷客斯金属株式会社 | Copper foil for flexible printed substrate |
| CN112210689B (en) * | 2019-07-10 | 2021-12-14 | 捷客斯金属株式会社 | Copper foil for flexible printed substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107046768B (en) | 2019-12-31 |
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Address after: No. 10-4, erdingmu, tiger gate, Tokyo port, Japan Patentee after: JX Metal Co.,Ltd. Address before: Tokyo, Japan Patentee before: JX Metal Co.,Ltd. |