CN103748251A - Rolled copper foil - Google Patents
Rolled copper foil Download PDFInfo
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- CN103748251A CN103748251A CN201280040973.7A CN201280040973A CN103748251A CN 103748251 A CN103748251 A CN 103748251A CN 201280040973 A CN201280040973 A CN 201280040973A CN 103748251 A CN103748251 A CN 103748251A
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- copper foil
- rolled copper
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 83
- 239000011889 copper foil Substances 0.000 title claims abstract description 72
- 238000000137 annealing Methods 0.000 claims abstract description 50
- 238000002441 X-ray diffraction Methods 0.000 claims abstract description 33
- 238000005096 rolling process Methods 0.000 claims description 94
- 238000001953 recrystallisation Methods 0.000 claims description 30
- 239000002994 raw material Substances 0.000 claims description 9
- 239000013078 crystal Substances 0.000 description 16
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 238000012360 testing method Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 238000002425 crystallisation Methods 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000008467 tissue growth Effects 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000012010 growth Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 231100000732 tissue residue Toxicity 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
- B21B1/40—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling foils which present special problems, e.g. because of thinness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
- B21B2003/005—Copper or its alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
This rolled copper foil exhibits an I(311)/I(200) ratio of 0.001 to 0.01 after annealing at 200 DEG C for 0.5 hour, wherein I(311) is the integrated intensity of an X-ray diffraction peak attributed to the (311) plane, and I(200) is the integrated intensity of an X-ray diffraction peak attributed to the (200) plane. The rolled copper foil ensures stable flexibility.
Description
Technical field
The present invention relates to be used in for example flexible distributing board (FPC:Flexible Printed Circuit) and be suitable for the rolled copper foil of copper-clad lamination.
Background technology
Flexible distributing board (FPC) is laminated resin layer and Copper Foil, suitably for repeated flex portion.As the Copper Foil of the FPC for such, be widely used the rolled copper foil of bendability excellence.As the method that the bendability of rolled copper foil is improved, to the technology that makes the cubes set tissue growth after recrystallization annealing, report (patent documentation 1).In addition, as the method that makes the cubes set tissue growth after recrystallization annealing, enumerate regulation final rolling degree of finish and rolling condition (patent documentation 2), after rolling, retain cubes orientation (patent documentation 3).
Prior art document
Patent documentation
Patent documentation 1: No. 3009383 communique of Japanese Patent;
Patent documentation 2: TOHKEMY 2009-185376 communique;
Patent documentation 3: TOHKEMY 2010-150597 communique.
Summary of the invention
The problem that invention will solve
But, the existing method that makes cubes set tissue growth, there is this problem: in order to adjust final rolling degree of finish, be necessary change the thickness of the Copper Foil raw material while annealing before the final rolling of cubes set organizational growth or under special condition, be rolled etc. according to the thickness of end article, productivity declines.
In addition, even if the development degree of sometimes cubes set tissue (X-ray diffraction intensity in (200) orientation of copper foil surface) is same degree, bendability is also different, and the control that is difficult to only to carry out (200) orientation just stably obtains the rolled copper foil of bendability excellence.
That is, the present invention makes in order to solve above-mentioned problem, and its object is for providing a kind of rolled copper foil that can stably obtain bendability.
For solving the scheme of problem
Inventors of the present invention carry out various research, found that, Copper Foil not only there is (200) orientation but also the crystal grain with (420) orientation and (311) orientation impacts bendability.There is the crystal grain in (420) orientation and (311) orientation, because stress when the bending applies direction and slip direction, approach and be difficult to cause the distortion of sliding, therefore, easily make bendability decline.
; rolled copper foil of the present invention, take ratio I (311)/I (200) of the integrated intensity I (200) of X-ray diffraction peak value of (200) face after 200 ° of C annealing 0.5 hour and the integrated intensity I (311) of the X-ray diffraction peak value of (311) face as more than 0.001 and below 0.01.
In addition, rolled copper foil of the present invention, take ratio I (420)/I (200) of the integrated intensity I (200) of X-ray diffraction peak value of (200) face after 200 ° of C annealing 0.5 hour and the integrated intensity I (420) of the X-ray diffraction peak value of (420) face as more than 0.005 and below 0.02.
In addition, rolled copper foil of the present invention, take ratio I (311)/I (200) of the integrated intensity I (200) of X-ray diffraction peak value of (200) face after 200 ° of C annealing 0.5 hour and the integrated intensity I (311) of the X-ray diffraction peak value of (311) face as more than 0.001 and below 0.01, and, take ratio I (420)/I (200) of the integrated intensity I (200) of X-ray diffraction peak value of (200) face after 200 ° of C annealing 0.5 hour and the integrated intensity I (420) of the X-ray diffraction peak value of (420) face as more than 0.005 and below 0.02.
The rolled copper foil that claim 1 or 3 is recorded, preferably, ratio I (311) b/I (200) b of I (200) b of the integrated intensity to the X-ray diffraction peak value as before final rolling and after recrystallization annealing and I (311) b is that Copper Foil raw material more than 0.01 and below 0.02 carries out final rolling and forms.
In the rolled copper foil of recording in claim 4, preferably, final rolling degree of finish is made as to η and by η=Ln{ (thickness before final rolling)/(thickness after final rolling) while representing, η >=2.3.
In the rolled copper foil of recording in claim 4 or 5, preferably, I (311) b/I (200) b/ η is more than 0.1 and below 0.7.
In the rolled copper foil of recording in claim 2 or 3, preferably, ratio I (420) b/I (200) b of I (200) b of the integrated intensity to the X-ray diffraction peak value as before final rolling and after recrystallization annealing and I (420) b is that Copper Foil raw material more than 0.02 and below 0.04 carries out final rolling and forms.
In the rolled copper foil of recording in claim 7, preferably, final rolling degree of finish is made as to η and by η=Ln{ (thickness before final rolling)/(thickness after final rolling) while representing, η >=2.3.
In the rolled copper foil of recording in claim 7 or 8, preferably, final rolling degree of finish is made as to η and by η=Ln{ (final rolling before thickness)/(thickness after final rolling) while representing, I (420) b/I (200) b/ η is more than 0.5 and below 1.2.
The rolled copper foil that claim 3 is recorded, preferably, ratio I (311) b/I (200) b of I (200) b of the integrated intensity to the X-ray diffraction peak value as before final rolling and after recrystallization annealing and I (311) b is more than 0.01 and is 0.02 following and be that Copper Foil raw material more than 0.02 and below 0.04 carries out final rolling and forms as I (200) b of integrated intensity of the X-ray diffraction peak value before final rolling and after recrystallization annealing and ratio I (420) b/I (200) b of I (420) b.
In the rolled copper foil of recording in claim 10, preferably, final rolling degree of finish is made as to η and by η=Ln{ (thickness before final rolling)/(thickness after final rolling) while representing, η >=2.3.
In the rolled copper foil of recording in claim 10 or 11, preferably, final rolling degree of finish is made as to η and by η=Ln{ (final rolling before thickness)/(thickness after final rolling) while representing, I (311) b/I (200) b/ η is more than 0.1 and below 0.7, and I (420) b/I (200) b/ η is more than 0.5 and below 1.2.
The effect of invention
According to the present invention, can stably obtain the rolled copper foil of bendability excellence.
Accompanying drawing explanation
Fig. 1 illustrates the figure that is carried out the method for measuring of flexible life by bend test device.
Embodiment
Below, the related rolled copper foil of embodiments of the present invention is described.
< becomes to be grouped into >
One-tenth as Copper Foil is grouped into, and can use suitably tough pitch copper (TPC) or JIS-H3100 (C1020) oxygen free copper (OFC) take JIS-H3100 (C1100) as specification.In addition, the Sn that contains 10 ~ 500 quality ppm and/or the Ag that contains 10 ~ 500 quality ppm as adding element, making remainder is that tough pitch copper or oxygen free copper are also passable.
In addition, as more than one of the element consisting of Ag, Sn, In, Ti, Zn, Zr, Fe, P, Ni, Si, Te, Cr, Nb, V that add element and containing and add up to 20 ~ 500 quality ppm, making remainder is that tough pitch copper or oxygen free copper are also passable.
In addition, the rolled copper foil using due to FPC requires bendability, thereby the thickness of rolled copper foil is preferably below 20 μ m.
The rolled copper foil > that < the 1st mode is related
The related rolled copper foil of the 1st mode of the present invention, after with 200 ° of C annealing 0.5 hour, the integrated intensity I (200) of the X-ray diffraction peak value of (200) face and ratio I (311)/I (200) of the integrated intensity I (311) of the X-ray diffraction peak value of (311) face are more than 0.001 and below 0.01.If rolled copper foil is carried out with 200 ° of C the annealing of 0.5 hour, produce recrystallized structure, cubes set tissue growth, improves the bendability of rolled copper foil.On the other hand, have the crystal grain in (420) orientation and (311) orientation after recrystallize, during due to bending, stress applies direction and slip direction approaches, thereby is difficult to cause the distortion of sliding, and therefore, easily makes bendability decline.
Due to such situation, if compared with (200) orientation, the ratio in (311) orientation is less, make bendability improve, thereby to make than I (311)/I (200) is below 0.01.If exceed 0.01 than I (311)/I (200), the ratio in (311) orientation becomes many, and bendability is declined.Lower than I (311)/I (200), bendability is just higher and preferred, but becomes more than 0.001 value aspect practical.
In addition, the related rolled copper foil of the 1st mode, can take degree of finish more than η=2.3 to final rolling before and ratio I (311) b/I (200) b after recrystallization annealing as the Copper Foil raw material more than 0.01 and below 0.02 carries out final rolling, manufacture.
At this, consider, Copper Foil is carried out to recrystallization annealing (420) orientation and (311) orientation afterwards and using the crystal grain that is present in having in the rolling structure before recrystallization annealing (420) orientation and (311) orientation, as starting point, develop.In addition, consider (420) orientation in rolling structure and (311) orientation tissue before from rolling.; before final rolling and after recrystallization annealing; control the development degree in (420) orientation and (311) orientation, thus, can control the paper tinsel after final rolling is carried out to recrystallization annealing (420) orientation and (311) orientation afterwards.
Due to such situation, if ratio I (311) b/I (200) b before final rolling and after recrystallization annealing exceedes 0.02, the crystal grain also after final rolling with (311) orientation is more residual, the ratio with the crystal grain in (311) orientation increases, thereby sometimes can not obtain sufficient bendability.On the other hand, than I (311) b/I (200) b less than 0.01 in the situation that, because annealing causes coarse grains, thereby can not apply sufficient strain by final rolling, sometimes after carrying out recrystallization annealing, the paper tinsel to after final rolling can not obtain sufficient bendability.
The in the situation that of not enough η=2.3 of final rolling degree of finish, can not apply sufficient strain by final rolling, sometimes after carrying out recrystallization annealing, the paper tinsel to after final rolling can not obtain sufficient bendability.
In the related rolled copper foil of the 1st mode, preferably, I (311) b/I (200) b/ η is more than 0.1 and below 0.7.In addition, more preferably, I (311) b/I (200) b/ η is more than 0.1 and below 0.5.
Generally speaking, in the manufacturing process of Copper Foil, the degree of finish of final rolling processing is high, even thereby control the tissue before final rolling, also in its impact, be difficult to remain to fully the tendency after rolling.So, by the degree of finish of the tissue before the final rolling of common management and final rolling, thereby can obtain bendability more fully.
If I (311) b/I (200) b/ η exceedes 0.5, the crystal grain also after final rolling with (311) orientation is more residual, the ratio with the crystal grain in (311) orientation increases, thereby sometimes can not obtain sufficient bendability.Lower than I (311) b/I (200) b/ η, bendability is just higher and preferred, but aspect practical, becomes more than 0.05 value.
The rolled copper foil > that < the 2nd mode is related
The related rolled copper foil of the 2nd mode of the present invention, after with 200 ° of C annealing 0.5 hour, the integrated intensity I (200) of the X-ray diffraction peak value of (200) face and ratio I (420)/I (200) of the integrated intensity I (420) of the X-ray diffraction peak value of (420) face are more than 0.005 and below 0.02.
As mentioned above, after recrystallize, there is the crystal grain in (420) orientation and (311) orientation, because stress when the bending applies direction, approach with slip direction, thereby be difficult to cause the distortion of sliding, therefore, easily make bendability decline.That is,, if the ratio in (420) orientation is less compared with (200) orientation, make bendability improve, thereby to make than I (420)/I (200) be below 0.02.If exceed 0.02 than I (420)/I (200), the ratio in (420) orientation becomes many, and bendability is declined.But if than I (420)/I (200) less than 0.005, the ratio in (200) orientation is too much, although can obtain sufficient bendability, because Copper Foil is excessively soft, thereby treatability declines.
In addition, the related rolled copper foil of the 2nd mode, can be preferably take degree of finish more than η=2.3 to final rolling before and ratio I (420) b/I (200) b after recrystallization annealing as the Copper Foil raw material more than 0.02 and below 0.04 carries out final rolling, manufacture.
If ratio I (420) b/I (200) b before final rolling and after recrystallization annealing exceedes 0.04, the crystal grain also after final rolling with (420) orientation is more residual, the ratio with the crystal grain in (420) orientation increases, thereby sometimes can not obtain sufficient bendability.On the other hand, than I (420) b/I (200) b less than 0.02 in the situation that, because annealing causes coarse grains, thereby can not apply sufficient strain by final rolling, sometimes after carrying out recrystallization annealing, the paper tinsel to after final rolling can not obtain sufficient bendability.
In the related rolled copper foil of the 2nd mode, preferably, I (420) b/I (200) b/ η is more than 0.5 and below 1.2.In addition, further preferred, I (420) b/I (200) b/ η is more than 0.5 and below 1.0.
At this, as the crystal grain with (420) orientation of recrystallized structure, by rolling, process and rotate, become the crystal grain with other orientation.Therefore, in the situation that rolling degree of finish is high, the ratio of (420) face reduces, and I (420) declines.On the other hand, the crystal grain in the situation that degree of finish is low, with (420) orientation is easily remaining, and I (420) easily uprises.
Due to such situation, if I (420) b/I (200) b/ η exceedes 1.0, the crystal grain also after final rolling with (420) orientation is more residual, the ratio with the crystal grain in (420) orientation increases, thereby sometimes can not obtain sufficient bendability.In addition, if I (420) b/I (200) b/ η less than 0.5, although can obtain sufficient bendability, because Copper Foil is excessively soft, thereby sometimes treatability declines.
The manufacture > of < rolled copper foil
The related rolled copper foil of the 1st and the 2nd mode, the front rolling of all can annealing after hot rolling to ingot, recrystallization annealing and final rolling and manufacture.At this, the stability in recrystallize orientation is the order of (200) > (311) > (420), heat-up rate when recrystallization annealing is higher, the tendency that unsettled (420) orientation and (311) orientation just more increase.Therefore, be preferably, the heat-up rate while making recrystallization annealing is that 5 ~ 50 ° of C/s make speed slower than prior art.
In addition, be preferably, be made as degree of finish more than η=1.6 of rolling before annealing, and, make after recrystallization annealing, the crystallization particle diameter before final rolling is that 10 μ m are above and below 30 μ m.Crystallization particle diameter before final rolling becomes annealing conditions such below 10 μ m, and the possibility of non-recrystallization tissue residue uprises.In addition, the crystallization particle diameter before final rolling exceedes 30 μ m, can not apply sufficient strain by final rolling, sometimes after the paper tinsel to after final rolling carries out recrystallization annealing, can not obtain sufficient bendability.
In addition, as mentioned above, can carry out final rolling with degree of finish more than η=2.3.
In addition, crystallization particle diameter is measured by the process of chopping of JIS H0501.
Embodiment
First, the copper ingot of the composition that manufacture table 1 is recorded, is hot-rolled down to thickness 10mm.Subsequently, repeat annealing and rolling, after being rolling to set thickness, make plate carry out recrystallization annealing by the continuous annealing furnace of 750 ° of C.And, with the degree of finish shown in table 1, carry out finally cold rollingly, obtain the Copper Foil of the thickness shown in table 1.In addition the heat-up rate when recrystallization annealing shown in table 1.
< orientation degree >
When the copper foil annealing final rolling being obtained with 200 ° of C 0.5 hour and after making its recrystallize, obtain respectively the integrated value (I) of the intensity of (200) face of obtaining by the X-ray diffraction of rolling surface, (311) face, (420) face.
In addition, obtain respectively before final rolling and recrystallization annealing after the integrated intensity of X-ray diffraction peak value of (200) face, (311) face, (420) face.About this value, as I (200) b, by the word adding " b ", represented.
< bendability >
When the Copper Foil sample heating final rolling being obtained with 200 ° of C 30 minutes and after making its recrystallize, bend test device as shown in Figure 1 carries out the mensuration of flexible life.This device becomes the structure with 4 combinations of vibration driving body by vibration transmission member 3, by test Copper Foil 1 by the leading section of the part of the screw 2 shown in arrow and 3 altogether 4 be fixed on device.If vibration section 3 drives up and down, the pars intermedia of Copper Foil 1 bends to hairpin with set radius-of-curvature r.In this test, while obtaining under following condition repeated flex till the number of times of fracture.
In addition, test conditions is as follows: test film width: 12.7mm, test film length: 200mm, test film is taked direction: with length direction and the rolling direction of test film, become parallel mode and take, radius-of-curvature r:1.5mm, vibratility adjustment: 20mm, vibration velocity: 1000 beats/min.
In addition, according to following benchmark, evaluate bendability.If be evaluated as ◎, zero or △, bendability is good.
◎: number of bends is that more than 200,000 times bendability is the best
Zero: number of bends is 100,000 above and less thaies 200,000 times, and bendability is good
△: number of bends is 50,000 above and less thaies 100,000 times, bendability excellence
×: number of bends less than 50,000 times, bendability is poor.
In the result obtaining shown in table 1, table 2.
At this, " TPC " on the composition hurdle in table 1 represents the tough pitch copper (TPC) take JIS-H3100 (C1100) as specification, and " OFC " represents the oxygen free copper (OFC) take JIS-H3100 (C1020) as specification.Therefore, for example, the composition hurdle " 190ppmAg-TPC " in table 1 means the Ag of 190 quality ppm is added into the composition in the tough pitch copper (TPC) take JIS-H3100 (C1100) as specification.In addition, the composition hurdle " 100ppmSn-OFC " in table 1 means the Sn of 100 quality ppm is added into the composition in the oxygen free copper (OFC) take JIS-H3100 (C1020) as specification.
[table 1]
[table 2]
As evident from Table 1, at I (311)/I (200), be more than 0.001 and below 0.01 or (420)/I (200) is the each embodiment more than 0.005 and below 0.02, bendability excellence.Especially, at I (311)/I (200), be more than 0.001, below 0.01 and I (420)/I (200) is the embodiment 1 ~ 12,15 ~ 21 more than 0.005, below 0.02, compared with embodiment 13,14, bendability is more excellent.
On the other hand, in the case of I (311)/I (200) exceed 0.01 and I (420)/I (200) exceed 0.02 comparative example 1 ~ 3, bendability is poor.
In addition, as as evident from Table 2, the in the situation that of each embodiment, I (311) b/I (200) b becomes more than 0.01 and below 0.02, or I (311) b/I (200) b/ η becomes more than 0.1 and below 0.7.In addition, the in the situation that of each embodiment, I (420) b/I (200) b becomes more than 0.02 and below 0.04, or I (420) b/I (200) b/ η becomes more than 0.5 and below 1.2.Especially, the in the situation that of embodiment 1 ~ 12,15 ~ 21, I (311)/I (200) is more than 0.001 and below 0.01, and, I (420)/I (200) is more than 0.005 and below 0.02, and bendability is excellent especially.
On the other hand, the in the situation that of comparative example 1 ~ 3, I (311) b/I (200) b exceedes 0.02, and I (311) b/I (200) b/ η exceedes 0.7.Similarly, the in the situation that of comparative example 1 ~ 3, I (420) b/I (200) b exceedes 0.04, and I (420) b/I (200) b/ η exceedes 1.2.
Claims (12)
1. a rolled copper foil, it is characterized in that, take ratio I (311)/I (200) of the integrated intensity I (200) of X-ray diffraction peak value of (200) face after 200 ° of C annealing 0.5 hour and the integrated intensity I (311) of the X-ray diffraction peak value of (311) face as more than 0.001 and below 0.01.
2. a rolled copper foil, it is characterized in that, take ratio I (420)/I (200) of the integrated intensity I (200) of X-ray diffraction peak value of (200) face after 200 ° of C annealing 0.5 hour and the integrated intensity I (420) of the X-ray diffraction peak value of (420) face as more than 0.005 and below 0.02.
3. a rolled copper foil, it is characterized in that, take ratio I (311)/I (200) of the integrated intensity I (200) of X-ray diffraction peak value of (200) face after 200 ° of C annealing 0.5 hour and the integrated intensity I (311) of the X-ray diffraction peak value of (311) face as more than 0.001 and below 0.01, and, take ratio I (420)/I (200) of the integrated intensity I (200) of X-ray diffraction peak value of (200) face after 200 ° of C annealing 0.5 hour and the integrated intensity I (420) of the X-ray diffraction peak value of (420) face as more than 0.005 and below 0.02.
4. according to the rolled copper foil described in claim 1 or 3, it is characterized in that, ratio I (311) b/I (200) b of I (200) b of the integrated intensity to the X-ray diffraction peak value as before final rolling and after recrystallization annealing and I (311) b is that the Copper Foil raw material more than 0.01 and below 0.02 carries out final rolling and forms.
5. rolled copper foil according to claim 4, is characterized in that, final rolling degree of finish is made as to η and by η=Ln{ (final rolling before thickness)/(thickness after final rolling) while representing, η >=2.3.
6. according to the rolled copper foil described in claim 4 or 5, it is characterized in that, I (311) b/I (200) b/ η is more than 0.1 and below 0.7.
7. according to the rolled copper foil described in claim 2 or 3, it is characterized in that, ratio I (420) b/I (200) b of I (200) b of the integrated intensity to the X-ray diffraction peak value as before final rolling and after recrystallization annealing and I (420) b is that the Copper Foil raw material more than 0.02 and below 0.04 carries out final rolling and forms.
8. rolled copper foil according to claim 7, is characterized in that, final rolling degree of finish is made as to η and by η=Ln{ (final rolling before thickness)/(thickness after final rolling) while representing, η >=2.3.
9. according to claim 7 or rolled copper foil claimed in claim 8, it is characterized in that, final rolling degree of finish is made as to η and by η=Ln{ (final rolling before thickness)/(thickness after final rolling) while representing,
I (420) b/I (200) b/ η is more than 0.5 and below 1.2.
10. rolled copper foil according to claim 3, it is characterized in that, ratio I (311) b/I (200) b of I (200) b of the integrated intensity to the X-ray diffraction peak value as before final rolling and after recrystallization annealing and I (311) b is more than 0.01 and below 0.02, and, as I (200) b of integrated intensity of the X-ray diffraction peak value before final rolling and after recrystallization annealing and ratio I (420) b/I (200) b of I (420) b, be that Copper Foil raw material more than 0.02 and below 0.04 carries out final rolling and forms.
11. rolled copper foils according to claim 10, is characterized in that, final rolling degree of finish is made as to η and by η=Ln{ (final rolling before thickness)/(thickness after final rolling) while representing, η >=2.3.
12. according to the rolled copper foil described in claim 10 or 11, it is characterized in that, final rolling degree of finish is made as to η and by η=Ln{ (final rolling before thickness)/(thickness after final rolling) while representing,
I (311) b/I (200) b/ η is more than 0.1 and below 0.7, and I (420) b/I (200) b/ η is more than 0.5 and below 1.2.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011181228 | 2011-08-23 | ||
| JP2011-181228 | 2011-08-23 | ||
| JP2011201838A JP5752536B2 (en) | 2011-08-23 | 2011-09-15 | Rolled copper foil |
| JP2011-201838 | 2011-09-15 | ||
| PCT/JP2012/058848 WO2013027437A1 (en) | 2011-08-23 | 2012-04-02 | Rolled copper foil |
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| Publication Number | Publication Date |
|---|---|
| CN103748251A true CN103748251A (en) | 2014-04-23 |
| CN103748251B CN103748251B (en) | 2016-02-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201280040973.7A Active CN103748251B (en) | 2011-08-23 | 2012-04-02 | Rolled copper foil |
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| JP (1) | JP5752536B2 (en) |
| KR (1) | KR101632515B1 (en) |
| CN (1) | CN103748251B (en) |
| TW (1) | TWI453290B (en) |
| WO (1) | WO2013027437A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106304689A (en) * | 2015-06-05 | 2017-01-04 | Jx日矿日石金属株式会社 | Rolled copper foil, copper-clad laminated board and flexible printed board and electronic equipment |
| CN107046768A (en) * | 2016-02-05 | 2017-08-15 | Ｊｘ金属株式会社 | Flexible printed board copper foil, copper clad layers stack, flexible printed board and electronic device using it |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014058704A (en) * | 2012-09-14 | 2014-04-03 | Jx Nippon Mining & Metals Corp | Rolled copper foil |
| JP2014058705A (en) * | 2012-09-14 | 2014-04-03 | Jx Nippon Mining & Metals Corp | Rolled copper foil and copper-clad laminate |
| JP6104200B2 (en) * | 2014-03-13 | 2017-03-29 | Ｊｘ金属株式会社 | Rolled copper foil, copper clad laminate, flexible printed circuit board, and electronic device |
| KR101721314B1 (en) * | 2015-05-21 | 2017-03-29 | 제이엑스금속주식회사 | Rolled copper foil, copper clad laminate, and flexible printed board and electronic device |
| JP6294376B2 (en) * | 2016-02-05 | 2018-03-14 | Ｊｘ金属株式会社 | Copper foil for flexible printed circuit board, copper-clad laminate using the same, flexible printed circuit board, and electronic device |
| JP6781562B2 (en) * | 2016-03-28 | 2020-11-04 | Ｊｘ金属株式会社 | Copper foil for flexible printed circuit boards, copper-clad laminates using it, flexible printed circuit boards, and electronic devices |
| JP2019194360A (en) * | 2019-06-26 | 2019-11-07 | Ｊｘ金属株式会社 | Copper foil for flexible printed wiring board, and copper clad laminate, flexible printed wiring board and electronic device using the same |
| JP7186141B2 (en) * | 2019-07-10 | 2022-12-08 | Ｊｘ金属株式会社 | Copper foil for flexible printed circuit boards |
| KR20220068985A (en) * | 2019-09-27 | 2022-05-26 | 미쓰비시 마테리알 가부시키가이샤 | pure copper plate |
| US20230114969A1 (en) * | 2020-03-06 | 2023-04-13 | Mitsubishi Materials Corporation | Pure copper plate, copper/ceramic bonded body, and insulated circuit board |
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- 2012-04-02 WO PCT/JP2012/058848 patent/WO2013027437A1/en active Application Filing
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| CN107046768A (en) * | 2016-02-05 | 2017-08-15 | Ｊｘ金属株式会社 | Flexible printed board copper foil, copper clad layers stack, flexible printed board and electronic device using it |
Also Published As
| Publication number | Publication date |
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| KR101632515B1 (en) | 2016-06-21 |
| JP5752536B2 (en) | 2015-07-22 |
| WO2013027437A1 (en) | 2013-02-28 |
| JP2013060651A (en) | 2013-04-04 |
| TW201309818A (en) | 2013-03-01 |
| TWI453290B (en) | 2014-09-21 |
| CN103748251B (en) | 2016-02-10 |
| KR20140037962A (en) | 2014-03-27 |
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