CN103748251B - Rolled copper foil - Google Patents
Rolled copper foil Download PDFInfo
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- CN103748251B CN103748251B CN201280040973.7A CN201280040973A CN103748251B CN 103748251 B CN103748251 B CN 103748251B CN 201280040973 A CN201280040973 A CN 201280040973A CN 103748251 B CN103748251 B CN 103748251B
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 79
- 239000011889 copper foil Substances 0.000 title claims abstract description 68
- 238000002441 X-ray diffraction Methods 0.000 claims abstract description 33
- 238000005096 rolling process Methods 0.000 claims description 88
- 238000000137 annealing Methods 0.000 claims description 40
- 238000001953 recrystallisation Methods 0.000 claims description 32
- 239000002994 raw material Substances 0.000 claims description 9
- 239000013078 crystal Substances 0.000 description 16
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 238000012360 testing method Methods 0.000 description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 238000002425 crystallisation Methods 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000008467 tissue growth Effects 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000012010 growth Effects 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 231100000732 tissue residue Toxicity 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
- B21B1/40—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling foils which present special problems, e.g. because of thinness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
- B21B2003/005—Copper or its alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The present invention is such rolled copper foil: the integrated intensity I (200) of X-ray diffraction peak value in (200) face annealed after 0.5 hour with 200 ° of C and ratio I (the 311)/I (200) of the integrated intensity I (311) of the X-ray diffraction peak value in (311) face are more than 0.001 and less than 0.01, stably can obtain bendability.
Description
Technical field
The present invention relates to and be used in such as flexible distributing board (FPC:FlexiblePrintedCircuit) and the rolled copper foil being suitable for copper-clad lamination.
Background technology
Resin layer and Copper Foil are laminated by flexible distributing board (FPC), suitably for repeated flex portion.As the Copper Foil for such FPC, widely use the rolled copper foil of bendability excellence.As the method making the bendability of rolled copper foil improve, report (patent documentation 1) making the technology of the cubes set tissue growth after recrystallization annealing.In addition, as the method making the cubes set tissue growth after recrystallization annealing, enumerate regulation final rolling degree of finish and rolling condition (patent documentation 2), after rolling, retain cubes orientation (patent documentation 3).
Prior art document
Patent documentation
Patent documentation 1: Japanese Patent No. 3009383 publication;
Patent documentation 2: Japanese Unexamined Patent Publication 2009-185376 publication;
Patent documentation 3: Japanese Unexamined Patent Publication 2010-150597 publication.
Summary of the invention
The problem that invention will solve
But, the existing method making cubes set tissue growth, there is this problem: in order to adjust final rolling degree of finish, the thickness of Copper Foil raw material when being necessary thickness according to end article and annealing before changing the final rolling of cubes set organizational growth or be rolled under special condition, productivity declines.
In addition, even if the Development degree of sometimes cubes set tissue (X-ray diffraction intensity in (200) orientation of copper foil surface) is same degree, bendability is also different, and the control being difficult to only carry out (200) orientation just stably obtains the rolled copper foil of bendability excellence.
That is, the present invention makes to solve above-mentioned problem, and its object is for providing a kind of rolled copper foil that stably can obtain bendability.
For solving the scheme of problem
Inventors of the present invention carry out various research, found that, not only having (200) orientation but also having (420) orientation of Copper Foil impacts bendability with the crystal grain in (311) orientation.There is the crystal grain in (420) orientation and (311) orientation, due to when bending stress apply direction and slip direction close to and be difficult to cause distortion of sliding, therefore, easily make bendability decline.
Namely, rolled copper foil of the present invention, the integrated intensity I (200) of X-ray diffraction peak value in (200) face annealed after 0.5 hour with 200 ° of C and ratio I (the 311)/I (200) of the integrated intensity I (311) of the X-ray diffraction peak value in (311) face are more than 0.001 and less than 0.01.
In addition, rolled copper foil of the present invention, the integrated intensity I (200) of X-ray diffraction peak value in (200) face annealed after 0.5 hour with 200 ° of C and ratio I (the 420)/I (200) of the integrated intensity I (420) of the X-ray diffraction peak value in (420) face are more than 0.005 and less than 0.02.
In addition, rolled copper foil of the present invention, the integrated intensity I (200) of X-ray diffraction peak value in (200) face annealed after 0.5 hour with 200 ° of C and ratio I (the 311)/I (200) of the integrated intensity I (311) of the X-ray diffraction peak value in (311) face are more than 0.001 and less than 0.01, and, the integrated intensity I (200) of X-ray diffraction peak value in (200) face annealed after 0.5 hour with 200 ° of C and ratio I (the 420)/I (200) of the integrated intensity I (420) of the X-ray diffraction peak value in (420) face are more than 0.005 and less than 0.02.
Rolled copper foil described in technical scheme 1 or 3, preferably, ratio I (311) b/I (200) b of I (200) b and I (311) b of the integrated intensity as the X-ray diffraction peak value before final rolling and after recrystallization annealing is more than 0.01 and the Copper Foil raw material of less than 0.02 carries out final rolling forms.
In the rolled copper foil described in technical scheme 4, preferably, final rolling degree of finish is set to η and by η=Ln{ (thickness before final rolling)/(thickness after final rolling) represent time, η >=2.3.
In the rolled copper foil described in technical scheme 4 or 5, preferably, I (311) b/I (200) b/ η is more than 0.1 and less than 0.7.
In the rolled copper foil described in technical scheme 2 or 3, preferably, ratio I (420) b/I (200) b of I (200) b and I (420) b of the integrated intensity as the X-ray diffraction peak value before final rolling and after recrystallization annealing is more than 0.02 and the Copper Foil raw material of less than 0.04 carries out final rolling forms.
In the rolled copper foil described in technical scheme 7, preferably, final rolling degree of finish is set to η and by η=Ln{ (thickness before final rolling)/(thickness after final rolling) represent time, η >=2.3.
In the rolled copper foil described in technical scheme 7 or 8, preferably, final rolling degree of finish is set to η and by η=Ln{ (thickness before final rolling)/(thickness after final rolling) represent time, I (420) b/I (200) b/ η is more than 0.5 and less than 1.2.
Rolled copper foil described in technical scheme 3, preferably, ratio I (311) b/I (200) b of I (200) b and I (311) b of the integrated intensity as the X-ray diffraction peak value before final rolling and after recrystallization annealing is more than 0.01 and less than 0.02 and be more than 0.02 as ratio I (420) b/I (200) b of I (200) b and I (420) b of the integrated intensity of the X-ray diffraction peak value before final rolling and after recrystallization annealing and the Copper Foil raw material of less than 0.04 carries out final rolling forms.
In the rolled copper foil described in technical scheme 10, preferably, final rolling degree of finish is set to η and by η=Ln{ (thickness before final rolling)/(thickness after final rolling) represent time, η >=2.3.
In the rolled copper foil described in technical scheme 10 or 11, preferably, final rolling degree of finish is set to η and by η=Ln{ (thickness before final rolling)/(thickness after final rolling) represent time, I (311) b/I (200) b/ η is more than 0.1 and less than 0.7, and I (420) b/I (200) b/ η is more than 0.5 and less than 1.2.
The effect of invention
According to the present invention, the rolled copper foil of bendability excellence stably can be obtained.
Accompanying drawing explanation
Fig. 1 is the figure that the method for measuring being carried out flexible life by bend test device is shown.
Embodiment
Below, the rolled copper foil involved by embodiments of the present invention is described.
< becomes to be grouped into >
One-tenth as Copper Foil is grouped into, and can use suitably with JIS-H3100 (C1100) be specification tough pitch copper (TPC) or JIS-H3100 (C1020) oxygen free copper (OFC).In addition, contain the Sn of 10 ~ 500 quality ppm and/or the Ag containing 10 ~ 500 quality ppm as Addition ofelements, make remainder be that tough pitch copper or oxygen free copper are also passable.
In addition, contain more than one of the element be made up of Ag, Sn, In, Ti, Zn, Zr, Fe, P, Ni, Si, Te, Cr, Nb, V of total 20 ~ 500 quality ppm as Addition ofelements, make remainder be that tough pitch copper or oxygen free copper are also passable.
In addition, the rolled copper foil used due to FPC requires bendability, thus the thickness of rolled copper foil preferably less than 20 μm.
Rolled copper foil > involved by < the 1st mode
Rolled copper foil involved by 1st mode of the present invention, after annealing 0.5 hour with 200 ° of C, ratio I (the 311)/I (200) of the integrated intensity I (311) of the integrated intensity I (200) of the X-ray diffraction peak value in (200) face and the X-ray diffraction peak value in (311) face is more than 0.001 and less than 0.01.If carry out the annealing of 0.5 hour to rolled copper foil with 200 ° of C, then produce recrystallized structure, cubes set tissue growth, the bendability of rolled copper foil is improved.On the other hand, there is the crystal grain in (420) orientation and (311) orientation after recrystallization, due to stress time bending apply direction and slip direction close, be thus difficult to cause distortion of sliding, therefore, easily make bendability decline.
Due to such situation, if compared with (200) orientation, the ratio in (311) orientation is less, then make bendability improve, and thus making than I (311)/I (200) is less than 0.01.If than I (311)/I (200) more than 0.01, then the ratio in (311) orientation becomes many, and bendability is declined.Lower than I (311)/I (200), bendability is higher and preferred, but becomes the value of more than 0.001 in practical.
In addition, rolled copper foil involved by 1st mode, can be more than 0.01 with degree of finish more than η=2.3 to ratio I (311) b/I (200) b before final rolling and after recrystallization annealing and the Copper Foil raw material of less than 0.02 carries out final rolling manufactures.
At this, consider, (420) orientation after carrying out recrystallization annealing to Copper Foil and (311) orientation develop using the crystal grain with (420) orientation and (311) orientation be present in the rolling structure before recrystallization annealing as starting point.In addition, consider, (420) orientation in rolling structure and (311) orientation are from the tissue before rolling.Namely, before final rolling and after recrystallization annealing, control the development degree in (420) orientation and (311) orientation, thereby, it is possible to (420) orientation after controlling to carry out recrystallization annealing to the paper tinsel after final rolling and (311) orientation.
Due to such situation, if ratio I (311) b/I (200) b before final rolling and after recrystallization annealing is more than 0.02, the crystal grain then also after final rolling with (311) orientation more remains, the ratio with the crystal grain in (311) orientation increases, and thus sometimes can not obtain sufficient bendability.On the other hand, when than I (311) b/I (200) b less than 0.01, coarse grains is caused due to annealing, thus do not apply sufficient strain by final rolling, sometimes can not obtain sufficient bendability after recrystallization annealing is carried out to the paper tinsel after final rolling.
When final rolling degree of finish is less than η=2.3, do not apply sufficient strain by final rolling, sometimes can not obtain sufficient bendability after recrystallization annealing is carried out to the paper tinsel after final rolling.
In the rolled copper foil involved by the 1st mode, preferably, I (311) b/I (200) b/ η is more than 0.1 and less than 0.7.In addition, more preferably, I (311) b/I (200) b/ η is more than 0.1 and less than 0.5.
Generally speaking, in the manufacturing process of Copper Foil, the degree of finish of final rolling processing is high, even if thus control the tissue before final rolling, is also in its impact and is difficult to the tendency after remaining to rolling fully.So, by jointly managing the degree of finish of the tissue before final rolling and final rolling, thus bendability more fully can be obtained.
If I (311) b/I (200) b/ η is more than 0.5, the crystal grain then also after final rolling with (311) orientation more remains, the ratio with the crystal grain in (311) orientation increases, and thus sometimes can not obtain sufficient bendability.Lower than I (311) b/I (200) b/ η, bendability is higher and preferred, but in practical, becomes the value of more than 0.05.
Rolled copper foil > involved by < the 2nd mode
Rolled copper foil involved by 2nd mode of the present invention, after annealing 0.5 hour with 200 ° of C, ratio I (the 420)/I (200) of the integrated intensity I (420) of the integrated intensity I (200) of the X-ray diffraction peak value in (200) face and the X-ray diffraction peak value in (420) face is more than 0.005 and less than 0.02.
As mentioned above, there is the crystal grain in (420) orientation and (311) orientation after recrystallization, due to when bending stress to apply direction close with slip direction, be thus difficult to cause slide and be out of shape, therefore, easily make bendability decline.That is, if the ratio in (420) orientation is less compared with (200) orientation, then make bendability improve, thus making than I (420)/I (200) is less than 0.02.If than I (420)/I (200) more than 0.02, then the ratio in (420) orientation becomes many, and bendability is declined.But if than I (420)/I (200) less than 0.005, then the ratio in (200) orientation is too much, although can obtain sufficient bendability, because Copper Foil is excessively soft, thus treatability declines.
In addition, rolled copper foil involved by 2nd mode, preferably can be more than 0.02 with degree of finish more than η=2.3 to ratio I (420) b/I (200) b before final rolling and after recrystallization annealing and the Copper Foil raw material of less than 0.04 carries out final rolling manufactures.
If ratio I (420) b/I (200) b before final rolling and after recrystallization annealing is more than 0.04, the crystal grain then also after final rolling with (420) orientation more remains, the ratio with the crystal grain in (420) orientation increases, and thus sometimes can not obtain sufficient bendability.On the other hand, when than I (420) b/I (200) b less than 0.02, coarse grains is caused due to annealing, thus do not apply sufficient strain by final rolling, sometimes can not obtain sufficient bendability after recrystallization annealing is carried out to the paper tinsel after final rolling.
In the rolled copper foil involved by the 2nd mode, preferably, I (420) b/I (200) b/ η is more than 0.5 and less than 1.2.In addition, further preferably, I (420) b/I (200) b/ η is more than 0.5 and less than 1.0.
At this, the crystal grain with (420) orientation as recrystallized structure is processed by rolling and rotates, and becomes the crystal grain with other orientation.Therefore, when rolling degree of finish is high, the ratio in (420) face reduces, and I (420) declines.On the other hand, the crystal grain when degree of finish is low, with (420) orientation is easily remaining, and I (420) easily uprises.
Due to such situation, if I (420) b/I (200) b/ η is more than 1.0, the crystal grain then also after final rolling with (420) orientation more remains, the ratio with the crystal grain in (420) orientation increases, and thus sometimes can not obtain sufficient bendability.In addition, if I (420) b/I (200) b/ η is less than 0.5, although then can obtain sufficient bendability, because Copper Foil is excessively soft, thus sometimes treatability declines.
The manufacture > of < rolled copper foil
Rolled copper foil involved by 1st and the 2nd mode, all can to anneal front rolling, recrystallization annealing and final rolling and manufacture to ingot after hot rolling.At this, the stability in recrystallize orientation is the order of (200) > (311) > (420), heat-up rate when being in recrystallization annealing is higher, the tendency that unstable (420) orientation and (311) orientation more increase.Therefore, be preferably, make heat-up rate during recrystallization annealing be that 5 ~ 50 ° of C/s make speed slower than prior art.
In addition, be preferably, be set to the degree of finish of more than η=1.6 of the front rolling of annealing, and the crystallization particle diameter after making recrystallization annealing, before final rolling is more than 10 μm and less than 30 μm.Crystallization particle diameter before final rolling becomes less than 10 μm such annealing conditions, the possibility of non-recrystallization tissue residue uprises.In addition, the crystallization particle diameter before final rolling is more than 30 μm, do not apply sufficient strain by final rolling, sometimes can not obtain sufficient bendability after recrystallization annealing is carried out to the paper tinsel after final rolling.
In addition, as mentioned above, final rolling can be carried out with degree of finish more than η=2.3.
In addition, crystallization particle diameter is measured by the process of chopping of JISH0501.
Embodiment
First, manufacture the copper ingot of the composition described in table 1, carry out being hot-rolled down to thickness 10mm.Subsequently, repeat annealing and rolling, after being rolling to set thickness, make plate carry out recrystallization annealing by the continuous annealing furnace of 750 ° of C.And, carry out with the degree of finish shown in table 1 finally cold rolling, obtain the Copper Foil of the thickness shown in table 1.In addition, heat-up rate during recrystallization annealing is shown in Table 1.
< orientation degree >
After making its recrystallize when the copper foil annealing final rolling obtained with 200 ° of C 0.5 hour, obtain the integrated value (I) of intensity being obtained (200) face, (311) face, (420) face by the X-ray diffraction of rolling surface respectively.
In addition, to obtain respectively before final rolling and the integrated intensity of the X-ray diffraction peak value in (200) face after recrystallization annealing, (311) face, (420) face.About this value, represented by the word added " b " as I (200) b.
< bendability >
After the copper foil sample final rolling obtained with 200 ° of C heats 30 minutes and makes its recrystallize, bend test device as shown in Figure 1 carries out the mensuration of flexible life.This device becomes vibration transmission member 3 and the structure that is combined of vibration driving body 4, by test Copper Foil 1 amounting at 4 and be fixed on device by the part of screw 2 shown in arrow and the leading section of 3.If vibration section about 3 drives, then the pars intermedia of Copper Foil 1 bends to hairpin with set radius-of-curvature r.In this test, obtain the number of times to fracture during repeated flex under the following conditions.
In addition, test conditions is as follows: test film width: 12.7mm, test film length: 200mm, direction taked by test film: become parallel mode with the length direction of test film and rolling direction and take, radius-of-curvature r:1.5mm, vibratility adjustment: 20mm, vibration velocity: 1000 beats/min.
In addition, bendability is evaluated according to following benchmark.If be evaluated as ◎, zero or △, then bendability is good.
◎: number of bends is more than 200,000 times, and bendability is the best
Zero: number of bends is more than 100,000 times and less than 200,000 times, bendability is good
△: number of bends is more than 50,000 times and less than 100,000 times, bendability is excellent
×: number of bends is less than 50,000 times, and bendability is poor.
The result obtained shown in table 1, table 2.
At this, " TPC " on the composition hurdle in table 1 represents the tough pitch copper (TPC) being specification with JIS-H3100 (C1100), the oxygen free copper (OFC) that " OFC " represents is specification with JIS-H3100 (C1020).Such as, composition hurdle " 190ppmAg-TPC " therefore, in table 1 means the composition be added into by the Ag of 190 quality ppm with in JIS-H3100 (C1100) tough pitch copper (TPC) that is specification.In addition, the composition hurdle " 100ppmSn-OFC " in table 1 means the composition be added into by the Sn of 100 quality ppm with in JIS-H3100 (C1020) oxygen free copper (OFC) that is specification.
[table 1]
[table 2]
As evident from Table 1, when I (311)/I (200) be more than 0.001 and less than 0.01 or (420)/I (200) be more than 0.005 and each embodiment of less than 0.02, bendability is excellent.Especially, when I (311)/I (200) is more than 0.001, less than 0.01 and I (420)/I (200) is more than 0.005, less than 0.02 embodiment 1 ~ 12,15 ~ 21, compared with embodiment 13,14, bendability is more excellent.
On the other hand, when I (311)/I (200) more than 0.01 and I (420)/I (200) more than 0.02 comparative example 1 ~ 3, bendability is poor.
In addition, as as evident from Table 2, when each embodiment, I (311) b/I (200) b becomes more than 0.01 and less than 0.02, or I (311) b/I (200) b/ η becomes more than 0.1 and less than 0.7.In addition, when each embodiment, I (420) b/I (200) b becomes more than 0.02 and less than 0.04, or I (420) b/I (200) b/ η becomes more than 0.5 and less than 1.2.Especially, when embodiment 1 ~ 12,15 ~ 21, I (311)/I (200) is more than 0.001 and less than 0.01, and, I (420)/I (200) is more than 0.005 and less than 0.02, and bendability is excellent especially.
On the other hand, when comparative example 1 ~ 3, I (311) b/I (200) b is more than 0.02, and I (311) b/I (200) b/ η is more than 0.7.Similarly, when comparative example 1 ~ 3, I (420) b/I (200) b is more than 0.04, and I (420) b/I (200) b/ η is more than 1.2.
Claims (9)
1. a rolled copper foil, it is characterized in that, the integrated intensity I (200) of X-ray diffraction peak value in (200) face annealed after 0.5 hour with 200 ° of C and ratio I (the 311)/I (200) of the integrated intensity I (311) of the X-ray diffraction peak value in (311) face are more than 0.001 and less than 0.008.
2. a rolled copper foil, it is characterized in that, the integrated intensity I (200) of X-ray diffraction peak value in (200) face annealed after 0.5 hour with 200 ° of C and ratio I (the 420)/I (200) of the integrated intensity I (420) of the X-ray diffraction peak value in (420) face are more than 0.005 and less than 0.02.
3. a rolled copper foil, it is characterized in that, the integrated intensity I (200) of X-ray diffraction peak value in (200) face annealed after 0.5 hour with 200 ° of C and ratio I (the 311)/I (200) of the integrated intensity I (311) of the X-ray diffraction peak value in (311) face are more than 0.001 and less than 0.01, and, the integrated intensity I (200) of X-ray diffraction peak value in (200) face annealed after 0.5 hour with 200 ° of C and ratio I (the 420)/I (200) of the integrated intensity I (420) of the X-ray diffraction peak value in (420) face are more than 0.005 and less than 0.02.
4. the rolled copper foil according to claim 1 or 3, it is characterized in that, ratio I (311) b/I (200) b of I (200) b and I (311) b of the integrated intensity as the X-ray diffraction peak value before final rolling and after recrystallization annealing is more than 0.01 and the Copper Foil raw material of less than 0.02 carries out final rolling forms.
5. rolled copper foil according to claim 4, is characterized in that, final rolling degree of finish is set to η and by η=Ln{ (thickness before final rolling)/(thickness after final rolling) represent time, η >=2.3.
6. the rolled copper foil according to Claims 2 or 3, it is characterized in that, ratio I (420) b/I (200) b of I (200) b and I (420) b of the integrated intensity as the X-ray diffraction peak value before final rolling and after recrystallization annealing is more than 0.02 and the Copper Foil raw material of less than 0.04 carries out final rolling forms.
7. rolled copper foil according to claim 6, is characterized in that, final rolling degree of finish is set to η and by η=Ln{ (thickness before final rolling)/(thickness after final rolling) represent time, η >=2.3.
8. rolled copper foil according to claim 3, it is characterized in that, ratio I (311) b/I (200) b of I (200) b and I (311) b of the integrated intensity as the X-ray diffraction peak value before final rolling and after recrystallization annealing is more than 0.01 and less than 0.02, and ratio I (420) b/I (200) b as I (200) b and I (420) b of the integrated intensity of the X-ray diffraction peak value before final rolling and after recrystallization annealing is more than 0.02 and the Copper Foil raw material of less than 0.04 carries out final rolling forms.
9. rolled copper foil according to claim 8, is characterized in that, final rolling degree of finish is set to η and by η=Ln{ (thickness before final rolling)/(thickness after final rolling) represent time, η >=2.3.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011181228 | 2011-08-23 | ||
| JP2011-181228 | 2011-08-23 | ||
| JP2011201838A JP5752536B2 (en) | 2011-08-23 | 2011-09-15 | Rolled copper foil |
| JP2011-201838 | 2011-09-15 | ||
| PCT/JP2012/058848 WO2013027437A1 (en) | 2011-08-23 | 2012-04-02 | Rolled copper foil |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103748251A CN103748251A (en) | 2014-04-23 |
| CN103748251B true CN103748251B (en) | 2016-02-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280040973.7A Active CN103748251B (en) | 2011-08-23 | 2012-04-02 | Rolled copper foil |
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| Country | Link |
|---|---|
| JP (1) | JP5752536B2 (en) |
| KR (1) | KR101632515B1 (en) |
| CN (1) | CN103748251B (en) |
| TW (1) | TWI453290B (en) |
| WO (1) | WO2013027437A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014058704A (en) * | 2012-09-14 | 2014-04-03 | Jx Nippon Mining & Metals Corp | Rolled copper foil |
| JP2014058705A (en) * | 2012-09-14 | 2014-04-03 | Jx Nippon Mining & Metals Corp | Rolled copper foil and copper-clad laminate |
| JP6104200B2 (en) * | 2014-03-13 | 2017-03-29 | Ｊｘ金属株式会社 | Rolled copper foil, copper clad laminate, flexible printed circuit board, and electronic device |
| KR101721314B1 (en) * | 2015-05-21 | 2017-03-29 | 제이엑스금속주식회사 | Rolled copper foil, copper clad laminate, and flexible printed board and electronic device |
| CN111526674A (en) * | 2015-06-05 | 2020-08-11 | Jx日矿日石金属株式会社 | Rolled copper foil, copper-clad laminate, flexible printed board, and electronic device |
| JP6294376B2 (en) * | 2016-02-05 | 2018-03-14 | Ｊｘ金属株式会社 | Copper foil for flexible printed circuit board, copper-clad laminate using the same, flexible printed circuit board, and electronic device |
| CN107046768B (en) * | 2016-02-05 | 2019-12-31 | Ｊｘ金属株式会社 | Copper foil for flexible printed board, copper-clad laminate using same, flexible printed board, and electronic device |
| JP6781562B2 (en) * | 2016-03-28 | 2020-11-04 | Ｊｘ金属株式会社 | Copper foil for flexible printed circuit boards, copper-clad laminates using it, flexible printed circuit boards, and electronic devices |
| JP2019194360A (en) * | 2019-06-26 | 2019-11-07 | Ｊｘ金属株式会社 | Copper foil for flexible printed wiring board, and copper clad laminate, flexible printed wiring board and electronic device using the same |
| JP7186141B2 (en) * | 2019-07-10 | 2022-12-08 | Ｊｘ金属株式会社 | Copper foil for flexible printed circuit boards |
| KR20220068985A (en) * | 2019-09-27 | 2022-05-26 | 미쓰비시 마테리알 가부시키가이샤 | pure copper plate |
| US20230114969A1 (en) * | 2020-03-06 | 2023-04-13 | Mitsubishi Materials Corporation | Pure copper plate, copper/ceramic bonded body, and insulated circuit board |
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| JP2006063431A (en) * | 2004-08-30 | 2006-03-09 | Dowa Mining Co Ltd | Copper alloy and its production method |
| CN101346042A (en) * | 2007-07-11 | 2009-01-14 | 日立电线株式会社 | Rolled copper foil |
| JP2009185376A (en) * | 2008-01-08 | 2009-08-20 | Hitachi Cable Ltd | Rolled copper foil and manufacturing method therefor |
| JP2010150578A (en) * | 2008-12-24 | 2010-07-08 | Hitachi Cable Ltd | Rolled copper foil |
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| JPH01150748A (en) * | 1987-12-08 | 1989-06-13 | Rinnai Corp | Surplus heat discharging mechanism for heating device |
| JP2782790B2 (en) | 1989-06-07 | 1998-08-06 | 富士ゼロックス株式会社 | Image reading device |
| JP3009383B2 (en) * | 1998-03-31 | 2000-02-14 | 日鉱金属株式会社 | Rolled copper foil and method for producing the same |
| JP5261122B2 (en) * | 2008-10-03 | 2013-08-14 | Ｄｏｗａメタルテック株式会社 | Copper alloy sheet and manufacturing method thereof |
| JP2010150597A (en) | 2008-12-25 | 2010-07-08 | Hitachi Cable Ltd | Rolled copper foil |
| JP5094834B2 (en) * | 2009-12-28 | 2012-12-12 | Ｊｘ日鉱日石金属株式会社 | Copper foil manufacturing method, copper foil and copper clad laminate |
-
2011
- 2011-09-15 JP JP2011201838A patent/JP5752536B2/en active Active
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2012
- 2012-04-02 WO PCT/JP2012/058848 patent/WO2013027437A1/en active Application Filing
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- 2012-04-02 CN CN201280040973.7A patent/CN103748251B/en active Active
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Patent Citations (4)
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| JP2006063431A (en) * | 2004-08-30 | 2006-03-09 | Dowa Mining Co Ltd | Copper alloy and its production method |
| CN101346042A (en) * | 2007-07-11 | 2009-01-14 | 日立电线株式会社 | Rolled copper foil |
| JP2009185376A (en) * | 2008-01-08 | 2009-08-20 | Hitachi Cable Ltd | Rolled copper foil and manufacturing method therefor |
| JP2010150578A (en) * | 2008-12-24 | 2010-07-08 | Hitachi Cable Ltd | Rolled copper foil |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101632515B1 (en) | 2016-06-21 |
| JP5752536B2 (en) | 2015-07-22 |
| WO2013027437A1 (en) | 2013-02-28 |
| JP2013060651A (en) | 2013-04-04 |
| CN103748251A (en) | 2014-04-23 |
| TW201309818A (en) | 2013-03-01 |
| TWI453290B (en) | 2014-09-21 |
| KR20140037962A (en) | 2014-03-27 |
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