TW201242448A - Copper foil and copper-clad laminate obtained using same - Google Patents

Copper foil and copper-clad laminate obtained using same Download PDF

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Publication number
TW201242448A
TW201242448A TW101108599A TW101108599A TW201242448A TW 201242448 A TW201242448 A TW 201242448A TW 101108599 A TW101108599 A TW 101108599A TW 101108599 A TW101108599 A TW 101108599A TW 201242448 A TW201242448 A TW 201242448A
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Taiwan
Prior art keywords
copper
less
copper foil
work hardening
oil film
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TW101108599A
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Chinese (zh)
Inventor
Kaichiro Nakamuro
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Jx Nippon Mining & Metals Corp
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Publication of TW201242448A publication Critical patent/TW201242448A/en

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    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/10Alloys based on copper with silicon as the next major constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/02Alloys based on copper with tin as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/04Alloys based on copper with zinc as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/06Alloys based on copper with nickel or cobalt as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/02Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0355Metal foils

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Metal Rolling (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

The present invention provides both a copper foil which imparts excellent bendability when used in copper-clad laminates and a copper-clad laminate which is obtained using the copper foil. The copper foil has a thickness of 5-30 μ m, has an I(220)/I(200) of 0.11 or less after annealed at 350 C for 0.5 hours, and has a work hardening coefficient of 0.3-0.45 after annealed at 350 C for 0.5 hours.

Description

201242448 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種使用於例如可撓性印刷配線板 (FPC . Flexible Printed Circuit )中之銅箔、及將該銅箔積 層於樹脂層之至少單面之覆銅積層板。 【先前技術】 作為驅動數位相機或行動電話等電子機器之電路,使 用有可撓性印刷配線板(FPC : Flexible Printed Circuit)或 COF ( chip 0f flexible circuit)。該 FPC 或 COF 係使用於 樹脂層之單面或雙面積層有銅箔之覆銅積層板(CCL, copper- clad laminate),且於銅箔形成電路圖案而成。 並且’為使此種電子機器小型化及高功能化,採用有 將FPC摺疊收納至殼體内之狹小空間之方法。例如於用於 液晶顯示器周邊之COF之情形時,為使鑲框(所謂之「邊 框」)變細’而將COF之銅配線折回至液晶基板之内側。 然而,摺疊FPC或COF時,存在銅箔部分受到較大之 變形負載而易造成斷裂之問題。 因此’揭示有由含有柱狀之銅結晶粒子且2 5。匸之伸長 率為5%以上之電解銅箔構成Fpc,藉此獲得配線圖案不易 斷裂之FPC (專利文獻1)。 專利文獻1 .日本特開2007—335541號公報 【發明内容】 先前,認為CCL之銅箔之彎曲性與銅箔之伸長存在關 聯,因此如上述專利文獻丨中所記載般,使用伸長較大之 201242448 電解銅笛。 然而’本發明人等發現:即便使用伸長較大之壓延銅 猪’亦存在CCL之彎曲性並未提高之情形。 即’本發明係為解決上述課題研究而成者,其目的在 於提供一種用於覆銅積層板時彎曲性優異之銅箔及使用其 之覆銅積層板》 本發明人等經種種研討後,發現作為提高CCL之彎曲 性之因素’重要的並非銅箔之伸長而是加工硬化指數(η 值)0 為達成上述目的,本發明之銅箔為厚度5〜30/zm,以 350°C進行0.5小時退火後之I (22〇) (2〇〇)為〇 u以 下,且以35(TC進行0.5小時退火後之加工硬化指數為〇 3 以上0.45以下。 本發明之銅箔之半軟化溫度較佳為ΐ5〇β〇以下。 又,本發明之鋼落較佳為由無氧鋼或精銅構成,或 無氧銅或精銅令含有合計5〇〇質量ppm以下之由“及! 所構成之群中之1種以上。 1 本發明之銅落較佳為無氧銅或精銅中含有合計2〇 5〇〇 質量 PPm 之選自 Ag、Sn、In、Ti、ZnZr、Fep 如、81〜。、外、及乂之群中之1種以上的元素。 於使用在上述鋼箱之單面積層有樹脂層且合計厚声 5—以下、寬度為3職以上5_以下之試料,以上: 落之露出面為外側進行⑽度密合f曲時,至上& 裂之彎曲次數較佳為4次以上。 ’白1 4 201242448 較佳為最後冷壓延時之總加工度為85%以上,且將上 述最後冷壓延之最後3道次中之油膜當量設為以下條件壓 延而成。其中,將最後道次之前前道次的油膜當量設為 2 5 0 0 0以下’將最後道次之前道次的油膜當量設為3 〇 〇 〇 〇以 下’將最後道次之油膜當量設為3 5 0 0 0以下。此處,於熱 壓延鑄錠後,經由冷壓延製造銅箔時,於冷壓延中交替地 進行冷壓延及退火。並且’將最後退火後最後進行之冷壓 延設為「最後冷壓延」。 本發明之覆銅積層板係將上述銅箔積層於樹脂層之至 少單面而成。 根據本發明,可獲得用於覆銅積層板時彎曲性優異之 銅羯。 【實施方式】 以下,針對本發明之實施形態之銅羯進行說明。再者, 本發明中之%,只要未特別說明,則表示質量%。 本發明之實施形態之銅箔為厚度5〜3〇ym,以35〇它 進行0.5小時退火後之X射線繞射之()繞射波峰的積 分強度1(2〇〇)與1 ( 220 )繞射波峰的積分強度之比即! ⑵(〇川测為o.u以下,且以赋進行0 5 退火後之加工硬化指數為0.3以上〇 45以下。 . <加工硬化指數(η值)> 加工硬化指數(η值)係由以下式UH〇llomon式)近 似降伏點以上之塑性變形F e + if文形Q域之應力與應變之關係之 時的指數η表示。 201242448 [真應力]=[材料常數]χ [真應變]n (!) ,加工硬化指數愈大’愈難發生局部變形,變形時愈難 斷裂。又,加工硬化指數較高之材料拉延加工性優異,適 P於加壓加H於將銅荡積層於樹脂層之至少單面 而製造覆銅積層板,且評價該覆銅積層板之彎曲性之情形 ,、〜為加工硬化私數為〇 3以上之銅箔不易發生局部變 形’並且由彎曲部位整體承受變形,故銅落難以斷裂。然 而’加工硬化指數超過〇 45之材料退火後之強度較低且操 作性劣化’故不適宜用作覆銅積層板。 、處將以3 5 0 C進行〇. 5小時退火後之加工硬化指數 、 之理由,係因為製造覆銅積層板時之加熱條件為 孝S 产 0 闲 . ^ ’於覆鋼積層板之樹脂層為將樹脂組成物塗 :於鋼羯並硬化而得之情形(樹脂層及銅落之間未夾有接 考層之2居 增之情形)時,於上述加熱條件下進行樹脂 之硬化。 再者作為提昇銅箔之彎曲性之因素,認為重要的並 非銅箔之伸4 β , 长而疋加工硬化指數(η值)之理由如下。 ’加工硬化指數係表示材料之加工硬化行為的值 ^ 該值愈大’材料具有愈容易加工硬化之性質。此處, 若材料受岛丨 拉伸變形’將局部地發生收縮而斷裂,然而加 係數較大之材料,將發生收縮之部分加工硬化,收 縮部變得;^ u 约變形。因此,其以外之部分便代替了不易變 六 v °卩’開始發生變形。藉由重複該步驟,而使材料 整體均勻i士 _201242448 VI. Description of the Invention: [Technical Field] The present invention relates to a copper foil used in, for example, a flexible printed wiring board (FPC), and at least laminated the copper foil to a resin layer Single-sided copper clad laminate. [Prior Art] As a circuit for driving an electronic device such as a digital camera or a mobile phone, a flexible printed wiring board (FPC: Flexible Printed Circuit) or a COF (chip 0f flexible circuit) is used. The FPC or COF is used for a copper-clad laminate of a single-sided or double-sided layer of a resin layer, and a circuit pattern is formed on the copper foil. Further, in order to reduce the size and function of such an electronic device, a method of folding and storing the FPC into a narrow space in the casing is employed. For example, in the case of COF used in the periphery of a liquid crystal display, the copper wiring of the COF is folded back to the inner side of the liquid crystal substrate in order to make the bezel (so-called "edge") thin. However, when the FPC or the COF is folded, there is a problem that the copper foil portion is subjected to a large deformation load and is liable to cause cracking. Therefore, it is revealed that there are columnar copper crystal particles and 25. The electrodeposited copper foil having an elongation ratio of 5% or more constitutes Fpc, thereby obtaining an FPC in which the wiring pattern is less likely to be broken (Patent Document 1). [Patent Document 1] Japanese Laid-Open Patent Publication No. 2007-335541. SUMMARY OF THE INVENTION In the prior art, it is considered that the flexibility of the copper foil of CCL is related to the elongation of the copper foil. Therefore, as described in the above-mentioned patent document, the elongation is large. 201242448 Electrolytic copper flute. However, the inventors of the present invention have found that the bending property of CCL is not improved even if a rolled copper pig having a large elongation is used. In other words, the present invention has been made to solve the problems described above, and an object of the present invention is to provide a copper foil which is excellent in flexibility when used for a copper-clad laminate, and a copper-clad laminate using the same. It is found that as a factor for improving the bendability of CCL, it is not the elongation of the copper foil but the work hardening index (η value). To achieve the above object, the copper foil of the present invention has a thickness of 5 to 30/zm and is carried out at 350 °C. After 0.5 hours of annealing, I (22 〇) (2 〇〇) is 〇u or less, and the work hardening index after annealing for 0.5 hours at TC is 〇3 or more and 0.45 or less. The semi-softening temperature of the copper foil of the present invention. Preferably, it is ΐ5〇β〇 or less. Further, the steel slab of the present invention is preferably composed of oxygen-free steel or refined copper, or oxygen-free copper or refined copper, which contains a total of 5 〇〇 mass ppm or less. One or more of the constituent groups. 1 The copper drop of the present invention is preferably selected from the group consisting of Ag, Sn, In, Ti, ZnZr, and Fep as a total of 2〇5〇〇 mass PPm in the oxygen-free copper or the refined copper. One or more elements in the group of 81~., outside, and 乂. Used in the above steel box When the area layer has a resin layer and the total thickness is 5 - or less, and the width is 3 or more and 5 or less, the above: When the exposed surface is the outer side (10) degree close to the f-curve, the upper and lower cracks are preferably better. It is 4 or more times. 'White 1 4 201242448 It is preferable that the total processing degree of the final cold pressing delay is 85% or more, and the oil film equivalent of the last 3 passes of the above final cold rolling is set as follows. , the oil film equivalent of the previous pass before the last pass is set to 2500 or less 'Set the oil film equivalent of the pass before the last pass to 3 〇〇〇〇 or less'. Set the last equivalent of the film equivalent to 3 5% or less. Here, after the hot rolled ingot is cast, the copper foil is produced by cold rolling, and cold rolling and annealing are alternately performed in the cold rolling, and the cold rolling is performed after the final annealing. In the copper-clad laminate of the present invention, the copper foil is laminated on at least one side of the resin layer. According to the present invention, it is possible to obtain a copper ruthenium which is excellent in flexibility when used for a copper-clad laminate. Embodiments Hereinafter, the present invention is directed to the present invention. In addition, the % of the present invention is a mass % unless otherwise specified. The copper foil of the embodiment of the present invention has a thickness of 5 to 3 〇 ym and is 35 〇 for 0.5 hour. The ratio of the integrated intensity of the diffracted peak of the X-ray diffraction after annealing (1〇〇2〇〇) to the integrated intensity of the diffraction peak of 1 (220) is (2) (〇川为为 below ou, and the assignment is performed 0 5 The work hardening index after annealing is 0.3 or more and 45 or less. · <Work hardening index (η value)> The work hardening index (η value) is a plastic deformation above the point of the drop point by the following formula UH〇llomon The exponent η of the relationship between the stress and strain of the F e + if morph Q domain. 201242448 [True stress] = [material constant] χ [true strain] n (!), the greater the work hardening index, the more difficult it is to deform locally, and the more difficult it is to break during deformation. Further, the material having a high work hardening index is excellent in drawing workability, and is suitable for producing a copper clad laminate by pressurizing and adding a layer of copper to at least one side of the resin layer, and evaluating the bending of the copper clad laminate. In the case of sex, the copper foil which is a work hardening number of 〇3 or more is less likely to undergo local deformation and is deformed by the entire curved portion, so that the copper drop is difficult to break. However, the material having a work hardening index exceeding 〇 45 has a low strength after annealing and is inferior in workability, so it is not suitable for use as a copper clad laminate. The work hardening index of 5 5 0 C. The reason of the work hardening index after 5 hours of annealing is because the heating condition for the production of copper clad laminate is Xiao S. 0 production. ^ 'Resin in the laminated steel sheet In the case where the resin composition is coated on a steel crucible and hardened (in the case where the resin layer and the copper drop do not sandwich the second test layer), the resin is cured under the above heating conditions. Further, as a factor for improving the bendability of the copper foil, it is considered that the reason why the copper foil is not stretched by 4 β and the work hardening index (η value) is as follows is as follows. The work hardening index indicates the value of the work hardening behavior of the material. ^ The larger the value, the more the material has the property of work hardening. Here, if the material is locally deformed by the tensile deformation of the island 断裂, the material having a large coefficient is subjected to work hardening, and the shrinkage portion becomes; Therefore, the other part is replaced by the non-variable six v °卩' starting to deform. By repeating this step, the material is evenly uniformed _

It形。另一方面,伸長係在不考慮此種狀況之 6 201242448 下宏觀地被採用之指標,故即便伸長較大者亦未必加工硬 化指數較大。 先前,作為此種材料整體均勻變形之容易程度的指 標,例如於具有厚度之材料的拉伸加工令,使用加工硬化 指數’然而如㈣般較薄之材料不會進行拉伸加工等加 工,故迄今尚未有將加工硬化指數作為指標1此,本發 明中,考慮若使鋼落之加工硬化指數增大,則即便於⑽ 之180度密合弯曲中,蠻油邱敕躺+ T 4曲邛整體亦會因均勻地變形而不 發生斷裂地彎曲。 亦騎G·5何退火後之^硬化指數 為二声二以上°·45以下。其原因在於’製造使用膜作 广層且膜與銅I經由接著層而積層之3層 2度為爾左右。加工硬化指數由於㈣ 結晶而增大,因此若較350t低溫 叙生再 -皿I 2 υ υ c之加工硬化相叙 為0.3以上,則於35〇t亦 又,為了於上述退火中充分地二:二曰之加工硬化指數。 私儿、 r兄刀地獲侍再結晶組織,銅荡之车 軟化溫度較佳為1 5 0。(:以下。 半 (厚度) 伸加:t ’於具有如結構構件般之厚度之材料的拉 :,例如使用材料整體均句變形之容 即加工硬化指數Mb 加工箄如工 ]冶般車乂薄之材料不會進行拉伸 因太故迄今尚未有將加工硬化指數作為指標Z 因此’本發明之屋延銅箱之厚度規定為5〜 又,於鋼箔的厚度比5〜30 m。 以111溥之情形時,因為朝向 201242448 材料表面之晶粒的比例變多,故由於變形而被導入之差排 不會累積於晶界,自材料表面被釋放的比例變高。因此, 銅泊之加工硬化指數變得比相對較厚的材料要低。另一方 面,加工硬化指數係根據因變形而被導入材料中之差排的 置與差排之移動容易度來決定。也就是說,若存在如成為 差排環之產生來源的析出物、或阻礙差排之移動的固溶元 素及晶界,則加工硬化指數變大◎然而,若添加會嚴重影 響差排移動之程度的固溶元素、或會生成析出物之程度的 。金兀素’則會導致導電率下降,因此,作為可撓性配線 板用銅箔為不佳。 (組成) 本發月之銅、名較佳為以JIS — H3丨〇〇之合金編號cU⑽ 所規定之精銅或以JIS_H3100之合金編號^〇2〇所規定之 "、氧銅作為組成。若没為與上述純銅相近之組成,則銅箔 之導電率不會下降,適於FPC或c〇F。壓延銅落中含有之 氧濃度,於精銅之情形時為G.G1〜G G5 f量%,於無氧銅之 情形時為0.001質量%以下。 又無氧銅亦可使用Jis — H3510之合金編號cl〇1!所 規定之無氧銅。 進步亦可έ有合§十500質量ppm以下之選自Ag 及Sn之群中的!種以上。若於麼延銅箔令添加^或h則 會阻礙差排移動,故加工硬化係數變大。若壓延銅箔中之 的合計添加量超過5〇〇質量ppm,則導電率降低且 〇日日度上升而有於最後退火時變得難以抑制銅箔之 201242448 。再者,雖 但通常為 然Ag與 2G質量 表面氧化且難以進行再結晶退火之情形It shape. On the other hand, the elongation is a macroscopically used index without considering this condition. 201242448, even if the elongation is larger, the processing hardening index is not necessarily large. Previously, as an index of the ease of uniform deformation of such a material as a whole, for example, a stretch processing order of a material having a thickness, a work hardening index is used. However, a material thinner than (4) is not subjected to drawing processing or the like. In the present invention, it has been considered that the work hardening index is used as an index. The whole is also bent by uniform deformation without breaking. Also, the hardness index of the G·5 after annealing is two or more and less than 45. The reason for this is that the film is formed into a wide layer, and the film and the copper I are laminated on the third layer by the second layer. The work hardening index increases due to (4) crystallization. Therefore, if the work hardening phase of the 350 t low temperature re-distribution I 2 υ υ c is 0.3 or more, then at 35 〇t, in order to fully align the above annealing. : The work hardening index of the second. Private children, r brothers are re-crystallized, the softening temperature of the copper car is preferably 1 50. (: the following. Half (thickness) Stretching: t 'In the drawing of a material having a thickness like a structural member: for example, the material is deformed by the whole sentence, that is, the work hardening index Mb is processed. The thin material does not stretch. Therefore, the work hardening index has not been used as the index Z. Therefore, the thickness of the copper box of the present invention is defined as 5~, and the thickness ratio of the steel foil is 5 to 30 m. In the case of 111 ,, since the proportion of the crystal grains toward the surface of the material of 201242448 becomes large, the difference introduced by the deformation does not accumulate at the grain boundary, and the proportion released from the surface of the material becomes high. Therefore, the copper berth The work hardening index becomes lower than that of a relatively thick material. On the other hand, the work hardening index is determined by the ease of movement of the difference between the set and the difference introduced into the material due to deformation. When there is a precipitate which is a source of the difference ring or a solid solution element and a grain boundary which hinder the movement of the difference row, the work hardening index becomes large. However, if a solid solution element which seriously affects the degree of the displacement movement is added, In the case of a precipitate, the amount of precipitates may be reduced. Therefore, the copper foil for the flexible wiring board is not preferable. (Composition) The copper of the month is preferably JIS-H3. The fine copper specified by the alloy number cU(10) or the alloy of the JIS_H3100 alloy number ^〇2〇, oxy copper as the composition. If it is not similar to the above pure copper, the conductivity of the copper foil is not It is lowered and is suitable for FPC or c〇F. The oxygen concentration contained in the rolled copper is G.G1 to G G5 f in the case of refined copper, and 0.001% by mass or less in the case of oxygen-free copper. Further, the oxygen-free copper may be an oxygen-free copper as defined by the alloy number cl〇1 of Jis-H3510. The progress may be ≥10,500 ppm by mass or less selected from the group consisting of Ag and Sn. If the copper foil is added, the addition of ^ or h will hinder the movement of the difference, so the work hardening coefficient becomes large. If the total addition amount in the rolled copper foil exceeds 5 〇〇 mass ppm, the electrical conductivity decreases and the next day The degree rises and it becomes difficult to suppress the copper foil of 201242448 at the time of final annealing. Generally difficult situation recrystallization annealing of Ag is then oxidized and the surface quality of the 2G

Sn之合計添加量的下限並無特別規定, ppm以上。 又’上述精鋼或上述無氧銅中,亦可含有合 質ϊ ppm之選自A n、& ςί τ ^ Ζη、Zr、Fe、Ρ、Ni、 呂”^卜⑽…群中的一種以上的元素。 將以3耽進行Q.5小時退火後之㈣的加工硬化 控制在0.3以上之方法,可舉出將最後冷壓延時之總加二 設為85%以上,且進-步調整最後冷壓延之最後3道^ 之油膜當量。具體而言,將最後冷壓延之最後道次之前前 道次的油膜當量設為25〇〇〇以下,將最後道次之前1道次 的油膜當量設為3GGGG以下,將最後道次的油膜當量 3 5 000以下。 再者,若材料厚度變薄則有油膜當量增大之傾向,故 最後3道次之油膜當量之值逐漸增大。因此,針對各個厚 度不同之最後3道次,必須設定適當之油膜當量。 於最後冷壓延中’若使壓延油黏度及材料降伏應力於 所有道次中為相等,則油膜當量係與(壓延速度)咬 入角)成比例。於加工度相同之情形時,若材料厚度變薄 則咬入角變小’故存在愈接近最後道次則油膜當量變得愈 大之傾向。又,為確保生產性,愈接近材料長度較長之最 後道次愈需要提高壓延速度,因此亦存在愈接近最後道次 則油膜當量變得愈大之傾向。 而且’若最後冷壓延之中間道次中的油膜當量較大, 201242448 則即便於最後道次將油臈當量抑制為較低仍然無法得到使 加工硬化指數為〇.3以上之效果。根據此種事由,而對最後 冷壓延之最後3道次中之油膜當量進行管理。 為降低油膜當量,使最後道次之壓延加工度為25%以 上即可。 再者’上述油膜當量以下式表示。 (油膜當量)(壓延油黏度、40t之動黏度;cSt) X (壓延速度;m/分)(材料之降伏應力;kg/_2: X (輥咬入角;rad ) } 可將壓延油黏度設為4.0〜8.0cSt左右,將壓延速度設 為200〜600m/分,輥之咬入角設為例如〇〇〇〇5〜 0.005rad ’ 較佳為 0.001〜〇 〇4ra(J。 <1 ( 220 ) / 1 ( 2〇〇) > 於本發明之銅落中,將】(220 ) (2〇〇)設為〇 η 以下。雖然純銅型之再結晶集合組織之特徵在於(2〇〇).面 朝向銅落表面方向’但此時(2〇〇)面亦朝向壓延平行方向 及壓延直角方向。X…般於弯曲銅羯之情形時,於壓延 平=方向或壓延直角方向取料曲轴,此時,目為施加於 銅泊=變形’銅之主滑動面即{111}面產生多重滑動, =較南之加工硬化指數。另―方面,若(_)面以外的& =方位Μ數’則無法產生充分的多重滑動,$法得到較 inn工硬化相數。根據以上理由,具有相對於彎曲軸為 1}方位之結晶愈多,則愈成為彎曲性優異之銅_。 此處’因為純銅型之再結晶集合組織之{〇〇1}方 10 201242448 ND方向(壓延面法線 ^ ^ ; KD方向'丁〇方向之各個方 向,故可使用测定容易之ND方 ^ ., 门之(2〇〇)面繞射強度作 為指標來代替弯曲方向之RD或丁D方向。 =將本發明之銅笛之與相當於ccl形成時之熱處 理相备的處理(於350t退火〇.5小時)後之“⑽广 (200 )設為ο.η以下。作為退火環境,為了防止表面氧化, 較佳為非氧化性環境。 又,由於根據以下理由而必須藉由退火來充分地得到 再結晶組織,因此較佳為將㈣之半軟化溫度設為15代以 下。為了充分地得到再結晶組織,必須調整銅落之組成及 加工度並適當地控制再結晶溫度,但若將銅落之組成與加 。工度規定於上述範圍内,則可使再結晶溫度成& i2〇〜i5〇 C左右’半軟化溫度成為15 0°C以下。 此處,因為未再結晶組織殘留有加工應變,且已加工 =化,故難以進行f曲變形所導致之加工硬化,加工硬化 才曰數變小,且彎曲性變差。將加工硬化指數設為較大的值 時’鋼積層》CCL後之狀態必須為未加卫硬化之狀態, P為加工應纟文已被去除之狀態。換而言之,雖然銅箔於CCL 製造過程中受到熱處理,但因為該熱處理而應變被去除, 隻仔必須進仃再結晶。而且,若銅箔之半軟化溫度為i 5〇 °C以下,則即便藉由於CCL製造過程中所受程度的熱處 理亦可期待銅杂之再結晶,且可使加工硬化指數變大。 進一步,使用於本發明之實施形態之銅箔之單面積層 有樹脂層,且合計厚度為50μπι以下、寬度為3mm以上5mm 201242448 以下之試料’並以銅箔之露出面兔冰 田曲為外側而進行180度密合 彎曲時,至銅箔斷裂之彎曲次數較 *銅㈣面積層有物=:::為上;。… 下之試料係模擬覆銅積層板者,丨18〇度密合贊曲之彎曲 次數用於對覆銅積層板之彎曲性進行評價。 樹脂層可使用聚醯亞胺;聚對苯二甲酸乙二酯 (polyethylene terephthalate,PET);環氧樹脂、酚醛樹脂 等熱硬化性樹脂;及飽和聚酿樹脂等之熱塑性樹脂,但並 不限定於該等。又,亦可將溶劑中溶解有該等樹脂層成分 而成之清漆(例如聚醯亞胺之前驅物即聚醯胺酸溶夜)塗 佈於銅络之單面並加熱,藉此除去溶劑而使得反應(例如 醯亞胺化反應)進行並使其硬化。 1 80度密合彎曲係以折痕平行於自身之寬度方向之方 式折回試料,且以手壓機反覆壓扁而進行。並且,以光學 顯微鏡觀察彎曲部之剖面之銅箔部分有無斷裂。若無斷 裂’則打開密合彎曲後之試料,且使用手壓機使其伸展為 平坦之後,於同一部位再次折回並以手壓機壓扁。如此, 求出至銅箔斷裂之弯曲次數。 本發明之覆銅積層板係將上述之銅羯積層於上述樹脂 層之至少單面而成。因為本發明之實施形態之銅箔其彎曲 性優異’故採用其之覆銅積層板其彎曲性亦優異。例如, 本發明之覆銅積層板可適宜地使用於以半徑5mm以下彎折 9〇〜180度之用途。 實施例 12 201242448 熔解無氧銅(JISH0500 )或精銅(jish〇5〇〇) >------- 一 / 茜要添加纟2所示之元素而進行禱造,從❼製作厚度 2〇mm、寬度6。_之鑄錢。將鑄旋熱壓延至厚纟1()麵後, 適當地重複冷壓延及退火而製作銅落。為了調整軟化溫 度’將最後冷壓延時之總加工度設為85%以上,且為了降 低表面粗糙度,使用表面平滑(於報轴方向Ra^.^m) 之輥進行最後冷壓延,而製造銅羯。於將壓延油黏度設為 S.OcSt左右、壓延速度2〇〇〜6〇〇m/分、輥之咬入角 0.003〜0.03rad之範圍内進行調整,使最後冷壓延之最後3 道次中之任-油膜當量均& 35〇〇〇卩了(最後道次之前前 道次的油膜當量為25000以下,最後道次之前i道次的油 膜备里為30000以下,最後道次之油膜當量為35〇〇〇以下)。 <加工硬化指數> 將所獲得之鋼箔分別以2〇(rCx〇.5小時及35〇<t χ〇 5小 時進行退火後,進行拉伸試驗(依照JIS_Z2241 ),求出 加工硬化指數。再者’由於必須使用材料經降伏後之均句 伸長及應力來求出加工硬化指數,故使用自伸長2%至最大 應力點之值。而且,以最小平方法近似根據所測定之伸長 及應力求出之真應變與真應力的雙對數曲線,根據曲線之 斜率而求出加工硬化指數。真應變與真應力藉由以下式子 求出。 [真應變]=In ( 1 + [應變]) [真應力卜(1+[真應變])χ[應力] 再者,於該拉伸試驗中求出斷裂伸長。因此,表1、表 13 201242448 2之斷裂伸長係以350°C χ〇.5小時進行退火後之值。 <半軟化溫度> 將所獲得之銅箔分別以1〇〇〜4〇〇°c χθ.5小時於非氧化 性環境中退火後進行拉伸試驗,求出對應於熱處理條件之 強度(拉伸強度)。將退火後之強度成為壓延上升(退火 則)之強度與已完全軟化(於3〇〇〇c退火3〇分鐘)之狀態 的強度之中間值的退火溫度設為半軟化溫度。 <覆銅積層板之彎折次數> 其次,於所獲得之銅箔之單面,以澆鑄法將厚度約2〇 以01之聚醢亞胺層製膜,而製作單面CCL .具體而言,對 所獲得之銅箔之單面進行化學處理(鍍敷),且於該面以 厚度成為20 a m之方式塗佈聚醯亞胺樹脂之前驅物清漆(宇 部興產製U-清漆A)。其後,於設定為130。。之熱風循環 式尚溫槽中乾燥3〇分鐘,且經2〇〇〇秒階段性地升溫至Μ。 艺使其硬化(醯亞胺化)而形成樹脂層(聚醯亞胺層), 從而製作單面CCL。 180度密合彎曲係按照以下順序進行4先,將該單面 CCL以寬度3.2mm,長度3〇mm且使試驗片之長度方向與 壓延方向平行之方式切出而作為試驗片,以樹脂層面為内 側並使其呈環狀,且以手壓機壓扁而進行18〇度密合彎曲。 然後,藉由光學顯微鏡觀察弯曲部之剖面之銅荡部分有無 斷裂。若無斷裂’則打開密合彎曲後之試料,錢手壓機 使其伸展為平坦之後’於同一部位再次折回並以手壓機壓 扁。如此,求出至銅箔斷裂之彎曲次數。 14 201242448 <鋼箔之滑動彎曲次數> 其次,將所獲得之鋼箔 使試驗片$ 士 白乂寬度U.Tmm、長度200mm且 1文4敏片之長度方向血 ^ u B 。彳、土延方向平行之方式切出而作為試 驗片,且以20(TCi隹;^ ,Λ、 ! ^ . ^ TD ^ 丁 〇 /刀鐘加熱而使其再結晶。藉由圖 斤不之ipc (美國印刷雷故丁 14力a D . 業協會,The Institute ofThe lower limit of the total amount of addition of Sn is not particularly limited, and is not more than ppm. Further, the above-mentioned steel or the above-mentioned oxygen-free copper may further contain one or more selected from the group consisting of A n, & ςί τ ^ Ζη, Zr, Fe, Ρ, Ni, and ” ^ (10). The method of controlling the work hardening of (4) after Q. 5 hours annealing at 3 耽 is 0.3 or more, and the total plus 2 of the final cold pressing delay is set to 85% or more, and the final adjustment is performed. The oil film equivalent of the last three passes of the cold rolling. Specifically, the oil film equivalent of the previous pass before the last pass of the final cold rolling is set to 25 〇〇〇 or less, and the oil film equivalent of one pass before the last pass is set. When it is 3 GGGG or less, the oil film equivalent of the last pass is 35,000 or less. Further, if the thickness of the material is thin, the oil film equivalent tends to increase, so the value of the oil film equivalent of the last three passes gradually increases. For the last 3 passes of different thicknesses, the appropriate oil film equivalent must be set. In the final cold rolling, 'If the rolling oil viscosity and material lodging stress are equal in all passes, the oil film equivalent system and (calendering speed) bite into The angle is proportional. The same degree of processing When the thickness of the material becomes thinner, the bite angle becomes smaller. Therefore, the closer to the last pass, the greater the oil film equivalent becomes. Further, in order to ensure productivity, the closer to the last length of the material, the more it is needed. Increasing the calendering speed, so there is a tendency that the oil film equivalent becomes larger as it approaches the last pass. And 'If the oil film equivalent in the middle pass of the final cold rolling is large, 201242448 will even be the equivalent of the last pass. If the inhibition is low, the effect of the work hardening index of 〇.3 or higher cannot be obtained. According to this reason, the oil film equivalent of the last 3 passes of the final cold rolling is managed. To reduce the oil film equivalent, the last pass is made. The degree of calendering can be 25% or more. Further, the above oil film equivalent is expressed by the following formula: (oil film equivalent) (calendering oil viscosity, dynamic viscosity of 40t; cSt) X (calendering speed; m/min) (fall of material) Stress; kg / _2: X (roll bite angle; rad ) } The rolling oil viscosity can be set to about 4.0 to 8.0 cSt, the rolling speed can be set to 200 to 600 m / min, and the bite angle of the roll is set to, for example, 〇〇 〇〇5~ 0.005rad Preferably, it is 0.001 to 〇〇4ra (J. <1 (220) / 1 (2〇〇) > In the copper drop of the present invention, (220) (2〇〇) is set to 〇η or less. Although the pure copper type recrystallized aggregate structure is characterized by (2 〇〇). The surface faces the copper falling surface direction 'but the (2 〇〇) plane is also oriented toward the rolling parallel direction and the rolling right angle direction. X...like curved gong In the case of the rolling, the crankshaft is taken in the direction of the flattening direction or the right angle of the rolling. At this time, the main sliding surface of the copper/deformation copper is generated, that is, the {111} plane produces multiple slips, and the work hardening index is southerly. . On the other hand, if the & = azimuth turns outside the (_) plane does not produce sufficient multiple slip, the $ method obtains a harder phase than the inn. For the above reasons, the more crystals having an orientation of 1} with respect to the bending axis, the more excellent the copperness is. Here, 'because of the pure copper type recrystallized aggregate structure {〇〇1} side 10 201242448 ND direction (the calendering surface normal ^ ^ ; KD direction 'the direction of the Ding direction, so you can use the ND side that is easy to measure ^. The diffraction intensity of the door (2〇〇) surface is used as an index instead of the RD or D direction of the bending direction. = The treatment of the copper flute of the present invention and the heat treatment corresponding to the formation of ccl (annealing at 350t) After (5), the "(10) wide (200) is ο. η or less. In the annealing environment, in order to prevent surface oxidation, a non-oxidizing environment is preferable. Further, it is necessary to sufficiently anneal for the following reasons. Since the recrystallized structure is obtained, it is preferable to set the semi-softening temperature of (4) to 15 or less. In order to sufficiently obtain the recrystallized structure, it is necessary to adjust the composition and workability of the copper drop and appropriately control the recrystallization temperature, but if copper is used, When the composition is within the above range, the recrystallization temperature can be set to & i2〇~i5〇C, and the semi-softening temperature is below 150 °C. Here, since there is no recrystallized structure remaining. Processed strain and processed = It is difficult to carry out the work hardening caused by the f-bend deformation, the number of work hardening becomes small, and the bendability is deteriorated. When the work hardening index is set to a large value, the state after the 'steel build-up' CCL must be In the state where the hardening is not applied, P is the state in which the processing should have been removed. In other words, although the copper foil is subjected to heat treatment in the CCL manufacturing process, the strain is removed due to the heat treatment, and only the Further, when the half softening temperature of the copper foil is i 5 〇 ° C or less, the recrystallization of the copper impurities can be expected even by the heat treatment to the extent of the CCL production process, and the work hardening index can be made large. Further, the single-layer layer of the copper foil used in the embodiment of the present invention has a resin layer and a total thickness of 50 μm or less and a width of 3 mm or more and 5 mm of 201242448 or less, and the outer surface of the copper foil is the outer side of the rabbit ice field. When the 180 degree tight bend is performed, the number of bends to the copper foil break is better than that of the *copper (four) area layer =::: is upper;.... The sample under test is a simulated copper clad laminate, which is 18 degrees tightly bonded. Number of bends The bending property of the copper-clad laminate is evaluated. The resin layer may be a polyimide, a polyethylene terephthalate (PET), a thermosetting resin such as an epoxy resin or a phenol resin, and a saturated resin. a thermoplastic resin such as a polystyrene resin, but is not limited thereto. Further, a varnish in which the resin layer components are dissolved in a solvent (for example, a polyamidamine precursor, that is, a polyamidite solution, may be used. Applying to one side of the copper network and heating, thereby removing the solvent to cause the reaction (for example, hydrazine imidization reaction) to proceed and harden it. 1 80 degree close-fitting bending system with the crease parallel to the width direction of itself The sample is folded back and the sample is pressed and flattened by a hand press. Further, the copper foil portion of the cross section of the bent portion was observed by an optical microscope for the presence or absence of breakage. If there is no breakage, the sample after the close bending is opened, and after being stretched flat by using a hand press, it is folded back again at the same portion and crushed by a hand press. Thus, the number of times of bending to the copper foil fracture was obtained. In the copper clad laminate of the present invention, the copper layer is deposited on at least one side of the resin layer. Since the copper foil according to the embodiment of the present invention is excellent in flexibility, the copper-clad laminate using the same is excellent in flexibility. For example, the copper clad laminate of the present invention can be suitably used for the purpose of bending 9 to 180 degrees with a radius of 5 mm or less. Example 12 201242448 Melting oxygen-free copper (JISH0500) or fine copper (jish〇5〇〇) >------- A / 茜 To add the element shown in 纟 2, pray, make thickness from ❼ 2〇mm, width 6. _ cast money. After the cast spinning is hot-rolled to a thickness of 1 (), the cold rolling and annealing are appropriately repeated to prepare a copper drop. In order to adjust the softening temperature, the total degree of processing of the final cold pressing delay is set to 85% or more, and in order to reduce the surface roughness, the final cold rolling is performed using a roll having a smooth surface (in the direction of the shaft axis Ra^.^m). Causeway. Adjusting the calendering oil viscosity to about S.OcSt, rolling speed 2〇〇~6〇〇m/min, and the bite angle of the roll 0.003~0.03rad, so that the last 3 passes of the final cold rolling The equivalent of the oil film equivalent & 35 〇〇〇卩 (the oil film equivalent of the previous pass before the last pass is 25000 or less, before the last pass, the i-time oil film preparation is less than 30,000, the last pass of the oil film equivalent It is 35 〇〇〇 or less). <Process Hardening Index> The obtained steel foil was annealed at 2 Torr (rCx 〇.5 hours and 35 〇<t χ〇5 hours, respectively, and subjected to a tensile test (in accordance with JIS_Z2241) to obtain work hardening. Index. In addition, the value of self-elongation from 2% to the maximum stress point is used because the work hardening index must be obtained by using the mean elongation and stress of the material after the fall. Moreover, the minimum flat method is used to approximate the measured elongation. And the double logarithmic curve of the true strain and the true stress obtained by the stress, and the work hardening index is obtained according to the slope of the curve. The true strain and the true stress are obtained by the following formula [true strain] = In ( 1 + [strain] ]) [Real stress (1+[true strain])χ[stress] Furthermore, the elongation at break is obtained in this tensile test. Therefore, the elongation at break of Table 1, Table 13 201242448 2 is 350 °C. 〇. Value after annealing for 5 hours. <Semi-softening temperature> The obtained copper foil was annealed in a non-oxidizing atmosphere at a temperature of 1 〇〇 to 4 〇〇 ° c χ θ. 5 hours, respectively, and subjected to a tensile test. Find the strength (tensile strength) corresponding to the heat treatment conditions. After annealing The annealing temperature at which the strength becomes the intermediate value of the strength of the rolling rise (annealing) and the state of the state which has been completely softened (annealed at 3 ° C for 3 minutes) is set to a semi-softening temperature. <Bending of a copper clad laminate Folding times> Next, a single-sided CCL is formed by casting a film of a polyimine layer having a thickness of about 2 Å on one side of the obtained copper foil. Specifically, the obtained copper is obtained. One side of the foil was chemically treated (plated), and the polyimide varnish (U-varnish A) was coated on the surface with a thickness of 20 am. The hot air circulation type is dried in a hot air tank for 3 minutes, and is heated to the crucible step by step in 2 seconds. The resin is hardened (醯iminated) to form a resin layer (polyimine) Layer), thereby producing a single-sided CCL. The 180-degree close-bend bending system is carried out in the following order, and the single-sided CCL is cut in such a manner that the width of the single-sided CCL is 3.2 mm, the length is 3 mm, and the longitudinal direction of the test piece is parallel to the rolling direction. As a test piece, the resin layer is inside and is made into a ring shape, and The machine is flattened and subjected to 18-degree tight bending. Then, the optical slanting portion of the curved portion of the curved portion is observed by an optical microscope. If there is no fracture, the sample after the tight bending is opened, and the hand press is stretched. After being flat, it is folded back again at the same portion and flattened by a hand press. Thus, the number of times of bending to the copper foil break is obtained. 14 201242448 <Number of sliding bending of steel foil> Next, the obtained steel foil is made The test piece $Shibai 乂 width U.Tmm, length 200mm and the length of the 1 Wen 4 sensitive piece of blood ^ u B. 彳, soil extension direction parallel to cut out as a test piece, and to 20 (TCi 隹; ^ , Λ, ! ^ . ^ TD ^ Ding 〇 / knife clock heated to recrystallize. By the figure I don't have ipc (US printed mines, 14 forces a D. Industry Association, The Institute of

Pnnted Circuits )滑動彎 蒗置對其進仃IPC滑動彎曲次數 之測足。該裝置係將振動傳 ^ 寻遴構件3結合於振盪驅動體4 之構ia ’且試驗片1於薪通张_ —丄田 ' 斤不之螺釘2之部分與3之前 端部之共計4點處固定於#胃 、 *疋方、裝置。右振動部3上下驅動,則 试驗片1之中間部以特定 ώ 給…心 +徑Γ彎曲為髮夾狀。本試 驗中,求出按照以下條件重複彎 设考曲時之至斷裂的次數。 於曲率半徑r·· 2.5mm、振動行裎.” m切仃矛王.25mm、 1500次/分之條件下進行試驗。立 度 x、T 貫施例17係將曲率 半徑r設為〇.9mn^此係為了使彎曲# 文 < 典時施加於銅箔之應變量 與比貫施例17厚之其他實施例相同。 < I ( 220 ) /1 ( 2〇〇 ) > 將所獲得之銅箔以35〇»c 〇 5 7|主 > 」小時於非氧化性環境中 退火後,進行壓延面之x射線繞射, , 、 刀别求出(220)面及 (200 )面之繞射峰值強度之積分值(1)。 將所獲得之結果示於表丨、表2。 丹者,於表1、表2 之組成中,0FC及TPC分別表干Pnnted Circuits) The sliding bend is used to measure the number of IPC sliding bends. The device combines the vibration transmitting and oscillating member 3 with the oscillating driving body 4 and the test piece 1 is a total of 4 points of the portion of the screw 2 and the front end of the 3 It is fixed at #胃, *疋方,装置. When the right vibrating portion 3 is driven up and down, the intermediate portion of the test piece 1 is bent in a hairpin shape by a specific ώ. In this test, the number of breaks to the time when the test is repeated is repeated according to the following conditions. The test was carried out under the conditions of radius of curvature r··2.5mm, vibrating line ”.” m cut 仃 spear king. 25mm, 1500 times/min. The degree of x, T, and the 17th method set the radius of curvature r to 〇. 9mn^ This is the same as the other embodiments in which the bending applied to the copper foil is the same as the other embodiments thicker than the embodiment 17. < I ( 220 ) /1 ( 2〇〇) > The obtained copper foil is annealed in a non-oxidizing environment after 35 〇»c 〇5 7|main> hrs, and then x-ray diffraction of the calendering surface is performed, and the (220) plane and (200) are obtained by the knife. The integral value of the diffraction peak intensity of the surface (1). The results obtained are shown in Tables and Table 2. Dan, in the composition of Table 1, Table 2, 0FC and TPC respectively

不無氧鋼及精銅(JIS H3100)’Ag l〇0ppm TPC 係表示於精 1月甲添加1〇〇質量ppm 之Ag者。 再者,JIS H3100所規定之無氧鋼 利⑴興JIS H0500所規定 15 201242448 之無氧銅皆一樣為合金編號C1020。又,JIS H3100所規定 之精銅與 JIS H0500所規定之精銅皆一樣為合金編號 C1 100。 16 201242448 Ιτ^τNon-oxygen-free steel and refined copper (JIS H3100) 'Ag l〇0ppm TPC system is expressed as 1% by mass of Ag added to the fine January. Furthermore, the oxygen-free copper specified in JIS H3100 (1) JIS H0500 stipulated in the 2012 20120448 is the alloy number C1020. Further, the fine copper specified in JIS H3100 is the alloy number C1 100 as the fine copper specified in JIS H0500. 16 201242448 Ιτ^τ

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鬢曲次數為4次以上,彎曲性優異。 於 ϊ ( 220 ) /1 ( 200 )為 0.11 L火後之加工硬化指數為0.3 ,進行1 80度密合彎曲時之 另方面最後冷壓延時之總加工度未達8 5 %之比較 例3、5、6、7之情形時’以35〇。〇進行〇 5小時退火後之 加工硬化指數未達0·3,進行丨8〇度密合彎曲時之彎曲次數 未達4次,弯曲性劣化。再者, 認為於比較例1之情形時, 因銅箔中Sn之添加量超過5〇〇質量ppm,故半軟化溫度超 過150°C ’且加工硬化指數未達〇·3。 又於半权化溫度超過1 5 0。〇之比較例1、6、7之情形 時,以35(TC進行0.5小時退火後之加工硬化指數未達〇 3, 進仃1 80度密合彎曲時之彎曲次數未達4次,彎曲性劣化。 於作為最後冷壓延之最後3道次中的油膜當量,最後 道次之前前道次的油膜當量超過25〇〇〇,最後道次之前1道 次的油膜當量超過3〇〇〇〇,且最後道次之油膜當量超過 35000之比較例2之情形時,進行180度密合彎曲時之彎曲 人數未達4次,彎曲性劣化。 於最後冷壓延之最後3道次中的油膜當量中,最後道 次之前前道次的油膜當量超過25〇〇〇之比較例4之情形 時’進行1 8 0度密合彎曲時之彎曲次數未達4次,彎曲性 劣化。 再者’可知於比較例1〜7之情形時,先前之彎曲性之 6平價即IPC滑動彎曲次數亦與各實施例相同,於滑動彎曲 201242448 試驗中無法評價覆銅積層板之彎曲性。 【圖式簡單說明】 圖1係表示採用IPC滑動彎曲裝置之滑動彎曲方法之 圖。 【主要元件符號說明】 1 試驗片 2 螺釘 3 振動傳遞構件 4 振盪驅動體 r 曲率半徑 20The number of distortions is 4 or more, and the bending property is excellent. Yu Yu ( 220 ) /1 ( 200 ) is a work hardening index of 0.11 L after fire, and the total processing degree of the final cold press delay of less than 8 5 % when the 1 80 degree close bending is performed is not compared with Comparative Example 3 In the case of 5, 6, or 7, '35. After the 小时 5 hour annealing, the work hardening index was less than 0.3, and the bending time when the 丨8 密 degree of close bending was performed was less than 4 times, and the bendability was deteriorated. Further, in the case of Comparative Example 1, since the addition amount of Sn in the copper foil exceeds 5 〇〇 mass ppm, the semi-softening temperature exceeds 150 ° C ' and the work hardening index does not reach 〇·3. Again, the semi-weighted temperature exceeds 150. In the case of Comparative Examples 1, 6, and 7, the work hardening index after annealing for 0.5 hours at TC did not reach 〇3, and the number of bends when the 仃1 80 degree was tightly bent was less than 4 times, and the bending property was not obtained. Deterioration. As the oil film equivalent in the last 3 passes of the final cold rolling, the oil film equivalent of the previous pass before the last pass exceeds 25 〇〇〇, and the oil film equivalent of 1 pass before the last pass exceeds 3 〇〇〇〇. In the case of Comparative Example 2 in which the oil film equivalent of the last pass exceeds 35,000, the number of bends at the time of 180 degree close bending is less than four times, and the bendability is deteriorated. In the oil film equivalent of the last three passes of the final cold rolling In the case of Comparative Example 4 in which the oil film equivalent of the previous pass before the last pass exceeds 25 ', the number of bends when the 180-degree tight bend is performed is less than 4 times, and the bendability is deteriorated. In the case of Comparative Examples 1 to 7, the 6-valence of the previous bending property, that is, the IPC sliding bending number was also the same as in the respective examples, and the bending property of the copper-clad laminate was not evaluated in the sliding bending 201242448 test. Figure 1 shows the use of IPC sliding Diagram of the sliding bending method of the curved device. [Description of main component symbols] 1 Test piece 2 Screw 3 Vibration transmission member 4 Oscillating drive body r Radius of curvature 20

Claims (1)

201242448 七、申請專利範圍: I一種銅箔,其厚度為5〜30以m,以350°C進行ο」小 時退火後之I ( 220) /1 ( 2〇〇)為011以下,且以35〇t>c 進仃0·5小時退火後之加工硬化指數為〇 3以上〇 以下。 2·如申請專利範圍第1項之銅箔,其半軟化溫度為j 50 °C以下。 3.如巾請專利範圍第1或2項之㈣,其係由無氧銅或 精鋼構成,或者無氧銅或精銅中含有合計5〇〇質量ppm以 下之由Ag及Sn所構成之群中之丨種以上。 4.如申請專利範圍第丨或2項之㈣,其於無氧銅或精 鋼中含有合計20〜_ f量ppm之選自Ag、Sn、in、们、 以上的元素。 5·如申請專利範圍第m項中卜項之銅㉙,其中, 以使用在之單面積層有樹脂層且合計厚度為心爪 以下、寬度為3mm以上5mm以下之試料,以該銅箔之露出 :為外側進仃180纟密合彎曲時,至該銅箔斷裂之彎曲次 數為4次以上。 0.如申請專利範圍第 i 王 ^ Τ ΊΠ: 2壓延時之總加工度為85%以上,且將該最後冷壓延: <二道次中之油膜當量設為以下條件進行壓延而成; 「中,最後道次之前前道次的油膜當量為25〇〇〇以下 、ώ肢a人之刖道—人的油犋當量為3〇000以下;最後道次二 油膜當量為35000以下。 21 201242448 7.—種覆銅積層板,其係將申請專利範圍第1至6項中 任一項之銅箔積層於樹脂層之至少單面而成。 22201242448 VII. Patent application scope: I A copper foil with a thickness of 5 to 30 m, and I (220) /1 (2〇〇) after annealing at 350 ° C is 011 or less, and 35加工t>c The work hardening index after annealing for 0.5 hours is 〇3 or more. 2. The copper foil of claim 1 of the patent application has a semi-softening temperature of j 50 ° C or less. 3. For the towel, please refer to paragraph (1) or (4) of the patent range, which consists of oxygen-free copper or stainless steel, or a group of Ag and Sn in total of 5 〇〇 mass ppm or less in oxygen-free copper or refined copper. More than one species in the middle. 4. In the fourth or second item of claim 2, the oxygen-free copper or stainless steel contains a total of 20 to _ppm of an element selected from the group consisting of Ag, Sn, in, and above. 5. The copper 29 of the item in the item m of the patent application, wherein the sample having the resin layer in the single-area layer and having a total thickness of less than the core claw and having a width of 3 mm or more and 5 mm or less is used as the copper foil. Exposed: When the outer side is 180 纟 tightly bent, the number of times of bending to the copper foil is four or more. 0. If the patent application scope is i-th wang Τ ΊΠ: 2 the total processing degree of the pressure delay is 85% or more, and the final cold rolling: < the oil film equivalent in the second pass is set to the following conditions for calendering; "In the middle, the oil film equivalent of the previous pass before the last pass is 25 〇〇〇 or less, and the 犋 a 人 — 人 人 人 人 人 人 人 人 人 人 人 人 人 人 人 人 人 人 人 人 人 人 人 人 人 人 人 人 人 人 人 人 人 人 人201242448 7. A copper-clad laminate which is formed by laminating a copper foil according to any one of claims 1 to 6 on at least one side of a resin layer.
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JP4972115B2 (en) * 2009-03-27 2012-07-11 Jx日鉱日石金属株式会社 Rolled copper foil

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI460069B (en) * 2012-11-09 2014-11-11 Jx Nippon Mining & Metals Corp Surface treatment of copper foil and the use of its laminated board, printed wiring board and copper clad laminate
CN107249263A (en) * 2012-11-09 2017-10-13 Jx日矿日石金属株式会社 Surface treatment copper foil and the plywood for having used it

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WO2012128099A1 (en) 2012-09-27
JP5124039B2 (en) 2013-01-23

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