MY183375A - Surface treated copper foil, copper clad laminate, printed wiring board, electronic apparatus and method for manufacturing printed wiring board - Google Patents
Surface treated copper foil, copper clad laminate, printed wiring board, electronic apparatus and method for manufacturing printed wiring boardInfo
- Publication number
- MY183375A MY183375A MYPI2016702133A MYPI2016702133A MY183375A MY 183375 A MY183375 A MY 183375A MY PI2016702133 A MYPI2016702133 A MY PI2016702133A MY PI2016702133 A MYPI2016702133 A MY PI2016702133A MY 183375 A MY183375 A MY 183375A
- Authority
- MY
- Malaysia
- Prior art keywords
- copper foil
- surface treated
- wiring board
- printed wiring
- treated copper
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Laser Beam Processing (AREA)
Abstract
A surface treated copper foil which is well bonded to a resin and achieves excellent visibility in observation through the resin is provided. A surface treated copper foil having one surface and other surface each surface treated, wherein a copper clad laminate formed by lamination of the surface treated copper foil to a polyimide in which the following ?B (PI) is 50 or more and 65 or less has a surface color difference ?E*ab based on JIS 28730 through the polyimide, of 50 or more. In the case that the copper foil is photographed through the polyimide, a surface treated surface of which is laminated, with a CCD camera to produce an observation spot versus brightness graph, ?B (?B ? Bt -Bb) is 40 or more. The other surface treated copper foil surface of the surface treated copper foil has a TD ten-spot average roughness Rz measured with a laser microscope using laser light having a wavelength of 405 nm of, 0.35 ?m or more. Figure 1
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013255472 | 2013-12-10 | ||
PCT/JP2014/082766 WO2015087942A1 (en) | 2013-12-10 | 2014-12-10 | Treated surface copper foil, copper-clad laminate, printed wiring board, electronic device, and printed wiring board manufacturing method |
Publications (1)
Publication Number | Publication Date |
---|---|
MY183375A true MY183375A (en) | 2021-02-18 |
Family
ID=53371241
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2016702133A MY183375A (en) | 2013-12-10 | 2014-12-10 | Surface treated copper foil, copper clad laminate, printed wiring board, electronic apparatus and method for manufacturing printed wiring board |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP5819571B1 (en) |
KR (1) | KR101944166B1 (en) |
CN (1) | CN105980609B (en) |
MY (1) | MY183375A (en) |
PH (1) | PH12016501130A1 (en) |
TW (1) | TWI573500B (en) |
WO (1) | WO2015087942A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6895936B2 (en) * | 2018-09-28 | 2021-06-30 | 古河電気工業株式会社 | Surface-treated copper foil, and copper-clad laminates and circuit boards using this |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2849059B2 (en) * | 1995-09-28 | 1999-01-20 | 日鉱グールド・フォイル株式会社 | Processing method of copper foil for printed circuit |
KR100632861B1 (en) | 2002-05-13 | 2006-10-13 | 미쓰이 긴조꾸 고교 가부시키가이샤 | Flexible printed wiring board for chip-on-film |
JP2004098659A (en) | 2002-07-19 | 2004-04-02 | Ube Ind Ltd | Copper-clad laminate and its manufacturing process |
JP3977790B2 (en) * | 2003-09-01 | 2007-09-19 | 古河サーキットフォイル株式会社 | Manufacturing method of ultra-thin copper foil with carrier, ultra-thin copper foil manufactured by the manufacturing method, printed wiring board using the ultra-thin copper foil, multilayer printed wiring board, chip-on-film wiring board |
US8524378B2 (en) * | 2008-11-25 | 2013-09-03 | Jx Nippon Mining & Metals Corporation | Copper foil for printed circuit |
JP5467930B2 (en) * | 2010-05-19 | 2014-04-09 | Jx日鉱日石金属株式会社 | Copper clad laminate |
JP5124039B2 (en) * | 2011-03-23 | 2013-01-23 | Jx日鉱日石金属株式会社 | Copper foil and copper-clad laminate using the same |
JP5148726B2 (en) * | 2011-03-30 | 2013-02-20 | Jx日鉱日石金属株式会社 | Electrolytic copper foil and method for producing electrolytic copper foil |
JP5074611B2 (en) * | 2011-03-30 | 2012-11-14 | Jx日鉱日石金属株式会社 | Electrolytic copper foil for secondary battery negative electrode current collector and method for producing the same |
JP5855244B2 (en) * | 2012-05-21 | 2016-02-09 | Jx日鉱日石金属株式会社 | Surface-treated copper foil, laminate using the same, printed wiring board, electronic device, and method for producing printed wiring board |
-
2014
- 2014-12-10 TW TW103143259A patent/TWI573500B/en active
- 2014-12-10 JP JP2015520739A patent/JP5819571B1/en active Active
- 2014-12-10 MY MYPI2016702133A patent/MY183375A/en unknown
- 2014-12-10 KR KR1020167015615A patent/KR101944166B1/en active IP Right Grant
- 2014-12-10 CN CN201480067242.0A patent/CN105980609B/en active Active
- 2014-12-10 WO PCT/JP2014/082766 patent/WO2015087942A1/en active Application Filing
-
2016
- 2016-06-10 PH PH12016501130A patent/PH12016501130A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
JPWO2015087942A1 (en) | 2017-03-16 |
TWI573500B (en) | 2017-03-01 |
WO2015087942A1 (en) | 2015-06-18 |
TW201532485A (en) | 2015-08-16 |
JP5819571B1 (en) | 2015-11-24 |
KR101944166B1 (en) | 2019-01-30 |
KR20160086378A (en) | 2016-07-19 |
CN105980609A (en) | 2016-09-28 |
PH12016501130A1 (en) | 2016-07-18 |
CN105980609B (en) | 2018-08-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
PH12016501106B1 (en) | Treated surface copper foil, copper-clad laminate, printed wiring board, electronic device, and printed wiring board manufacturing method | |
PH12019000429A1 (en) | Copper foil, copper-clad laminate board, method for producing printed wiring board, method for producing electronic apparatus, method for producing transmission channel, and method for producing antenna | |
MY185462A (en) | Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board | |
JP2013147688A5 (en) | Surface-treated copper foil and copper-clad laminate using the same | |
MY186451A (en) | Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring board | |
MY186859A (en) | Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same | |
EP3026145A4 (en) | Treated surface copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper clad laminate, and printed circuit board manufacturing method | |
MY177723A (en) | Surface-treated copper foil, laminate using same, printed wiring board, electronic device, and method for fabricating printed wiring board | |
MY181562A (en) | Black color surface-treated copper foil, method of manufacturing black color surface-treated copper foil, copper-clad laminate and flexible printed wiring board | |
EP3786318A4 (en) | Surface-treated copper foil, copper clad laminate, and printed wiring board | |
MY186397A (en) | Roughened copper foil, copper-clad laminate, and printed wiring board | |
MY157604A (en) | Copper foil with carrier, and copper clad laminate, printed wiring board and printed circuit board using the same, and method for manufacturing printed wiring board | |
MY176312A (en) | Surface-treated metal material, metal foil with carrier, connector, terminal, laminate, shielding tape, shielding material, printed wiring board, processed metal member, electronic device, and method for manufacturing printed wiring board | |
MY185927A (en) | Copper foil provided with carrier, laminate, method for fabricating printed wiring board and method for fabricating electronic device | |
ATE557576T1 (en) | CIRCUIT BOARD WITH ELECTRONIC COMPONENT | |
PH12014502509B1 (en) | Surface-treated copper foil and laminate using same, copper foil, printed wiring board, electronic device, and process for producing printed wiring board | |
MY177771A (en) | Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic device | |
PH12014000344B1 (en) | Surface - treated copper foil, laminate, printed wiring board, electronic device, copper foil provided with carrier and method for fabricating printing wiring board | |
MY193835A (en) | Production method for printed wiring board having dielectric layer | |
MY174931A (en) | Ultrathin copper foil with carrier and method for manufacturing same | |
MY180430A (en) | Copper foil with carrier, laminate, printed wiring board, and method of producing electronic devices | |
MY167064A (en) | Multilayer printed wiring board manufacturing method | |
MY175520A (en) | Copper clad laminate for forming of embedded capacitor layer, multilayered printed wiring board, and manufacturing method of multilayered printed wiring board | |
MY190542A (en) | Electrolytic copper foil, method of manufacturing electrolytic copper foil, copper-clad laminate, printed wiring board, method of manufacturing printed wiring board, and method of manufacturing electronic device | |
TWI563892B (en) | Copper clad laminate with protective layer and multi-layer printed wiring board |