KR101944166B1 - Treated surface copper foil, copper-clad laminate, printed wiring board, electronic device, and printed wiring board manufacturing method - Google Patents

Abstract

Provided is a surface-treated copper foil that can be adhered well to a resin, and when observed over a resin, realizes excellent visibility. A surface-treated copper foil having a surface treated on one surface and the other surface, the surface-treated copper foil being a laminate of a surface-treated copper foil and polyimide having a? B (PI) of 50 or more and 65 or less before adhering to the copper foil The color difference? E * ab based on JIS Z8730 of the surface beyond the polyimide is 50 or more. When the copper foil is photographed with a CCD camera over the polyimide laminated from the surface side on which the surface treatment is performed,? B (? B = Bt - Bb) is 40 or more in the observation point-lightness graph. The 10-point average roughness Rz of TD measured by a laser microscope with a laser beam wavelength of 405 nm on the surface of the copper foil subjected to the other surface treatment of the surface-treated copper foil is 0.35 탆 or more.

Description

TECHNICAL FIELD [0001] The present invention relates to a surface-treated copper foil, a copper-clad laminate, a printed wiring board, an electronic device, and a method for producing a printed wiring board,

The present invention relates to a surface-treated copper foil, a copper clad laminate, a printed wiring board, an electronic device, and a method for producing a printed wiring board.

Flexible printed wiring boards (hereinafter referred to as FPCs) are employed in small electronic devices such as smart phones and tablet PCs in terms of ease of wiring and light weight. In recent years, the speeding up of the signal transmission speed has been progressed by increasing the function of these electronic devices, and impedance matching is also an important factor in the FPC. As a measure for impedance matching with an increase in the signal capacity, a post-layering (thickening) of a resin insulating layer (for example, polyimide) as a base of the FPC is progressing. Further, due to the demand for increasing the density of the wiring, the FPC has been further layered. On the other hand, the FPC is subjected to processing such as bonding to a liquid crystal substrate or mounting of an IC chip. In this case, alignment is performed by passing the resin insulating layer remaining after etching the copper foil on the laminate of the copper foil and the resin insulating layer, The visibility of the resin insulating layer becomes important.

The copper clad laminate which is a laminate of a copper foil and a resin insulating layer can also be produced by using a rolled copper foil whose surface is roughened. This rolled copper foil is usually produced by using tough pitch copper (oxygen content 100 to 500 ppm by weight) or oxygen free copper (oxygen content 10 ppm by weight or less) as a raw material, hot rolling these ingots, And annealing are repeated.

As such a technique, for example, Patent Document 1 discloses that a polyimide film and a low-illuminance copper foil are laminated, and the light transmittance at a wavelength of 600 nm of the film after copper foil etching is 40% or more and the haze (HAZE) is 30% , And an adhesive strength of 500 N / m or more.

Patent Document 2 discloses a chip-on-flexible (hereinafter referred to as " chip-on-flexible ") chip having an insulating layer in which a conductor layer is laminated by an electrolytic copper foil and having a light transmittance of an insulating layer in an etching region when a circuit is formed by etching the conductor layer COF), wherein the electrolytic copper foil has a rust-preventive treatment layer of a nickel-zinc alloy on a bonding surface to be bonded to an insulating layer, and a surface roughness Rz of the bonding surface is 0.05 to 1.5 탆 And a mirror polish degree at an incident angle of 60 DEG of not less than 250. The present invention relates to a flexible printed wiring board for COF.

Patent Document 3 discloses a method of treating a copper foil for a printed circuit in which a cobalt-nickel alloy plating layer is formed on the surface of a copper foil after a roughening treatment by copper-cobalt-nickel alloy plating and a zinc- A copper foil for a printed circuit board, and a method for processing a copper foil for a printed circuit.

Japanese Patent Application Laid-Open No. 2004-98659 WO2003 / 096776 Japanese Patent No. 2849059

In the case of Patent Document 1, the low-illuminance copper foil obtained by improving the adhesiveness by an organic treatment after the blackening treatment or the plating treatment is disadvantageous in that the copper-clad laminate is broken due to fatigue in applications requiring flexibility, There is a case.

Also, in Patent Document 2, the roughening treatment is not performed and the adhesion strength between the copper foil and the resin is low in applications other than the COF flexible printed wiring board, which is insufficient.

Further, in the treatment method described in Patent Document 3, the copper foil can be finely treated with Cu-Co-Ni, but when the copper foil is observed over the resin, excellent visibility can not be realized.

The present invention provides a surface-treated copper foil that exhibits excellent visibility when adhered well to a resin and observed over a resin.

As a result of intensive studies, the inventors of the present invention have found that a copper foil having a surface color difference controlled to a predetermined range by a surface treatment can be observed on a polyimide substrate laminated from the treated surface side, It is preferable to pay attention to the slope of the brightness curve near the end of the drawn copper foil in the brightness graph and to control the slope of the brightness curve without being influenced by the type of the substrate resin film or the thickness of the substrate resin film, And transparency becomes good.

The present invention, which is completed on the basis of the above findings, is a surface treated copper foil having a surface treated on one surface and the other surface, wherein the surface treated copper foil is bonded to the copper foil The color difference DELTA E * ab based on JIS Z8730 on the surface of the polyimide over the copper clad laminate formed by laminating the copper clad laminate with a polyimide having a total of DELTA B (PI) of 50 or more and 65 or less is 50 or more, The brightness of each observation point was measured along the direction perpendicular to the direction in which the observed copper foil was stretched with respect to the image obtained by the photographing when the image was taken with a CCD camera over the polyimide laminated from the front side of the polyimide , And the observation point-brightness graph, the top average value Bt of the brightness curve occurring from the end portion of the copper foil to the portion without the copper foil (B = Bt - Bb) between the bottom average value Bb and the bottom average value Bb is 40 or more, and the ten-point average roughness Rz of TD measured by a laser microscope with the wavelength of laser light of the surface of the copper surface subjected to the other surface treatment is 405 nm 0.35 탆 or more.

In another aspect of the present invention, there is provided a surface-treated copper foil having a surface treated on one surface and the other surface, wherein the surface treated copper foil has the following characteristics:? B (PI) A color difference DELTA E * ab based on JIS Z8730 of the surface of the polyimide overlaid on a copper clad laminate formed by laminating a copper foil with a polyimide having a thickness of 50 to 65 is 50 or more, The observation point-brightness graph prepared by measuring the brightness of each observation point along the direction perpendicular to the direction in which the observed copper foil was stretched, with respect to the image obtained by the photographing, when the image was photographed with a CCD camera over polyimide , The difference between the top average value Bt and the bottom average value Bb of the lightness curve that occurs from the end portion of the copper foil to the portion without the copper foil is? B A value indicating the position of an intersection point closest to the copper foil among the intersections of the brightness curve and Bt is t1 and Bt is a value obtained from the intersection of the brightness curve and Bt, , A value indicating a position of an intersection point closest to the copper foil among the intersections of the brightness curve and 0.1? B is defined as t2, the Sv defined by the following formula (1) is at least 3.0 Lt; / RTI &

Sv = (DELTA Bx0.1) / (t1 - t2) (1)

Wherein the ten-point average roughness Rz of TD measured by a laser microscope having a laser beam wavelength of 405 nm on the surface of the copper surface subjected to the other surface treatment is not less than 0.35 mu m.

In another embodiment of the surface-treated copper foil of the present invention, the average roughness Rz of TD measured by a laser microscope with a wavelength of laser beam of 405 nm on the surface of the copper surface subjected to the other surface treatment is 0.35 탆 or more.

In the surface-treated copper foil of the present invention, the arithmetic average roughness Ra of the TD measured by a laser microscope having a laser beam wavelength of 405 nm on the other surface-treated copper foil surface is 0.05 mu m or more.

In another aspect, the present invention provides a surface-treated copper foil having surface treatment on one surface and the other surface, the surface-treated copper foil having a surface roughness of? B (PI) before adhering the surface- Is 50 or more and 65 or less, the color difference DELTA E * ab based on JIS Z8730 of the surface of the polyimide over the polyimide is 50 or more, and the copper foil is laminated from one surface side The observation point-brightness graph prepared by measuring the brightness of each observation point along the direction perpendicular to the direction in which the observed copper foil is stretched, with respect to the image obtained by the photographing, , A difference? B between the top average value Bt and the bottom average value Bb of the brightness curve occurring from the end portion of the copper foil to the portion having no copper foil (? B = Bt - Bb) is 40 or more, and the arithmetic average roughness Ra of the TD measured by a laser microscope with a laser beam wavelength of 405 nm on the surface of the copper surface subjected to the other surface treatment is 0.05 占 퐉 or more.

In another aspect, the present invention provides a surface-treated copper foil having surface treatment on one surface and the other surface, the surface-treated copper foil having a surface roughness of? B (PI) before adhering the surface- Is 50 or more and 65 or less, the color difference DELTA E * ab based on JIS Z8730 of the surface of the polyimide over the polyimide is 50 or more, and the copper foil is laminated from one surface side The observation point-brightness graph prepared by measuring the brightness of each observation point along the direction perpendicular to the direction in which the observed copper foil is stretched, with respect to the image obtained by the photographing, , The difference between the top average value Bt and the bottom average value Bb of the brightness curve occurring from the end portion of the copper foil to the portion without the copper foil And a value indicating a position of an intersection nearest to the copper foil among the intersections of the brightness curve and Bt is t1 and the intersection of the brightness curve and Bt is B (ΔB = Bt - Bb) , A value indicating a position of an intersection point closest to the copper foil among the intersections of the lightness curve and 0.1? B in a depth range from 0.1?? To 0.1? B based on Bt, 3.0 or more,

Sv = (DELTA Bx0.1) / (t1 - t2) (1)

Treated copper foil having an arithmetic average roughness Ra of 0.05 mu m or more as measured by a laser microscope having a laser beam wavelength of 405 nm on the other surface-treated copper foil surface.

In the surface-treated copper foil of the present invention, the square root mean square height Rq of TD measured by a laser microscope having a wavelength of laser beam of 405 nm on the other surface-treated copper foil surface is 0.08 mu m or more.

In another aspect, the present invention provides a surface-treated copper foil having surface treatment on one surface and the other surface, the surface-treated copper foil having a surface roughness of? B (PI) before adhering the surface- Is 50 or more and 65 or less, the color difference DELTA E * ab based on JIS Z8730 of the surface of the polyimide over the polyimide is 50 or more, and the copper foil is laminated from one surface side The observation point-brightness graph prepared by measuring the brightness of each observation point along the direction perpendicular to the direction in which the observed copper foil is stretched, with respect to the image obtained by the photographing, , A difference? B between the top average value Bt and the bottom average value Bb of the brightness curve occurring from the end portion of the copper foil to the portion having no copper foil (DELTA B = Bt - Bb) is 40 or more, and the square root mean square height Rq of TD measured by a laser microscope having a laser beam wavelength of 405 nm on the other surface-treated copper foil surface is 0.08 mu m or more .

In another aspect, the present invention provides a surface-treated copper foil having surface treatment on one surface and the other surface, the surface-treated copper foil having a surface roughness of? B (PI) before adhering the surface- Is 50 or more and 65 or less, the color difference DELTA E * ab based on JIS Z8730 of the surface of the polyimide over the polyimide is 50 or more, and the copper foil is laminated from one surface side The observation point-brightness graph prepared by measuring the brightness of each observation point along the direction perpendicular to the direction in which the observed copper foil is stretched, with respect to the image obtained by the photographing, , The difference between the top average value Bt and the bottom average value Bb of the brightness curve occurring from the end portion of the copper foil to the portion without the copper foil And a value indicating a position of an intersection nearest to the copper foil among the intersections of the brightness curve and Bt is t1 and the intersection of the brightness curve and Bt is B (ΔB = Bt - Bb) , A value indicating a position of an intersection point closest to the copper foil among the intersections of the lightness curve and 0.1? B in a depth range from 0.1?? To 0.1? B based on Bt, 3.0 or more,

Sv = (DELTA Bx0.1) / (t1 - t2) (1)

Treated copper foil having a square root mean square height (Rq) of TD of 0.08 占 퐉 or more as measured by a laser microscope having a wavelength of laser light of 405 nm on the surface of the copper surface subjected to the other surface treatment.

In another embodiment of the surface-treated copper foil of the present invention, the surface treatment of the other surface is a roughening treatment.

In another embodiment of the surface-treated copper foil according to the present invention, in the observation point-brightness graph, a value indicating the position of an intersection nearest to the copper foil among intersections of the brightness curve and Bt is t1, (1) where t2 is a value indicating the position of an intersection point closest to the copper foil among the intersections of the brightness curve and 0.1? B in the depth range from the intersection point of Bt to 0.1? B with respect to Bt, The Sv becomes 3.0 or more.

Sv = (DELTA Bx0.1) / (t1 - t2) (1)

In still another embodiment of the surface-treated copper foil according to the present invention, the surface-treated copper foil is formed by laminating a polyimide having a? B (PI) of 50 or more and 65 or less before adhering the surface- The color difference? E * ab based on JIS Z8730 of the surface of the polyimide over the laminated board is 53 or more.

In another embodiment of the surface-treated copper foil according to the present invention, the Sv defined by the formula (1) in the lightness curve is 3.5 or more.

In another embodiment of the surface-treated copper foil according to the present invention, the Sv defined by the expression (1) in the lightness curve is 3.9 or more.

In another embodiment of the surface-treated copper foil according to the present invention, the Sv defined by the formula (1) in the lightness curve is 5.0 or more.

In another embodiment of the surface-treated copper foil according to the present invention, the 10-point average roughness Rz of TD measured by a contact type roughness meter on one surface of the copper foil is 0.20 to 0.64 탆, and the three-dimensional surface area A of the copper foil surface and the two- The ratio A / B of B is 1.0 to 1.7.

In another embodiment of the surface-treated copper foil according to the present invention, the ten-point average roughness Rz of TD measured by the contact type roughness meter on one surface is 0.26 to 0.62 mu m.

In another embodiment of the surface-treated copper foil according to the present invention, the A / B ratio is 1.0 to 1.6.

In another aspect, the present invention is a copper clad laminate comprising a surface-treated copper foil of the present invention and a resin substrate laminated.

In another aspect, the present invention is a printed wiring board using the surface-treated copper foil of the present invention.

According to another aspect of the present invention, there is provided an electronic device using at least one printed wiring board of the present invention.

According to a still further aspect of the present invention, there is provided a printed circuit board having an insulating resin substrate and a copper circuit formed on an insulating resin substrate, wherein the copper circuit has a surface on one side of the insulating resin substrate, Wherein a color difference DELTA E * ab based on JIS Z8730 of the surface of the copper circuit beyond the insulating resin substrate is 50 or more, and when the copper circuit is photographed by the CCD camera over the insulating resin substrate, In the observation point-brightness graph prepared by measuring the brightness of each observation point along a direction perpendicular to the direction in which the observed copper circuit extends, with respect to the obtained image, The difference? B (? B = Bt - Bb) between the top average value Bt and the bottom average value Bb of the brightness curve occurring over the portion becomes 40 or more, And a 10-point average roughness Rz of TD measured by a laser microscope with a wavelength of 405 nm of the laser light on the surface of the copper circuit that has been removed is 0.35 탆 or more.

According to a still further aspect of the present invention, there is provided a printed circuit board having an insulating resin substrate and a copper circuit formed on an insulating resin substrate, wherein the copper circuit has a surface on one side of the insulating resin substrate, Wherein a color difference DELTA E * ab based on JIS Z8730 of the surface of the copper circuit beyond the insulating resin substrate is 50 or more, and when the copper circuit is photographed by the CCD camera over the insulating resin substrate, In the observation point-brightness graph prepared by measuring the brightness of each observation point along a direction perpendicular to the direction in which the observed copper circuit extends, with respect to the obtained image, (B = Bt - Bb) between the top average value Bt and the bottom average value Bb of the lightness curve that occurs over the portion , A value indicating the position of an intersection point closest to the copper circuit among the intersections of the brightness curve and Bt is t1 and a brightness curve is defined in the depth range from the intersection of the brightness curve and Bt to 0.1 [ And a value indicating the position of an intersection point closest to the copper circuit among the intersections of 0.1? B and 0.1? B is t2, the Sv defined by the following formula (1)

Sv = (DELTA Bx0.1) / (t1 - t2) (1)

And a 10-point average roughness Rz of TD measured by a laser microscope with a wavelength of laser beam of 405 nm on the surface of the copper circuit subjected to the other surface treatment is 0.35 탆 or more.

In another embodiment of the printed wiring board according to the present invention, the arithmetic average roughness Ra of the TD measured by a laser microscope with a laser beam wavelength of 405 nm on the surface of the copper circuit subjected to the other surface treatment is 0.05 m or more.

According to another aspect of the present invention, there is provided a printed wiring board having an insulating resin substrate and a copper circuit formed on an insulating resin substrate, wherein the copper circuit has a surface on one side of the insulating resin substrate, Wherein the color difference DELTA E * ab based on JIS Z8730 of the surface of the copper circuit above the insulating resin substrate is 50 or more, and when the copper circuit is photographed by the CCD camera over the insulating resin substrate, In the observation point-lightness graph obtained by measuring the brightness of each observation point along a direction perpendicular to the direction in which the observed copper circuit extends, with respect to the image obtained by the copper circuit, The difference? B (? B = Bt - Bb) between the top average value Bt and the bottom average value Bb of the lightness curve that occurs over the other surface And the arithmetic mean roughness Ra of the TD measured by a laser microscope with a wavelength of the laser beam of the treated copper circuit surface of 405 nm is 0.05 m or more.

According to another aspect of the present invention, there is provided a printed wiring board having an insulating resin substrate and a copper circuit formed on an insulating resin substrate, wherein the copper circuit has a surface on one side of the insulating resin substrate, Wherein the color difference DELTA E * ab based on JIS Z8730 of the surface of the copper circuit above the insulating resin substrate is 50 or more, and when the copper circuit is photographed by the CCD camera over the insulating resin substrate, In the observation point-lightness graph obtained by measuring the brightness of each observation point along a direction perpendicular to the direction in which the observed copper circuit extends, with respect to the image obtained by the copper circuit, (B = Bt - Bb) between the top average value Bt and the bottom average value Bb of the luminosity curve that occurs over a portion where there is no light, A value indicating the position of an intersection point closest to the copper circuit among the intersections of the brightness curve and Bt is t1 and a value of brightness in the depth range from the intersection of the brightness curve and Bt to 0.1? The value Sv defined by the following formula (1) is 3.0 or more when t2 is a value indicating the position of an intersection closest to the copper circuit among the intersections of the curve and 0.1? B,

Sv = (DELTA Bx0.1) / (t1 - t2) (1)

And the arithmetic average roughness Ra of the TD measured by a laser microscope having a wavelength of laser beam of 405 nm on the surface of the copper circuit subjected to the other surface treatment is not less than 0.05 mu m.

In another embodiment of the printed wiring board of the present invention, the square root mean square root height Rq of TD measured by a laser microscope having a wavelength of laser beam of 405 nm on the surface of the copper circuit subjected to the other surface treatment is 0.08 탆 or more.

According to another aspect of the present invention, there is provided a printed wiring board having an insulating resin substrate and a copper circuit formed on an insulating resin substrate, wherein the copper circuit has a surface on one side of the insulating resin substrate, Wherein the color difference DELTA E * ab based on JIS Z8730 of the surface of the copper circuit above the insulating resin substrate is 50 or more, and when the copper circuit is photographed by the CCD camera over the insulating resin substrate, In the observation point-lightness graph obtained by measuring the brightness of each observation point along a direction perpendicular to the direction in which the observed copper circuit extends, with respect to the image obtained by the copper circuit, The difference? B (? B = Bt - Bb) between the top average value Bt and the bottom average value Bb of the lightness curve that occurs over the other surface And the square root mean square height Rq of TD measured by a laser microscope having a wavelength of laser beam of 405 nm on the copper circuit surface treated is 0.08 mu m or more.

According to another aspect of the present invention, there is provided a printed wiring board having an insulating resin substrate and a copper circuit formed on an insulating resin substrate, wherein the copper circuit has a surface on one side of the insulating resin substrate, Wherein the color difference DELTA E * ab based on JIS Z8730 of the surface of the copper circuit above the insulating resin substrate is 50 or more, and when the copper circuit is photographed by the CCD camera over the insulating resin substrate, In the observation point-lightness graph obtained by measuring the brightness of each observation point along a direction perpendicular to the direction in which the observed copper circuit extends, with respect to the image obtained by the copper circuit, (B = Bt - Bb) between the top average value Bt and the bottom average value Bb of the luminosity curve that occurs over a portion where there is no light, A value indicating the position of an intersection point closest to the copper circuit among the intersections of the brightness curve and Bt is t1 and a value of brightness in the depth range from the intersection of the brightness curve and Bt to 0.1? The value Sv defined by the following formula (1) is 3.0 or more when t2 is a value indicating the position of an intersection closest to the copper circuit among the intersections of the curve and 0.1? B,

Sv = (DELTA Bx0.1) / (t1 - t2) (1)

And a square root mean square height (Rq) of TD measured by a laser microscope having a wavelength of laser beam of 405 nm on the surface of the copper circuit subjected to the other surface treatment is 0.08 mu m or more.

In a printed wiring board according to another embodiment of the present invention, the surface treatment of the other surface is a harmonic treatment.

According to another aspect of the present invention, there is provided a method for manufacturing a printed wiring board in which two or more printed wiring boards are connected by connecting two or more printed wiring boards of the present invention.

In another aspect of the present invention, there is provided a printed wiring board including at least one printed wiring board of the present invention and at least a step of connecting a printed wiring board of the present invention or a printed wiring board not corresponding to the printed wiring board of the present invention Thereby manufacturing two or more connected printed wiring boards.

According to another aspect of the present invention, there is provided an electronic device using at least one printed wiring board to which at least one printed wiring board of the present invention is connected.

In another aspect, the present invention is a surface-treated copper foil used for a printed wiring board of the present invention.

According to still another aspect of the present invention, there is provided a copper clad laminate having an insulating resin substrate and a copper foil formed on an insulating resin substrate, wherein the copper foil has a surface on one side of the insulating resin substrate, Wherein the color difference DELTA E * ab based on JIS Z8730 of the surface of the copper foil above the insulating resin substrate is not less than 50 and the copper foil of the copper clad laminate is made into a copper foil on the line by etching, The observation point-brightness graph prepared by measuring the brightness of each observation point along the direction perpendicular to the direction in which the copper foil on the line was observed with respect to the image obtained by the photographing, , The top average value Bt of the brightness curve occurring from the end portion of the copper foil on the line to the portion having no copper foil on the line, Point average roughness Rz of the TD measured by a laser microscope with a wavelength of 405 nm of laser light of the surface of the copper surface subjected to the surface treatment on the other side is not less than 0.35 占 퐉 and the difference ΔB (B = Bt-Bb) Copper clad laminate.

According to still another aspect of the present invention, there is provided a copper clad laminate having an insulating resin substrate and a copper foil formed on an insulating resin substrate, wherein the copper foil has a surface on one side of the insulating resin substrate, Wherein the color difference DELTA E * ab based on JIS Z8730 of the surface of the copper foil above the insulating resin substrate is not less than 50 and the copper foil of the copper clad laminate is made into a copper foil on the line by etching, The observation point-brightness graph prepared by measuring the brightness of each observation point along the direction perpendicular to the direction in which the copper foil on the line was observed with respect to the image obtained by the photographing, , The top average value Bt of the brightness curve occurring from the end portion of the copper foil on the line to the portion having no copper foil on the line, And a value indicating a position of an intersection closest to the copper foil on the line among the intersections of the brightness curve and Bt in the observation point-brightness graph is t1, and the brightness difference? B (? B = Bt- And a value indicating a position of an intersection point closest to the copper foil on the line among the intersections of the brightness curve and 0.1? B in the depth range from the intersection of the curve and Bt to 0.1 ?? B with respect to Bt is represented by t? ) ≪ / RTI > is 3.0 or higher,

Sv = (DELTA Bx0.1) / (t1 - t2) (1)

And a 10-point average roughness Rz of TD measured by a laser microscope with a laser beam wavelength of 405 nm on the other surface-treated copper foil surface is 0.35 탆 or more.

In an embodiment of the copper clad laminate according to the present invention, the average roughness Rz of TD measured by a laser microscope with a wavelength of laser light of 405 nm on the surface of the copper surface subjected to the other surface treatment is 0.35 탆 or more.

In another embodiment of the copper clad laminate according to the present invention, the arithmetic mean roughness Ra of the TD measured by a laser microscope with a wavelength of the laser light of 405 nm on the surface of the copper surface subjected to the other surface treatment is 0.05 탆 or more.

According to another aspect of the present invention, there is provided a copper clad laminate having an insulating resin substrate and a copper foil formed on an insulating resin substrate, wherein the copper foil has one surface on the insulating resin substrate side, Wherein the color difference DELTA E * ab based on JIS Z8730 of the surface of the copper foil above the insulating resin substrate is not less than 50 and the copper foil of the copper clad laminate is made into a copper foil on the line by etching, The image obtained by the photographing was photographed with a CCD camera over a resin substrate. The observation point-brightness value was measured by measuring the brightness of each observation point along a direction perpendicular to the direction in which the copper foil on the line was observed In the graph, the top average value Bt of the brightness curve occurring from the end of the copper foil on the line to the portion without the copper on the line, The arithmetic average roughness Ra of the TD measured by a laser microscope with a laser beam having a wavelength of 405 nm on the surface of the copper surface subjected to the surface treatment on the other side is 40 or more and the difference DELTA B (B = Bt-Bb) Copper clad laminate.

According to another aspect of the present invention, there is provided a copper clad laminate having an insulating resin substrate and a copper foil formed on an insulating resin substrate, wherein the copper foil has one surface on the insulating resin substrate side, Wherein the color difference DELTA E * ab based on JIS Z8730 of the surface of the copper foil above the insulating resin substrate is not less than 50 and the copper foil of the copper clad laminate is made into a copper foil on the line by etching, The image obtained by the photographing was photographed with a CCD camera over a resin substrate. The observation point-brightness value was measured by measuring the brightness of each observation point along a direction perpendicular to the direction in which the copper foil on the line was observed In the graph, the top average value Bt of the brightness curve occurring from the end of the copper foil on the line to the portion without the copper on the line, A value indicating t1 indicates a position of an intersection closest to the copper foil on the line among the intersections of the brightness curve and Bt in the observation point-brightness graph, and the difference? B (? B = Bt-Bb) And a value indicating a position of an intersection point closest to the copper foil on the line among the intersections of the brightness curve and 0.1? B in the depth range from the intersection of the brightness curve and Bt to 0.1? B with respect to Bt is represented by t2 1) is 3.0 or more,

Sv = (DELTA Bx0.1) / (t1 - t2) (1)

And the arithmetic average roughness Ra of the TD measured by a laser microscope having a wavelength of laser light of 405 nm on the surface of the copper surface subjected to the other surface treatment is 0.05 m or more.

In another embodiment of the copper clad laminate according to the present invention, the square root mean square height Rq of TD measured by a laser microscope having a laser beam wavelength of 405 nm on the other surface-treated copper foil surface is 0.08 mu m or more.

According to another aspect of the present invention, there is provided a copper clad laminate having an insulating resin substrate and a copper foil formed on an insulating resin substrate, wherein the copper foil has one surface on the insulating resin substrate side, Wherein the color difference DELTA E * ab based on JIS Z8730 of the surface of the copper foil above the insulating resin substrate is not less than 50 and the copper foil of the copper clad laminate is made into a copper foil on the line by etching, The image obtained by the photographing was photographed with a CCD camera over a resin substrate. The observation point-brightness value was measured by measuring the brightness of each observation point along a direction perpendicular to the direction in which the copper foil on the line was observed In the graph, the top average value Bt of the brightness curve occurring from the end of the copper foil on the line to the portion without the copper on the line, The square root mean square height Rq of the TD measured by a laser microscope with a laser beam whose wavelength is 405 nm on the surface of the copper surface subjected to the surface treatment on the other side is not less than 0.08 m (B = Bt - Bb) Copper clad laminate.

According to another aspect of the present invention, there is provided a copper clad laminate having an insulating resin substrate and a copper foil formed on an insulating resin substrate, wherein the copper foil has one surface on the insulating resin substrate side, Wherein the color difference DELTA E * ab based on JIS Z8730 of the surface of the copper foil above the insulating resin substrate is not less than 50 and the copper foil of the copper clad laminate is made into a copper foil on the line by etching, The image obtained by the photographing was photographed with a CCD camera over a resin substrate. The observation point-brightness value was measured by measuring the brightness of each observation point along a direction perpendicular to the direction in which the copper foil on the line was observed In the graph, the top average value Bt of the brightness curve occurring from the end of the copper foil on the line to the portion without the copper on the line, A value indicating t1 indicates a position of an intersection closest to the copper foil on the line among the intersections of the brightness curve and Bt in the observation point-brightness graph, and the difference? B (? B = Bt-Bb) And a value indicating a position of an intersection point closest to the copper foil on the line among the intersections of the brightness curve and 0.1? B in the depth range from the intersection of the brightness curve and Bt to 0.1? B with respect to Bt is represented by t2 1) is 3.0 or more,

Sv = (DELTA Bx0.1) / (t1 - t2) (1)

And a square root mean square height (Rq) of TD measured by a laser microscope having a laser beam wavelength of 405 nm on the surface of the other surface-treated copper foil is 0.08 mu m or more.

In another embodiment of the copper clad laminate according to the present invention, the surface treatment of the other surface is a roughening treatment.

In another aspect, the present invention is a surface treated copper foil used in the copper clad laminate of the present invention.

The present invention is, in another aspect, a printed wiring board manufactured using the copper clad laminate of the present invention.

According to the present invention, it is possible to provide a surface-treated copper foil that exhibits excellent visibility when adhered well to a resin and observed over a resin.

1 is a schematic diagram for defining Bt and Bb.
2 is a schematic diagram defining t1 and t2 and Sv.
3 is a schematic diagram showing a configuration of a photographing apparatus and a method of measuring the slope of the lightness curve at the time of evaluating the slope of the lightness curve.
4A is a SEM photograph of the surface of the copper foil of Comparative Example 1 at the time of Rz evaluation.
4B is a SEM photograph of the surface of the copper foil of Example 1 at the time of Rz evaluation.
Fig. 5 is a photograph of the appearance of the impurities used in the embodiment. Fig.
6 is a photograph of the appearance of the impurities used in the embodiment.

[Form of surface-treated copper foil and manufacturing method]

The copper foil used in the present invention is useful for a copper foil or the like which is used by forming a laminate by laminating on a resin substrate and forming a circuit by etching.

The copper foil used in the present invention may be either an electrolytic copper foil or a rolled copper foil. For the purpose of improving the peel strength of the copper foil after lamination, the surface of the copper foil to be bonded to the resin substrate of the copper foil (this surface is also referred to as " one surface " in the present invention) (Electrodeposition) may be performed. The electrolytic copper foil has irregularities at the time of production, but the convex portions of the electrolytic copper foil can be strengthened by the roughening treatment to further increase the irregularities. In the present invention, this roughening treatment can be carried out by an alloy plating such as a copper-cobalt-nickel alloy plating or a copper-nickel-phosphorus alloy plating, preferably a copper alloy plating. Conventional copper plating or the like may be applied as a pretreatment before conditioning. In order to prevent electrodeposition from coming off as a post-conditioning finishing treatment, conventional copper plating may be performed.

The copper foil to be used in the present invention may have a heat-resistant plating layer or a rust-preventive plating layer on its surface after the roughening treatment or the roughening treatment is omitted on one surface. Plating treatment by a Ni-W plating bath under the following conditions can be used as a treatment for applying a heat-resistant plating layer or a rust-preventive plating layer to the surface by omitting the roughening treatment. The balance of the treatment liquid used for electrolytic, surface treatment or plating used in the present invention is water unless otherwise specified.

Plating bath composition: Ni: 20 to 30 g / l, W: 15 to 40 mg / l

pH: 3.0 to 4.0

Temperature: 35 ~ 45 ℃

Current density D _k : 1.7 to 2.3 A / dm 2

Plating time: 18 ~ 25 seconds

The thickness of the copper foil used in the present invention is not particularly limited. For example, the thickness of the copper foil is not less than 1 占 퐉, not less than 2 占 퐉, not less than 3 占 퐉, not less than 5 占 퐉, for example, not more than 3000 占 퐉, Not more than 800 mu m, not more than 300 mu m, not more than 150 mu m, not more than 100 mu m, not more than 70 mu m, not more than 50 mu m, not more than 40 mu m.

The copper foil according to the present invention may further contain at least one element selected from the group consisting of Ag, Sn, In, Ti, Zn, Zr, Fe, P, Ni, Si, Te, Cr, Nb, V, Is included. When the concentration of the element is high (for example, 10 mass% or more in total), the conductivity may be lowered. The electrical conductivity of the rolled copper foil is preferably 50% IACS or more, more preferably 60% IACS or more, and still more preferably 80% IACS or more. The rolled copper foil also includes copper foil produced using tough pitch copper (JIS H3100 C1100) or oxygen free copper (JIS H3100 C1020).

The production conditions of the electrolytic copper foil to be used in the present invention are shown below.

<Electrolyte Composition>

Copper: 90 ~ 110 g / ℓ

Sulfuric acid: 90 to 110 g / l

Chlorine: 50 to 100 ppm

Leveling agent 1 (bis (3-sulfopropyl) disulfide): 10 to 30 ppm

Leveling second (amine compound): 10 to 30 ppm

The amine compound may be an amine compound of the following formula.

[Chemical Formula 1]

Wherein R ₁ and R ₂ are selected from the group consisting of a hydroxyalkyl group, an ether group, an aryl group, an aromatic substituted alkyl group, an unsaturated hydrocarbon group and an alkyl group.

<Manufacturing Conditions>

Current density: 70 to 100 A / dm 2

Electrolyte temperature: 50 to 60 ° C

Electrolyte Line Speed: 3 ~ 5 m / sec

Electrolysis time: 0.5 to 10 minutes

The copper-cobalt-nickel alloy plating as the roughening treatment is preferably a copper-cobalt-nickel alloy plating such as nickel having an adhesion amount of 15 to 40 mg / dm 2 and copper of -100 to 3000 μg / dm 2 to 100 μg / So as to form a ternary alloy layer. When the Co deposition amount is less than 100 占 퐂 / dm2, the heat resistance is deteriorated and the etching property is sometimes deteriorated. When the Co deposition amount is more than 3000 占 퐂 / dm2, it is not preferable when the effect of magnetism is to be considered, etching unevenness occurs, and acid resistance and chemical resistance deteriorate in some cases. When the Ni adhesion amount is less than 100 占 퐂 / dm2, the heat resistance may be deteriorated. On the other hand, if the amount of Ni adhered exceeds 1500 / / dm 2, etching residues may increase. The preferable Co deposition amount is 1000 to 2500 占 퐂 / dm2, and the preferable nickel deposition amount is 500 to 1200 占 퐂 / dm2. Here, the term "etching unevenness" means that Co remains unmelted when etching with copper chloride, and the term "etching residue" means that Ni remains unmelted when subjected to alkali etching with ammonium chloride.

The plating bath and plating conditions for forming such a ternary copper-cobalt-nickel alloy plating are as follows:

Plating bath composition: 10 to 20 g / l of Cu, 1 to 10 g / l of Co, 1 to 10 g / l of Ni

pH: 1-4

Temperature: 30 ~ 50 ℃

Current density D _k : 20 to 30 A / dm 2

Plating time: 1 to 5 seconds

The plating conditions of the copper-nickel-phosphorus alloy as the roughening treatment of the present invention are shown below.

Plating bath composition: 10 to 50 g / l of Cu, 3 to 20 g / l of Ni, 1 to 10 g / l of P

pH: 1-4

Temperature: 30 ~ 40 ℃

Current density D _k : 20 to 50 A / dm 2

Plating time: 0.5 ~ 3 seconds

The copper-nickel-cobalt-tungsten alloy plating conditions as the roughening treatment of the present invention are shown below.

Plating bath composition: 5 to 20 g / l of Cu, 5 to 20 g / l of Ni, 5 to 20 g / l of Co, 1 to 10 g / l of W

pH: 1-5

Temperature: 30 ~ 50 ℃

Current density D _k : 20 to 50 A / dm 2

Plating time: 0.5 to 5 seconds

The plating conditions of the copper-nickel-molybdenum-phosphorus alloy as the roughening treatment of the present invention are shown below.

Plating bath composition: 5 to 20 g / l of Cu, 5 to 20 g / l of Ni, 1 to 10 g / l of Mo, 1 to 10 g /

pH: 1-5

Temperature: 20 ~ 50 ℃

Current density D _k : 20 to 50 A / dm 2

Plating time: 0.5 to 5 seconds

After the roughening treatment, one or more layers selected from the group consisting of the heat-resistant layer, the rust-preventive layer and the weather-resistant layer may be formed on the roughened surface. Each layer may be a plurality of layers such as two layers or three layers, and the order of laminating the layers may be any order, and the layers may be alternately laminated.

Here, a well-known heat-resistant layer can be used as the heat-resistant layer. In addition, for example, the following surface treatment can be used.

As the heat-resistant layer and the rust-preventive layer, known heat-resistant layers and rust-preventive layers can be used. For example, the heat-resistant layer and / or the rust-preventive layer may be formed of a material selected from the group consisting of nickel, zinc, tin, cobalt, molybdenum, copper, tungsten, phosphorus, arsenic, chromium, vanadium, titanium, aluminum, gold, silver, Or a layer containing at least one element selected from the group consisting of nickel, zinc, tin, cobalt, molybdenum, copper, tungsten, phosphorus, arsenic, chromium, vanadium, titanium, aluminum, gold, silver, platinum group elements, May be a metal layer or an alloy layer composed of at least one kind of element selected from the group consisting of The heat resistant layer and / or the rust preventive layer may be selected from the group of nickel, zinc, tin, cobalt, molybdenum, copper, tungsten, phosphorus, arsenic, chromium, vanadium, titanium, aluminum, gold, silver, platinum group elements, Nitride, or silicide containing at least one element selected from the group consisting of oxides, nitrides, and silicides. The heat-resistant layer and / or rust-preventive layer may be a layer containing a nickel-zinc alloy. The heat-resistant layer and / or rust-preventive layer may be a nickel-zinc alloy layer. The nickel-zinc alloy layer may contain 50 wt% to 99 wt% of nickel and 50 wt% to 1 wt% of zinc, other than inevitable impurities. The total adhesion amount of zinc and nickel in the nickel-zinc alloy layer may be 5 to 1000 mg / m 2, preferably 10 to 500 mg / m 2, and preferably 20 to 100 mg / m 2. It is preferable that the ratio of the adhesion amount of nickel to the adhesion amount of nickel (= adhesion amount of nickel / adhesion amount of zinc) of the nickel-zinc alloy layer or the nickel-zinc alloy layer is 1.5 to 10. The adhesion amount of nickel in the nickel-zinc alloy layer or nickel-zinc alloy layer is preferably 0.5 mg / m 2 to 500 mg / m 2, more preferably 1 mg / m 2 to 50 mg / m 2 Do. When the heat-resistant layer and / or the rust-preventive layer is a layer containing a nickel-zinc alloy, the interface between the copper foil and the resin substrate does not corrode well in the desmear liquid when the inner wall portion of the through hole, And the resin substrate are improved. The rust-preventive layer may be a chromate treatment layer. A known chromate treatment layer may be used for the chromate treatment layer. For example, the chromate treatment layer refers to a layer treated with a liquid containing chromic anhydride, chromic acid, dichromic acid, chromic acid or dichromate. The chromate treatment layer may contain any element (metal, alloy, oxide, nitride, sulfide, etc.) such as cobalt, iron, nickel, molybdenum, zinc, tantalum, copper, aluminum, phosphorus, tungsten, tin, arsenic, You can. Specific examples of the chromate treatment layer include a pure chromate treatment layer and a zinc chromate treatment layer. In the present invention, the chromate treatment layer treated with an aqueous solution of chromic acid anhydride or potassium dichromate is referred to as a pure chromate treatment layer. In the present invention, the chromate treatment layer treated with the treatment liquid containing chromic anhydride, potassium dichromate and zinc is referred to as a zinc chromate treated layer.

For example, the heat resistant layer and / or the rust preventive layer may be formed of a nickel or nickel alloy layer having an adhesion amount of 1 mg / m2 to 100 mg / m2, preferably 5 mg / m2 to 50 mg / m2 and an adhesion amount of 1 mg / M 2 to 40 mg / m 2, and the nickel alloy layer may be formed of any one of nickel-molybdenum, nickel-zinc, and nickel-molybdenum-cobalt It may be composed of species. The total thickness of the heat-resistant layer and / or the rust-preventive layer is preferably 2 mg / m2 to 150 mg / m2, more preferably 10 mg / m2 to 70 mg / m2, of nickel or a nickel alloy and tin. It is preferable that the heat resistant layer and / or the rust preventive layer has a nickel adhesion amount of [nickel or nickel alloy] / [tin adhesion amount] = 0.25 to 10, more preferably 0.33 to 3. [

Further, as the heat-resistant layer and / or the rust-preventive layer, a cobalt-nickel alloy plating layer of nickel having an adhesion amount of 200 to 2000 占 퐂 / dm2 and a cobalt of -50 to 700 占 퐂 / dm2 can be formed. This treatment can be regarded as a kind of rust treatment in a broad sense. This cobalt-nickel alloy plating layer needs to be carried out to such an extent that the bonding strength between the copper foil and the substrate is not substantially lowered. When the cobalt adherence amount is less than 200 占 퐂 / dm2, the heat-resisting peel strength may be lowered and the oxidation resistance and chemical resistance may be deteriorated. In addition, as another reason, if the amount of cobalt is small, the treated surface becomes reddish, which is not preferable.

After the roughening treatment, a cobalt-nickel alloy plating layer of nickel having an adhesion amount of 200 to 3000 占 퐂 / dm2 and a cobalt-100 to 700 占 퐂 / dm2 can be formed on the roughened surface. This treatment can be regarded as a kind of rust treatment in a broad sense. This cobalt-nickel alloy plating layer needs to be carried out to such an extent that the bonding strength between the copper foil and the substrate is not substantially lowered. When the cobalt adherence amount is less than 200 占 퐂 / dm2, the heat-resisting peel strength may be lowered and the oxidation resistance and chemical resistance may be deteriorated. In addition, as another reason, if the amount of cobalt is small, the treated surface becomes reddish, which is not preferable. If the amount of cobalt adhered exceeds 3000 占 퐂 / dm2, it is not preferable when the effect of magnetism is to be considered, etching unevenness may occur, and acid resistance and chemical resistance may be deteriorated. The preferable cobalt deposition amount is 500 to 2500 占 퐂 / dm2. On the other hand, when the nickel adhesion amount is less than 100 占 퐂 / dm2, the heat peel strength may be lowered and the oxidation resistance and chemical resistance may be deteriorated. If the nickel exceeds 1300 占 퐂 / dm2, the alkali etching property is deteriorated. The preferred amount of nickel adhered is 200 to 1200 占 퐂 / dm2.

The conditions of the cobalt-nickel alloy plating are as follows:

Plating bath composition: Co 1 to 20 g / l, Ni 1 to 20 g / l

pH: 1.5 to 3.5

Temperature: 30 ~ 80 ℃

Current density D _k : 1.0 to 20.0 A / dm 2

Plating time: 0.5 to 4 seconds

According to the present invention, a zinc plating layer having an adhesion amount of 30 to 250 占 퐂 / dm2 is further formed on the cobalt-nickel alloy plating. When the zinc adhesion amount is less than 30 占 퐂 / dm2, the effect of improving the heat deterioration rate may be lost. On the other hand, when the zinc adhesion amount exceeds 250 占 퐂 / dm2, the hydrochloric acid deterioration rate may be extremely deteriorated. Preferably, the zinc adhesion amount is 30 to 240 占 퐂 / dm2, more preferably 80 to 220 占 퐂 / dm2.

The conditions of the zinc plating are as follows:

Plating bath composition: Zn 100 ~ 300 g / ℓ

pH: 3-4

Temperature: 50 ~ 60 ℃

Current density D _k : 0.1 to 0.5 A / dm 2

Plating time: 1 to 3 seconds

Alternatively, a zinc alloy plating layer such as a zinc-nickel alloy plating layer may be formed instead of the zinc plating layer, or a rust-preventive layer may be formed on the outermost surface by chromate treatment, application of a silane coupling agent or the like.

As the weather resistant layer, a known weather resistant layer can be used. As the weather resistant layer, for example, a well-known silane coupling treatment layer can be used, and a silane coupling treatment layer formed using the following silane can be used.

A known silane coupling agent may be used for the silane coupling agent used in the silane coupling treatment. For example, an amino silane coupling agent, an epoxy silane coupling agent, or a mercapto silane coupling agent may be used. Examples of the silane coupling agent include vinyltrimethoxysilane, vinylphenyltrimethoxysilane,? -Methacryloxypropyltrimethoxysilane,? -Glycidoxypropyltrimethoxysilane, 4-glycidylbutyltrimethoxy Aminopropyltrimethoxysilane, N-3- (4- (3-aminopropoxy) butoxy) propyl-3-aminopropyl Trimethoxysilane, imidazole silane, triazinilane, gamma-mercaptopropyltrimethoxysilane, or the like may be used.

The silane coupling treatment layer may be formed using a silane coupling agent such as an epoxy silane, an amino silane, a methacryloxy silane, or a mercapto silane. Two or more such silane coupling agents may be used in combination. Among them, it is preferable to use an amino-based silane coupling agent or an epoxy-based silane coupling agent.

Examples of the amino-based silane coupling agent include N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, 3- (N-styrylmethyl-2-aminoethylamino) propyltrimethoxysilane, 3- Aminopropyltriethoxysilane, bis (2-hydroxyethyl) -3-aminopropyltriethoxysilane, aminopropyltrimethoxysilane, N-methylaminopropyltrimethoxysilane, N-phenylaminopropyltrimethoxy Silane, N- (3-acryloxy-2-hydroxypropyl) -3-aminopropyltriethoxysilane, 4-aminobutyltriethoxysilane, (aminoethylaminomethyl) phenethyltrimethoxysilane, N- Aminopropyl) trimethoxysilane, N- (2-aminoethyl-3-aminopropyl) tris (2-ethylhexoxy) silane, 6- (aminohexylaminopropyl) , Aminophenyltrimethoxysilane, 3- (1-aminopropoxy) -3,3-dimethyl-1-propenyltrimethoxysilane, 3- (Methoxyethoxyethoxy) silane, 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, omega -aminoundecyltrimethoxysilane, 3- (2-N- benzylaminoethylamino Propyl) trimethoxysilane, bis (2-hydroxyethyl) -3-aminopropyltriethoxysilane, (N, N-diethyl- Aminopropyl) trimethoxysilane, N-methylaminopropyltrimethoxysilane, N-phenylaminopropyltrimethoxysilane, 3- (N-styrylmethyl-2-aminoethylamino) propyltrimethoxysilane aminopropyltrimethoxysilane, N-3- (4- (3-aminopropoxy) butoxy) propyl-3-aminopropyltriethoxysilane, N- Methoxysilane, and methoxysilane.

The silane coupling treatment layer is preferably used in a range of 0.05 mg / m 2 to 200 mg / m 2, preferably 0.15 mg / m 2 to 20 mg / m 2, preferably 0.3 mg / m 2 to 2.0 mg / . In the above-mentioned range, the adhesion between the base resin and the surface-treated copper foil can be further improved.

When roughening treatment is usually performed on the surface of the copper foil, the copper foil in the aqueous solution of copper sulfate is the prior art, but copper-cobalt-nickel alloy plating or copper-nickel-nickel alloy plating containing a metal other than copper in the plating bath (PI) of not less than 50 and not more than 65 before bonding the copper foil to the copper foil by the alloy plating of the surface of the copper foil on the surface of the copper foil, It is possible to perform the surface treatment in which the color difference? E * ab based on Z8730 is 50 or more.

[Surface color difference? E * ab]

The surface-treated copper foil of the present invention is a copper-clad laminate obtained by laminating polyimide having a ΔB (PI) of 50 or more and 65 or less before adhering to a copper foil from one surface side of the copper- The chrominance DELTA E * ab based on Z8730 is controlled to be 50 or more. With this configuration, the contrast with the back surface becomes clear, and the visibility when the copper foil is observed over the polyimide substrate becomes high. As a result, when the copper foil is used for circuit formation or the like, alignment at the time of mounting an IC chip, which is carried out through a positioning pattern visible through the polyimide substrate, is facilitated. If the color difference? E * ab is less than 50, there is a possibility that the contrast with the back surface becomes unclear. The color difference? E * ab is more preferably 53 or more, 55 or more, and more preferably 60 or more. The upper limit of the color difference ΔE * ab is not particularly limited, but is, for example, 90 or less, 88 or less, or 87 or less, or 85 or less, or 75 or less, or 70 or less.

Here, the color difference [Delta] E * ab is an aggregate index measured using a L * a * b colorimetric system based on JIS Z8730, measured with a colorimeter and added with black / white / red / green / ? A: redox,? B: sulfur, represented by the following formula:

[10 point average roughness Rz of the surface of the copper foil]

The surface-treated copper foil of the present invention may be an unhardened copper foil on one surface of the copper foil, may be a roughened copper foil having roughened particles formed thereon, and may have a ten-point average roughness Rz of TD measured by a contact- Is preferably 0.20 to 0.64 mu m. With such a constitution, the peel strength becomes high, and the resin adheres well to the resin, and after the copper foil is removed by etching, the transparency of the resin becomes high. As a result, it becomes easy to align the IC chip when mounting the IC chip through a positioning pattern which is visible through the resin. If the ten-point average roughness Rz of TD measured by a contact type illuminometer on one surface of the copper foil is less than 0.20 mu m, there is a fear that the roughening treatment of the surface of the copper foil is insufficient, . On the other hand, if the ten-point average roughness Rz of TD measured by a contact type roughness meter on one surface of the copper foil is more than 0.64 mu m, the unevenness of the resin surface after the removal of the copper foil by etching may become large, There is a fear that this problem may become defective. The 10-point average roughness Rz of TD measured by a contact type roughness meter on one surface of the copper foil is more preferably 0.26 to 0.62 占 퐉, and still more preferably 0.40 to 0.55 占 퐉.

In order to achieve the effect of visibility, the illuminance (Rz) and gloss of the TD measured by a contact type illuminometer on one surface of the copper foil before the surface treatment are controlled. Specifically, the surface roughness Rz of the TD measured by a contact roughness meter on one surface of the copper foil before the surface treatment is set to 0.20 to 0.55 mu m, preferably 0.20 to 0.42 mu m. Such a copper foil may be prepared by rolling (high gloss rolling) by adjusting the oil film equivalent of the rolling oil, or by chemical polishing such as chemical etching or electrolytic polishing in a phosphoric acid solution. By setting the surface roughness (Rz) and the gloss of TD on one surface of the copper foil before treatment to the above range, it is possible to easily control the surface roughness (Rz) and surface area on one surface of the treated copper foil can do.

The copper foil before surface treatment is more preferably 500 to 810%, and more preferably 500 to 710%, with the 60 degree glossiness of TD on one surface being 300 to 910%, more preferably 500 to 810%. If the 60 degree glossiness of the MD on one surface of the copper foil before the surface treatment is less than 300%, the transparency of the above-mentioned resin may become worse than that of 300% or more, and if it exceeds 910% There is a concern that difficulty may arise.

The high gloss rolling can be carried out by setting the oil film equivalent defined by the following formula to 13000 to 24000 or less.

(Yield stress [kg / mm &lt; 2 &gt;]) of the material = {(rolling oil viscosity [cSt]) x (passing speed [mpm] + roll main speed [mpm])} }

The viscosity of the rolling oil [cSt] is the kinematic viscosity at 40 ° C.

In order to make the oil film equivalent to 13000 to 24000, it is possible to use a known method such as using low-viscosity rolling oil or slowing the passing speed.

The chemical polishing is carried out for a long period of time by lowering the concentration by an etching solution such as a sulfuric acid-hydrogen peroxide-water system or an ammonia-hydrogen peroxide-water system.

[Brightness Curve]

The surface-treated copper foil of the present invention is obtained by laminating polyimide having a ΔB (PI) of 50 or more and 65 or less before adhering to a copper foil from one surface side, and then photographing the copper foil with a CCD camera over polyimide In the observation point-lightness graph obtained by measuring the brightness of each observation point along the direction perpendicular to the direction in which the observed copper foil extends, the brightness of the image obtained from the end of the copper foil to the portion without the copper foil The difference? B (? B = Bt - Bb) between the top average value Bt of the curve and the bottom average value Bb is 40 or more.

In the observation point-brightness graph, a value indicating the position of an intersection point closest to the copper foil among the intersections of the lightness curve and Bt is t1, and the depth from the intersection of the brightness curve and Bt to 0.1 B , The value Sv defined by the following formula (1) is preferably 3.0 or more, where t2 is a value indicating the position of the intersection point closest to the copper foil in the intersection of the brightness curve and 0.1 DELTA B.

Sv = (DELTA Bx0.1) / (t1 - t2) (1)

Here, the top average value Bt of the brightness curve, the bottom average value Bb of the brightness curve, and t1, t2, and Sv described later will be described with reference to the drawings.

Fig. 1 (a) and Fig. 1 (b) are schematic views for defining Bt and Bb when the width of the copper foil is set to about 0.3 mm. When the width of the copper foil is set to about 0.3 mm, there may be a case where the lightness curve has a V-shape as shown in Fig. 1 (a) and a lightness curve having a bottom as shown in Fig. 1 (b). In any case, the &quot; top average value Bt of brightness curve &quot; represents an average value of brightness measured at five points (10 points in total at both sides) at intervals of 30 占 퐉 at positions 50 占 퐉 away from the end positions on both sides of the copper foil. On the other hand, the "bottom average value Bb of brightness curve" indicates the minimum brightness value at the tip of the V-shaped bone when the brightness curve becomes V-shape as shown in Fig. 1 (a) ), The value of the central portion of about 0.3 mm is shown. The width of the mark may be about 0.2 mm, 0.16 mm, and 0.1 mm. The &quot; top average value Bt of brightness curve &quot; was measured at five points (total 10 points on both sides) at intervals of 30 占 퐉 at positions separated by 100 占 퐉, 300 占 퐉, or 500 占 퐉 from the end positions on both sides of the mark The average value of the brightness at the time of exposure may be used.

Fig. 2 shows a schematic diagram defining t1 and t2 and Sv. "T1 (pixel x 0.1)" represents an intersection closest to the copper foil among intersections of the brightness curve and Bt. "T2 (pixel x 0.1)" represents an intersection point closest to the copper foil among the intersections of the brightness curve and 0.1? B in the depth range from the intersection of the brightness curve and Bt to 0.1? B with respect to Bt. At this time, the slope of the brightness curve represented by the line connecting t1 and t2 is defined as Sv (grayscale / pixel x 0.1) calculated as 0.1 DELTA B in the y axis direction and (t1 - t2) in the x axis direction. Further, one pixel on the horizontal axis corresponds to a length of 10 mu m. Further, Sv measures both sides of the copper foil to adopt a small value. Further, when the shape of the brightness curve is unstable and a plurality of "intersection points of brightness curve and Bt" exist, an intersection point closest to the copper foil is employed.

In the image photographed with the CCD camera, a high brightness is obtained in a portion where no copper foil is present, but brightness is reduced as soon as it reaches the copper foil end portion. When the visibility when viewed over the polyimide substrate is good, such a state of decrease in brightness is clearly observed. On the other hand, if the visibility is poor when viewed over the polyimide substrate, the brightness is not suddenly lowered from "high" to "low" at once in the vicinity of the copper foil end, but the lowered state becomes gentle and the lowered state of brightness becomes unclear .

On the basis of the above finding, the present invention provides a surface-treated copper foil of the present invention which comprises a laminate of a polyimide having a? B (PI) of 50 or more and 65 or less before adhering to a copper foil, When the copper foil was photographed with a CCD camera over polyimide, the image obtained by photographing was measured by measuring the brightness at each observation point along a direction perpendicular to the direction in which the observed copper foil was stretched. The difference? B (? B = Bt - Bb) between the top average value Bt and the bottom average value Bb of the brightness curve occurring from the end portion of the copper foil to the portion without the copper foil is controlled to be 40 or more. Alternatively, in the surface-treated copper foil of the present invention, the Sv value is controlled to 3.0 or more.

According to this structure, the discrimination power of the copper foil beyond the polyimide by the CCD camera is improved without being influenced by the type and thickness of the substrate resin. Therefore, good visibility when observed from the polyimide substrate is obtained, and positioning accuracy such as marking by the copper foil when the polyimide substrate is subjected to a predetermined treatment in an electronic substrate manufacturing process or the like is improved, And the like can be obtained.

In the present invention, Sv is preferably at least 3.5, more preferably at least 3.9, even more preferably at least 4.5, more preferably at least 5.0, even more preferably at least 5.5. The upper limit of Sv is not particularly limited, but is, for example, 15 or less and 10 or less. With such a configuration, the boundary between the copper foil and the non-copper foil becomes clearer, the positioning accuracy is improved, the error due to the copper foil image recognition is reduced, and the alignment can be performed more accurately.

Further, the surface-treated copper foil is laminated on both surfaces of the polyimide, and then the copper foils on both surfaces are removed by etching so that only the copper foil on one surface is molded into a circuit and the visibility obtained by observing the copper foil on the circuit over the polyimide If such a surface-treated copper foil is favorable, the resulting surface-treated copper foil is laminated on the polyimide, and then the visibility obtained by observing on the polyimide is improved.

[Surface Area Ratio]

The ratio A / B of the three-dimensional surface area A and the two-dimensional surface area B of one surface of the copper foil greatly affects the transparency of the above-mentioned resin. That is, when the surface roughness Rz is the same, the copper as the copper having a small ratio A / B becomes better in transparency of the above-mentioned resin. Therefore, the surface-treated copper foil of the present invention preferably has a ratio A / B of 1.0 to 1.7, more preferably 1.0 to 1.6. Here, the ratio A / B of the three-dimensional surface area A and the two-dimensional surface area B of the coarse particles on the surface of the surface-treated side can be determined by, for example, the surface area A of the coarse particles, It can be said as the ratio A / B of the area B obtained when viewed from the plane.

By controlling the current density and the plating time at the time of surface treatment such as the formation of particles, the surface state such as the shape of the particles, the density of formation and the irregularity state of the surface are determined and the surface roughness Rz, the glossiness, / B can be controlled.

In the surface-treated copper foil of the present invention, the surface of the copper foil on the surface opposite to the surface to be bonded to the resin substrate (in the present invention, the surface is also referred to as the &quot; other surface &quot;) is subjected to surface treatment. When a surface-treated copper foil is bonded to a resin substrate from one surface side, generally, a resin substrate / surface-treated copper foil / protective film is laminated in this order, and heat and pressure . At this time, there is a problem in that a protective film is stuck on the surface (the other surface) of the surface-treated copper foil opposite to the resin substrate side (the surface-treated copper foil does not slip between the surface-treated copper foil and the protective film) . When such a problem occurs, wrinkles or streaks are generated on the other surface of the copper foil. On the other hand, the surface-treated copper foil of the present invention is surface-treated on the other surface, and the contact area between the copper foil and the protective film is increased so that the protective film is attached to the copper foil in the lamination step with the resin substrate Can be suppressed well.

In the surface-treated copper foil of the present invention, the ten-point average roughness Rz of TD measured by a laser microscope having a wavelength of laser beam of 405 nm on the surface of the copper surface subjected to the other surface treatment on the other surface is 0.35 탆 or more. With this configuration, it is possible to further suppress the problem that the protective film is attached to the copper foil in the lamination step with the resin substrate by further increasing the contact area between the copper foil and the protective film. The surface-treated copper foil of the present invention preferably has a ten-point average roughness Rz of TD of 0.40 占 퐉 or more as measured by a laser microscope having a wavelength of laser light of 405 nm on the other surface-treated copper foil surface, more preferably 0.50 占 퐉 or more More preferably 0.60 占 퐉 or more, even more preferably 0.8 占 퐉 or more, and typically 0.40 to 4.0 占 퐉, and more typically 0.50 to 3.0 占 퐉. The upper limit of the 10-point average roughness Rz of the TD of the surface-treated copper foil of the present invention measured by a laser microscope having a wavelength of laser beam of 405 nm on the surface of the copper surface subjected to the other surface treatment is not particularly limited, Is 4.0 m or less, more typically 3.0 m or less, more typically 2.5 m or less, and more typically 2.0 m or less.

In the surface-treated copper foil of the present invention, the arithmetic average roughness Ra of the TD measured by a laser microscope having a wavelength of laser beam of 405 nm on the other surface-treated copper foil surface is 0.05 m or more. With this configuration, it is possible to further suppress the problem that the protective film is attached to the copper foil in the lamination step with the resin substrate by further increasing the contact area between the copper foil and the protective film. The surface-treated copper foil of the present invention preferably has an arithmetic mean roughness Ra of 0.08 占 퐉 or more, and more preferably 0.10 占 퐉 or more as measured by a laser microscope having a wavelength of 405 nm on the surface of the copper foil subjected to the other surface treatment Still more preferably 0.20 mu m or more, and still more preferably 0.30 mu m or more. The upper limit of the arithmetic average roughness Ra of the surface-treated copper foil of the present invention measured by a laser microscope having a laser beam of 405 nm on the surface of the copper surface subjected to the other surface treatment is not particularly limited, More typically 0.80 mu m or less, more typically 0.65 mu m or less, more typically 0.50 mu m or less, and more typically 0.40 mu m or less.

In the surface-treated copper foil of the present invention, the square root mean square height Rq of TD measured by a laser microscope having a wavelength of laser beam of 405 nm on the other surface-treated copper foil surface is 0.08 mu m or more. With this configuration, it is possible to further suppress the problem that the protective film is attached to the copper foil in the lamination step with the resin substrate by further increasing the contact area between the copper foil and the protective film. The surface-treated copper foil of the present invention preferably has a square root mean square height Rq of TD of 0.10 탆 or more as determined by a laser microscope having a wavelength of laser beam of 405 nm on the other surface-treated copper foil surface, and more preferably 0.15 탆 or more More preferably 0.20 占 퐉 or more, even more preferably 0.30 占 퐉 or more, and typically 0.08 to 0.60 占 퐉, and more typically 0.10 to 0.50 占 퐉. The upper limit of the square root mean square root height Rq of the TD of the surface-treated copper foil of the present invention measured by a laser microscope having a wavelength of 405 nm of laser light on the surface of the copper surface subjected to the other surface treatment is not particularly limited, Is not more than 0.80 mu m, more typically not more than 0.60 mu m, more typically not more than 0.50 mu m, and more typically not more than 0.40 mu m.

The surface treatment of the other surface of the surface-treated copper foil of the present invention is not particularly limited and may be a roughening treatment. The roughening treatment may be omitted, and a heat-resistant layer or rust-preventive layer may be formed by plating (normal plating, .

For example, a roughening treatment may be performed using a plating solution containing copper sulfate and an aqueous sulfuric acid solution, or the roughening treatment may be performed using a plating solution comprising a copper sulfate and an aqueous sulfuric acid solution. It may be an alloy plating such as a copper-cobalt-nickel alloy plating, a copper-nickel-phosphorus alloy plating or a nickel-zinc alloy plating. It is also preferable to conduct the plating by copper alloy plating. The copper alloy plating bath includes, for example, a plating bath containing at least one element other than copper and copper, more preferably a group consisting of copper and cobalt, nickel, arsenic, tungsten, chromium, zinc, phosphorus, manganese and molybdenum Is preferably used as the plating bath.

The other surface treatment in the surface-treated copper foil of the present invention may be surface treatment other than the above-mentioned roughening treatment or plating treatment.

As the surface treatment for forming the irregularities on the surface of the other surface, the surface treatment by electrolytic polishing may be performed. For example, unevenness can be formed on the other surface of the copper foil by electrolytically polishing the other surface of the copper foil in a solution comprising copper sulfate and an aqueous solution of sulfuric acid. Electrolytic polishing is generally aimed at smoothing, but in the surface treatment of the other side of the present invention, unevenness is formed by electrolytic polishing, which is contrary to ordinary practice. The method of forming the irregularities by electrolytic polishing may be carried out by a known technique. Examples of known techniques of electrolytic polishing for forming the irregularities include the methods described in JP-A-2005-240132, JP-A-2010-059547, and JP-A-2010-047842. Specific conditions of the process for forming the concavities and convexities by electrolytic polishing include, for example,

Treatment solution: Cu: 20 g / l, H ₂ SO ₄ : 100 g / l, temperature: 50 ° C

Electrolytic polishing current: 15 A / dm 2

Electrolytic polishing time: 15 seconds

And the like.

As the surface treatment for forming the irregularities on the surface of the other, for example, the irregularities may be formed by mechanically polishing the other surface. The mechanical polishing may be performed by a known technique.

After the other surface treatment in the surface-treated copper foil of the present invention, a heat-resistant layer, rust-preventive layer or weather-resistant layer may be formed. The heat-resistant layer, the rust-preventive layer and the weather-resistant layer may be the methods described in the above-mentioned description and experimental examples, or may be a known technique.

The surface treated copper foil of the present invention can be bonded to an insulating resin substrate from one surface side to produce a laminate. The insulating resin substrate is not particularly limited as long as it has properties applicable to a printed wiring board and the like. For example, a paper substrate phenol resin, a paper base epoxy resin, a synthetic fiber base epoxy resin, a glass / paper composite substrate epoxy A polyester film, a polyimide film, a liquid crystal polymer (LCP) film, a Teflon (registered trademark) film, or the like can be used for an FPC using a resin, glass / glass nonwoven composite substrate epoxy resin, have.

In the case of the rigid PWB, the prepreg is prepared by impregnating a base material such as a glass cloth with resin and curing the resin to a semi-hardened state. The copper foil may be superimposed on the prepreg from the opposite side of the coating layer and heated and pressed. In the case of FPC, a laminate can be manufactured by laminating the laminate to a copper foil under a high temperature and high pressure without using an adhesive on a base material such as a polyimide film, or applying a polyimide precursor, drying and curing have.

The thickness of the polyimide base resin is not particularly limited, but it is generally 25 占 퐉 or 50 占 퐉.

The laminate of the present invention can be applied to various printed wiring boards (PWB) and is not particularly limited. For example, it can be applied to single-sided PWB, double-sided PWB, multilayer PWB (three or more layers) And is applicable to rigid PWB, flexible PWB (FPC), and rigid flex PWB from the viewpoint of kinds of insulating substrate materials. The electronic device of the present invention can be manufactured by using such a printed wiring board.

The printed circuit board according to the present invention is a printed circuit board having an insulating resin substrate and a copper circuit formed on an insulating resin substrate, wherein the copper circuit has a surface on one side of the insulating resin substrate, And the color difference DELTA E * ab based on JIS Z8730 of the surface of the copper circuit beyond the insulating resin substrate is not less than 50. When the copper circuit is photographed by the CCD camera over the insulating resin substrate, The observation point-brightness graph was produced by measuring the brightness of each observation point along the direction perpendicular to the direction in which the observed copper circuit was elongated. In the observation point-brightness graph, a curve of brightness curve arising from the end of the copper circuit to the portion without the copper circuit The difference? B (? B = Bt - Bb) between the average value Bt and the bottom average value Bb becomes 40 or more. By using such a printed wiring board, positioning of the printed wiring board can be performed more accurately.

The printed circuit board according to the present invention is a printed circuit board having an insulating resin substrate and a copper circuit formed on an insulating resin substrate, wherein the copper circuit has a surface on one side of the insulating resin substrate, Wherein a color difference DELTA E * ab based on JIS Z8730 of the surface of the copper circuit beyond the insulating resin substrate is 50 or more, and when the copper circuit is photographed by the CCD camera over the insulating resin substrate, In the observation point-brightness graph prepared by measuring the brightness of each observation point along a direction perpendicular to the direction in which the observed copper circuit extends, with respect to the obtained image, (B = Bt - Bb) between the top average value Bt and the bottom average value Bb of the brightness curve occurring over the portion And a value indicating the position of an intersection point closest to the copper circuit among the intersections of the brightness curve and Bt is t1 and the brightness curve and the brightness curve in the depth range from the intersection of the brightness curve and Bt to Sv defined by the following formula (1) is 3.0 or more when t2 is a value indicating the position of an intersection closest to the copper circuit among 0.1? B intersections. By using such a printed wiring board, positioning of the printed wiring board can be performed more accurately.

Sv = (DELTA Bx0.1) / (t1 - t2) (1)

The copper clad laminate according to the present invention is a copper clad laminate having an insulating resin substrate and a copper foil formed on an insulating resin substrate, wherein the copper foil has one surface on the insulating resin substrate side, The color difference DELTA E * ab based on JIS Z8730 of the surface of the copper foil over the insulating resin substrate is not less than 50 and the copper foil of the copper clad laminate is made into a copper foil on the line by etching, In the observation point-brightness graph prepared by measuring the brightness of each observation point along the direction perpendicular to the direction in which the observed copper foil on the line is stretched with respect to the image obtained by photographing when photographed with a camera, (B = Bt - Bb) between the top average value Bt and the bottom average value Bb of the lightness curve that occurs from the end of the copper foil on the line to the portion without the copper foil on the line is 40 It is.

As the copper foil of the copper clad laminate of the present invention, the surface-treated copper foil of the present invention can be used.

When a printed wiring board is manufactured using such a copper clad laminate, positioning of the printed wiring board can be performed more accurately.

The copper clad laminate according to the present invention is a copper clad laminate having an insulating resin substrate and a copper foil formed on an insulating resin substrate, wherein the copper foil has one surface on the insulating resin substrate side, Wherein the color difference DELTA E * ab based on JIS Z8730 of the surface of the copper foil above the insulating resin substrate is not less than 50 and the copper foil of the copper clad laminate is made into a copper foil on the line by etching, The image obtained by the photographing was photographed with a CCD camera over a resin substrate. The observation point-brightness value was measured by measuring the brightness of each observation point along a direction perpendicular to the direction in which the copper foil on the line was observed In the graph, the top average value Bt of the brightness curve occurring from the end portion of the copper foil on the line to the portion having no copper foil on the line, And a value indicating a position of an intersection nearest to the copper foil on the line among the intersections of the brightness curve and Bt in the observation point-brightness graph is represented by t1, and a difference? B (B = Bt- And a value indicating a position of an intersection point closest to the copper foil on the line among the intersections of the brightness curve and 0.1? B in the depth range from the intersection of the brightness curve and Bt to 0.1? B with respect to Bt is represented by t2 1) is 3.0 or more.

As the copper foil of the copper clad laminate of the present invention, the surface-treated copper foil of the present invention can be used.

When a printed wiring board is manufactured using such a copper clad laminate, positioning of the printed wiring board can be performed more accurately.

Sv = (DELTA Bx0.1) / (t1 - t2) (1)

In the printed wiring board or the copper clad laminate of the present invention described above, the surface of the copper circuit or the copper foil on the opposite side of the surface to be bonded to the resin substrate (the other surface) is subjected to surface treatment. When the printed wiring board or the copper clad laminate is passed through a production line of roll-to-roll, the transfer roll in the production line and the printed circuit board or the copper clad laminate are pasted (not slipped) between the surface opposite to the resin substrate side Sometimes a problem arises. When such a problem occurs, wrinkles or streaks are generated on the other surface of the copper circuit or the copper foil. On the other hand, the printed wiring board or the copper clad laminate of the present invention is surface-treated on the other surface, and is attached (slipped) to the transfer roll in the production line by increasing the contact area between the copper circuit or the copper foil and the protective film, The problem of discarding can be satisfactorily suppressed. Further, since the adhesion between the other surface and the dry film and the coverlay is improved, the weather resistance of the printed wiring board or the copper clad laminate is improved.

(Layers and method for positioning printed wiring boards using the same)

A method of positioning the metal-resin laminate according to the present invention will be described. First, a laminate of a metal and a resin is prepared. The form of the laminate of the metal and the resin is not particularly limited as long as it is formed by bonding a metal to the resin. As a specific example of the metal-resin laminate of the present invention, metal wiring such as copper is formed on at least one surface of a resin such as polyimide used for electrically connecting the main substrate and the accessory circuit board to each other In an electronic apparatus constituted by a flexible printed circuit board, a flexible printed circuit board is precisely positioned and pressed onto a wiring end of the main circuit board and the accessory circuit board. That is, in this case, the laminate is a laminate in which the end portions of the flexible printed circuit board and the main board are bonded by compression, or a laminate in which the end portions of the flexible printed circuit board and the circuit board are bonded by compression. The laminate has a mark formed of a part of the metal wiring or a separate material. The position of the mark is not particularly limited as far as it can be photographed by a photographing means such as a CCD camera over the resin constituting the laminate.

In the thus-prepared laminate, the mark described above is photographed by a photographing means over a resin, and a brightness for each observation point along a direction perpendicular to the direction in which the mark is observed is observed with respect to the image obtained by the photographing (B = Bt - Bb) between the top average value Bt and the bottom average value Bb of the brightness curve occurring from the end portion of the mark to the portion having no mark, Position of the laminated body of metal and resin is determined based on the position of the detected mark.

In this case, the position of the mark may be detected using only the Sv value, and the laminated body of metal and resin may be positioned based on the detected position of the mark, and both of the? B value and the Sv value May be used to detect the position of the mark and position the stack of metal and resin on the basis of the position of the detected mark.

According to such a positioning method, a boundary between a mark and a non-mark portion becomes more clear, positioning accuracy is improved, error due to mark image recognition is reduced, and positioning can be performed more accurately. For example, when the value of the DELTA B value, the value of the Sv, or the value of the DELTA B and the value of the Sv are equal to or larger than a predetermined value, the apparatus for detecting the position may determine that the mark exists at the position. Concretely, for example, when the determination is made based only on the ΔB value, when the determination is made based on only the Sv value when the ΔB is 40 or more, when the Sv is 3.0 or more, or when the determination is made based on the ΔB value and the Sv value , The position detecting device can determine that the mark exists at the position when? B is 40 or more and Sv is 3.0 or more. By using such a positioning method, positioning of the printed wiring board can be performed more accurately.

Therefore, when one printed wiring board is connected to another printed wiring board, it is considered that the defective connection is reduced and the yield is improved. At this time, the copper foil may be subjected to a surface treatment. As a method of connecting one printed wiring board to another printed wiring board, a method of connecting via anisotropic conductive film (ACF), anisotropic conductive paste (ACP) A known connection method such as connection through an adhesive having conductivity can be used. In the present invention, the &quot; printed wiring board &quot; includes a printed wiring board on which components are mounted, a printed circuit board, and a printed board. It is also possible to manufacture a printed wiring board to which two or more printed wiring boards are connected by connecting two or more printed wiring boards according to the present invention. Further, at least one printed wiring board of the present invention, Alternatively, a printed wiring board not corresponding to the printed wiring board of the present invention can be connected, and an electronic apparatus can be manufactured using such a printed wiring board. In the present invention, the "copper circuit" is also assumed to include a copper wiring.

The positioning method according to the embodiment of the present invention may also include a step of moving a laminate (including a laminate of copper and resin or a printed wiring board). In the moving process, for example, it may be moved by a conveyor such as a belt conveyor or a chain conveyor, or may be moved by a moving device provided with an arm mechanism, or may be moved by moving a stack by using a gas, (Including a roller, a bearing, and the like) that moves a laminate by rotating an article such as a substantially cylindrical shape, a moving device or a moving device using hydraulic pressure as a power source, A moving device having a stage such as a moving device or a moving device, a moving device or a moving device using a motor as a power source, a gantry moving linear guide stage, a gantry moving air guide stage, a stacked linear guide stage, a linear motor driving stage, . Also, a moving process by a known moving means may be carried out.

The positioning method according to the embodiment of the present invention may be used in a surface mount machine or a chip mounter.

The laminated body of the metal and the resin positioned in the present invention may be a printed wiring board having a resin plate and a circuit formed on the resin plate. In this case, the mark may be the circuit.

In the present invention, &quot; positioning &quot; includes &quot; detecting the position of a mark or an object &quot;. In the present invention, &quot; alignment &quot; includes &quot; moving a mark or an object to a predetermined position based on the detected position after detecting the position of the mark or object &quot;.

Example

Each of the copper foils was prepared as Examples 1 to 9 and Comparative Examples 1 to 6, and plating treatment was carried out on one surface thereof under the conditions shown in Table 2 and Table 3 as a roughening treatment.

The rolled copper foil was prepared as follows. A predetermined copper ingot was produced and subjected to hot rolling. Annealing and cold rolling of a continuous annealing line at 300 to 800 캜 were repeated to obtain a rolled plate having a thickness of 1 to 2 mm. The rolled sheet was annealed by a continuous annealing line at 300 to 800 캜 to be recrystallized, and finally cold rolled to a thickness of Table 1 to obtain a copper foil. The "tough pitch dynamics" in Table 1 indicates tough pitch dynamics specified in JIS H3100 C1100. "Oxygen free copper" in Table 1 indicates oxygen free copper specified in JIS H3100 C1020. &Quot; ppm &quot; of the additive element described in Table 1 indicates ppm by mass. For example, &quot; tough pitch copper + Ag 180 ppm &quot; in Table 1 indicates the addition of 180 mass ppm of Ag to tough pitch copper.

The electrolytic copper foil was prepared under the following conditions.

Electrolyte composition (copper: 100 g / l, sulfuric acid: 100 g / l, chlorine: 50 ppm, leveling agent 1 (bis (3 sulfopropyl) disulfide): 10 to 30 ppm, leveling agent 2 10 to 30 ppm)

· Electrolyte temperature: 50 to 60 ° C

Current density: 70 to 100 A / dm 2

· Delivery time: 1 minute

· Electrolyte Line Speed: 4 m / sec

The following amine compounds were used for the amine compounds.

(2)

Wherein R ₁ and R ₂ are selected from the group consisting of a hydroxyalkyl group, an ether group, an aryl group, an aromatic substituted alkyl group, an unsaturated hydrocarbon group and an alkyl group.

Table 1 shows the points of the copper foil manufacturing process on the one surface before the surface treatment. &Quot; High gloss rolling &quot; means that the final cold rolling (cold rolling after final recrystallization annealing) is carried out at the value of the film equivalent described.

In Comparative Example 5, the same surface treatment as in Example 2 was carried out, and in Comparative Example 6, the same surface treatment as in Example 6 was carried out.

In the examples, the following surface treatment was performed on the other surface of the copper foil.

· Surface treatment conditions

Plating solution

Cu: 15 g / l, Co: 9 g / l, Ni: 9 g / l

pH: 3

Temperature: 38 ° C

Current density: 25 A / dm 2

Plating time: 1 second

Various evaluations were carried out for each of the samples prepared as described above and the comparative example as follows.

Measurement of surface roughness (Rz);

10-point average roughness was measured with respect to one surface of the copper foil after the surface treatment of each of the examples and comparative examples using a contact type roughness meter Surfcorder SE-3C manufactured by Kosaka Laboratory Co., Ltd. according to JIS B0601-1994. The measurement position is changed in the direction (TD) perpendicular to the rolling direction for the rolled copper foil under the conditions of the measurement reference length of 0.8 mm, the evaluation length of 4 mm, the cutoff value of 0.25 mm and the feed rate of 0.1 mm / The measurement positions were changed in the direction (TD) perpendicular to the advancing direction of the electrolytic copper foil in the copper foil production apparatus, and the measurements were carried out ten times, and the values at ten measurements were obtained.

The surface roughness (Rz) of the copper foil before the surface treatment was also determined in the same manner.

It is preferable that the surface roughness of the other surface after the surface treatment of each of the examples and the comparative examples is measured by a non-contact method. Specifically, the surface state of the other surface after the surface treatment of each of the examples and the comparative examples is evaluated with the value of the roughness measured with a laser microscope. This is because the surface state can be evaluated in more detail.

The surface roughness (10-point average roughness) Rz of the other surface of the surface-treated copper foil was measured by a laser microscope OLS4000 manufactured by Olympus Co., in accordance with JIS B0601 1994. The measurement was carried out by measuring the direction TD perpendicular to the rolling direction with respect to the rolled copper foil under the condition of an evaluation length of 258 mu m and a cutoff value of zero at the observation of the surface of the copper foil using an objective lens 50 times, (TD) perpendicular to the advancing direction of the electrolytic copper foil in the production apparatus of the present invention. The measurement environment temperature of the surface roughness Rz by the laser microscope was 23 to 25 占 폚. Rz was arbitrarily measured at 10 points, and the average value of 10 points of Rz was taken as the value of surface roughness (10 point average roughness) Rz. The wavelength of the laser light of the laser microscope used for the measurement was 405 nm.

Measuring the root-mean-square height Rq of the surface;

The square-root-mean-square height Rq of the surface of the copper foil was measured according to JIS B0601 2001 using a laser microscope OLS4000 manufactured by Olympus, Inc., on the other surface of the copper foil of each of the examples and comparative examples. The measurement was carried out by measuring the direction TD perpendicular to the rolling direction with respect to the rolled copper foil under the condition of an evaluation length of 258 mu m and a cutoff value of zero at the observation of the surface of the copper foil using an objective lens 50 times, (TD) perpendicular to the traveling direction of the electrolytic copper foil in the production apparatus of the present invention. In addition, the measurement environment temperature of the root-mean-square root height Rq of the surface by the laser microscope was 23 to 25 캜. Rq were arbitrarily measured at 10 points, and the average value of the 10 points of the Rq was taken as the value of the square root mean square height Rq. The wavelength of the laser light of the laser microscope used for the measurement was 405 nm.

The measurement of the arithmetic average roughness Ra of the surface;

The surface roughness Ra of the other surface of the copper foil after the surface treatment of each of the examples and comparative examples was measured with a laser microscope OLS4000 manufactured by Olympus, in accordance with JIS B0601-1994. The measurement was carried out by measuring the direction TD perpendicular to the rolling direction with respect to the rolled copper foil under the condition of an evaluation length of 258 mu m and a cutoff value of zero at the observation of the surface of the copper foil using the objective lens 50 times, The respective values were obtained by measuring the direction (TD) perpendicular to the traveling direction of the electrolytic copper foil in the copper foil production apparatus. The measurement environment temperature of the arithmetic average roughness Ra of the surface by the laser microscope was set at 23 to 25 占 폚. Ra was arbitrarily measured at 10 points, and the average value of 10 points of the Ra was taken as the value of the arithmetic average roughness Ra. The wavelength of the laser light of the laser microscope used for the measurement was 405 nm.

· Measurement of color difference ΔE * ab beyond polyimide;

The surface-treated copper foil and the surface over the polyimide film in the copper-clad laminated board composed of a polyimide film (25 占 퐉 or 50 占 퐉 thick made by Kaneka) having? B (PI) of 50 or more and 65 or less before being adhered to the copper foil The color difference? E * ab based on JIS Z8730 was measured. The color difference? E * ab was measured in accordance with JIS Z8730 using a color difference meter MiniScan XE Plus manufactured by HunterLab. In the above-mentioned color difference meter, the color difference is calibrated by setting the measurement value when the measurement value of the white plate is covered with the black encapsulation of DELTA E * ab = 0 and the measurement value in the dark place is DELTA E * ab = 90. ? E * ab was measured on the basis of the following formula using L * a * b color system,? L: black and white,? A: red color, and? B: Here, the color difference [Delta] E * ab is defined as zero for white and 90 for black;

The color difference DELTA E * ab based on JIS Z8730 on the surface of the copper circuit can be measured using a micro face spectrophotometer (model: VSS400, etc.) manufactured by Nippon Seimei Kogyo Co., Ltd. or a micro face spectrophotometer : SC-50 占 and the like).

The area ratio (A / B) of the copper foil surface;

The surface area of one surface of the copper foil was measured by a laser microscope. On one surface of the copper foil after the surface treatment of each of the examples and comparative examples, a surface area of 647 占 퐉 占 646 占 퐉 corresponding to 20 times magnification of the treated surface was measured using a laser microscope OLS4000 manufactured by Olympus Corporation (417,953 占 퐉 ) Was measured, and the setting was performed by a three-dimensional surface area A / two-dimensional surface area B = area ratio (A / B). The measurement environment temperature of the three-dimensional surface area A by the laser microscope was set at 23 to 25 ° C.

Glossiness;

The rolled copper foil was subjected to a heat treatment in a direction TD perpendicular to the rolling direction (the direction of movement of the copper foil at the time of rolling, that is, the width direction) using a gloss gauge Handy Gloss Meter PG-1 manufactured by Nippon Seimei Kogyo K.K. The angle of incidence was measured at one surface before the surface treatment at 60 degrees. The electrolytic copper foil was measured with respect to the surface (matte surface) before the surface treatment at an incident angle of 60 degrees in the direction perpendicular to the direction of the copper foil during the electrolytic treatment (i.e., the width direction) TD.

· Slope of brightness curve

The produced copper foil was laminated on both sides of the polyimide film from one surface side toward the polyimide film.

Here, as the polyimide film, a polyimide film (PIXEO (polyimide type: FRS), a polyimide film with an adhesive layer for a copper clad laminate, PMDA (pyromellitic anhydride ) Based polyimide film (polyimide film of PMDA-ODA (4,4'-diaminodiphenyl ether) system)] was used.

In the evaluation of the visibility (resin transparency), the peel strength (adhesion strength) and the yield, which will be described later, the polyimide film to which the surface of the surface-treated copper foil according to each test example is bonded, The slope of the lightness curve &quot;.

Then, the copper foils on one side were all removed by etching. The copper foil on the other side was etched to form a line of 0.3 mm width. Thereafter, blank paper was laid on the back surface of a copper foil having a line width of 0.3 mm, and the film was photographed with a CCD camera (line CCD camera of 8192 pixels) over the polyimide film, and the observed copper foil In the observation point-brightness graph prepared by measuring the brightness of each observation point along the direction perpendicular to the extending direction, ΔB and t1, t2, and Sv are calculated from the brightness curve that occurs from the end of the mark to the portion without the mark Respectively. Fig. 3 is a schematic diagram showing a configuration of a photographing apparatus used at this time and a measurement method of a brightness curve. The polyimide having a thickness of 25 占 퐉 or 50 占 퐉 used for evaluating the slope of the lightness curve was polyimide having? B (PI) of 50 or more and 65 or less with respect to the polyimide before being adhered to the copper foil. In measuring the? B (PI) with respect to the polyimide before adhering to the copper foil, a black mark on the line of 0.3 mm in width was printed on blank paper instead of the copper foil on the line of 0.3 mm in width (Printed matter printed) was used to measure? B (PI).

Further,? B and t1, t2, and Sv were measured by the following photographing apparatus. Further, one pixel on the horizontal axis corresponds to a length of 10 mu m.

In addition, a white glossy paper having a glossiness of 43.0 占 was used for the &quot; white paper &quot; on the back side of the copper foil having a line width of 0.3 mm.

The printed matter on which the black mark on the line is printed has a gloss value of 43.0 ± 2 on white glossy paper in accordance with JIS P8208 (1998) (copy of the measurement chart of Fig. 1) and JIS P8145 (2011) (A foreign matter comparison chart of a visual method) and a transparent film shown in Fig. 6 (a copy of a visual comparison foreign matter chart) Scatter diagram - full size version "Part Number: JQA160-20151-1 (manufactured by the National Bureau of Printing, Independent Administrative Institution)).

The glossiness of the glossy paper was measured at an incident angle of 60 degrees using a glossy gloss handy gloss meter PG-1 manufactured by Nippon Seisen Kogyo Co., Ltd. in accordance with JIS Z8741.

The photographing apparatus includes a CCD camera, a blank (a polyimide substrate on which a copper foil is laminated is placed on a side opposite to a side having a copper foil on a line toward a CCD camera), a polyimide substrate on which a polyimide substrate And a conveyor (not shown) that conveys the copper foil and the polyimide substrate onto the stage. The main specifications of the photographing apparatus are as follows:

· Photographing device: Nireco Co., Ltd. Sheet inspection device Mujiken

Line CCD camera: 8192 pixels (160 MHz), 1024 gradation digital (10 bits)

· Lighting power supply: High frequency lighting power supply (power supply unit × 2)

· Lighting: Fluorescent lamp (30 W, model name: FPL27EX-D, twin fluorescent lamp)

The line for measuring the ΔB (PI) used was a line indicated by an arrow drawn in the obscuration of FIG. 5 of 0.7 mm 2. The width of the line is 0.3 mm. The line CCD camera field-of-view is arranged in a dotted line in Fig.

In photographing with a line CCD camera, signals are checked at a full scale of 256 gradations. In a state in which no polyimide film (polyimide substrate) is to be measured, , And the point outside the mark printed on the contaminants on the side of the transparent film was measured with a CCD camera) was adjusted so that the peak gradation signal of 230 ± 5 was included. The camera scan time (the time when the shutter of the camera was opened and the time when the light was taken) was fixed at 250 占 sec, and the lens iris was adjusted so as to be included within the above-mentioned gradation.

In addition, with respect to the lightness shown in Fig. 3, 0 means "black", brightness 255 means "white", and the degree of gray from "black" to "white" 256 gradations are displayed in a divided manner.

· Visibility (resin transparency);

A copper foil was attached to both surfaces of the polyimide film from one surface side, and the copper foil was removed by etching (ferric chloride aqueous solution) to prepare a sample film. A print (black circle having a diameter of 6 cm) was attached to one surface of the obtained resin layer, and the visibility of the print was judged from the opposite surface to the resin layer. The outline of the black circle of the printed matter is not less than 90% of the circumference, and the outline of the black circle is not less than 80% and not more than 90% of the circumference, Of the circumference of the circumference is less than 0 to 80% of the circumference and the outline is broken is evaluated as &quot; x &quot; (rejection).

Peel strength (adhesion strength);

According to IPC-TM-650, state (normal) fill strength was measured with a tensile tester Autograph 100, and the state fill strength was 0.7 N / mm or more so that it could be used for laminated board applications. In order to measure the peel strength, a sample in which a polyimide film and a surface-treated surface, which is one surface of a surface-treated copper foil related to the experimental example of the present invention, were laminated. The peel strength was measured with a copper foil thickness of 18 占 퐉. The copper foil having a thickness of less than 18 占 퐉 was plated with copper to have a thickness of 18 占 퐉. When the thickness is larger than 18 占 퐉, the copper foil is etched to have a thickness of 18 占 퐉.

Yield;

The copper foil was etched (ferric chloride aqueous solution) to produce an FPC having a circuit width of L / S of 30 占 퐉 / 30 占 퐉 on the both surfaces of the polyimide film from the surface side of one side of the copper foil. Thereafter, an attempt was made to detect a mark of 20 mu m x 20 mu m in width on a polyimide with a CCD camera. , &Quot;? &Quot;, &quot;? &Quot;, &quot;? &Quot;, and &quot; x &quot;, respectively.

(1) surface roughness (Rz) and (3) area ratio (A / B) of the surface of the copper foil to the surface of the copper circuit or copper foil can do.

Evaluation of copper foil wrinkles and the like by lamination;

Treated copper foils of Examples and Comparative Examples were laminated on both surfaces of a polyimide resin having a thickness of 25 占 퐉 from one surface side and protective films of a thickness of 125 占 퐉 on the other surface side of each surface- A laminate roll is used from the outside of both protective films in a state in which the protective film / surface-treated copper foil / polyimide resin / surface-treated copper foil / (Laminate processing) was carried out to apply a surface-treated copper foil to both surfaces of the polyimide resin. Subsequently, the protective film on both surfaces was peeled off, and the other surface of the surface-treated copper foil was visually observed to check whether wrinkles or streaks were present. When no wrinkles or streaks occurred, When the wrinkles or streaks were observed at only one point, it was evaluated as?, When the wrinkles or streaks were observed at two or more points per 5 m of the copper foil.

The conditions and the evaluation of each of the above tests are shown in Tables 1 to 4.

(Evaluation results)

In Examples 1 to 9, the color difference? E * ab beyond polyimide was 50 or more,? B was 40 or more, and visibility was good. Further, since the surface treatment is formed on the other surface, generation of wrinkles and streaks on the other surface of the copper foil in the double-sided laminate method is satisfactorily suppressed.

In Comparative Examples 1 to 4, the color difference ΔE * ab of the polyimide was less than 50, or ΔB was less than 40, and the visibility was poor.

In Comparative Examples 1 to 4 and Comparative Examples 5 and 6, since the surface treatment was not formed on the other surface, the generation of wrinkles or streaks on the other surface of the copper foil in the double-sided laminate method was suppressed I could not.

Fig. 4 shows SEM observation photographs of the surface of the copper foils of Comparative Example 1 (b) and Example 1 (a) at the Rz evaluation.

In Examples 1 to 9, the copper foil mark having a line width of 0.3 mm and the mark of the impurity were changed from 0.3 mm to 0.16 mm (from the side close to the substrate of 0.5 of the sheet area of 0.5 mm &lt; 2 & (PI), Sv value and? B value are measured by changing the third mark (the mark indicated by the arrow in Fig. 6) 0.3 mm, respectively.

In the above Examples 1 to 9, the position of 50 占 퐉 from the end position on both sides of the mark was set at a position 100 占 퐉 apart, 300 占 퐉 apart, and 500 占 퐉 apart with respect to the "top average value Bt of brightness curve" (PI), Sv value and? B value were measured by changing the average value of brightness at five points (total of 10 points on both sides) measured at intervals of 30 占 퐉 from the position, ), The Sv value and the? B value were calculated by dividing the average value of the lightness measured at five points (total of 10 points on both sides) at intervals of 30 占 퐉 at a position 50 占 퐉 away from the end positions on both sides of the mark as a "top average value Bt of the lightness curve" (PI), the Sv value and the? B value in the case where the value of?

The surface treated copper foil was produced and evaluated on both surfaces of the copper foil under the same conditions as those in which the surface treatment was performed on one surface using the same copper foil as in each of the above examples. As a result, The same evaluation results as those of the one surface of the example were obtained. When electrolytic polishing or chemical polishing was performed on the copper foil, both surfaces were subjected to electrolytic polishing or chemical polishing, followed by surface treatment. In Example 8, electrolytic polishing and / or chemical polishing was performed on the glossy surface of the copper foil (the surface on the side in contact with the drum at the time of producing electrolytic copper foil), and the roughness Rz and gloss of the TD were measured. A predetermined surface treatment or formation of an intermediate layer or the like was carried out.

When the surface treatment such as roughening treatment is applied to both surfaces of the copper foil, the surface treatment may be performed on both surfaces at the same time, or the surface treatment may be performed separately on one surface and the other surface. When both surfaces are simultaneously subjected to the surface treatment, surface treatment may be performed using a surface treatment apparatus (plating apparatus) having an anode formed on both sides of the copper foil. In this embodiment, both surfaces were simultaneously subjected to surface treatment at the same time.

The 10-point average roughness Rz of TD measured by a laser microscope having a laser beam wavelength of 405 nm on the surface of the copper foil subjected to the roughening treatment in each example was 0.35 탆 or more. In addition, the arithmetic average roughness Ra of the TD measured by a laser microscope with a laser beam wavelength of 405 nm on the surface of the copper foil subjected to the roughening treatment in each example was not less than 0.05 mu m. In addition, the square root mean square height Rq of TD measured by a laser microscope with a laser beam wavelength of 405 nm on the surface of the copper foil subjected to the roughening treatment in each of Examples was 0.08 mu m or more.

Claims (84)

A surface-treated copper foil having a surface treated on one surface and the other surface,
A copper clad laminate formed by laminating a surface-treated copper foil with a polyimide having a ΔB (PI) of 50 or more and 65 or less before adhering to the copper foil from the one surface side of the copper foil, wherein the surface of the copper foil above the polyimide The chrominance DELTA E * ab based on Z8730 becomes 50 or more,
When the above-mentioned copper foil is photographed with a CCD camera over the polyimide laminated from one surface side,
In the observation point-brightness graph prepared by measuring the brightness of each observation point along a direction perpendicular to the direction in which the observed copper foil extends, with respect to the image obtained by the photographing,
The difference? B (? B = Bt - Bb) between the top average value Bt and the bottom average value Bb of the brightness curve occurring from the end portion of the copper foil to the portion having no copper foil is 40 or more,
Wherein the ten-point average roughness Rz of TD measured by a laser microscope with a laser beam wavelength of 405 nm on the other surface-treated copper foil surface is 0.35 탆 or more. A surface-treated copper foil having a surface treated on one surface and the other surface,
A copper clad laminate formed by laminating a surface-treated copper foil with a polyimide having a ΔB (PI) of 50 or more and 65 or less before adhering to the copper foil from the one surface side of the copper foil, wherein the surface of the copper foil above the polyimide The chrominance DELTA E * ab based on Z8730 becomes 50 or more,
When the above-mentioned copper foil is photographed with a CCD camera over the polyimide laminated from one surface side,
In the observation point-brightness graph prepared by measuring the brightness of each observation point along a direction perpendicular to the direction in which the observed copper foil extends, with respect to the image obtained by the photographing,
(B = Bt - Bb) between the top average value Bt and the bottom average value Bb of the brightness curve generated from the end portion of the copper foil to the portion without the copper foil, , A value indicating the position of an intersection point closest to the copper foil is t1 and the intersection of the brightness curve and 0.1? B in the depth range from the intersection of the brightness curve and Bt to 0.1? B with respect to Bt, And a value indicating a position of an intersection nearest to the copper foil is t2, an Sv defined by the following formula (1) is 3.0 or more,
Sv = (DELTA Bx0.1) / (t1 - t2) (1)
Wherein the ten-point average roughness Rz of TD measured by a laser microscope with a laser beam wavelength of 405 nm on the other surface-treated copper foil surface is 0.35 탆 or more. The method according to claim 1,
Wherein the arithmetic average roughness Ra of the TD measured by a laser microscope having a laser beam wavelength of 405 nm on the other surface-treated copper foil surface is not less than 0.05 mu m. 3. The method of claim 2,
Wherein the arithmetic average roughness Ra of the TD measured by a laser microscope having a laser beam wavelength of 405 nm on the other surface-treated copper foil surface is not less than 0.05 mu m. A surface-treated copper foil having a surface treated on one surface and the other surface,
A copper clad laminate formed by laminating a surface-treated copper foil with a polyimide having a ΔB (PI) of 50 or more and 65 or less before adhering to the copper foil from the one surface side of the copper foil, wherein the surface of the copper foil above the polyimide The chrominance DELTA E * ab based on Z8730 becomes 50 or more,
When the above-mentioned copper foil is photographed with a CCD camera over the polyimide laminated from one surface side,
In the observation point-brightness graph prepared by measuring the brightness of each observation point along a direction perpendicular to the direction in which the observed copper foil extends, with respect to the image obtained by the photographing,
The difference? B (? B = Bt - Bb) between the top average value Bt and the bottom average value Bb of the brightness curve occurring from the end portion of the copper foil to the portion having no copper foil is 40 or more,
Wherein the arithmetic average roughness Ra of the TD measured by a laser microscope having a laser beam wavelength of 405 nm on the other surface-treated copper foil surface is not less than 0.05 mu m. A surface-treated copper foil having a surface treated on one surface and the other surface,
A copper clad laminate formed by laminating a surface-treated copper foil with a polyimide having a ΔB (PI) of 50 or more and 65 or less before adhering to the copper foil from the one surface side of the copper foil, wherein the surface of the copper foil above the polyimide The chrominance DELTA E * ab based on Z8730 becomes 50 or more,
When the above-mentioned copper foil is photographed with a CCD camera over the polyimide laminated from one surface side,
In the observation point-brightness graph prepared by measuring the brightness of each observation point along a direction perpendicular to the direction in which the observed copper foil extends, with respect to the image obtained by the photographing,
(B = Bt - Bb) between the top average value Bt and the bottom average value Bb of the brightness curve generated from the end portion of the copper foil to the portion without the copper foil, , A value indicating the position of an intersection point closest to the copper foil is t1 and the intersection of the brightness curve and 0.1? B in the depth range from the intersection of the brightness curve and Bt to 0.1? B with respect to Bt, And a value indicating a position of an intersection nearest to the copper foil is t2, an Sv defined by the following formula (1) is 3.0 or more,
Sv = (DELTA Bx0.1) / (t1 - t2) (1)
Wherein the arithmetic average roughness Ra of the TD measured by a laser microscope having a laser beam wavelength of 405 nm on the other surface-treated copper foil surface is not less than 0.05 mu m. The method according to claim 1,
Wherein the square root mean square height Rq of TD measured by a laser microscope having a laser beam wavelength of 405 nm on the other surface-treated copper foil surface is 0.08 mu m or more. 3. The method of claim 2,
Wherein the square root mean square height Rq of TD measured by a laser microscope having a laser beam wavelength of 405 nm on the other surface-treated copper foil surface is 0.08 mu m or more. The method of claim 3,
Wherein the square root mean square height Rq of TD measured by a laser microscope having a laser beam wavelength of 405 nm on the other surface-treated copper foil surface is 0.08 mu m or more. 5. The method of claim 4,
Wherein the square root mean square height Rq of TD measured by a laser microscope having a laser beam wavelength of 405 nm on the other surface-treated copper foil surface is 0.08 mu m or more. 6. The method of claim 5,
Wherein the square root mean square height Rq of TD measured by a laser microscope having a laser beam wavelength of 405 nm on the other surface-treated copper foil surface is 0.08 mu m or more. The method according to claim 6,
Wherein the square root mean square height Rq of TD measured by a laser microscope having a laser beam wavelength of 405 nm on the other surface-treated copper foil surface is 0.08 mu m or more. A surface-treated copper foil having a surface treated on one surface and the other surface,
A copper clad laminate formed by laminating a surface-treated copper foil with a polyimide having a ΔB (PI) of 50 or more and 65 or less before adhering to the copper foil from the one surface side of the copper foil, wherein the surface of the copper foil above the polyimide The chrominance DELTA E * ab based on Z8730 becomes 50 or more,
When the above-mentioned copper foil is photographed with a CCD camera over the polyimide laminated from one surface side,
In the observation point-brightness graph prepared by measuring the brightness of each observation point along a direction perpendicular to the direction in which the observed copper foil extends, with respect to the image obtained by the photographing,
The difference? B (? B = Bt - Bb) between the top average value Bt and the bottom average value Bb of the brightness curve occurring from the end portion of the copper foil to the portion having no copper foil is 40 or more,
Wherein the square root mean square height Rq of TD measured by a laser microscope having a laser beam wavelength of 405 nm on the other surface-treated copper foil surface is 0.08 mu m or more. A surface-treated copper foil having a surface treated on one surface and the other surface,
A copper clad laminate formed by laminating a surface-treated copper foil with a polyimide having a ΔB (PI) of 50 or more and 65 or less before adhering to the copper foil from the one surface side of the copper foil, wherein the surface of the copper foil above the polyimide The chrominance DELTA E * ab based on Z8730 becomes 50 or more,
When the above-mentioned copper foil is photographed with a CCD camera over the polyimide laminated from one surface side,
In the observation point-brightness graph prepared by measuring the brightness of each observation point along a direction perpendicular to the direction in which the observed copper foil extends, with respect to the image obtained by the photographing,
(B = Bt - Bb) between the top average value Bt and the bottom average value Bb of the brightness curve generated from the end portion of the copper foil to the portion without the copper foil, , A value indicating the position of an intersection point closest to the copper foil is t1 and the intersection of the brightness curve and 0.1? B in the depth range from the intersection of the brightness curve and Bt to 0.1? B with respect to Bt, And a value indicating a position of an intersection nearest to the copper foil is t2, an Sv defined by the following formula (1) is 3.0 or more,
Sv = (DELTA Bx0.1) / (t1 - t2) (1)
Wherein the square root mean square height Rq of TD measured by a laser microscope having a laser beam wavelength of 405 nm on the other surface-treated copper foil surface is 0.08 mu m or more. The surface-treated copper foil according to any one of claims 1, 3, 5, 7, 9, 11, and 13, Or two or three copper foils.
(1) The 10-point average roughness Rz of TD measured by a laser microscope with a wavelength of laser beam of 405 nm on the surface of the copper surface subjected to the other surface treatment is 0.40 탆 or more.
(2) The arithmetic average roughness Ra of the TD measured by a laser microscope with a wavelength of 405 nm of the laser light on the surface of the copper surface subjected to the other surface treatment is 0.08 mu m or more.
(3) The square root mean square height Rq of TD measured by a laser microscope with a laser beam wavelength of 405 nm on the other surface-treated copper foil surface is 0.10 m or more. 14. A method according to any one of claims 1, 3, 5, 7, 9, 11, and 13,
And the surface treatment of the other surface is a roughening treatment. 16. The method of claim 15,
And the surface treatment of the other surface is a roughening treatment. The method according to any one of claims 1, 3, 5, 7, 9, 11, or 13,
In the observation point-brightness graph, a value indicating the position of an intersection point closest to the copper foil among the intersections of the brightness curve and Bt is t1, and a depth range from the intersection of the brightness curve and Bt to 0.1 B Wherein Sv defined by the following formula (1) is 3.0 or more, where t2 is a value indicating the position of an intersection closest to the copper foil among intersections of the brightness curve and 0.1? B.
Sv = (DELTA Bx0.1) / (t1 - t2) (1) 16. The method of claim 15,
In the observation point-brightness graph, a value indicating the position of an intersection point closest to the copper foil among the intersections of the brightness curve and Bt is t1, and a depth range from the intersection of the brightness curve and Bt to 0.1 B Wherein Sv defined by the following formula (1) is 3.0 or more, where t2 is a value indicating the position of an intersection closest to the copper foil among intersections of the brightness curve and 0.1? B.
Sv = (DELTA Bx0.1) / (t1 - t2) (1) 17. The method of claim 16,
In the observation point-brightness graph, a value indicating the position of an intersection point closest to the copper foil among the intersections of the brightness curve and Bt is t1, and a depth range from the intersection of the brightness curve and Bt to 0.1 B Wherein Sv defined by the following formula (1) is 3.0 or more, where t2 is a value indicating the position of an intersection closest to the copper foil among intersections of the brightness curve and 0.1? B.
Sv = (DELTA Bx0.1) / (t1 - t2) (1) 18. The method of claim 17,
In the observation point-brightness graph, a value indicating the position of an intersection point closest to the copper foil among the intersections of the brightness curve and Bt is t1, and a depth range from the intersection of the brightness curve and Bt to 0.1 B Wherein Sv defined by the following formula (1) is 3.0 or more, where t2 is a value indicating the position of an intersection closest to the copper foil among intersections of the brightness curve and 0.1? B.
Sv = (DELTA Bx0.1) / (t1 - t2) (1) 15. The method according to any one of claims 1 to 14,
Treated copper foil is laminated with polyimide having a? B (PI) of 50 or more and 65 or less before the surface-treated copper foil is bonded to the copper foil from the one surface side of the copper foil, wherein the surface of the polyimide- Wherein the base color difference? E * ab is 53 or more. The method according to any one of claims 2, 4, 6, 8, 10, 12, and 14,
Wherein the Sv defined by the expression (1) in the lightness curve is not less than 3.5. 19. The method of claim 18,
Wherein the Sv defined by the expression (1) in the lightness curve is not less than 3.5. 20. The method of claim 19,
Wherein the Sv defined by the expression (1) in the lightness curve is not less than 3.5. 21. The method of claim 20,
Wherein the Sv defined by the expression (1) in the lightness curve is not less than 3.5. 22. The method of claim 21,
Wherein the Sv defined by the expression (1) in the lightness curve is not less than 3.5. 24. The method of claim 23,
Wherein the Sv defined by the expression (1) in the lightness curve is 3.9 or more. 25. The method of claim 24,
Wherein the Sv defined by the expression (1) in the lightness curve is 3.9 or more. 29. The method of claim 28,
Wherein the Sv defined by the expression (1) in the lightness curve is 5.0 or more. 30. The method of claim 29,
Wherein the Sv defined by the expression (1) in the lightness curve is 5.0 or more. 15. The method according to any one of claims 1 to 14,
Wherein the ten-point average roughness Rz of TD measured by the contact type roughness meter of one surface is 0.20 to 0.64 mu m and the ratio A / B of the three-dimensional surface area A and the two-dimensional surface area B of the copper foil surface is 1.0 to 1.7, . 33. The method of claim 32,
Wherein a ten-point average roughness Rz of TD measured by a contact type roughness meter of one surface is 0.26 to 0.62 mu m. 33. The method of claim 32,
Wherein the A / B is 1.0 to 1.6. 34. The method of claim 33,
Wherein the A / B is 1.0 to 1.6. A copper clad laminate comprising the surface-treated copper foil according to any one of claims 1 to 14 and a resin substrate laminated. A printed wiring board using the surface-treated copper foil according to any one of claims 1 to 14. An electronic device using at least one printed wiring board according to claim 37. A printed wiring board having an insulating resin substrate and a copper circuit formed on an insulating resin substrate,
Wherein the copper circuit has one surface on the insulating resin substrate side and the other surface subjected to the surface treatment,
The color difference? E * ab based on JIS Z8730 of the surface of the copper circuit beyond the insulating resin substrate is 50 or more,
When the copper circuit is photographed with a CCD camera over the insulating resin substrate,
In the observation point-brightness graph prepared by measuring the brightness of each observation point along a direction perpendicular to the direction in which the observed copper circuit extends, with respect to the image obtained by the photographing,
The difference? B (? B = Bt - Bb) between the top average value Bt and the bottom average value Bb of the brightness curve occurring from the end of the copper circuit to the portion without the copper circuit becomes 40 or more, Wherein a 10-point average roughness Rz of TD measured by a laser microscope having a surface laser beam wavelength of 405 nm is 0.35 탆 or more. A printed wiring board having an insulating resin substrate and a copper circuit formed on an insulating resin substrate,
Wherein the copper circuit has one surface on the insulating resin substrate side and the other surface subjected to the surface treatment,
The color difference? E * ab based on JIS Z8730 of the surface of the copper circuit beyond the insulating resin substrate is 50 or more,
When the copper circuit is photographed with a CCD camera over the insulating resin substrate,
In the observation point-brightness graph prepared by measuring the brightness of each observation point along a direction perpendicular to the direction in which the observed copper circuit extends, with respect to the image obtained by the photographing,
(B = Bt - Bb) between the top average value Bt and the bottom average value Bb of the brightness curve occurring from the end of the copper circuit to the portion without the copper circuit, And a value indicating a position of an intersection closest to the copper circuit among the intersections of Bt and Bt is t1 and the intersection of the brightness curve and the intersection point of B And a value indicating a position of an intersection nearest to the copper circuit is t2, Sv defined by the following formula (1) is 3.0 or more,
Sv = (DELTA Bx0.1) / (t1 - t2) (1)
Wherein a 10-point average roughness Rz of TD measured by a laser microscope having a wavelength of laser beam of 405 nm on the surface of the copper circuit subjected to the other surface treatment is 0.35 탆 or more. 40. The method of claim 39,
Wherein the arithmetic mean roughness Ra of the TD measured by a laser microscope having a wavelength of laser beam of 405 nm on the surface of the copper circuit subjected to the other surface treatment is 0.05 m or more. 41. The method of claim 40,
Wherein the arithmetic mean roughness Ra of the TD measured by a laser microscope having a wavelength of laser beam of 405 nm on the surface of the copper circuit subjected to the other surface treatment is 0.05 m or more. A printed wiring board having an insulating resin substrate and a copper circuit formed on an insulating resin substrate,
Wherein the copper circuit has one surface on the insulating resin substrate side and the other surface subjected to the surface treatment,
The color difference? E * ab based on JIS Z8730 of the surface of the copper circuit beyond the insulating resin substrate is 50 or more,
When the copper circuit is photographed with a CCD camera over the insulating resin substrate,
In the observation point-brightness graph prepared by measuring the brightness of each observation point along a direction perpendicular to the direction in which the observed copper circuit extends, with respect to the image obtained by the photographing,
The difference? B (? B = Bt - Bb) between the top average value Bt and the bottom average value Bb of the brightness curve occurring from the end of the copper circuit to the portion without the copper circuit becomes 40 or more, Wherein the arithmetic average roughness Ra of the TD measured by a laser microscope having a surface laser beam wavelength of 405 nm is 0.05 m or more. A printed wiring board having an insulating resin substrate and a copper circuit formed on an insulating resin substrate,
Wherein the copper circuit has one surface on the insulating resin substrate side and the other surface subjected to the surface treatment,
The color difference? E * ab based on JIS Z8730 of the surface of the copper circuit beyond the insulating resin substrate is 50 or more,
When the copper circuit is photographed with a CCD camera over the insulating resin substrate,
In the observation point-brightness graph prepared by measuring the brightness of each observation point along a direction perpendicular to the direction in which the observed copper circuit extends, with respect to the image obtained by the photographing,
(B = Bt - Bb) between the top average value Bt and the bottom average value Bb of the brightness curve occurring from the end of the copper circuit to the portion without the copper circuit, And a value indicating a position of an intersection closest to the copper circuit among the intersections of Bt and Bt is t1 and the intersection of the brightness curve and the intersection point of B And a value indicating a position of an intersection nearest to the copper circuit is t2, Sv defined by the following formula (1) is 3.0 or more,
Sv = (DELTA Bx0.1) / (t1 - t2) (1)
Wherein the arithmetic mean roughness Ra of the TD measured by a laser microscope having a wavelength of laser beam of 405 nm on the surface of the copper circuit subjected to the other surface treatment is 0.05 m or more. 40. The method of claim 39,
Wherein the square root mean square height Rq of TD measured by a laser microscope with a laser beam wavelength of 405 nm on the other surface-treated copper circuit surface is 0.08 mu m or more. 41. The method of claim 40,
Wherein the square root mean square height Rq of TD measured by a laser microscope with a laser beam wavelength of 405 nm on the other surface-treated copper circuit surface is 0.08 mu m or more. 42. The method of claim 41,
Wherein the square root mean square height Rq of TD measured by a laser microscope with a laser beam wavelength of 405 nm on the other surface-treated copper circuit surface is 0.08 mu m or more. 43. The method of claim 42,
Wherein the square root mean square height Rq of TD measured by a laser microscope with a laser beam wavelength of 405 nm on the other surface-treated copper circuit surface is 0.08 mu m or more. 44. The method of claim 43,
Wherein the square root mean square height Rq of TD measured by a laser microscope with a laser beam wavelength of 405 nm on the other surface-treated copper circuit surface is 0.08 mu m or more. 45. The method of claim 44,
Wherein the square root mean square height Rq of TD measured by a laser microscope with a laser beam wavelength of 405 nm on the other surface-treated copper circuit surface is 0.08 mu m or more. A printed wiring board having an insulating resin substrate and a copper circuit formed on an insulating resin substrate,
Wherein the copper circuit has one surface on the insulating resin substrate side and the other surface subjected to the surface treatment,
The color difference? E * ab based on JIS Z8730 of the surface of the copper circuit beyond the insulating resin substrate is 50 or more,
When the copper circuit is photographed with a CCD camera over the insulating resin substrate,
In the observation point-brightness graph prepared by measuring the brightness of each observation point along a direction perpendicular to the direction in which the observed copper circuit extends, with respect to the image obtained by the photographing,
The difference? B (? B = Bt - Bb) between the top average value Bt and the bottom average value Bb of the brightness curve occurring from the end of the copper circuit to the portion without the copper circuit becomes 40 or more, Wherein a square root mean square height Rq of TD measured by a laser microscope having a surface laser beam wavelength of 405 nm is 0.08 mu m or more. A printed wiring board having an insulating resin substrate and a copper circuit formed on an insulating resin substrate,
Wherein the copper circuit has one surface on the insulating resin substrate side and the other surface subjected to the surface treatment,
The color difference? E * ab based on JIS Z8730 of the surface of the copper circuit beyond the insulating resin substrate is 50 or more,
When the copper circuit is photographed with a CCD camera over the insulating resin substrate,
In the observation point-brightness graph prepared by measuring the brightness of each observation point along a direction perpendicular to the direction in which the observed copper circuit extends, with respect to the image obtained by the photographing,
(B = Bt - Bb) between the top average value Bt and the bottom average value Bb of the brightness curve occurring from the end of the copper circuit to the portion without the copper circuit, And a value indicating a position of an intersection closest to the copper circuit among the intersections of Bt and Bt is t1 and the intersection of the brightness curve and the intersection point of B And a value indicating a position of an intersection nearest to the copper circuit is t2, Sv defined by the following formula (1) is 3.0 or more,
Sv = (DELTA Bx0.1) / (t1 - t2) (1)
Wherein the square root mean square height Rq of TD measured by a laser microscope with a laser beam wavelength of 405 nm on the other surface-treated copper circuit surface is 0.08 mu m or more. 52. The method according to any one of claims 39 to 52,
And the surface treatment of the other surface is a harmonic treatment. 52. A method for producing a printed wiring board in which two or more printed wiring boards according to any one of claims 39 to 52 are connected and two or more printed wiring boards are connected. 52. A printed wiring board comprising at least one printed wiring board according to any one of claims 39 to 52 and a step of connecting a printed wiring board not corresponding to another printed wiring board or the printed wiring board, Or more. A printed wiring board comprising at least one printed wiring board according to claim 53 and at least a step of connecting a printed wiring board according to claim 53 or a printed wiring board not corresponding to the printed wiring board according to claim 53, Or more. An electronic device using at least one printed wiring board to which at least one of the printed wiring boards according to any one of claims 39 to 52 is connected. An electronic device using at least one printed wiring board to which at least one printed wiring board according to claim 53 is connected. A surface-treated copper foil used for the printed wiring board according to any one of claims 39 to 52. A surface-treated copper foil used for the printed wiring board according to claim 53. A copper clad laminate having an insulating resin substrate and a copper foil formed on an insulating resin substrate,
Wherein the copper foil has one surface on the insulating resin substrate side and the other surface subjected to the surface treatment,
The color difference? E * ab based on JIS Z8730 of the surface of the copper foil over the insulating resin substrate is 50 or more,
When the copper foil of the copper clad laminate is etched to form a copper foil on a line and then photographed with a CCD camera over the insulating resin substrate,
In the observation point-brightness graph prepared by measuring the brightness of each observation point along the direction perpendicular to the direction in which the observed copper foil on the line is observed with respect to the image obtained by the photographing,
The difference? B (? B = Bt - Bb) between the top average value Bt and the bottom average value Bb of the brightness curve occurring from the end of the copper foil on the line to the portion without the copper on the line becomes 40 or more, Wherein a 10-point average roughness Rz of TD measured by a laser microscope with a laser beam wavelength of 405 nm on the surface of the copper foil is 0.35 탆 or more. A copper clad laminate having an insulating resin substrate and a copper foil formed on an insulating resin substrate,
Wherein the copper foil has one surface on the insulating resin substrate side and the other surface subjected to the surface treatment,
The color difference? E * ab based on JIS Z8730 of the surface of the copper foil over the insulating resin substrate is 50 or more,
When the copper foil of the copper clad laminate is etched to form a copper foil on a line and then photographed with a CCD camera over the insulating resin substrate,
In the observation point-brightness graph prepared by measuring the brightness of each observation point along the direction perpendicular to the direction in which the observed copper foil on the line is observed with respect to the image obtained by the photographing,
(? B = Bt - Bb) between the top average value Bt and the bottom average value Bb of the brightness curve occurring from the end of the copper foil on the line to the portion without the copper foil on the line, A value indicating the position of the intersection point closest to the copper foil on the line is defined as t1 and a value of 0.1 DELTA B is obtained in the depth range from the intersection of the luminosity curve and Bt to 0.1 B with reference to Bt, , A value indicating a position of an intersection nearest to the copper foil on the line is t2, an Sv defined by the following formula (1) is 3.0 or more,
Sv = (DELTA Bx0.1) / (t1 - t2) (1)
Wherein a ten-point average roughness Rz of TD measured by a laser microscope having a wavelength of laser light of 405 nm on the surface of the copper surface subjected to the other surface treatment is not less than 0.35 mu m. 62. The method of claim 61,
Wherein an arithmetic average roughness Ra of a TD measured by a laser microscope having a laser beam wavelength of 405 nm on the other surface-treated copper foil surface is 0.05 m or more. 63. The method of claim 62,
Wherein an arithmetic average roughness Ra of a TD measured by a laser microscope having a laser beam wavelength of 405 nm on the other surface-treated copper foil surface is 0.05 m or more. A copper clad laminate having an insulating resin substrate and a copper foil formed on an insulating resin substrate,
Wherein the copper foil has one surface on the insulating resin substrate side and the other surface subjected to the surface treatment,
The color difference? E * ab based on JIS Z8730 of the surface of the copper foil over the insulating resin substrate is 50 or more,
When the copper foil of the copper clad laminate is etched to form a copper foil on a line and then photographed with a CCD camera over the insulating resin substrate,
In the observation point-brightness graph prepared by measuring the brightness of each observation point along the direction perpendicular to the direction in which the observed copper foil on the line is observed with respect to the image obtained by the photographing,
The difference? B (? B = Bt - Bb) between the top average value Bt and the bottom average value Bb of the brightness curve occurring from the end of the copper foil on the line to the portion without the copper on the line becomes 40 or more, Wherein an arithmetic average roughness Ra of the TD measured by a laser microscope having a laser beam wavelength of 405 nm on the surface of the copper foil is 0.05 m or more. A copper clad laminate having an insulating resin substrate and a copper foil formed on an insulating resin substrate,
Wherein the copper foil has one surface on the insulating resin substrate side and the other surface subjected to the surface treatment,
The color difference? E * ab based on JIS Z8730 of the surface of the copper foil over the insulating resin substrate is 50 or more,
When the copper foil of the copper clad laminate is etched to form a copper foil on a line and then photographed with a CCD camera over the insulating resin substrate,
In the observation point-brightness graph prepared by measuring the brightness of each observation point along the direction perpendicular to the direction in which the observed copper foil on the line is observed with respect to the image obtained by the photographing,
(? B = Bt - Bb) between the top average value Bt and the bottom average value Bb of the brightness curve occurring from the end of the copper foil on the line to the portion without the copper foil on the line, A value indicating the position of the intersection point closest to the copper foil on the line is defined as t1 and a value of 0.1 DELTA B is obtained in the depth range from the intersection of the luminosity curve and Bt to 0.1 B with reference to Bt, , A value indicating a position of an intersection nearest to the copper foil on the line is t2, an Sv defined by the following formula (1) is 3.0 or more,
Sv = (DELTA Bx0.1) / (t1 - t2) (1)
Wherein an arithmetic average roughness Ra of a TD measured by a laser microscope having a laser beam wavelength of 405 nm on the other surface-treated copper foil surface is 0.05 m or more. 62. The method of claim 61,
Wherein the square root mean square height Rq of the TD measured by a laser microscope having a laser beam wavelength of 405 nm on the other surface-treated copper foil surface is 0.08 mu m or more. 63. The method of claim 62,
Wherein the square root mean square height Rq of the TD measured by a laser microscope having a laser beam wavelength of 405 nm on the other surface-treated copper foil surface is 0.08 mu m or more. 64. The method of claim 63,
Wherein the square root mean square height Rq of the TD measured by a laser microscope having a laser beam wavelength of 405 nm on the other surface-treated copper foil surface is 0.08 mu m or more. 65. The method of claim 64,
Wherein the square root mean square height Rq of the TD measured by a laser microscope having a laser beam wavelength of 405 nm on the other surface-treated copper foil surface is 0.08 mu m or more. 66. The method of claim 65,
Wherein the square root mean square height Rq of the TD measured by a laser microscope having a laser beam wavelength of 405 nm on the other surface-treated copper foil surface is 0.08 mu m or more. 67. The method of claim 66,
Wherein the square root mean square height Rq of the TD measured by a laser microscope having a laser beam wavelength of 405 nm on the other surface-treated copper foil surface is 0.08 mu m or more. A copper clad laminate having an insulating resin substrate and a copper foil formed on an insulating resin substrate,
Wherein the copper foil has one surface on the insulating resin substrate side and the other surface subjected to the surface treatment,
The color difference? E * ab based on JIS Z8730 of the surface of the copper foil over the insulating resin substrate is 50 or more,
When the copper foil of the copper clad laminate is etched to form a copper foil on a line and then photographed with a CCD camera over the insulating resin substrate,
In the observation point-brightness graph prepared by measuring the brightness of each observation point along the direction perpendicular to the direction in which the observed copper foil on the line is observed with respect to the image obtained by the photographing,
The difference? B (? B = Bt - Bb) between the top average value Bt and the bottom average value Bb of the brightness curve occurring from the end of the copper foil on the line to the portion without the copper on the line becomes 40 or more, Wherein the square root mean square height Rq of the TD measured by a laser microscope with a laser beam wavelength of 405 nm on the copper foil surface is 0.08 탆 or more. A copper clad laminate having an insulating resin substrate and a copper foil formed on an insulating resin substrate,
Wherein the copper foil has one surface on the insulating resin substrate side and the other surface subjected to the surface treatment,
The color difference? E * ab based on JIS Z8730 of the surface of the copper foil over the insulating resin substrate is 50 or more,
When the copper foil of the copper clad laminate is etched to form a copper foil on a line and then photographed with a CCD camera over the insulating resin substrate,
In the observation point-brightness graph prepared by measuring the brightness of each observation point along the direction perpendicular to the direction in which the observed copper foil on the line is observed with respect to the image obtained by the photographing,
(? B = Bt - Bb) between the top average value Bt and the bottom average value Bb of the brightness curve occurring from the end of the copper foil on the line to the portion without the copper foil on the line, A value indicating the position of the intersection point closest to the copper foil on the line is defined as t1 and a value of 0.1 DELTA B is obtained in the depth range from the intersection of the luminosity curve and Bt to 0.1 B with reference to Bt, , A value indicating a position of an intersection nearest to the copper foil on the line is t2, an Sv defined by the following formula (1) is 3.0 or more,
Sv = (DELTA Bx0.1) / (t1 - t2) (1)
Wherein the square root mean square height Rq of the TD measured by a laser microscope having a laser beam wavelength of 405 nm on the other surface-treated copper foil surface is 0.08 mu m or more. 74. The method of any one of claims 61 to 74,
And the surface treatment of the other surface is a roughening treatment. 74. A surface-treated copper foil used for a copper clad laminate according to any one of claims 61 to 74. A surface-treated copper foil used for a copper clad laminate according to claim 75. A printed wiring board produced by using the copper clad laminate according to any one of claims 61 to 74. A printed wiring board produced by using the copper clad laminate according to claim 75. An electronic device using the printed wiring board according to claim 78. An electronic device using the printed wiring board according to claim 79. The surface-treated copper foil according to any one of claims 2, 4, 6, 8, 10, 12, and 14, Or two or three copper foils.
(1) The 10-point average roughness Rz of TD measured by a laser microscope with a wavelength of laser beam of 405 nm on the surface of the copper surface subjected to the other surface treatment is 0.40 탆 or more.
(2) The arithmetic average roughness Ra of the TD measured by a laser microscope with a wavelength of 405 nm of the laser light on the surface of the copper surface subjected to the other surface treatment is 0.08 mu m or more.
(3) The square root mean square height Rq of TD measured by a laser microscope with a laser beam wavelength of 405 nm on the other surface-treated copper foil surface is 0.10 m or more. The method according to any one of claims 2, 4, 6, 8, 10, 12, and 14,
And the surface treatment of the other surface is a roughening treatment. 83. The method of claim 82,
And the surface treatment of the other surface is a roughening treatment.

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