KR101498436B1 - Surface-treated copper foil and laminate using the same - Google Patents

Abstract

A surface-treated copper foil excellent in transparency of resin after being adhered well to a resin and having removed the copper foil by etching, and a laminated board using the same. A surface-treated copper foil having a surface roughness (Rsk) of at least one surface of -0.35 to 0.53, wherein a top average value (Bt) of a lightness curve occurring from an end portion of the mark to a portion in which no mark is formed in the observation point- And a value indicating a position of an intersection closest to the mark on the line, of the intersection of the brightness curve and Bt in the observation point-brightness graph, and the difference between the bottom average value Bb and the bottom average value Bb is ΔB (ΔB = Bt- A value indicating the position of an intersection point closest to the mark on the line among the intersections of the brightness curve and 0.1? B in the depth range from the intersection of the lightness curve and Bt to the reference angle of Bt to 0.1? B is t2 , The Sv defined by the following formula (1) becomes 3.5 or more.
Sv = (DELTA Bx0.1) / (t1-t2) (1)

Description

TECHNICAL FIELD [0001] The present invention relates to a surface-treated copper foil and a laminate using the same,

The present invention relates to a surface-treated copper foil and a laminated board using the same. More particularly, the present invention relates to a surface-treated copper foil and a laminated board using the same, which are suitable for applications requiring transparency of the remaining resin after etching the copper foil.

Flexible printed wiring boards (hereinafter referred to as FPC) are employed in small electronic devices such as smart phones and tablet PCs in terms of ease of wiring and light weight. In recent years, the speeding up of the signal transmission speed has been progressed by increasing the function of these electronic devices, and impedance matching is also an important factor in FPC. As a countermeasure for impedance matching with an increase in signal capacity, a post-layering (thickening) of a resin insulating layer (for example, polyimide) as a base of the FPC is progressing. In addition, due to the demand for high-density wiring, the FPC has been further layered. On the other hand, the FPC is subjected to processing such as bonding to a liquid crystal substrate or mounting of an IC chip. In this case, alignment is performed by passing the resin insulating layer remaining after etching the copper foil on the laminate of the copper foil and the resin insulating layer, The visibility of the resin insulating layer becomes important.

The copper clad laminate, which is a laminate of a copper foil and a resin insulating layer, can also be produced by using a rolled copper foil whose surface is roughened. The rolled copper foil is usually made of tough pitch copper (oxygen content of 100 to 500 ppm by weight) or oxygen free copper (oxygen content of 10 ppm by weight or less) as raw materials. After hot rolling these ingots, Annealing is repeated.

As such a technique, for example, Patent Document 1 discloses a technique in which a polyimide film and a low-illuminance copper foil are laminated, and the light transmittance at a wavelength of 600 nm of the film after copper foil etching is 40% or more, haze (HAZE) Of 30% or less and an adhesive strength of 500 N / m or more.

Patent Document 2 discloses a chip-on-flexible (hereinafter referred to as " chip-on-flexible ") chip having an insulating layer in which a conductor layer is laminated by an electrolytic copper foil and having a light transmittance of an insulating layer in an etching region when a circuit is formed by etching the conductor layer COF), wherein the electrolytic copper foil has a rust-preventive treatment layer of a nickel-zinc alloy on a bonding surface to be bonded to an insulating layer, and a surface roughness Rz of the bonding surface is 0.05 to 1.5 탆 And a mirror polish degree at an incident angle of 60 DEG of not less than 250. The present invention relates to a flexible printed wiring board for COF.

Patent Document 3 discloses a method of treating a copper foil for a printed circuit in which a cobalt-nickel alloy plating layer is formed on the surface of a copper foil after roughening by copper-cobalt-nickel alloy plating, Which is formed on the surface of the copper foil.

Japanese Patent Application Laid-Open No. 2004-98659 WO2003 / 096776 Japanese Patent No. 2849059

In the case of Patent Document 1, the low-illuminance copper foil obtained by improving the adhesiveness by an organic treating agent after the blackening treatment or the plating treatment is sometimes broken by fatigue in applications where flexibility is required of the copper clad laminate, There are cases of inferiority.

In Patent Document 2, the roughening treatment is not carried out, and in applications other than the flexible printed wiring board for COF, the adhesion strength between the copper foil and the resin is low, which is insufficient.

Further, in the treatment method described in Patent Document 3, fine processing with Cu-Co-Ni for the copper foil was possible, but excellent visibility could not be realized for the resin after the copper foil was bonded to the resin and removed by etching.

The present invention provides a surface-treated copper foil excellent in transparency of a resin after being adhered well to a resin and further removed by etching, and a laminated board using the same.

As a result of intensive researches, the inventors of the present invention have found that a polyimide substrate having a surface roughness (Rsk) controlled to a predetermined range by surface treatment is removed from the treated surface side and bonded to the polyimide substrate, Attention is paid to the slope of the lightness curve near the end of the mark drawn in the observation point-lightness graph obtained from the image of the mark portion photographed with a CCD camera over the printed material on the polyimide substrate, It has been found that controlling the tilt affects the resin transparency after the removal of the copper foil without being influenced by the kind of the substrate resin film and the thickness of the substrate resin film.

The present invention completed on the basis of the above findings is a surface treated copper foil having a distortion Rsk of -0.35 to 0.53 based on JIS B 0601-2001 of at least one surface, Is printed on both sides of the polyimide resin substrate on the side of the surface on which the polyimide substrate is placed and then the copper foils on both sides are removed by etching and the printed material on which the mark on the line is printed is laid under the exposed polyimide substrate, Was prepared by measuring the brightness of each observation point along the direction perpendicular to the direction in which the mark on the line was observed with respect to the image obtained by the photographing when the image was photographed with the CCD camera over the polyimide substrate In a point-brightness graph, a top average value Bt of a brightness curve generated from an end of the mark to a portion where the mark is not drawn, A value indicating the position of an intersection point closest to the mark on the line among the intersections of the brightness curve and Bt in the observation point-brightness graph is t1 (? B = Bt-Bb) And a value indicating a position of an intersection nearest to the mark on the line among the intersections of the brightness curve and 0.1? B in the depth range from the intersection of the brightness curve and Bt to 0.1 ?? B with respect to Bt is t2, The Sv defined by the following formula (1) becomes 3.5 or more.

Sv = (DELTA Bx0.1) / (t1-t2) (1)

In another embodiment of the surface-treated copper foil according to the present invention, the surface roughness Rsk of the surface-treated copper foil is -0.30 to 0.39, and the Sv defined by the formula (1) in the lightness curve is 3.9 Or more.

In another embodiment of the surface-treated copper foil according to the present invention, the Sv defined by the formula (1) in the lightness curve is 5.0 or more.

In another embodiment of the surface-treated copper foil according to the present invention, the average roughness (Rz) of TD on the surface is 0.20 to 0.64 占 퐉, the three-dimensional surface area A of the surface roughness particles and the two- (A / B) of 1.0 to 1.7.

In another embodiment of the surface-treated copper foil according to the present invention, the average roughness Rz of the TD is 0.26 to 0.62 占 퐉.

In another embodiment of the surface-treated copper foil according to the present invention, the A / B ratio is 1.0 to 1.6.

The present invention is, in another aspect, a laminated board comprising a surface-treated copper foil of the present invention and a resin substrate laminated.

In another aspect, the present invention is a printed wiring board using the surface-treated copper foil of the present invention.

According to another aspect of the present invention, there is provided an electronic apparatus using the printed wiring board of the present invention.

According to another aspect of the present invention, there is provided a method for manufacturing a printed wiring board in which two or more printed wiring boards are connected by connecting two or more printed wiring boards of the present invention.

According to another aspect of the present invention, there is provided a printed wiring board comprising at least one printed wiring board of the present invention, and a step of connecting a printed wiring board other than the one of the present invention or the printed wiring board of the present invention Thereby manufacturing two or more connected printed wiring boards.

According to another aspect of the present invention, there is provided an electronic device using at least one printed wiring board to which at least one printed wiring board of the present invention is connected.

According to the present invention, it is possible to provide a surface-treated copper foil excellent in transparency of a resin after being well adhered to a resin and removing the copper foil by etching, and a laminated board using the same.

Fig. 1 is a schematic diagram showing the surface morphology of polyimide (PI) after copper foil etching in each case where the resistance Rsk of the surface of the copper foil is positive or negative.
2 is a schematic diagram for defining Bt and Bb.
3 is a schematic diagram defining t1 and t2 and Sv.
4 is a schematic diagram showing a method of measuring the composition of a photographing apparatus and a slope of a lightness curve at the time of evaluating the slope of the lightness curve.
5A is a SEM photograph of the copper foil surface of Comparative Example 1 at the time of Rz evaluation.
5B is a SEM photograph of the surface of the copper foil of Example 1 at the time of Rz evaluation.
5C is a SEM photograph of the surface of the copper foil of Example 2 at the time of Rz evaluation.
6 is a photograph of the appearance of the impurities used in the embodiment.
Fig. 7 is a photograph of the appearance of the impurities used in the examples. Fig.

[Form of surface-treated copper foil and manufacturing method]

The copper foil used in the present invention is useful for a copper foil to be used by bonding a resin substrate to produce a laminate and removing the copper foil by etching.

The copper foil used in the present invention may be either an electrolytic copper foil or a rolled copper foil. Normally, when the surface of the copper foil to be adhered to the resin substrate, that is, the surface of the surface-treated side is subjected to a roughening treatment for carrying out electrodeposition of protrusions on the surface of the copper foil after degreasing in order to improve the peel strength of the copper foil after lamination do. The electrolytic copper foil has irregularities at the time of manufacture, but the convex portions of the electrolytic copper foil can be strengthened by the roughening treatment to further increase the irregularities. In the present invention, this roughening treatment can be carried out by an alloy plating such as a copper-cobalt-nickel alloy plating or a copper-nickel-phosphorus alloy plating, preferably a copper alloy plating. Conventional copper plating or the like may be applied as a pretreatment before harmonization. In order to prevent electrodeposition from falling off as a post-conditioning finishing treatment, conventional copper plating may be performed.

The copper foil to be used in the present invention may be provided with a heat-resistant plating layer or a rust-preventive plating layer on the surface thereof after the roughening treatment or after the roughening treatment is omitted. In the present invention, known treatments relating to the heat-resistant plating layer and the anti-corrosive plating layer may be included as necessary.

The thickness of the copper foil used in the present invention is not particularly limited. For example, the thickness of the copper foil is not less than 1 占 퐉, not less than 2 占 퐉, not less than 3 占 퐉, not less than 5 占 퐉, such as not more than 3000 占 퐉, Not more than 800 mu m, not more than 300 mu m, not more than 150 mu m, not more than 100 mu m, not more than 70 mu m, not more than 50 mu m, not more than 40 mu m.

The rolled copper foil according to the present invention may contain at least one element selected from the group consisting of Ag, Sn, In, Ti, Zn, Zr, Fe, P, Ni, Si, Te, Cr, Nb, V, Alloy foil is also included. When the concentration of the element is high (for example, 10 mass% or more in total), the conductivity may be lowered. The electrical conductivity of the rolled copper foil is preferably 50% IACS or more, more preferably 60% IACS or more, and still more preferably 80% IACS or more. The rolled copper foil also includes copper foil produced using tough pitch copper (JIS H3100 C1100) or oxygen free copper (JIS H3100 C1020).

The production conditions of the electrolytic copper foil to be used in the present invention are shown below.

<Electrolyte Composition>

Copper: 100 g / ℓ

Sulfuric acid: 100 g / l

Chlorine: 10 to 100 ppm

Leveling agent 1 (bis (3-sulfopropyl) disulfide): 10 to 30 ppm

Leveling second (amine compound): 10 to 30 ppm

The amine compound may be an amine compound of the following formula.

[Chemical Formula 1]

Wherein R ₁ and R ₂ are selected from the group consisting of a hydroxyalkyl group, an ether group, an aryl group, an aromatic substituted alkyl group, an unsaturated hydrocarbon group and an alkyl group.

<Manufacturing Conditions>

Current density: 70 to 100 A / dm 2

Electrolyte temperature: 50 to 60 ° C

Electrolyte flux: 3 ~ 5 m / sec

Electrolysis time: 0.5 to 10 minutes

The copper-cobalt-nickel alloy plating as the roughening treatment is preferably a copper-cobalt-nickel alloy plating having an adhesion amount of 15 to 40 mg / dm 2 and a nickel-100 to 3000 ㎍ / dm 2 of cobalt- It can be performed so as to form a core alloy layer. When the Co deposition amount is less than 100 占 퐂 / dm2, the heat resistance is deteriorated and the etching property is sometimes deteriorated. When the Co adherence amount is more than 3000 占 퐂 / dm2, it is not preferable when the effect of magnetism is to be considered, and etching unevenness occurs, and the acid resistance and chemical resistance deteriorate in some cases. When the Ni adhesion amount is less than 100 占 퐂 / dm2, the heat resistance may be deteriorated. On the other hand, if the amount of Ni adhered exceeds 1500 / / dm 2, etching residues may increase. The preferred Co deposition amount is 1000 to 2500 占 퐂 / dm2, and the preferable nickel deposition amount is 500 to 1200 占 퐂 / dm2. Here, the term "etching unevenness" means that Co remains unmelted when etching with copper chloride, and that the etching residues means that Ni remains unmelted when subjected to alkali etching with ammonium chloride.

The plating bath and plating conditions for forming such a ternary copper-cobalt-nickel alloy plating are as follows:

Plating bath composition: 10 to 20 g / l of Cu, 1 to 10 g / l of Co, 1 to 10 g / l of Ni

pH: 1-4

Temperature: 30 ~ 50 ℃

Current density (D _k ): 20 to 30 A / dm 2

Plating time: 1 to 5 seconds

The surface-treated copper foil according to one embodiment of the present invention is subjected to a roughening treatment under a condition that the plating time is shortened and the current density is made higher than the conventional one. The coarsening treatment is carried out under the condition that the plating time is shortened and the current density is made higher than in the prior art, so that fine coarsened particles are formed on the surface of the copper foil. When the current density of the plating is set to a high value in the above-described range, it is necessary to set the plating time to a low value in the above-described range.

The plating conditions of the copper-nickel-phosphorus alloy as the roughening treatment of the present invention are shown below.

Plating bath composition: 10 to 50 g / l of Cu, 3 to 20 g / l of Ni, 1 to 10 g / l of P

pH: 1-4

Temperature: 30 ~ 40 ℃

Current density (D _k ): 30 to 50 A / dm 2

Plating time: 0.2 to 3 seconds

The surface-treated copper foil according to one embodiment of the present invention is subjected to a roughening treatment under a condition that the plating time is shortened and the current density is made higher than the conventional one. The coarsening treatment is carried out under the condition that the plating time is shortened and the current density is made higher than in the prior art, so that fine coarsened particles are formed on the surface of the copper foil. When the current density of the plating is set to a high value in the above-described range, it is necessary to set the plating time to a low value in the above-described range.

The copper-nickel-cobalt-tungsten alloy plating conditions as the roughening treatment of the present invention are shown below.

Plating bath composition: 5 to 20 g / l of Cu, 5 to 20 g / l of Ni, 5 to 20 g / l of Co, 1 to 10 g / l of W

pH: 1-5

Temperature: 30 ~ 50 ℃

Current density (D _k ): 30 to 50 A / dm 2

Plating time: 0.2 to 3 seconds

The surface-treated copper foil according to one embodiment of the present invention is subjected to a roughening treatment under a condition that the plating time is shortened and the current density is made higher than the conventional one. The coarsening treatment is carried out under the condition that the plating time is shortened and the current density is made higher than in the prior art, so that fine coarsened particles are formed on the surface of the copper foil. When the current density of the plating is set to a high value in the above-described range, it is necessary to set the plating time to a low value in the above-described range.

The plating conditions of the copper-nickel-molybdenum-phosphorus alloy as the roughening treatment of the present invention are shown below.

Plating bath composition: 5 to 20 g / l of Cu, 5 to 20 g / l of Ni, 1 to 10 g / l of Mo, 1 to 10 g /

pH: 1-5

Temperature: 30 ~ 50 ℃

Current density (D _k ): 30 to 50 A / dm 2

Plating time: 0.2 to 3 seconds

The surface-treated copper foil according to one embodiment of the present invention is subjected to a roughening treatment under a condition that the plating time is shortened and the current density is made higher than the conventional one. The coarsening treatment is carried out under the condition that the plating time is shortened and the current density is made higher than in the prior art, so that fine coarsened particles are formed on the surface of the copper foil. When the current density of the plating is set to a high value in the above-described range, it is necessary to set the plating time to a low value in the above-described range.

After the roughening treatment, a cobalt-nickel alloy plating layer of nickel of 100 to 700 占 퐂 / dm2 in cobalt having an adhesion amount of 200 to 3000 占 퐂 / dm2 can be formed on the roughened surface. This treatment can be regarded as a kind of rust treatment in a broad sense. This cobalt-nickel alloy plating layer needs to be carried out to such an extent that the bonding strength between the copper foil and the substrate is not substantially lowered. When the cobalt adherence amount is less than 200 占 퐂 / dm2, the heat-resisting peel strength may be lowered and the oxidation resistance and chemical resistance may be deteriorated. In addition, as another reason, if the amount of cobalt is small, the treated surface becomes reddish. If the amount of cobalt adhered exceeds 3000 占 퐂 / dm2, it is not preferable when the influence of magnetism is to be considered, etching unevenness may occur, and acid resistance and chemical resistance may be deteriorated. The preferable cobalt deposition amount is 500 to 2500 占 퐂 / dm2. On the other hand, when the nickel adhesion amount is less than 100 占 퐂 / dm2, the heat peel strength may be lowered and the oxidation resistance and the chemical resistance may be deteriorated. If the nickel exceeds 1300 占 퐂 / dm2, the alkali etching property is deteriorated. The preferred amount of nickel adhered is 200 to 1200 占 퐂 / dm2.

An example of the conditions of the cobalt-nickel alloy plating is as follows:

Plating bath composition: Co 1 to 20 g / l, Ni 1 to 20 g / l

pH: 1.5 to 3.5

Temperature: 30 ~ 80 ℃

Current density (D _k ): 1.0 to 20.0 A / dm 2

Plating time: 0.5 to 4 seconds

According to the present invention, a zinc plating layer having an adhesion amount of 30 to 250 占 퐂 / dm2 is formed on the cobalt-nickel alloy plating. When the zinc adhesion amount is less than 30 占 퐂 / dm2, the effect of improving the heat deterioration rate may be lost. On the other hand, if the zinc adhesion amount exceeds 250 占 퐂 / dm2, the hydrochloric acid deterioration rate may be extremely deteriorated. Preferably, the zinc adhesion amount is 30 to 240 占 퐂 / dm2, more preferably 80 to 220 占 퐂 / dm2.

The conditions of the zinc plating are as follows:

Plating bath composition: Zn 100 ~ 300 g / ℓ

pH: 3-4

Temperature: 50 ~ 60 ℃

Current density (D _k ): 0.1 to 0.5 A / dm 2

Plating time: 1 to 3 seconds

Further, a zinc alloy plating layer such as a zinc-nickel alloy plating layer may be formed in place of the zinc plating layer, or a rust-preventive layer may be formed on the outermost surface by chromate treatment, application of a silane coupling agent or the like.

The surface-treated copper foil of the present invention is subjected to a treatment at a low current density so as not to cause irregularities in the plating film as described above, and in the case where the plating treatment is carried out, By downsizing the particles and plating them in a short time, it is possible to perform a surface treatment with a small degree of roughness, thereby controlling the surface roughness Rsk.

[Thickness of copper foil surface (Rsk)]

The degree of distortion Rsk represents the Z (x) th power average in the reference length which is dimensionless by the third power of the root mean square height Rq.

The square root mean square height (Rq) is an index indicating the degree of unevenness in the surface roughness measurement by a non-contact type roughness meter conforming to JIS B 0601 (2001), expressed by the following formula (A) (Height of the mountain) in the axial direction and is a root-mean-square root of the height of the mountain (Z (x)) at the reference length lr.

Root mean square height (Rq) of the height of the mountain at the reference length lr:

The reason (Rsk) is expressed by the following formula (B), using the root mean square height (Rq).

The deformation Rsk of the surface of the copper foil is an index indicating the objectivity of the surface irregularities of the surface of the copper foil when the average surface of the irregular surface of the surface of the copper foil is the center. As shown in Fig. 1, if Rsk < 0, the height distribution is shifted upward with respect to the average surface, and if Rsk > 0, the height distribution is shifted downward with respect to the average surface. When the bias toward the upper side is large, when the copper foil is attached to the polyimide (PI) and removed by etching, the PI surface has a concave shape. When light is irradiated from the light source, the diffuse reflection inside the PI becomes large. When the bias toward the lower side is large, when the copper foil is attached to the polyimide (PI) and then removed by etching, the PI surface is convex, and when the light is irradiated from the light source, the diffuse reflection on the PI surface becomes large.

In the surface-treated copper foil of the present invention, the distortion Rsk of at least one of the surfaces is controlled to -0.35 to 0.53. By such a constitution, the peel strength becomes high, the resin adheres well to the resin, and the transparency of the resin after removing the copper foil by etching is improved. As a result, it becomes easy to align the IC chip when the IC chip is mounted through a positioning pattern which is visible through the resin. If the degree of strain Rsk is less than -0.35, the surface treatment such as roughening treatment of the surface of the copper foil becomes insufficient and there arises a problem that it can not be sufficiently bonded to the resin. On the other hand, if the degree Rsk is more than 0.53, the unevenness of the resin surface after the removal of the copper foil by etching becomes large, resulting in a problem that the transparency of the resin becomes poor. The surface roughness Rsk of the surface-treated copper foil is preferably -0.30 or more, preferably -0.20 or more, and more preferably -0.10 or less. The surface roughness Rsk of the surface-treated copper foil is preferably 0.15 or more, more preferably 0.20 or more, more preferably 0.50 or less, more preferably 0.45 or less, more preferably 0.40 or less, desirable. The surface roughness Rsk of the surface-treated copper foil is preferably -0.30 or more, more preferably 0.50 or less, and most preferably 0.39 or less.

[Average roughness (Rz) of copper foil surface]

The surface-treated copper foil of the present invention may be an unhardened copper foil or a roughened copper foil having roughened particles formed therein, and preferably has an average roughness Rz of 0.20 to 0.64 mu m at the roughened surface. By such a constitution, the peel strength becomes higher, the resin adheres well to the resin, and the transparency of the resin after removing the copper foil by etching is further increased. As a result, it becomes easier to position the IC chip when the IC chip is mounted through a positioning pattern which is visible through the resin. If the average roughness Rz of TD is less than 0.20 占 퐉, there is a fear that the roughening treatment of the surface of the copper foil is insufficient, and there is a possibility that a problem that the resin can not be sufficiently bonded can occur. On the other hand, if the average roughness Rz of TD is more than 0.64 占 퐉, the unevenness of the resin surface after the removal of the copper foil by etching may become large, and as a result, there is a possibility that the transparency of the resin becomes poor. The average roughness (Rz) of TD of the treated surface is more preferably 0.26 to 0.62 mu m, and still more preferably 0.40 to 0.55 mu m.

In order to achieve the visibility effect of the present invention, the roughness (Rz) and gloss of the TD of the surface of the copper foil-treated side before the surface treatment are controlled. Specifically, the surface roughness Rz of the TD of the copper foil before the surface treatment is 0.20 to 0.55 mu m, and more preferably 0.20 to 0.42 mu m. Such a copper foil can be produced by rolling (high gloss rolling) by adjusting the oil film equivalent of the rolling oil, or by chemical polishing such as chemical etching or electrolytic polishing in a phosphoric acid solution. By setting the surface roughness (Rz) and gloss of the TD of the copper foil before the treatment to the above-mentioned range in this way, it is possible to easily control the surface roughness (Rz) and surface area of the treated copper foil.

The copper foil before surface treatment is more preferably 500 to 810%, and more preferably 500 to 710%, with the 60 degree glossiness of TD being 300 to 910%. If the 60 degree glossiness of the TD of the copper foil before the surface treatment is less than 300%, the transparency of the above-mentioned resin may become worse than that of 300% or more, and if it exceeds 910%, the problem that the production becomes difficult .

The high gloss rolling can be carried out by setting the oil film equivalent as defined by the following formula to 13000 to 24000 or less.

The yield stress of the material [kg / mm &lt; 2 &gt;] is expressed by the following formula: [(rolling oil viscosity [cSt]) x )}

The rolling oil viscosity [cSt] is the kinematic viscosity at 40 占 폚.

In order to make the oil film equivalent to 13000 to 24000, it is possible to use a known method such as using a low-viscosity rolling oil or slowing the passing speed.

The chemical polishing is carried out over a long period of time by lowering the concentration by an etching solution such as sulfuric acid-hydrogen peroxide-aqueous or ammonia-hydrogen peroxide-aqueous system.

[Slope of brightness curve]

The surface-treated copper foil of the present invention can be produced by a process comprising the steps of: adhering both surfaces of a polyimide base resin, removing copper foils on both sides by etching, printing a printed line mark on the exposed surface of the polyimide substrate, The observation point-lightness value obtained by photographing with a CCD camera over a polyimide substrate and measuring the brightness of each observation point along a direction perpendicular to the direction in which the mark on the observed line extends, In the graph, the difference between the top average value Bt and the bottom average value Bb of the brightness curve generated from the end of the mark to the portion where the mark is not drawn is? B (? B = Bt-Bb) In the graph, a value indicating the position of an intersection point closest to the line mark on the intersection of the brightness curve and Bt is t1, and Bt is calculated from the intersection of the brightness curve and Bt When a value indicating the position of an intersection point closest to the line mark among the intersections of the lightness curve and 0.1 DELTA B is defined as t2 in the depth range up to 0.1 DELTA B as a reference, Or more.

Here, the top average value Bt of the brightness curve, the bottom average value Bb of the brightness curve, and t1, t2, and Sv described later will be described with reference to the drawings.

2 (a) and 2 (b) are schematic views for defining Bt and Bb when the width of the mark is about 0.3 mm. When the width of the mark is about 0.3 mm, there may be a case where the lightness curve is a V-type lightness curve as shown in Fig. 2 (a) and a lightness curve having a bottom as shown in Fig. 2 (b). In any case, the "top average value (Bt) of brightness curve" represents an average value of brightness measured at five points (10 points on both sides in total) at intervals of 30 탆 from positions 50 탆 away from the end positions on both sides of the mark. On the other hand, when the brightness curve is a V-shape as shown in Fig. 2 (a), the "bottom average value Bb of the brightness curve" indicates the minimum brightness value at the tip of the V- b, the value of the central portion of about 0.3 mm is shown. The width of the mark may be about 0.2 mm, 0.16 mm, and 0.1 mm. The top average value (Bt) of the brightness curve was calculated from five points (total of 10 points on both sides) at a distance of 100 占 퐉, 300 占 퐉, or 500 占 퐉 apart from the end positions on both sides of the mark, ) May be an average value of brightness when measured.

Fig. 3 shows a schematic diagram defining t1 and t2 and Sv. &Quot; t1 (pixel x 0.1) &quot; indicates an intersection point closest to the line-shaped mark among intersections of the brightness curve and Bt. "T2 (pixel x 0.1)" represents an intersection closest to the line-shaped mark among the intersections of the brightness curve and 0.1ΔB in the depth range from the intersection of the brightness curve and Bt to 0.1 ΔB with respect to Bt. At this time, the slope of the brightness curve represented by the line connecting t1 and t2 is defined as Sv (grayscale / pixel x 0.1) calculated at 0.1? B in the y-axis direction and at t1-t2 in the x-axis direction. Further, one pixel on the horizontal axis corresponds to a length of 10 mu m. Sv measures both sides of the mark and employs a small value. Further, when the shape of the brightness curve is unstable and a plurality of "intersection points of brightness curve and Bt" exist, an intersection nearest to the closest mark is employed.

In the image photographed by the CCD camera, a high brightness is obtained at a portion not marked, but the brightness decreases at the end of the mark. When the visibility of the polyimide substrate is good, such a state of decrease in brightness is clearly observed. On the other hand, if the visibility of the polyimide substrate is poor, the lightness does not suddenly descend from "high" to "low" at once in the vicinity of the end of the mark, but the lowered state becomes gentler and the lowered state of brightness becomes unclear.

On the basis of the above finding, the present invention is based on such a finding that, with respect to a polyimide substrate to which a surface-treated copper foil of the present invention is bonded and removed, a printed material with a mark is placed below the polyimide substrate, The inclination of the brightness curve near the end of the mark drawn in the observation point-brightness graph to be obtained is controlled. More specifically, the difference between the top average value Bt and the bottom average value Bb of the lightness curve is? B (? B = Bt-Bb), and in the observation point- A value indicating the position of the intersection closest to the mark on the line is set to t1. In the depth range from the intersection of the lightness curve and Bt to 0.1 ?? B with respect to Bt, of the intersection of the lightness curve and 0.1? And the value indicating the position of the intersection closest to the center of gravity is t2, the Sv defined by the above formula (1) becomes 3.5 or more. According to such a configuration, the discrimination power of the mark beyond the polyimide by the CCD camera is improved without being influenced by the type and thickness of the substrate resin. This makes it possible to manufacture a polyimide substrate having excellent visibility and improve positioning accuracy by marking when a predetermined process is performed on a polyimide substrate in an electronic substrate manufacturing process or the like, Is obtained. Sv is preferably not less than 3.9, preferably not less than 4.5, more preferably not less than 5.0, more preferably not less than 5.5. The upper limit of Sv is not particularly limited, but is, for example, 15 or less and 10 or less. According to such a configuration, the boundary between the mark and the non-mark portion becomes clearer, the positioning accuracy is improved, the error caused by the mark image recognition is reduced, and more precise alignment becomes possible.

Therefore, when the copper foil according to the embodiment of the present invention is used for a printed wiring board, it is considered that the connection failure is reduced and the yield is improved when one printed wiring board is connected to another printed wiring board.

[Surface area ratio of copper foil surface]

The ratio (A / B) of the three-dimensional surface area (A) and the two-dimensional surface area (B) of the surface of the copper foil on the surface-treated side greatly affects the transparency of the above-mentioned resin. That is, when the surface roughness Rz is the same, the copper foil having a small ratio (A / B) has better transparency of the above-mentioned resin. Therefore, the surface-treated copper foil of the present invention preferably has a ratio (A / B) of 1.0 to 1.7, more preferably 1.0 to 1.6. Here, the ratio (A / B) of the three-dimensional surface area (A) and the two-dimensional surface area (B) of the coarse particles on the surface of the surface treatment side is, for example, (A / B) of the area (B) obtained when the copper foil is viewed from the plane from the copper foil surface side.

The surface state such as the shape of the particles, the density of formation and the irregularity state of the surface are determined by controlling the current density and the plating time at the surface treatment such as the formation of the particles, and the surface roughness Rz, The surface area ratio (A / B) can be controlled.

The surface treated copper foil of the present invention can be produced by laminating a resin substrate with a surface treatment side. The resin substrate is not particularly limited as long as it has properties applicable to a printed wiring board and the like. For example, for a rigid PWB, a paper base phenol resin, a paper base epoxy resin, a synthetic fiber base epoxy resin, , A glass cloth / glass nonwoven fabric composite base epoxy resin, a glass cloth base epoxy resin or the like can be used, and a polyester film, a polyimide film, a liquid crystal polymer (LCP) film, a Teflon (registered trademark) film or the like can be used for FPC .

In the case of the rigid PWB, a prepreg is prepared by impregnating a base material such as glass cloth with resin and hardening the resin to a semi-hardened state. The copper foil is superimposed on the prepreg from the opposite side of the coating layer and is heated and pressed. In the case of an FPC, a laminate is produced by applying an adhesive to a base material such as a polyimide film or by laminating the base material to a copper foil under high temperature and high pressure without using an adhesive, or by applying, drying and curing a polyimide precursor .

The thickness of the polyimide base resin is not particularly limited, but it is generally 25 占 퐉 or 50 占 퐉.

The laminate of the present invention can be used for various printed wiring boards (PWB), and is not particularly limited. For example, from the viewpoint of the number of layers of the conductor pattern, it can be applied to one side PWB, double side PWB, And can be applied to the rigid PWB, the flexible PWB (FPC), and the rigid flex PWB from the viewpoint of the kind of the insulating substrate material.

(Method of positioning a laminated board and a printed wiring board using the same)

A method of positioning the laminated board of the surface-treated copper foil and the resin substrate of the present invention will be described. First, a laminated board of a surface-treated copper foil and a resin substrate is prepared. Specific examples of the laminated board of the surface-treated copper foil and the resin substrate of the present invention include a laminate of a copper substrate and at least one surface of a resin substrate such as polyimide used for electrically connecting the main substrate and an attached circuit board, The flexible printed circuit board is precisely positioned and press-bonded to the end portion of the circuit board of the main circuit board and the circuit board to which the flexible printed circuit board is attached. That is, in this case, the laminated board is a laminate obtained by bonding the wiring end portions of the flexible printed circuit board and the main substrate by compression bonding, or a laminated board obtained by bonding the wiring end portions of the flexible printed circuit board and the circuit board by press bonding. The laminated board has a mark formed of a part of the copper wiring or a separate material. The position of the mark is not particularly limited as long as it can be photographed by a photographing means such as a CCD camera over the resin constituting the laminated plate.

In the thus prepared laminated plate, when the above-described mark is photographed by the photographing means over resin, the position of the mark can be detected satisfactorily. Then, the position of the mark is detected in this manner, and the positioning of the laminate of the surface-treated copper foil and the resin substrate can be favorably performed based on the detected position of the mark. Also in the case where a printed wiring board is used as the laminated board, the position of the mark can be detected well by the photographing means by this positioning method, and positioning of the printed wiring board can be performed more accurately.

Therefore, when one printed wiring board is connected to another printed wiring board, it is considered that the defective connection is reduced and the yield is improved. As a method for connecting one printed wiring board to another printed wiring board, a connection via anisotropic conductive film (ACF), anisotropic conductive paste (ACP) A known connection method such as connection through an adhesive having conductivity can be used. In the present invention, the &quot; printed wiring board &quot; includes a printed wiring board on which components are mounted, a printed circuit board, and a printed board. In addition, it is possible to manufacture a printed wiring board to which two or more printed wiring boards are connected by connecting two or more printed wiring boards of the present invention, and further, there can be provided at least one printed wiring board of the present invention, Alternatively, a printed wiring board which does not correspond to the printed wiring board of the present invention can be connected, and an electronic apparatus can be manufactured by using such a printed wiring board. In the present invention, the "copper circuit" is also assumed to include a copper wiring.

The positioning method according to the embodiment of the present invention may include a step of moving the laminate (including a laminate of a copper foil and a resin substrate or a printed wiring board). In the moving process, for example, it may be moved by a conveyor such as a belt conveyor or a chain conveyor, by a moving device provided with an arm mechanism, or by a moving device or moving means for moving the laminate by floating using a base A moving device or a moving device (including a roller or a bearing) for moving a laminated plate by rotating an article such as a substantially cylindrical or the like, a moving device or a moving device using hydraulic pressure as a power source, a moving device using air pressure as a power source A moving device or a moving device having a stage such as a moving device or a moving device using a motor as a power source, a linear guide stage for moving a gantry, a gantry moving air guide stage, a stacked linear guide stage, a linear motor driving stage, do. Also, a moving process by a known moving means may be carried out.

The positioning method according to the embodiment of the present invention may be used for a surface mount device or a chip mount.

The laminate of the surface-treated copper foil and the resin substrate positioned in the present invention may be a resin board and a printed wiring board having a circuit formed on the resin board. In this case, the mark may be the circuit.

In the present invention, &quot; positioning &quot; includes &quot; detecting the position of a mark or an object &quot;. In the present invention, &quot; alignment &quot; includes &quot; moving a mark or an object to a predetermined position based on the detected position after detecting the position of the mark or object &quot;.

In the printed wiring board, the circuit on the printed wiring board may be used as a mark instead of the mark of the printed material, and the circuit may be photographed with a CCD camera to measure the value of Sv. The copper-clad laminate was prepared by etching copper to form a line, then, instead of the mark of the printed material, the copper on the line was marked, and the copper in the line was photographed with the CCD camera. The value can be measured.

Example

Each of the copper foils was prepared as Examples 1 to 7 and Comparative Examples 1 and 2, and plating treatment was performed on one surface thereof under the conditions shown in Table 2 as a roughening treatment. It was also prepared that no harmony treatment was performed.

The rolled copper foil was prepared as follows. A predetermined copper ingot was produced and subjected to hot rolling. Annealing and cold rolling of a continuous annealing line at 300 to 800 캜 were repeated to obtain a rolled plate having a thickness of 1 to 2 mm. This rolled sheet was annealed in a continuous annealing line at 300 to 800 캜 to be recrystallized and finally cold rolled to the thickness of Table 1 to obtain a copper foil. &Quot; Tough pitch copper &quot; in Table 1 indicates tough pitch copper specified in JIS H3100 C1100, and &quot; oxygen free copper &quot; indicates oxygen free copper specified in JIS H3100 C1020. For example, &quot; tough pitch copper + Ag 180 ppm &quot; in the column of the metal foil (before surface treatment) in Table 1 means that 180 mass ppm of Ag is added to tough pitch copper.

Table 1 shows the points of the copper foil manufacturing process before the surface treatment. &Quot; High gloss rolling &quot; means that the final cold rolling (cold rolling after final recrystallization annealing) is carried out at the value of the oil film equivalent described above.

The electrolytic copper foil was produced under the following conditions.

Electrolyte composition (copper: 100 g / l, sulfuric acid: 100 g / l, chlorine: 50 ppm, leveling agent 1 (bis (3 sulfopropyl) disulfide): 10 to 30 ppm, leveling agent 2 10 to 30 ppm)

· Electrolyte temperature: 50 to 60 ° C

Current density: 70 to 100 A / dm 2

· Delivery time: 1 minute

· Electrolyte flux: 4 m / sec

The following amine compounds were used for the amine compounds.

(2)

Wherein R ₁ and R ₂ are selected from the group consisting of a hydroxyalkyl group, an ether group, an aryl group, an aromatic substituted alkyl group, an unsaturated hydrocarbon group and an alkyl group.

Various evaluations were carried out for each of the samples prepared as described above and the comparative example as follows.

(1) measurement of surface roughness (Rz);

Ten-point average roughness was measured on the surface-treated surface in accordance with JIS B 0601-1994 by using a contact roughness tester Surfcorder SE-3C manufactured by Kosaka Laboratory Co., Ltd. for each of the copper foils subjected to the surface treatment in each of the examples and comparative examples. (The direction of progress of the copper foil at the time of rolling, that is, the width direction) of the rolled copper foil (the direction of the width of the copper foil at the time of rolling) was 0.8 mm, the evaluation length of 4 mm, the cutoff value of 0.25 mm and the feed rate of 0.1 mm / TD), or for the electrolytic copper foil, the measurement position is changed in the direction perpendicular to the advancing direction of the electrolytic copper foil in the electrolytic copper foil production apparatus (i.e., the width direction) , And the values at ten measurements were obtained.

The surface roughness (Rz) of the copper foil before the surface treatment was also determined in the same manner.

(2) Measurement of surface roughness (Rsk);

First, the root mean square height (Rq) and the degree of distortion (Rsk) of the surface of the copper foil were measured with a laser microscope OLS4000 manufactured by Olympus Corporation. The measurement was carried out by measuring the direction (TD) perpendicular to the rolling direction of the rolled copper foil under the condition that the evaluation length was 647 占 퐉 and the cutoff value was zero in the observation of the copper foil surface at a magnification of 1000 times or in the electrolytic copper foil production apparatus And the direction (TD) perpendicular to the traveling direction of the electrolytic copper foil. The measurement environmental temperature of the surface roughness (Rsk) by the laser microscope was set at 23 to 25 占 폚.

(3) the surface area ratio (A / B) of the copper foil surface;

The surface area of the coarse particles was measured by a laser microscope. The three-dimensional surface area A in the area of 647 占 퐉 占 646 占 퐉 equivalent area B (417,953 占 퐉 ^{2 in} practical data) at 1000 times magnification of the treated surface was measured using a laser microscope OLS4000 manufactured by Olympus Corporation, Dimensional surface area (A) / 2-dimensional surface area (B) = surface area ratio (A / B). The measurement environment temperature of the three-dimensional surface area (A) by a laser microscope was 23 to 25 占 폚.

(4) glossiness;

A glossiness meter Handy Gloss Meter PG-1 manufactured by Nippon Denshoku Industries Co., Ltd. in accordance with JIS Z8741 was used, and glossiness at an incident angle of 60 degrees in the direction (TD) perpendicular to the rolling direction was measured for the rolled copper foil, The glossiness at an incident angle of 60 degrees in the direction (TD) perpendicular to the traveling direction of the electrolytic copper foil in the electrolytic copper foil production apparatus was measured for the copper foil before surface treatment, respectively.

(5) Slope of brightness curve

The copper foil was adhered to both surfaces of a polyimide film (thickness 50 mu m, produced by Kaneka), and the copper foil was removed by etching (ferric chloride aqueous solution) to prepare a sample film. Subsequently, printed matter printed with black mark on the line was laid beneath the sample film, the printed matter was photographed with a CCD camera (line CCD camera of 8192 pixels) over the sample film, and with respect to the image obtained by photographing, In the observation point-brightness graph prepared by measuring the brightness of each observation point along a direction perpendicular to the direction in which the mark on the mark is extended from the lightness curve generated from the end of the mark to the portion where the mark is not drawn, t1, t2, and Sv were measured. Fig. 4 is a schematic diagram showing a configuration of a photographing apparatus used at this time and a method of measuring a lightness curve.

As shown in Fig. 3,? B and t1, t2, and Sv were measured by the following photographing apparatus. One pixel on the horizontal axis corresponds to a length of 10 mu m.

The printed matter on which the black mark on the line is printed has a gloss value of 43.0 ± 2 on white glossy paper in accordance with JIS P8208 (1998) (copy of the measurement chart of Fig. 1) and JIS P8145 (2011) 6 (a copy of the visual inspection method foreign material comparison chart and JA.1-visual inspection method foreign substance comparison chart)), the impurities on which various lines were printed (manufactured by Choyo Chemical Co., Ltd.: - Full size version "Part Number: JQA160-20151-1 (manufactured by the National Bureau of Printing, Independent Administrative Act)).

The glossiness of the glossy paper was measured at an angle of incidence of 60 degrees using a gloss meter, Handy Gloss meter PG-1 manufactured by Nippon Denshoku Kogyo Co., Ltd. in accordance with JIS Z8741.

The photographing apparatus includes a CCD camera, a stage (white) having a polyimide substrate on which a mark (a glossy paper with impurities) is placed, an illumination power source for irradiating the photographing unit of the polyimide substrate with light, And a conveyor (not shown) for conveying the evaluation polyimide substrate having the paper attached thereon on the stage. The main specifications of the photographing apparatus are as follows:

· Photographing device: Nireco Co., Ltd. Sheet inspection device Mujiken

Line CCD camera: 8192 pixels (160 MHz), 1024 gradation digital (10 bits)

· Lighting power supply: High frequency lighting power supply (power supply unit × 2)

· Lighting: Fluorescent lamp (30 W, model name: FPL27EX-D, twin fluorescent lamp)

The Sv measuring line used was a line indicated by an arrow drawn in the obscuration of Fig. 6 of 0.7 mm &lt; 2 &gt;. The width of the line is 0.3 mm. The line CCD camera field of view is arranged in a dotted line in Fig.

In the case of photographing with a line CCD camera, signals are checked at a full scale of 256 gradations. In a state where a polyimide film (polyimide substrate) to be measured is not placed, a spot on the white glossy paper When the transparent film was placed and a point other than the mark printed on the impure substance was measured with the CCD camera from the side of the transparent film), the lens iris was adjusted so that the peak gradation signal was included in 230 +/- 5. The camera scan time (the time when the camera shutter was opened and the time when the light was introduced) was fixed to 250 microseconds, and the lens diaphragm was adjusted so as to be included within the above gradation.

In addition, with respect to the lightness shown in Fig. 4, 0 means "black", brightness 255 means "white", and the degree of gray from "black" to "white" (grayscale in black and white) 256 gradations are displayed in a divided manner.

(6) Visibility (resin transparency);

The copper foil was adhered to both surfaces of a polyimide film (thickness 50 mu m, produced by Kaneka), and the copper foil was removed by etching (ferric chloride aqueous solution) to prepare a sample film. A print (black circle having a diameter of 6 cm) was attached to one surface of the obtained resin layer, and the visibility of the print was judged from the opposite surface to the resin layer. The result of confirming that the outline of the black circle of the printed material is 90% or more of the circumference is "⊚", the outline of the black circle is 80% or more of the circumference of the circle and the length is less than 90% The fact that the contour became clear at a length less than 0 to 80% of the circumference and that the contour was broken was evaluated as &quot; x &quot; (rejection).

(7) Peel strength (adhesive strength);

According to IPC-TM-650, the state peel strength was measured with a tensile tester Autograph 100, and the state peel strength was 0.7 N / mm or more so that it could be used for laminated board applications. The peel strength was measured with a copper foil thickness of 18 占 퐉. The copper foil having a thickness of less than 18 占 퐉 was plated with copper to a thickness of 18 占 퐉. When the thickness is larger than 18 占 퐉, the copper foil is etched to have a thickness of 18 占 퐉. The peel strength was measured using a polyimide film having a thickness of 50 占 퐉 manufactured by Kaneka and a sample obtained by kneading the surface-treated surfaces of the surface-treated copper foils of the examples and comparative examples of the present invention. Further, at the time of measurement, the polyimide film was fixed by affixing it to a hard substrate (plate of stainless steel or plate of synthetic resin (which should not be deformed during peel strength measurement)) with double-sided tape.

(8) Yield

The copper foil was adhered to both surfaces of a polyimide film (thickness of 50 mu m produced by Kaneka), and the copper foil was etched (ferric chloride aqueous solution) to produce an FPC having a circuit width of L / S of 30 mu m / 30 mu m. Thereafter, an attempt was made to detect a mark of 20 mu m x 20 mu m in width on a polyimide with a CCD camera. &Quot; &quot; when it was detected 7 times to 8 times, &quot; DELTA &quot; when it was able to detect 6 times, and when it was detected 5 times or less Quot; x &quot;.

Tables 1 and 2 show conditions and evaluations of each test.

(1) surface roughness (Rz), (2) surface roughness (Rsk), (3) surface roughness (Rsk) of the copper circuit or copper foil surface on the copper circuit or copper foil surface by dissolving and removing the resin in the printed wiring board or copper- The area ratio (A / B) of the surface of the copper foil can be measured.

(Evaluation results)

In Examples 1 to 7, the surface roughness (Rsk) was in the range of -0.35 to 0.53, Sv was 3.5 or more, and the visibility, the peel strength, and the yield were good.

In Comparative Examples 1 and 2, the surface roughness Rsk was out of the range of -0.35 to 0.53, Sv was less than 3.5, and visibility and yield were poor.

Fig. 5 shows SEM observation photographs of the surfaces of the copper foils of (a) Comparative Example 1, (b) Example 1, and (c) Example 2 at the time of Rz evaluation.

Further, in Examples 1 to 7, the width of the mark was changed from 0.3 mm to 0.16 mm (the mark indicated by the arrow in Fig. 7) from the side closer to the base of 0.5 of the sheet area of the obscuration to 0.5 mm2 And the same Sv value was measured. All the Sv values were the same as those obtained when the width of the mark was 0.3 mm.

In Examples 1 to 7, the position of 50 占 퐉 from the both side end positions of the mark was divided into 100 占 퐉 apart, 300 占 퐉 apart, 500 占 퐉 apart from the top average value (Bt) of the lightness curve , And the same Sv value was measured by changing to the average value of the brightness measured at five points (10 points in total at both sides) at intervals of 30 占 퐉 from the position, and the Sv value was the same at both ends of the mark (Bt) of the brightness curve, the average value of the brightness when measured at five points (10 points on both sides in total) at a distance of 30 占 퐉 from a position spaced apart from 50 占 퐉 from the brightness value was obtained.

Claims (14)

A surface-treated copper foil having a distortion (Rsk) of -0.35 to 0.53 based on JIS B 0601-2001 of at least one surface,
The copper foil is applied to both surfaces of the polyimide resin substrate on the surface side where the surface treatment is performed, and then the copper foils on both sides are removed by etching,
When a printed matter on which a mark on a line is printed is laid under the exposed polyimide substrate and the printed matter is photographed with a CCD camera above the polyimide substrate,
In the observation point-brightness graph prepared by measuring the brightness of each observation point along a direction perpendicular to the direction in which the mark on the line is observed with respect to the image obtained by the photographing,
The difference between the top average value Bt and the bottom average value Bb of the brightness curve generated from the end of the mark to the portion where the mark is not drawn is defined as? B (? B = Bt-Bb) , A value indicating the position of an intersection point closest to the mark on the line among the intersections of the brightness curve and Bt is t1 and a brightness curve is obtained in the depth range from the intersection of the brightness curve and Bt to 0.1? And a value indicating a position of an intersection point closest to the mark on the line among the intersections of 0.1? B and 0.1? B is t2, the Sv defined by the following formula (1) is 3.5 or more.
Sv = (DELTA Bx0.1) / (t1-t2) (1)
(Note that the bottom average value Bb is the lowest value of the brightness at the tip of the V-shaped bone when the brightness curve is V-shaped, and when the brightness curve has a bottom, Lt; / RTI &gt; The method according to claim 1,
Wherein the surface roughness (Rsk) of the surface of the surface-treated copper foil is -0.30 to 0.39. The method according to claim 1,
Wherein the Sv defined by the expression (1) in the lightness curve is 3.9 or more. The method according to claim 1,
Wherein the Sv defined by the expression (1) in the lightness curve is 5.0 or more. The method according to claim 1,
(A / B) of 1.0 to 1.7, wherein the average roughness Rz of the surface in the width direction (TD) is 0.20 to 0.64 mu m and the ratio of the three-dimensional surface area (A) Treated copper. 6. The method of claim 5,
Wherein an average roughness (Rz) of the surface in the width direction (TD) is 0.26 to 0.62 mu m. 6. The method of claim 5,
Wherein the A / B is 1.0 to 1.6. A laminated board comprising the surface-treated copper foil according to any one of claims 1 to 7 and a resin substrate laminated. A printed wiring board using the surface-treated copper foil according to any one of claims 1 to 7. An electronic device using the printed wiring board according to claim 9. A method for producing a printed wiring board in which two or more printed wiring boards according to claim 9 are connected and two or more printed wiring boards are connected. A printed wiring board comprising at least one printed wiring board according to claim 9 and a printed wiring board according to any one of claims 9 to 9 or a printed wiring board not corresponding to the printed wiring board according to claim 9, Thereby forming a connected printed wiring board. An electronic device using at least one printed wiring board to which at least one printed wiring board manufactured by the method according to claim 11 is connected. An electronic device using at least one printed wiring board to which at least one printed wiring board manufactured by the method according to claim 12 is connected.

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