CN111757599B - Copper foil for flexible printed board - Google Patents
Copper foil for flexible printed board Download PDFInfo
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- CN111757599B CN111757599B CN202010223434.3A CN202010223434A CN111757599B CN 111757599 B CN111757599 B CN 111757599B CN 202010223434 A CN202010223434 A CN 202010223434A CN 111757599 B CN111757599 B CN 111757599B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/01—Alloys based on copper with aluminium as the next major constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
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- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The invention provides a copper foil for flexible printed circuit board, a copper-clad laminate using the copper foil, a flexible printed circuit board and an electronic device. A copper foil for flexible printed circuit board, which is a copper foil containing 99.0 mass% or more of Cu and the balance of unavoidable impurities, wherein the surface roughness Ra of the circuit surface after 2000 IPC slip bending cycles with a radius of curvature R=2.0 is 0.030, using a double-layer single-sided CCL sample having a width of 12.7mm and a length of 200mm, which is obtained by forming a circuit from the copper foilμm is more than 0.400μm is less than or equal to m.
Description
Technical Field
The present invention relates to a copper foil suitable for use in wiring members such as flexible printed boards, a copper-clad laminate using the copper foil, a flexible wiring board, and an electronic device.
Background
Flexible printed boards (flexible wiring boards, hereinafter referred to as "FPCs") are widely used for bending and moving parts of electronic circuits due to their flexibility. For example, FPCs are used for movable parts of disk-related devices such as HDDs, DVDs, and CD-ROMs, and bending parts of folding cellular phones.
The FPC is a substrate obtained by forming wiring by etching a copper-clad laminate (Copper Clad Laminate, hereinafter referred to as CCL) obtained by laminating copper foil and resin, and then coating the wiring with a resin layer called a coverlay. In the former stage of lamination of the cover layer, etching of the copper foil surface is performed as a loop of a surface modification step for improving adhesion of the copper foil to the cover layer. In addition, in order to reduce the thickness of the copper foil to improve the bendability, thin-wall etching may be performed.
However, with the miniaturization, thickness, and high performance of electronic devices, flexibility of FPCs is further required. Then, a technique for improving bendability by defining an average crystal grain size and a maximum crystal grain size of the copper foil has been reported (patent document 1). Further, a technique for improving MIT flexibility by defining a relationship between a plate thickness and an elongation at break (elongation at break) is reported (patent document 2).
In addition, miniaturization (for example, about 20 to 30 μm) of the circuit width and the pitch width of FPC is also required with miniaturization, thickness reduction, and high performance of electronic devices.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open publication 2016-188415;
patent document 2: japanese patent application laid-open No. 2018-131653.
Disclosure of Invention
Problems to be solved by the invention
However, if the circuit of the FPC is miniaturized, there are the following problems: when bending the FPC, repeated deformation with low strain is applied to the circuit (copper foil), the surface roughness increases, the stress concentrates on the concave portion, and the bending property decreases.
In other words, in the case where the circuit width is sufficiently wide relative to the thickness of the copper foil, the deformation in the direction parallel to the bending direction is dominant, but in the case of a fine circuit, since the value of (thickness/width) of the copper foil becomes large, the deformation in the width direction perpendicular to the bending direction must also be considered. In addition, it is considered that the vicinity of the end portions is generally less restricted by the surroundings and is likely to be deformed than the widthwise central portion of the circuit, but in a fine circuit, the proportion of the region near the end portions that is likely to be deformed is considered to be large. For the above reasons, it is considered that as the circuit width becomes narrower, the flexibility becomes stricter.
The present invention has been made to solve the above problems, and an object thereof is to: provided are a copper foil for flexible printed boards, which is excellent in flexibility after formation of fine circuits, a copper-clad laminate using the copper foil, a flexible printed board, and an electronic device.
Means for solving the problems
The present inventors have conducted various studies and as a result found that: an increase in surface roughness of a copper foil (circuit) due to repeated deformation that reduces bendability of a fine circuit of an FPC is related to a strain rate of a final pass (pass) in final cold rolling, and a range of surface roughness that does not reduce bendability is defined.
That is, the copper foil for flexible printed circuit board of the present invention is a copper foil containing 99.0 mass% or more of Cu and the balance of unavoidable impurities, and the surface roughness Ra of the circuit surface after 2000 IPC slip bending with a radius of curvature r=2.0 is 0.030 μm or more and 0.400 μm or less using a double-layer single-sided CCL sample having a width of 12.7mm and a length of 200mm, which is obtained by forming a circuit from the copper foil. Wherein, the double-layer single-sided CCL sample is manufactured as follows: after copper roughening plating was performed on one side of the copper foil, 2 pieces of the copper foil were laminated with each copper roughening plated side facing the both sides of a polyimide film having a thickness of 25 μm, and the copper foil on one side was bonded under 4MPa by hot pressing at 300 ℃. Then, the copper foil side surface of the double-layer single-sided CCL sample was etched at a circuit number of 8 and a circuit pitch of 125 μm to form a circuit having a line width of 25 μm and extending in the rolling direction.
In the copper foil for flexible printed circuit board of the present invention, the surface roughness Ra of the circuit surface before the IPC slip bending is preferably 0.010 μm or more and 0.200 μm or less.
The copper foil for flexible printed circuit board of the present invention preferably contains Tough Pitch Copper (TPC) specified in JIS-H3100 (C1100) or Oxygen Free Copper (OFC) of JIS-H3100 (C1020).
The copper foil for flexible printed circuit board of the present invention is preferably further formed so as to contain at least 1 or 2 or more kinds selected from P, ag, si, ge, al, ga, zn, sn and Sb as additive elements in an amount of 0.7 mass% or less in total.
The copper-clad laminate of the present invention is formed by laminating the copper foil for a flexible printed board and a resin layer.
The flexible printed circuit board of the present invention is produced by forming a circuit on the copper foil of the copper-clad laminate.
The electronic device of the present invention is formed using the flexible printed board.
Effects of the invention
According to the present invention, a copper foil for flexible printed circuit board excellent in flexibility after formation of fine circuit can be obtained.
Drawings
Fig. 1 is a diagram showing a bending test method.
Detailed Description
Hereinafter, embodiments of the copper foil according to the present invention will be described. In the present invention, "%" means "% by mass" unless otherwise specified.
First, an evaluation of flexibility after formation of a fine circuit will be described.
As described above, in the case of a fine circuit, since the value of the copper foil (thickness/width) becomes large, the deformation in the width direction perpendicular to the bending direction becomes large, and the proportion of the end region of the circuit which is easily deformed becomes large. As a result, when repeated deformation with low strain is applied to the circuit (copper foil), the surface roughness increases, the stress concentrates on the concave portion, and the bendability decreases.
Then, a fine circuit was produced in a simulated manner, the surface roughness of the circuit (copper foil) before and after the predetermined bending test was measured, and Ra after bending was set to be 0.030 μm or more and 0.400 μm or less.
By controlling Ra after bending within the above range, stress applied to the surface can be uniformly dispersed, and excellent bendability can be exhibited.
If Ra after bending is less than 0.030 μm, the surface is too smooth, stress concentrates on small undulations (oil grooves, etc.) existing before deformation, and the bendability is lowered. When Ra after bending exceeds 0.400 μm, surface roughness increases, stress concentrates on the concave portion, and bendability decreases.
Further, ra before bending is preferably 0.010 μm or more and 0.200 μm or less.
When Ra before bending is less than 0.010 μm, ra after bending is also easily less than 0.030 μm, and when Ra before bending exceeds 0.200 μm, ra after bending is also easily more than 0.400 μm.
The analog microcircuit was fabricated as follows. First, copper roughening plating was performed on one side of the final cold rolled copper foil, and the roughened plating side of each copper foil was laminated on both sides of a polyimide film (thickness 25 μm), and bonded by hot pressing (4 MPa), to obtain a three-layer double-sided copper foil CCL sample. In the lamination of the films, heat treatment was performed at 300 ℃. In the three-layer double-sided copper foil CCL sample, the single-sided copper foil was completely removed by etching, and a double-layer single-sided CCL was manufactured.
The copper foil according to the present invention is used for a flexible printed circuit board, and in this case, a CCL obtained by laminating a copper foil and a resin is subjected to a heat treatment for curing the resin at 200 to 400 ℃. This heat treatment was assumed to be performed at 300 ℃ for 30 minutes.
On the copper foil side surface of the double-layer single-sided CCL sample, etching was performed at a circuit number of 8 and a circuit interval of 125 μm to form a circuit having a line width of 25 μm and extending in the rolling direction. The etching factor EF of the circuit is more than 4.0.
The plating conditions for the rough plating and the like are not particularly limited as long as peeling of the copper foil from the resin can be prevented in the bending test, and for example, the plating conditions generally used for FPC use can be exemplified below. Electroplating bath composition: cu 15g/L, co, 8.5g/L, ni 8.6.6 g/L, pH of plating solution: 2.5, electroplating temperature: 38 ℃, current density: 20A/dm 2 Electroplating time: 2.0 seconds.
The etching solution can be adjusted as follows: for example CuCl 2 -2H 2 O:3mol/L, HCl: the etching temperature is, for example, 50℃and the etching time is such that the circuit width is 25. Mu.m, at 4 mol/L.
Then, the CCL on which the circuit was formed was subjected to 2000 sliding bending using an IPC (american society for printed circuit) bending test device shown in fig. 1, and then, a laser microscope was used to measure the surface roughness Ra in the direction parallel to the circuit direction.
The device is configured by connecting the vibration transmission member 3 to the vibration driving body 4, and the FPC1 is fixed to the device at 4 points in total of the portion of the screw 2 indicated by the arrow and the tip portion of the vibration transmission member 3. When the vibration transmission member 3 is driven up and down, the intermediate portion of the FPC1 is bent in a hairpin shape with a predetermined radius of curvature r. In this test, bending was repeated under the following conditions.
The test conditions were as follows: test piece width: 12.7mm, test piece length: 200mm, the direction of the test piece is: the curvature radius r is assumed so that the longitudinal direction of the test piece is parallel to the rolling direction: 2mm, vibration stroke: 20mm, vibration speed: 100 times/min, bending direction: the copper foil in FPC1 is inside.
The surface roughness (arithmetic average roughness) Ra is a center line average roughness calculated according to JIS B0601-1994 from the concave-convex profile of the copper foil surface.
As the measurement of the surface roughness Ra, a shape analysis laser microscope VK-X1050 manufactured by Keyence Co., ltd can be used. The measurement conditions are as follows: in the objective lens: 50 times, intermediate lens: under 24-fold conditions, 10 line roughness analyses were performed in parallel to the circuit direction, and the average value was used as the surface roughness Ra. The line analysis interval is adjusted to be equal to or more than 80% of the width of the circuit surface between the 1 st and 10 th.
Composition >, composition
The copper foil according to the present invention contains 99.0 mass% or more of Cu and the balance of unavoidable impurities.
In addition, when at least 1 or 2 or more kinds selected from P, ag, si, ge, al, ga, zn, sn and Sb are contained as additive elements in an amount of 0.7 mass% or less in total with respect to the above composition, the recrystallized grains can be made finer, and an increase in surface roughness due to repeated deformation can be suppressed.
Since the above additive elements increase the frequency of dislocation entanglement during cold rolling, recrystallized grains can be made finer.
If the total amount of the additive elements exceeds 0.7 mass%, the conductivity may be lowered, and the copper foil may not be suitable for a flexible substrate, so that the upper limit is 0.7 mass%. The lower limit of the content of the above-mentioned additive element is not particularly limited, but for example, since it is industrially difficult to control each element to less than 0.0005 mass%, the lower limit of the content of each element can be set to 0.0005 mass%.
The copper foil according to the present invention may have a composition comprising Tough Pitch Copper (TPC) specified in JIS-H3100 (C1100) or oxygen-free copper (OFC) specified in JIS-H3100 (C1020).
The composition may be one containing P relative to the TPC or OFC.
The copper foil of the present invention can be produced, for example, as follows. First, a copper ingot is dissolved, cast, then hot rolled, cold rolled and annealed, and finally cold rolled, whereby a copper foil can be manufactured.
Here, if the strain rate of the final pass in the final cold rolling is increased, an increase in the surface roughness of the circuit (copper foil) due to repeated deformation can be suppressed. The reason for this is that, when the strain rate increases, a larger strain is concentrated and accumulated on the rolled surface of the copper foil than in the copper foil. As a result, fine crystal grains are arranged in random orientations (orientations) on the rolled surface during recrystallization of the copper foil, and deformation due to repeated deformation is not concentrated locally, thereby suppressing thickening of the surface and maintaining smoothness. The strain rate of the final pass in the final cold rolling is preferably 7.4X10 3 (1/s) or more. However, if the strain rate is too high, the copper foil may break during rolling, which may reduce the manufacturability, so that 9.5X10 can be used 3 (1/s) is set as the upper limit of the final pass strain rate.
Copper-clad laminate and flexible printed board
The copper foil of the present invention was subjected to: (1) A copper-clad laminate (CCL) comprising 2 layers of a copper foil and a resin base material is obtained by casting and polymerizing a resin precursor (for example, a polyimide precursor called a varnish) by heating, and (2) laminating a base film on the copper foil of the present invention using a thermoplastic adhesive of the same kind as the base film. Further, by laminating a base film coated with an adhesive on the copper foil of the present invention, a Copper Clad Laminate (CCL) composed of 3 layers of copper foil, a resin base material, and an adhesive layer therebetween can be obtained. In manufacturing these CCLs, copper foil is heat treated to cause recrystallization.
A circuit is formed over them by a photolithography technique, plating is performed on the circuit as necessary, and a cover film is laminated, whereby a flexible printed board (flexible wiring board) can be obtained.
Therefore, the copper-clad laminate of the present invention is formed by laminating a copper foil and a resin layer. The flexible printed board of the present invention is configured by forming a circuit on the copper foil of the copper-clad laminate.
As the resin layer, there may be mentioned: PET (polyethylene terephthalate), PI (polyimide), LCP (liquid crystal polymer), PEN (polyethylene naphthalate), but not limited thereto. As the resin layer, a resin film thereof can be used.
As a method of laminating the resin layer and the copper foil, a material for forming the resin layer may be applied to the surface of the copper foil and heated to form a film. In addition, a resin film may be used as the resin layer, and the following adhesive may be used between the resin film and the copper foil, or the resin film may be thermally bonded to the copper foil without using an adhesive. Among them, an adhesive is preferably used from the standpoint that excessive heat is not applied to the resin film.
In the case of using a film as the resin layer, the film may be laminated on the copper foil via an adhesive layer. In this case, an adhesive having the same composition as the film is preferably used. For example, in the case of using a polyimide film as the resin layer, a polyimide-based adhesive is also preferably used for the adhesive layer. The polyimide adhesive referred to herein means an adhesive containing an imide bond, and includes polyether imide and the like.
The present invention is not limited to the above embodiment. The copper alloy in the above embodiment may contain other components as long as the effects of the present invention are exhibited. In addition, the electrolytic copper foil may be used.
For example, the surface of the copper foil may be subjected to a roughening treatment, an anti-rust treatment, a heat-resistant treatment, or a surface treatment of a combination thereof.
Examples
The present invention will be described in further detail with reference to examples, but the present invention is not limited to these examples. Elements shown in table 1 were added to electrolytic copper to form compositions shown in table 1, and casting was performed in an Ar atmosphere to obtain ingots. The oxygen content in the ingot was less than 15ppm. The ingot was uniformly annealed at 900 c and then hot-rolled, followed by repeated cold rolling and recrystallization annealing, and further final recrystallization annealing and final cold rolling to obtain a rolled copper foil.
CCL was fabricated on the resulting rolled copper foil as described above.
Surface roughness of copper foil (Circuit) before and after bending test
The measurement was performed as described above.
< bending fatigue life >
For a sample fabricated by the same method as the CCL (double-layer single-sided CCL) in which the circuit for the bending test was fabricated as described above, a time point at which the initial resistance value flowing through both ends of the circuit was increased by more than 10% was set as a bending fatigue life by the IPC sliding bending test. The measurement conditions for obtaining the bending fatigue life were as follows: test piece width: 12.7mm, test piece length: 200mm, the direction of the test piece is: the curvature radius r is assumed so that the longitudinal direction of the test piece is parallel to the rolling direction: 5mm, vibration stroke: 20mm, vibration speed: 1500 times/min, bending direction: copper foil is inside in FPC (double-layer single-sided CCL) 1.
It is to be noted that the bending fatigue life of 8 ten thousand or more was evaluated as excellent in bending property, and the bending fatigue life of less than 8 ten thousand was evaluated as poor in bending property.
The results obtained are shown in table 1.
TABLE 1
As can be seen from table 1: in the case of each example in which the surface roughness Ra of the circuit surface after the bending test is 0.030 μm or more and 0.400 μm or less, the bending fatigue life is excellent.
In the case of comparative example 1 in which Ra is less than 0.030 μm, bending fatigue life is poor. This is thought to be due to the fact that the surface is too smooth and the stress is concentrated on the smaller undulations (oil grooves, etc.) that exist before deformation.
In the case of comparative examples 2 to 6 in which Ra exceeds 0.400. Mu.m, the bending fatigue life was poor. In comparative examples 2 to 6, the strain rate of the final pass in the final cold rolling was lower than that in the example, and the strain was not sufficiently accumulated on the rolling surface.
Claims (7)
1. A copper foil for flexible printed circuit boards, which is a copper foil containing 99.0 mass% or more of Cu and the balance of unavoidable impurities, wherein the surface roughness Ra of the circuit surface after 2000 sliding bending operations with a bending test device of the American society of printed circuit industry at a radius of curvature R=2.0 is 0.030 [ mu ] m or more and 0.400 [ mu ] m or less, using a double-layer single-sided CCL sample having a width of 12.7mm and a length of 200mm, which is obtained by forming a circuit from the copper foil,
wherein, the double-layer single-sided CCL sample is manufactured as follows: after copper roughening plating was performed on one side of the copper foil, 2 pieces of the copper foil were laminated with each copper roughening plated side facing the both sides of a polyimide film having a thickness of 25 μm, and the copper foil on one side was bonded under 4MPa by hot pressing at 300 ℃ for 30 minutes, and the copper foil on one side was completely removed by etching, to produce a double-layer single-sided CCL; then, the copper foil side surface of the double-layer single-sided CCL sample was etched at a circuit number of 8 and a circuit pitch of 125 μm to form a circuit having a line width of 25 μm and extending in the rolling direction.
2. The copper foil for flexible printed circuit board according to claim 1, wherein a surface roughness Ra of the circuit surface before the sliding bending is 0.010 μm or more and 0.200 μm or less.
3. The copper foil for flexible printed circuit board according to claim 1, which comprises a tough pitch copper specified in JIS-H3100C1100 or an oxygen-free copper of JIS-H3100C 1020.
4. The copper foil for flexible printed circuit board according to claim 1 or 2, further comprising 1 or 2 or more kinds of additive elements selected from P, ag, si, ge, al, ga, zn, sn and Sb in an amount of 0.7 mass% or less in total.
5. A copper-clad laminate comprising the copper foil for flexible printed circuit board according to any one of claims 1 to 4 and a resin layer laminated together.
6. A flexible printed circuit board comprising a circuit formed on the copper foil of the copper-clad laminate according to claim 5.
7. An electronic device using the flexible printed board according to claim 6.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019057781A JP6856688B2 (en) | 2019-03-26 | 2019-03-26 | Copper foil for flexible printed circuit boards, copper-clad laminates using it, flexible printed circuit boards, and electronic devices |
| JP2019-057781 | 2019-03-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111757599A CN111757599A (en) | 2020-10-09 |
| CN111757599B true CN111757599B (en) | 2023-06-30 |
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| CN202010223434.3A Active CN111757599B (en) | 2019-03-26 | 2020-03-26 | Copper foil for flexible printed board |
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| JP (1) | JP6856688B2 (en) |
| KR (1) | KR102285062B1 (en) |
| CN (1) | CN111757599B (en) |
| TW (1) | TWI718025B (en) |
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| JP7164752B1 (en) * | 2022-07-14 | 2022-11-01 | Ｊｘ金属株式会社 | Copper foil for flexible printed circuit board, copper-clad laminate using the same, flexible printed circuit board, and electronic equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012214894A (en) * | 2011-03-31 | 2012-11-08 | Nippon Steel Chem Co Ltd | Copper foil, copper-clad laminate, flexible circuit board, and manufacturing method for copper-clad laminate |
| JP2014214376A (en) * | 2013-04-30 | 2014-11-17 | 株式会社Ｓｈカッパープロダクツ | Rolled copper foil, flexible copper-clad laminated plate, and flexible printed wiring board |
| JP2016188415A (en) * | 2015-03-30 | 2016-11-04 | Ｊｘ金属株式会社 | Copper alloy foil for flexible printed circuit board, and copper cladding laminate, flexible printed circuit board and electronic apparatus using the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001196729A (en) * | 1999-10-28 | 2001-07-19 | Asahi Kasei Corp | Curable sheet |
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2019
- 2019-03-26 JP JP2019057781A patent/JP6856688B2/en active Active
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2020
- 2020-03-12 TW TW109108214A patent/TWI718025B/en active
- 2020-03-20 KR KR1020200034239A patent/KR102285062B1/en active IP Right Grant
- 2020-03-26 CN CN202010223434.3A patent/CN111757599B/en active Active
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| JP2012214894A (en) * | 2011-03-31 | 2012-11-08 | Nippon Steel Chem Co Ltd | Copper foil, copper-clad laminate, flexible circuit board, and manufacturing method for copper-clad laminate |
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| JP2016188415A (en) * | 2015-03-30 | 2016-11-04 | Ｊｘ金属株式会社 | Copper alloy foil for flexible printed circuit board, and copper cladding laminate, flexible printed circuit board and electronic apparatus using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202041721A (en) | 2020-11-16 |
| TWI718025B (en) | 2021-02-01 |
| JP6856688B2 (en) | 2021-04-07 |
| JP2020161581A (en) | 2020-10-01 |
| CN111757599A (en) | 2020-10-09 |
| KR102285062B1 (en) | 2021-08-04 |
| KR20200115206A (en) | 2020-10-07 |
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