WO2009041194A1 - High-strength high-electroconductivity copper alloy possessing excellent hot workability - Google Patents

High-strength high-electroconductivity copper alloy possessing excellent hot workability Download PDF

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Publication number
WO2009041194A1
WO2009041194A1 PCT/JP2008/064931 JP2008064931W WO2009041194A1 WO 2009041194 A1 WO2009041194 A1 WO 2009041194A1 JP 2008064931 W JP2008064931 W JP 2008064931W WO 2009041194 A1 WO2009041194 A1 WO 2009041194A1
Authority
WO
WIPO (PCT)
Prior art keywords
copper alloy
hot workability
less
phase particles
excellent hot
Prior art date
Application number
PCT/JP2008/064931
Other languages
French (fr)
Japanese (ja)
Inventor
Masatoshi Eto
Original Assignee
Nippon Mining & Metals Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining & Metals Co., Ltd. filed Critical Nippon Mining & Metals Co., Ltd.
Priority to KR1020107001453A priority Critical patent/KR101203437B1/en
Priority to CN2008801037913A priority patent/CN101784684B/en
Priority to JP2009534243A priority patent/JP5232794B2/en
Publication of WO2009041194A1 publication Critical patent/WO2009041194A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)

Abstract

This invention provides a copper alloy, for an electronic component, formed of a Cu-Ni-P-base alloy which has good hot workability and, at the same time, can exhibit high strength, high electroconductivity, and high heat conductivity without sacrificing bendability. The copper alloy comprises, by mass, Ni: 0.50% to 1.00% and P: 0.10% to 0.25%. The content ratio of Ni to P is Ni/P = 4.0 to 5.5. The copper alloy further comprises Cr: 0.03% to 0.45% and O: not more than 0.0050%. The content of at least one of Fe, Co, Mn, Ti, and Zr is not more than 0.05%, preferably not more than 0.03%, in total. In the copper alloy, the balance consists of Cu and unavoidable impurities. Regarding the size of Ni-P-base second phase particles, not less than 80% of the area of the total second phase particles contained in the copper alloy is accounted for by second phase particles having an a value of not less than 20 nm and not more than 50 nm and an aspect ratio, a/b, of not less than 1 and not more than 5 wherein a represents a major axis and b represents a minor axis.
PCT/JP2008/064931 2007-09-27 2008-08-21 High-strength high-electroconductivity copper alloy possessing excellent hot workability WO2009041194A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020107001453A KR101203437B1 (en) 2007-09-27 2008-08-21 High-strength high-electroconductivity copper alloy possessing excellent hot workability
CN2008801037913A CN101784684B (en) 2007-09-27 2008-08-21 High-strength high-electroconductivity copper alloy possessing excellent hot workability
JP2009534243A JP5232794B2 (en) 2007-09-27 2008-08-21 High strength and high conductivity copper alloy with excellent hot workability

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007251849 2007-09-27
JP2007-251849 2007-09-27

Publications (1)

Publication Number Publication Date
WO2009041194A1 true WO2009041194A1 (en) 2009-04-02

Family

ID=40511088

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/064931 WO2009041194A1 (en) 2007-09-27 2008-08-21 High-strength high-electroconductivity copper alloy possessing excellent hot workability

Country Status (5)

Country Link
JP (1) JP5232794B2 (en)
KR (1) KR101203437B1 (en)
CN (1) CN101784684B (en)
TW (1) TWI386493B (en)
WO (1) WO2009041194A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107208191B (en) * 2015-04-24 2020-03-13 古河电气工业株式会社 Copper alloy material and method for producing same
CN105603253B (en) * 2016-01-15 2017-10-17 宁波博威合金材料股份有限公司 A kind of nickeliferous phosphorus, the Cu alloy material of nickel boron phase and its manufacture method
CN107541613B (en) * 2016-06-28 2019-03-08 沈阳慧坤新材料科技有限公司 One Albatra metal and its preparation method and application
CN110643850B (en) * 2019-10-24 2020-12-01 宁波博威合金材料股份有限公司 Copper alloy with excellent bending performance and preparation method and application thereof
CN115537595B (en) * 2022-09-30 2023-08-01 宁波金田铜业(集团)股份有限公司 Copper foil and preparation method thereof

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62133033A (en) * 1985-12-04 1987-06-16 Mitsubishi Metal Corp Cu alloy lead material for semiconductor device
JPH04231446A (en) * 1990-12-27 1992-08-20 Nikko Kyodo Co Ltd Conductive material
JP2001335864A (en) * 2000-05-25 2001-12-04 Kobe Steel Ltd Copper alloy for electrical and electronic parts
JP2005298931A (en) * 2004-04-14 2005-10-27 Mitsubishi Shindoh Co Ltd Copper alloy and its production method
JP2006016667A (en) * 2004-07-01 2006-01-19 Dowa Mining Co Ltd Copper-based alloy and manufacturing method therefor
JP2007270267A (en) * 2006-03-31 2007-10-18 Nikko Kinzoku Kk High-strength copper alloy excellent in bending workability and dimensional stability
JP2008248351A (en) * 2007-03-30 2008-10-16 Nikko Kinzoku Kk High-strength and high-electric conductivity copper alloy having excellent hot workability
JP2008248352A (en) * 2007-03-30 2008-10-16 Nikko Kinzoku Kk High-strength and high-electric conductivity copper alloy having excellent hot workability
JP2008248355A (en) * 2007-03-30 2008-10-16 Nikko Kinzoku Kk Titanium copper for electronic parts, and electronic parts using the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3968955B2 (en) 2000-05-30 2007-08-29 Ｊｆｅスチール株式会社 Organic coated steel plate with excellent corrosion resistance
JP3699701B2 (en) * 2002-10-31 2005-09-28 日鉱金属加工株式会社 Easy-to-process high-strength, high-conductivity copper alloy
JP3871064B2 (en) * 2005-06-08 2007-01-24 株式会社神戸製鋼所 Copper alloy plate for electrical connection parts
JP5079574B2 (en) * 2008-03-31 2012-11-21 Ｊｘ日鉱日石金属株式会社 High strength and high conductivity copper alloy with excellent hot workability

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62133033A (en) * 1985-12-04 1987-06-16 Mitsubishi Metal Corp Cu alloy lead material for semiconductor device
JPH04231446A (en) * 1990-12-27 1992-08-20 Nikko Kyodo Co Ltd Conductive material
JP2001335864A (en) * 2000-05-25 2001-12-04 Kobe Steel Ltd Copper alloy for electrical and electronic parts
JP2005298931A (en) * 2004-04-14 2005-10-27 Mitsubishi Shindoh Co Ltd Copper alloy and its production method
JP2006016667A (en) * 2004-07-01 2006-01-19 Dowa Mining Co Ltd Copper-based alloy and manufacturing method therefor
JP2007270267A (en) * 2006-03-31 2007-10-18 Nikko Kinzoku Kk High-strength copper alloy excellent in bending workability and dimensional stability
JP2008248351A (en) * 2007-03-30 2008-10-16 Nikko Kinzoku Kk High-strength and high-electric conductivity copper alloy having excellent hot workability
JP2008248352A (en) * 2007-03-30 2008-10-16 Nikko Kinzoku Kk High-strength and high-electric conductivity copper alloy having excellent hot workability
JP2008248355A (en) * 2007-03-30 2008-10-16 Nikko Kinzoku Kk Titanium copper for electronic parts, and electronic parts using the same

Also Published As

Publication number Publication date
KR101203437B1 (en) 2012-11-21
CN101784684B (en) 2012-05-23
TWI386493B (en) 2013-02-21
TW200925298A (en) 2009-06-16
CN101784684A (en) 2010-07-21
JPWO2009041194A1 (en) 2011-01-20
JP5232794B2 (en) 2013-07-10
KR20100021666A (en) 2010-02-25

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