MX2018011176A - Aleacion de soldadura sin plomo, composicion de fundente, composicion de pasta de soldadura, placa de circuitos electronicos y controlador electronico. - Google Patents

Aleacion de soldadura sin plomo, composicion de fundente, composicion de pasta de soldadura, placa de circuitos electronicos y controlador electronico.

Info

Publication number
MX2018011176A
MX2018011176A MX2018011176A MX2018011176A MX2018011176A MX 2018011176 A MX2018011176 A MX 2018011176A MX 2018011176 A MX2018011176 A MX 2018011176A MX 2018011176 A MX2018011176 A MX 2018011176A MX 2018011176 A MX2018011176 A MX 2018011176A
Authority
MX
Mexico
Prior art keywords
mass
lead
solder alloy
circuit board
control device
Prior art date
Application number
MX2018011176A
Other languages
English (en)
Inventor
Arai Masaya
Nakano Takeshi
Hori Atsushi
Katsuyama Tsukasa
Munekawa Yurika
Maruyama Daisuke
Original Assignee
Tamura Seisakusho Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2016057712A external-priority patent/JP6047254B1/ja
Priority claimed from JP2016182809A external-priority patent/JP6230674B2/ja
Priority claimed from JP2016224592A external-priority patent/JP6125084B1/ja
Priority claimed from JP2017015245A external-priority patent/JP6560272B2/ja
Application filed by Tamura Seisakusho Kk filed Critical Tamura Seisakusho Kk
Publication of MX2018011176A publication Critical patent/MX2018011176A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K1/00—Printed circuits
    • H05K1/02—Details
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    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
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    • H01L2224/0554—External layer
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
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    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
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    • H05K3/3494—Heating methods for reflowing of solder

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Se desea proveer una aleación de soldadura sin plomo que suprime el desarrollo de grietas en las juntas de soldadura en un medio ambiente severo con variaciones de temperaturas extremas y cargas de vibraciones y suprime el desarrollo de grietas en la vecindad de las interfaces aunque los componentes electrónicos no tengan ningún enchapado de Ni/Pd/Au o similar; o composiciones de pasta de soldadura y juntas de soldadura que ejercen una buena capacidad de impresión mientras suprimen la aparición de huecos, el desarrollo de grietas en las juntas de soldadura y la aparición de bolas de soldadura aunque se use una aleación de soldadura en polvo que comprende una aleación de soldadura en polvo que comprende una aleación altamente oxidativa; una placa de circuitos electrónicos y un controlador electrónico que comprenden la misma. Para alcanzar el objetivo precedente, una aleación de soldadura sin plomo de la presente invención comprende 2% en masa o más y 3,1% en masa o menos de Ag, más del 0% en masa y 1% en masa o menos de Cu, 1% en masa o más y 5% en masa o menos de Sb, 3,1% en masa o más y 4,5% en masa o menos de Bi y 0,01% en asma o más y 0,25% en masa o menos de Ni, siendo el resto Sn.
MX2018011176A 2016-03-22 2017-03-21 Aleacion de soldadura sin plomo, composicion de fundente, composicion de pasta de soldadura, placa de circuitos electronicos y controlador electronico. MX2018011176A (es)

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JP2016057712A JP6047254B1 (ja) 2016-03-22 2016-03-22 鉛フリーはんだ合金、電子回路基板および電子制御装置
JP2016182809A JP6230674B2 (ja) 2016-09-20 2016-09-20 鉛フリーはんだ合金、電子回路基板および電子制御装置
JP2016224592A JP6125084B1 (ja) 2016-11-17 2016-11-17 鉛フリーはんだ合金を用いたソルダペースト組成物、電子回路基板および電子制御装置
JP2017015245A JP6560272B2 (ja) 2017-01-31 2017-01-31 ソルダペースト、電子回路基板及び電子制御装置
PCT/JP2017/011284 WO2017164194A1 (ja) 2016-03-22 2017-03-21 鉛フリーはんだ合金、フラックス組成物、ソルダペースト組成物、電子回路基板および電子制御装置

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PH12018500431A1 (en) 2018-08-29
HUE052698T2 (hu) 2021-05-28
EP3321025A4 (en) 2018-08-22
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CN108500499A (zh) 2018-09-07
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US10926360B2 (en) 2021-02-23
ES2840124T3 (es) 2021-07-06
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BR112018068596A2 (pt) 2019-02-12
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US20180029169A1 (en) 2018-02-01
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