JP6730999B2 - 過酷な環境での電子機器用途のための高信頼性無鉛はんだ合金 - Google Patents
過酷な環境での電子機器用途のための高信頼性無鉛はんだ合金 Download PDFInfo
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- JP6730999B2 JP6730999B2 JP2017557168A JP2017557168A JP6730999B2 JP 6730999 B2 JP6730999 B2 JP 6730999B2 JP 2017557168 A JP2017557168 A JP 2017557168A JP 2017557168 A JP2017557168 A JP 2017557168A JP 6730999 B2 JP6730999 B2 JP 6730999B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
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- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
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Description
開示される技術のさまざまな実施形態にしたがって、SnAgCuSbベースのPbフリーはんだ合金、および該はんだ合金を含むはんだ継手が開示される。開示されているはんだ合金は、150℃以上のような、より高い使用温度または動作温度で高信頼性を必要とする過酷な環境の電子機器用途のためのはんだプリフォーム、はんだボール、はんだ粉末またははんだペースト(はんだ粉末およびフラックスの混合物)の形態でのはんだ継手の作製に特に適しているが、これらには限定されない。
化学組成を重量%で列挙した図1および図2に示す通り、開示されているSnAgCuSbベースのPbフリーはんだ合金(合金No.1〜5および7〜21)、業界標準の高Pbはんだ合金(合金No.6)および市販のPbフリー合金Sn3.8Ag0.7Cu3.0Bi1.4Sb0.15Ni(Innolot、合金No.22)のさまざまな実施形態の化学組成を誘導結合プラズマ(ICP)分析で測定した。はんだ合金の溶融挙動を、示差走査熱量測定法(DSC)を用いて10℃/minの加熱および冷却速度で分析した。DSC試験を、TA Q2000示差走査熱量計で室温から350℃まで走査して実施した。各合金について、サンプルをまず周囲温度から350℃まで走査し、続いて20℃まで冷却し、次いで再び350℃まで走査した。第2の加熱サーモグラフを用いて合金の溶融挙動を表した。DSC分析から得られるはんだ合金の固相線温度および液相線温度を図1および図2の表に一覧にした。
図1に示すSnAgCuSbBi系はんだ合金の実施形態を含むはんだ継手の耐熱疲労性を、熱衝撃試験を用いて評価した。熱衝撃試験は、以下の手順を用いて行った。寸法がそれぞれ8×8×0.25mmおよび3×3×0.7mmのTi/Ni/Ag膜で被覆した2タイプのSiダイを純Ni被覆Cuのリードフレーム基材にはんだ付けしてダイアタッチはんだ継手を形成した。寸法がそれぞれ8×8×0.15mmおよび3×3×0.15mmのはんだプリフォームを使用した。はんだ付けは、アセンブリの位置決めと共平面性を容易にするためにSiダイ/はんだプリフォーム/基材の組(セット)をジグを用いて組み立て、続いて、Pbフリー実験のはんだ合金についてはピーク温度246℃および220℃を上回る時間:61秒で、あるいは標準的な高Pbはんだ合金(Pb5Sn2.5Ag)についてはピーク温度335℃およびTAL(液相線を上回る時間):61秒でリフロー炉内で加熱することによって行った。
SnAgCuSbBi系(図1)で設計されたはんだ合金の良好な信頼性性能に続いて、図2に示すSnAgCuSb系およびSnAgCuSbIn(Bi)系の合金(合金No.11〜21)を試験した。
本明細書に開示の合金の成分範囲の利益を以下で説明する。Sn−Ag−Cu合金系では、三元共晶組成は約Sn3.7Ag0.9Cuであり、共晶温度は217℃である。Agは、Ag3Sn金属間粒子を形成して分散強化相として作用する、合金中の主要な強化元素である。Agは、はんだ合金のぬれ性も向上させる。合金の溶融挙動、ぬれ性、機械的特性および熱サイクル信頼性を包括的に考慮すると、Ag含有量は、2.5〜4.5重量%の範囲内であることが好ましい。Agが2.5重量%未満のとき、はんだ継手の機械的特性および熱サイクル信頼性性能は、過酷な環境の電子機器用途には十分ではない。Agが4.5重量%を超えるとき、合金の液相線温度が著しく上昇し、はんだ付け性能に悪影響を与える。加えて、より高いAg含有量に伴うコストの上昇は望ましくない。したがって、実施形態において、Ag含有量は、好ましくは3.0〜4.0重量%の範囲内である。
Claims (20)
- 2.5〜4.5重量%のAg;
0.6〜2.0重量%のCu;
5.0重量%より多く9.0重量%までのSb;
0.1重量%以上で0.5重量%未満のBi、及び、0.1〜4.5重量%のInのうちの少なくとも一方;
オプションとして、0.001〜0.2重量%のNiもしくはCo、またはそれらの両方;
並びに、残余のSn
を含んでなる、はんだ合金。 - 2.5〜4.5重量%のAg;
0.6〜2.0重量%のCu;
5.0重量%より多く9.0重量%までのSb;
0.1〜4.5重量%のIn;
オプションとして、0.001〜0.2重量%のNiもしくはCo、またはそれらの両方;
並びに、残余のSn
を含んでなる、請求項1に記載のはんだ合金。 - 2.5〜4.5重量%のAg;
0.6〜2.0重量%のCu;
5.0重量%より多く9.0重量%までのSb;
0.1〜4.5重量%のIn;
並びに、残余のSn
を含んでなる、請求項2に記載のはんだ合金。 - 2.5〜4.5重量%のAg;
0.6〜2.0重量%のCu;
5.0重量%より多く9.0重量%までのSb;
0.1〜3.0重量%のIn;
並びに、残余のSn
を含んでなる、請求項3に記載のはんだ合金。 - 3.0〜4.0重量%のAg;
0.6〜1.2重量%のCu;
5.0重量%より多く6.0重量%までのSb;
0.3〜1.5重量%のIn;
並びに、残余のSn
を含んでなる、請求項4に記載のはんだ合金。 - 3.8重量%のAg、1.0重量%のCu、5.5重量%のSb、0.5重量%のInおよび残余のSnを含んでなる、請求項5に記載のはんだ合金。
- 2.5〜4.5重量%のAg;
0.6〜2.0重量%のCu;
5.0重量%より多く9.0重量%までのSb;
0.1重量%以上で0.5重量%未満のBi;
オプションとして、0.001〜0.2重量%のNiもしくはCo、またはそれらの両方;
並びに、残余のSn
を含んでなる、請求項1に記載のはんだ合金。 - 2.5〜4.5重量%のAg;
0.6〜2.0重量%のCu;
5.0重量%より多く9.0重量%までのSb;
0.1重量%以上で0.5重量%未満のBi;
並びに、残余のSn
を含んでなる、請求項7に記載のはんだ合金。 - 3.0〜4.0重量%のAg;
0.6〜1.2重量%のCu;
5.0重量%より多く6.0重量%までのSb;
0.1重量%以上で0.5重量%未満のBi;
並びに、残余のSn
を含んでなる、請求項8に記載のはんだ合金。 - 3.0〜4.0重量%のAg;
0.6〜1.2重量%のCu;
5.0重量%より多く6.0重量%までのSb;
0.3重量%のBi;
並びに、残余のSn
を含んでなる、請求項9に記載のはんだ合金。 - フラックス及びはんだ合金粉末を含んでなるはんだペーストであって、
前記はんだ合金粉末は、
2.5〜4.5重量%のAg;
0.6〜2.0重量%のCu;
5.0重量%より多く9.0重量%までのSb;
0.1重量%以上で0.5重量%未満のBi、及び、0.1〜4.5重量%のInのうちの少なくとも一方;
オプションとして、0.001〜0.2重量%のNiもしくはCo、またはそれらの両方;
並びに、残余のSn
を含んでなる、ことを特徴とするはんだペースト。 - 前記はんだ合金粉末は、
2.5〜4.5重量%のAg;
0.6〜2.0重量%のCu;
5.0重量%より多く9.0重量%までのSb;
0.1〜4.5重量%のIn;
オプションとして、0.001〜0.2重量%のNiもしくはCo、またはそれらの両方;
並びに、残余のSn
を含んでなる、ことを特徴とする請求項11に記載のはんだペースト。 - 前記はんだ合金粉末は、
2.5〜4.5重量%のAg;
0.6〜2.0重量%のCu;
5.0重量%より多く9.0重量%までのSb;
0.1〜4.5重量%のIn;
並びに、残余のSn
を含んでなる、ことを特徴とする請求項12に記載のはんだペースト。 - 前記はんだ合金粉末は、
2.5〜4.5重量%のAg;
0.6〜2.0重量%のCu;
5.0重量%より多く9.0重量%までのSb;
0.1〜3.0重量%のIn;
並びに、残余のSn
を含んでなる、ことを特徴とする請求項13に記載のはんだペースト。 - 前記はんだ合金粉末は、
3.0〜4.0重量%のAg;
0.6〜1.2重量%のCu;
5.0重量%より多く6.0重量%までのSb;
0.3〜1.5重量%のIn;
並びに、残余のSn
を含んでなる、ことを特徴とする請求項14に記載のはんだペースト。 - 前記はんだ合金粉末は、
2.5〜4.5重量%のAg;
0.6〜2.0重量%のCu;
5.0重量%より多く9.0重量%までのSb;
0.1重量%以上で0.5重量%未満のBi;
オプションとして、0.001〜0.2重量%のNiもしくはCo、またはそれらの両方;
並びに、残余のSn
を含んでなる、ことを特徴とする請求項11に記載のはんだペースト。 - 前記はんだ合金粉末は、
2.5〜4.5重量%のAg;
0.6〜2.0重量%のCu;
5.0重量%より多く9.0重量%までのSb;
0.1重量%以上で0.5重量%未満のBi;
並びに、残余のSn
を含んでなる、ことを特徴とする請求項16に記載のはんだペースト。 - 前記はんだ合金粉末は、
3.0〜4.0重量%のAg;
0.6〜1.2重量%のCu;
5.0重量%より多く6.0重量%までのSb;
0.1重量%以上で0.5重量%未満のBi;
並びに、残余のSn
を含んでなる、ことを特徴とする請求項17に記載のはんだペースト。 - はんだ合金を基材とデバイスとの間に塗布してアセンブリを形成すること、及び、前記アセンブリをリフローはんだ付けしてはんだ継手を形成すること、のプロセスを経て形成されるはんだ継手であって、
前記はんだ合金は、
2.5〜4.5重量%のAg;
0.6〜2.0重量%のCu;
5.0重量%より多く9.0重量%までのSb;
0.1重量%以上で0.5重量%未満のBi、及び、0.1〜4.5重量%のInのうちの少なくとも一方;
オプションとして、0.001〜0.2重量%のNiもしくはCo、またはそれらの両方;
並びに、残余のSn
を含んでなる、ことを特徴とするはんだ継手。 - 3.0〜4.0重量%のAg;
0.6〜1.2重量%のCu;
5.0重量%より多く6.0重量%までのSb;
オプションとして、0.001〜0.2重量%のNiもしくはCo、またはそれらの両方;
並びに、残余のSn
からなる、ことを特徴とするはんだ合金。
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US15/147,137 US11229979B2 (en) | 2015-05-05 | 2016-05-05 | High reliability lead-free solder alloys for harsh environment electronics applications |
PCT/US2016/030915 WO2016179358A1 (en) | 2015-05-05 | 2016-05-05 | High reliability lead-free solder alloys for harsh environment electronics applications |
US15/147,137 | 2016-05-05 |
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