JP7273049B2 - 電子用途のコスト効率の良い鉛フリーはんだ合金 - Google Patents
電子用途のコスト効率の良い鉛フリーはんだ合金 Download PDFInfo
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- JP7273049B2 JP7273049B2 JP2020544347A JP2020544347A JP7273049B2 JP 7273049 B2 JP7273049 B2 JP 7273049B2 JP 2020544347 A JP2020544347 A JP 2020544347A JP 2020544347 A JP2020544347 A JP 2020544347A JP 7273049 B2 JP7273049 B2 JP 7273049B2
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- Prior art keywords
- alloy
- copper
- alloys
- tin
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0227—Rods, wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
Description
本出願は、2017年11月8日出願の「COST-EFFECTIVE LEAD-FREE SOLDER ALLOY FOR ELECTRONIC APPLICATIONS」と題された米国特許仮出願第62/583,271号、及び2018年6月28日出願の「COST-EFFECTIVE LEAD-FREE SOLDER ALLOY FOR ELECTRONIC APPLICATIONS」と題された米国特許出願第16/022,330号に対する優先権を主張する。米国特許仮出願第62/583,271号及び米国特許出願第16/022,330号の全体は、参照により本明細書に組み込まれる。
本開示は、概して、電子用途の鉛フリー、銀フリーはんだ合金に関する。
Claims (9)
- 鉛フリー、銀フリーはんだ合金であって、
0.5~0.9重量%の銅と、
1.0~3.5重量%のビスマスと、
0.02~0.08重量%のコバルトと、
0.02~0.09重量%のアンチモンと、
0.001~0.01重量%のゲルマニウムと、
残部のスズと、任意の不可避不純物とから成る、鉛フリー、銀フリーはんだ合金。 - 0.006重量%のゲルマニウムを含む、請求項1に記載の鉛フリー、銀フリーはんだ合金。
- 0.01~0.1重量%のニッケルを更に含む、請求項1に記載の鉛フリー、銀フリーはんだ合金。
- 0.05重量%のニッケルを含む、請求項3に記載の鉛フリー、銀フリーはんだ合金。
- 0.7重量%の銅を含む、請求項1に記載の鉛フリー、銀フリーはんだ合金。
- 1.2~1.8重量%のビスマスを含む、請求項1に記載の鉛フリー、銀フリーはんだ合金。
- 1.5重量%のビスマスを含む、請求項6に記載の鉛フリー、銀フリーはんだ合金。
- 0.05重量%のコバルトを含む、請求項1に記載の鉛フリー、銀フリーはんだ合金。
- 0.05重量%のアンチモンを含む、請求項1に記載の鉛フリー、銀フリーはんだ合金。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762583271P | 2017-11-08 | 2017-11-08 | |
US62/583,271 | 2017-11-08 | ||
US16/022,330 | 2018-06-28 | ||
US16/022,330 US11123823B2 (en) | 2017-11-08 | 2018-06-28 | Cost-effective lead-free solder alloy for electronic applications |
PCT/US2018/058457 WO2019094241A2 (en) | 2017-11-08 | 2018-10-31 | Cost-effective lead-free solder alloy for electronic applications |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021502258A JP2021502258A (ja) | 2021-01-28 |
JP7273049B2 true JP7273049B2 (ja) | 2023-05-12 |
Family
ID=66326664
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020544347A Active JP7273049B2 (ja) | 2017-11-08 | 2018-10-31 | 電子用途のコスト効率の良い鉛フリーはんだ合金 |
Country Status (8)
Country | Link |
---|---|
US (3) | US11123823B2 (ja) |
EP (1) | EP3706949B1 (ja) |
JP (1) | JP7273049B2 (ja) |
KR (1) | KR20200089269A (ja) |
CN (2) | CN115178910B (ja) |
SG (1) | SG11202004068XA (ja) |
TW (1) | TWI821211B (ja) |
WO (1) | WO2019094241A2 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101011782A (zh) | 2007-01-24 | 2007-08-08 | 太仓市南仓金属材料有限公司 | 一种无铅软钎锡焊料 |
JP2011251310A (ja) | 2010-06-02 | 2011-12-15 | Nippon Genma:Kk | 鉛フリーはんだ合金 |
JP2014097532A (ja) | 2012-11-12 | 2014-05-29 | Accurus Scientific Co Ltd | 無銀無鉛はんだ組成物 |
WO2015166945A1 (ja) | 2014-04-30 | 2015-11-05 | 株式会社日本スペリア社 | 鉛フリーはんだ合金 |
JP6119911B1 (ja) | 2016-09-13 | 2017-04-26 | 千住金属工業株式会社 | はんだ合金、はんだボールおよびはんだ継手 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4017088B2 (ja) * | 1997-08-07 | 2007-12-05 | ハリマ化成株式会社 | ソルダペースト |
US20040241039A1 (en) * | 2000-10-27 | 2004-12-02 | H-Technologies Group | High temperature lead-free solder compositions |
JP2003001482A (ja) * | 2001-06-19 | 2003-01-08 | Tokyo Daiichi Shoko:Kk | 無鉛半田合金 |
TW592872B (en) * | 2001-06-28 | 2004-06-21 | Senju Metal Industry Co | Lead-free solder alloy |
US8216395B2 (en) * | 2001-06-28 | 2012-07-10 | Senju Metal Industry Co., Ltd. | Lead-free solder alloy |
JP3768849B2 (ja) * | 2001-08-27 | 2006-04-19 | 白光株式会社 | 半田ごて用の半田 |
JP4817095B2 (ja) * | 2005-10-03 | 2011-11-16 | 上村工業株式会社 | ウィスカ抑制表面処理方法 |
KR101265449B1 (ko) * | 2007-07-13 | 2013-05-16 | 센주긴조쿠고교 가부시키가이샤 | 차재 실장용 무납 땜납과 차재 전자 회로 |
WO2009131114A1 (ja) | 2008-04-23 | 2009-10-29 | 千住金属工業株式会社 | 鉛フリーはんだ |
US8013444B2 (en) | 2008-12-24 | 2011-09-06 | Intel Corporation | Solder joints with enhanced electromigration resistance |
JP4787384B1 (ja) * | 2010-10-29 | 2011-10-05 | ハリマ化成株式会社 | 低銀はんだ合金およびはんだペースト組成物 |
WO2012127642A1 (ja) * | 2011-03-23 | 2012-09-27 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
JP6504401B2 (ja) * | 2015-11-05 | 2019-04-24 | パナソニックIpマネジメント株式会社 | はんだ合金およびそれを用いた実装構造体 |
US20200140975A1 (en) * | 2017-03-23 | 2020-05-07 | Nihon Superior Co., Ltd. | Soldered Joint |
JP6369620B1 (ja) * | 2017-12-31 | 2018-08-08 | 千住金属工業株式会社 | はんだ合金 |
-
2018
- 2018-06-28 US US16/022,330 patent/US11123823B2/en active Active
- 2018-10-31 SG SG11202004068XA patent/SG11202004068XA/en unknown
- 2018-10-31 JP JP2020544347A patent/JP7273049B2/ja active Active
- 2018-10-31 WO PCT/US2018/058457 patent/WO2019094241A2/en unknown
- 2018-10-31 CN CN202210902779.0A patent/CN115178910B/zh active Active
- 2018-10-31 KR KR1020207014921A patent/KR20200089269A/ko active IP Right Grant
- 2018-10-31 CN CN201880072316.8A patent/CN111511494B/zh active Active
- 2018-10-31 EP EP18804200.6A patent/EP3706949B1/en active Active
- 2018-11-08 TW TW107139613A patent/TWI821211B/zh active
-
2021
- 2021-08-31 US US17/462,064 patent/US11724342B2/en active Active
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2023
- 2023-06-30 US US18/217,156 patent/US20230356333A1/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101011782A (zh) | 2007-01-24 | 2007-08-08 | 太仓市南仓金属材料有限公司 | 一种无铅软钎锡焊料 |
JP2011251310A (ja) | 2010-06-02 | 2011-12-15 | Nippon Genma:Kk | 鉛フリーはんだ合金 |
JP2014097532A (ja) | 2012-11-12 | 2014-05-29 | Accurus Scientific Co Ltd | 無銀無鉛はんだ組成物 |
WO2015166945A1 (ja) | 2014-04-30 | 2015-11-05 | 株式会社日本スペリア社 | 鉛フリーはんだ合金 |
JP6119911B1 (ja) | 2016-09-13 | 2017-04-26 | 千住金属工業株式会社 | はんだ合金、はんだボールおよびはんだ継手 |
Also Published As
Publication number | Publication date |
---|---|
CN111511494B (zh) | 2022-08-16 |
WO2019094241A2 (en) | 2019-05-16 |
KR20200089269A (ko) | 2020-07-24 |
SG11202004068XA (en) | 2020-05-28 |
WO2019094241A3 (en) | 2019-07-18 |
TWI821211B (zh) | 2023-11-11 |
JP2021502258A (ja) | 2021-01-28 |
TW201934768A (zh) | 2019-09-01 |
US11724342B2 (en) | 2023-08-15 |
CN115178910B (zh) | 2024-04-16 |
CN111511494A (zh) | 2020-08-07 |
US20190134757A1 (en) | 2019-05-09 |
EP3706949A2 (en) | 2020-09-16 |
US11123823B2 (en) | 2021-09-21 |
EP3706949B1 (en) | 2023-11-29 |
US20230356333A1 (en) | 2023-11-09 |
US20220080535A1 (en) | 2022-03-17 |
CN115178910A (zh) | 2022-10-14 |
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