SG11202004068XA - Cost-effective lead-free solder alloy for electronic applications - Google Patents

Cost-effective lead-free solder alloy for electronic applications

Info

Publication number
SG11202004068XA
SG11202004068XA SG11202004068XA SG11202004068XA SG11202004068XA SG 11202004068X A SG11202004068X A SG 11202004068XA SG 11202004068X A SG11202004068X A SG 11202004068XA SG 11202004068X A SG11202004068X A SG 11202004068XA SG 11202004068X A SG11202004068X A SG 11202004068XA
Authority
SG
Singapore
Prior art keywords
cost
free solder
solder alloy
electronic applications
effective lead
Prior art date
Application number
SG11202004068XA
Other languages
English (en)
Inventor
Hasnine, Md
Lik Wai Kho
Original Assignee
Kester Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kester Llc filed Critical Kester Llc
Publication of SG11202004068XA publication Critical patent/SG11202004068XA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0227—Rods, wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
SG11202004068XA 2017-11-08 2018-10-31 Cost-effective lead-free solder alloy for electronic applications SG11202004068XA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762583271P 2017-11-08 2017-11-08
US16/022,330 US11123823B2 (en) 2017-11-08 2018-06-28 Cost-effective lead-free solder alloy for electronic applications
PCT/US2018/058457 WO2019094241A2 (en) 2017-11-08 2018-10-31 Cost-effective lead-free solder alloy for electronic applications

Publications (1)

Publication Number Publication Date
SG11202004068XA true SG11202004068XA (en) 2020-05-28

Family

ID=66326664

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202004068XA SG11202004068XA (en) 2017-11-08 2018-10-31 Cost-effective lead-free solder alloy for electronic applications

Country Status (8)

Country Link
US (3) US11123823B2 (ja)
EP (1) EP3706949B1 (ja)
JP (1) JP7273049B2 (ja)
KR (1) KR20200089269A (ja)
CN (2) CN111511494B (ja)
SG (1) SG11202004068XA (ja)
TW (1) TWI821211B (ja)
WO (1) WO2019094241A2 (ja)

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4017088B2 (ja) * 1997-08-07 2007-12-05 ハリマ化成株式会社 ソルダペースト
US20040241039A1 (en) * 2000-10-27 2004-12-02 H-Technologies Group High temperature lead-free solder compositions
JP2003001482A (ja) * 2001-06-19 2003-01-08 Tokyo Daiichi Shoko:Kk 無鉛半田合金
US8216395B2 (en) * 2001-06-28 2012-07-10 Senju Metal Industry Co., Ltd. Lead-free solder alloy
TW592872B (en) * 2001-06-28 2004-06-21 Senju Metal Industry Co Lead-free solder alloy
JP3768849B2 (ja) * 2001-08-27 2006-04-19 白光株式会社 半田ごて用の半田
JP4817095B2 (ja) * 2005-10-03 2011-11-16 上村工業株式会社 ウィスカ抑制表面処理方法
CN100439028C (zh) * 2007-01-24 2008-12-03 太仓市南仓金属材料有限公司 一种无铅软钎锡焊料
US8845826B2 (en) * 2007-07-13 2014-09-30 Senju Metal Industry Co., Ltd. Lead-free solder for vehicles and a vehicle-mounted electronic circuit using the solder
KR101184234B1 (ko) * 2008-04-23 2012-09-19 센주긴조쿠고교 가부시키가이샤 납프리 땜납
US8013444B2 (en) 2008-12-24 2011-09-06 Intel Corporation Solder joints with enhanced electromigration resistance
JP2011251310A (ja) * 2010-06-02 2011-12-15 Nippon Genma:Kk 鉛フリーはんだ合金
JP4787384B1 (ja) * 2010-10-29 2011-10-05 ハリマ化成株式会社 低銀はんだ合金およびはんだペースト組成物
WO2012127642A1 (ja) * 2011-03-23 2012-09-27 千住金属工業株式会社 鉛フリーはんだ合金
TWI460046B (zh) * 2012-11-12 2014-11-11 Accurus Scient Co Ltd High strength silver-free lead-free solder
AU2015254179B2 (en) * 2014-04-30 2017-07-20 Nihon Superior Co., Ltd. Lead-free solder alloy
JP6504401B2 (ja) * 2015-11-05 2019-04-24 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた実装構造体
JP6119911B1 (ja) * 2016-09-13 2017-04-26 千住金属工業株式会社 はんだ合金、はんだボールおよびはんだ継手
JPWO2018174162A1 (ja) * 2017-03-23 2019-03-28 株式会社日本スペリア社 はんだ継手
JP6369620B1 (ja) * 2017-12-31 2018-08-08 千住金属工業株式会社 はんだ合金

Also Published As

Publication number Publication date
CN111511494A (zh) 2020-08-07
US20230356333A1 (en) 2023-11-09
US20190134757A1 (en) 2019-05-09
US11724342B2 (en) 2023-08-15
US20220080535A1 (en) 2022-03-17
WO2019094241A3 (en) 2019-07-18
TWI821211B (zh) 2023-11-11
JP7273049B2 (ja) 2023-05-12
CN115178910A (zh) 2022-10-14
EP3706949A2 (en) 2020-09-16
KR20200089269A (ko) 2020-07-24
EP3706949B1 (en) 2023-11-29
CN111511494B (zh) 2022-08-16
US11123823B2 (en) 2021-09-21
WO2019094241A2 (en) 2019-05-16
TW201934768A (zh) 2019-09-01
JP2021502258A (ja) 2021-01-28
CN115178910B (zh) 2024-04-16

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