SG11202004067UA - Low-silver tin based alternative solder alloy to standard sac alloys for high reliability applications - Google Patents
Low-silver tin based alternative solder alloy to standard sac alloys for high reliability applicationsInfo
- Publication number
- SG11202004067UA SG11202004067UA SG11202004067UA SG11202004067UA SG11202004067UA SG 11202004067U A SG11202004067U A SG 11202004067UA SG 11202004067U A SG11202004067U A SG 11202004067UA SG 11202004067U A SG11202004067U A SG 11202004067UA SG 11202004067U A SG11202004067U A SG 11202004067UA
- Authority
- SG
- Singapore
- Prior art keywords
- low
- high reliability
- solder alloy
- tin based
- silver tin
- Prior art date
Links
- 229910045601 alloy Inorganic materials 0.000 title 2
- 239000000956 alloy Substances 0.000 title 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title 1
- 229910052709 silver Inorganic materials 0.000 title 1
- 239000004332 silver Substances 0.000 title 1
- 229910000679 solder Inorganic materials 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0227—Rods, wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Glass Compositions (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762583934P | 2017-11-09 | 2017-11-09 | |
| US16/022,337 US11577343B2 (en) | 2017-11-09 | 2018-06-28 | Low-silver alternative to standard SAC alloys for high reliability applications |
| PCT/US2018/058463 WO2019094242A1 (en) | 2017-11-09 | 2018-10-31 | Low-silver tin based alternative solder alloy to standard sac alloys for high reliability applications |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11202004067UA true SG11202004067UA (en) | 2020-05-28 |
Family
ID=66326662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11202004067UA SG11202004067UA (en) | 2017-11-09 | 2018-10-31 | Low-silver tin based alternative solder alloy to standard sac alloys for high reliability applications |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US11577343B2 (en) |
| EP (2) | EP3707285B1 (en) |
| JP (1) | JP2021502259A (en) |
| KR (1) | KR102667732B1 (en) |
| CN (1) | CN111542624A (en) |
| HU (1) | HUE065228T2 (en) |
| SG (1) | SG11202004067UA (en) |
| TW (1) | TWI782134B (en) |
| WO (1) | WO2019094242A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102187085B1 (en) * | 2019-01-24 | 2020-12-04 | 주식회사 경동엠텍 | lead-free solder composition for high-temperature and vibrational circumstance and manufacturing method thereof |
| TWI814081B (en) | 2019-09-02 | 2023-09-01 | 美商阿爾發金屬化工公司 | High temperature ultra-high reliability alloys, manufacturing method thereof, and applications thereof |
| CN117798544A (en) * | 2023-11-10 | 2024-04-02 | 苏州优诺电子材料科技有限公司 | High-strength thermal fatigue-resistant lead-free solder alloy and preparation method thereof |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6176947B1 (en) | 1998-12-31 | 2001-01-23 | H-Technologies Group, Incorporated | Lead-free solders |
| SG98429A1 (en) * | 1999-10-12 | 2003-09-19 | Singapore Asahi Chemical & Solder Ind Pte Ltd | Lead-free solders |
| JP3599101B2 (en) * | 2000-12-11 | 2004-12-08 | 株式会社トッパンＮｅｃサーキットソリューションズ | Solder, surface treatment method of printed wiring board using the same, and mounting method of electronic component using the same |
| US8216395B2 (en) * | 2001-06-28 | 2012-07-10 | Senju Metal Industry Co., Ltd. | Lead-free solder alloy |
| JP2004141910A (en) * | 2002-10-23 | 2004-05-20 | Senju Metal Ind Co Ltd | Lead-free solder alloy |
| GB2419137A (en) * | 2004-10-15 | 2006-04-19 | Alpha Fry Ltd | Solder alloy |
| EP1889684B1 (en) * | 2005-06-03 | 2016-03-30 | Senju Metal Industry Co., Ltd. | Lead-free solder alloy |
| CN100453244C (en) * | 2005-12-16 | 2009-01-21 | 浙江亚通焊材有限公司 | Lead les tin solder |
| US8845826B2 (en) * | 2007-07-13 | 2014-09-30 | Senju Metal Industry Co., Ltd. | Lead-free solder for vehicles and a vehicle-mounted electronic circuit using the solder |
| DE202009019184U1 (en) * | 2009-08-29 | 2017-11-14 | Umicore Ag & Co. Kg | solder alloy |
| WO2011102034A1 (en) * | 2010-02-16 | 2011-08-25 | 株式会社タムラ製作所 | Lead-free solder alloy, and solder paste and packaged components using same |
| JP2011251310A (en) | 2010-06-02 | 2011-12-15 | Nippon Genma:Kk | Lead-free solder alloy |
| CN102666002B (en) * | 2010-08-18 | 2014-09-10 | 新日铁住金高新材料株式会社 | Solder ball for semiconductor mounting and electronic member |
| WO2012127642A1 (en) * | 2011-03-23 | 2012-09-27 | 千住金属工業株式会社 | Lead-free solder alloy |
| EP2886243B1 (en) * | 2012-06-30 | 2018-03-14 | Senju Metal Industry Co., Ltd. | Lead-free solder ball |
| JP5893528B2 (en) * | 2012-07-27 | 2016-03-23 | 新日鉄住金マテリアルズ株式会社 | Lead-free solder bump bonding structure |
| CN103889644B (en) | 2012-10-09 | 2019-12-31 | 阿尔法组装解决方案公司 | High-temperature reliable lead-free and antimony-free tin solder |
| JP2015077601A (en) | 2013-04-02 | 2015-04-23 | 千住金属工業株式会社 | Lead-free solder alloy |
| JP5730354B2 (en) | 2013-07-17 | 2015-06-10 | ハリマ化成株式会社 | Solder composition, solder paste and electronic circuit board |
| US9559543B2 (en) * | 2013-07-19 | 2017-01-31 | Apple Inc. | Adaptive effective C-rate charging of batteries |
| WO2015037279A1 (en) * | 2013-09-11 | 2015-03-19 | 千住金属工業株式会社 | Lead-free solder, lead-free solder ball, solder joint obtained using said lead-free solder, and semiconductor circuit including said solder joint |
| JP2016019992A (en) | 2014-07-14 | 2016-02-04 | 株式会社日本スペリア社 | Aluminium soldering and solder joint |
| JP5723056B1 (en) * | 2014-12-15 | 2015-05-27 | ハリマ化成株式会社 | Solder alloy, solder paste and electronic circuit board |
| CN106001978B (en) * | 2015-03-24 | 2020-02-07 | 株式会社田村制作所 | Lead-free solder alloy, electronic circuit board, and electronic control device |
| US10518362B2 (en) * | 2015-07-24 | 2019-12-31 | Harima Chemicals, Incorporated | Solder alloy, solder paste, and electronic circuit board |
| US10195698B2 (en) | 2015-09-03 | 2019-02-05 | AIM Metals & Alloys Inc. | Lead-free high reliability solder alloys |
| JP6402127B2 (en) * | 2016-03-09 | 2018-10-10 | 株式会社タムラ製作所 | Bonding method of electronic parts |
| KR102052448B1 (en) * | 2016-03-22 | 2019-12-05 | 가부시키가이샤 다무라 세이사쿠쇼 | Lead-free solder alloys, flux compositions, solder paste compositions, electronic circuit boards and electronic control devices |
| US20180102464A1 (en) * | 2016-10-06 | 2018-04-12 | Alpha Assembly Solutions Inc. | Advanced Solder Alloys For Electronic Interconnects |
-
2018
- 2018-06-28 US US16/022,337 patent/US11577343B2/en active Active
- 2018-10-31 CN CN201880072408.6A patent/CN111542624A/en active Pending
- 2018-10-31 WO PCT/US2018/058463 patent/WO2019094242A1/en unknown
- 2018-10-31 KR KR1020207015369A patent/KR102667732B1/en active IP Right Grant
- 2018-10-31 EP EP18804799.7A patent/EP3707285B1/en active Active
- 2018-10-31 HU HUE18804799A patent/HUE065228T2/en unknown
- 2018-10-31 EP EP23202671.6A patent/EP4299238A3/en active Pending
- 2018-10-31 SG SG11202004067UA patent/SG11202004067UA/en unknown
- 2018-10-31 JP JP2020544348A patent/JP2021502259A/en active Pending
- 2018-11-08 TW TW107139607A patent/TWI782134B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| EP4299238A2 (en) | 2024-01-03 |
| CN111542624A (en) | 2020-08-14 |
| HUE065228T2 (en) | 2024-05-28 |
| EP3707285B1 (en) | 2023-11-29 |
| EP4299238A3 (en) | 2024-03-27 |
| US20190134758A1 (en) | 2019-05-09 |
| EP3707285A1 (en) | 2020-09-16 |
| TWI782134B (en) | 2022-11-01 |
| JP2021502259A (en) | 2021-01-28 |
| WO2019094242A1 (en) | 2019-05-16 |
| KR20200089273A (en) | 2020-07-24 |
| US11577343B2 (en) | 2023-02-14 |
| TW201923103A (en) | 2019-06-16 |
| KR102667732B1 (en) | 2024-05-20 |
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