WO2011102034A1 - Lead-free solder alloy, and solder paste and packaged components using same - Google Patents

Lead-free solder alloy, and solder paste and packaged components using same Download PDF

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Publication number
WO2011102034A1
WO2011102034A1 PCT/JP2010/070451 JP2010070451W WO2011102034A1 WO 2011102034 A1 WO2011102034 A1 WO 2011102034A1 JP 2010070451 W JP2010070451 W JP 2010070451W WO 2011102034 A1 WO2011102034 A1 WO 2011102034A1
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Prior art keywords
mass
lead
solder alloy
free solder
present
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PCT/JP2010/070451
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French (fr)
Japanese (ja)
Inventor
喜任 林田
篤史 小森
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株式会社タムラ製作所
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Priority to JP2012500457A priority Critical patent/JP5722302B2/en
Publication of WO2011102034A1 publication Critical patent/WO2011102034A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Definitions

  • the present invention relates to a solder alloy for mounting an electronic component on a circuit board, a solder paste using the solder alloy, and a mounted product.
  • Patent Document 1 proposes a Sn—Ag solder alloy containing phosphorus and germanium in order to suppress the generation of toxic gas during the soldering operation.
  • Patent Document 2 proposes a Sn—Cu solder alloy containing at least one of Bi and In in order to improve the heat cycle resistance.
  • Patent Document 3 proposes a Sn—Ag solder alloy containing zinc in order to approach the operating temperature condition of a 63Sn / 37Pb eutectic solder alloy.
  • Patent Document 4 proposes an Sn—Cu based solder alloy containing phosphorus in order to improve solderability.
  • JP-A-10-225790 Japanese Patent Laid-Open No. 2000-190090 JP 2004-34099 A JP 2007-26079 A
  • the solidus temperature in differential scanning calorimetry (DSC) as a solder alloy It is preferable to use one having a melting start temperature) of 220 ° C. or lower. Thereby, soldering temperature can be reduced.
  • Bi can be added to lower the solidus temperature of conventional lead-free solder alloys such as Sn-Ag alloys and Sn-Cu alloys, but if a large amount of Bi is added, the solder becomes very brittle. For this reason, there is a possibility that the reliability of a portion joined by solder (hereinafter referred to as a joined portion) may be reduced.
  • the present invention provides a lead-free solder alloy capable of reducing the soldering temperature and improving the reliability of the joint portion, and a solder paste and a mounted product using the lead-free solder alloy.
  • the present inventors have found that a lead-free solder alloy containing a specific element in a specific composition range can reduce the soldering temperature and improve the reliability of the joint location, and have completed the present invention. .
  • the lead-free solder alloy of the present invention has Cu 0.07 to 7.0 mass%, Bi 0.05 to 5.0 mass%, Sb 0.05 to 5.0 mass%, Fe 0.001 to 0.1 mass%.
  • a lead-free solder alloy comprising 0.01 to 1.0% by mass of one or more metals selected from Ni and Co, Ag of 3.0% by mass or less, and the balance Sn, selected from Fe, Ni and Co
  • the ratio of the content with one or more metals is 0.002 to 5.0.
  • the solder paste of the present invention contains the above lead-free solder alloy of the present invention and a flux.
  • the mounted product of the present invention is a mounted product having an electronic component and a circuit board on which the electronic component is soldered, and the solder alloy used for the soldering is the lead-free solder of the present invention. It is an alloy.
  • the soldering temperature can be reduced and the reliability of the joint location can be improved.
  • the lead-free solder alloy of the present invention is used, so that it is possible to prevent thermal damage of the mounting product during soldering and to improve the bonding strength, the creep time, etc. Can be made.
  • the present invention is directed to a “lead-free solder alloy”, that is, a solder alloy to which no lead is added.
  • lead is allowed to be present as an inevitable impurity in the solder alloy, but in this case, the amount of lead is preferably 100 ppm or less.
  • the components contained in the lead-free solder alloy of the present invention will be described.
  • the lead-free solder alloy of the present invention contains Cu in order to increase the bonding strength by the solder and improve the reliability of the bonded portion.
  • the Cu content is 0.07% by mass or more, preferably 0.1% by mass or more, and more preferably 0.5% by mass or more, from the viewpoint of improving the bonding strength.
  • it is 7.0 mass% or less, 5.0 mass% or less is preferable and 1.0 mass% or less is more preferable.
  • the lead-free solder alloy of the present invention contains Bi in order to reduce the solidus temperature.
  • the content of Bi is 0.05% by mass or more, preferably 0.1% by mass or more, and more preferably 0.5% by mass or more from the viewpoint of reducing the solidus temperature.
  • it is 5.0 mass% or less, 3.5 mass% or less is preferable and 2.0 mass% or less is more preferable.
  • the lead-free solder alloy of the present invention contains Sb in order to improve the brittleness of Bi so as to suppress a decrease in reliability of the joint portion.
  • the content of Sb is 0.05% by mass or more from the viewpoint of improving the brittleness of Bi, preferably 0.1% by mass or more, and more preferably 0.3% by mass or more.
  • it is 5.0 mass% or less, 3.5 mass% or less is preferable, and 2.0 mass% or less is more preferable.
  • the lead-free solder alloy of the present invention contains Fe in order to increase the bonding strength by the solder and to improve the reliability of the bonded portion by increasing the creep time described later.
  • the content of Fe is 0.001% by mass or more, preferably 0.005% by mass or more, and more preferably 0.01% by mass or more from the viewpoint of improving the reliability of the joint.
  • it is 0.1 mass% or less, 0.08 mass% or less is preferable and 0.05 mass% or less is more preferable.
  • the lead-free solder alloy of the present invention contains one or more metals selected from Ni and Co in order to increase the joint strength by soldering and improve the reliability of the joint location by increasing the creep time described later. From the viewpoint of improving the reliability of the joint portion, Co is preferably included.
  • the total content of one or more metals selected from Ni and Co is 0.01% by mass or more, preferably 0.05% by mass or more, and preferably 0.1% by mass or more, from the viewpoint of improving the reliability of the joint portion. Is more preferable.
  • it is 1.0 mass% or less, 0.5 mass% or less is preferable and 0.3 mass% or less is more preferable.
  • one or more metals selected from Fe, Ni, and Co are used from the viewpoint of improving the bonding strength by solder and improving the reliability of the joint by increasing the creep time described later.
  • the content ratio (one or more metals selected from Fe / Ni and Co) is 0.002 to 5.0, preferably 0.01 to 3.0, and preferably 0.05 to 0. .5 is more preferable.
  • the lead-free solder alloy of the present invention preferably contains Ag from the viewpoint of increasing the bonding strength by solder.
  • the content of Ag is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, and still more preferably 0.5% by mass or more from the viewpoint of improving the bonding strength.
  • it is 3.0 mass% or less, 2.0 mass% or less is preferable and 1.0 mass% or less is more preferable.
  • each of the elements described above is contained in the specific composition range, and the balance is Sn.
  • the amount of the other components is preferably 100 ppm or less.
  • the content of Sn is preferably 80.5 to 99.8% by mass, more preferably 87.0 to 99.5% by mass, from the viewpoint of improving the reliability of the joint portion, and 94.5 More preferably, it is ⁇ 98.5% by mass.
  • the lead-free solder alloy of the present invention has a solidus temperature of preferably 220 ° C. or lower, more preferably 217 ° C. or lower, and 214 ° C. or lower, from the viewpoint of reducing the soldering temperature. Further preferred. In order to control the solidus temperature within the above range, for example, the Bi content may be adjusted.
  • the lead-free solder alloy of the present invention is preferably in a powder form. This is because dispersibility in the flux described later is improved.
  • the solder paste of the present invention contains the above-described lead-free solder alloy of the present invention and a flux. It does not specifically limit as a flux, The thing of the mixing
  • rosin resin-containing flux containing rosin resin, activator, thixotropic agent, solvent, etc., thermosetting resin-containing flux containing thermosetting resin, activator, thixotropic agent, curing agent, etc. are used it can.
  • the content of the flux is preferably 9 to 13% by mass, and more preferably 10 to 12% by mass.
  • the viscosity and thixotropy as a paste will become favorable, and the solder paste suitable for mass-production processes, such as printing and dispensing application
  • the content of the lead-free solder alloy in the solder paste of the present invention is preferably 81 to 91% by mass, and more preferably 88 to 90% by mass.
  • the solder paste of the present invention or the flux contained in the solder paste contains various additives as necessary, for example, additives such as surfactants, antifoaming agents, leveling agents, etc. in addition to the above-described components. be able to. Among these, it is preferable to add a surfactant because solder wettability is improved.
  • the solder paste of the present invention preferably has a bonding strength of 70 MPa or more, more preferably 80 MPa or more, more preferably 90 MPa, from the viewpoint of improving the reliability of the joint location, as measured by the measurement method described in the examples described later. It is still more preferable that it is above.
  • the bonding strength is usually 1 GPa or less. In order to control the bonding strength within the above range, for example, the content of Fe, Ni, Co or the like, or the ratio of the content of Fe and one or more metals selected from Ni and Co (Fe / Ni and Co) One or more metals selected from the above may be adjusted.
  • the solder paste of the present invention preferably has a creep time of 160 hours or more, measured by the measurement method described in the examples described later, from the viewpoint of suppressing reliability deterioration due to thermal fatigue at the joints, and 170 hours or more. It is more preferable that it is 180 hours or more.
  • the creep time is usually 1000 hours or less.
  • One or more metals selected from the above may be adjusted.
  • solder paste of the present invention can be easily manufactured by kneading together with the above-described essential components and additives added as necessary.
  • the mounted product of the present invention has an electronic component and a circuit board, and the above-described lead-free solder alloy of the present invention is used as a solder alloy for joining the electronic component and the circuit board.
  • a mounted product in which the electronic component and the circuit board are soldered using the solder paste of the present invention described above can be exemplified.
  • an electronic component is not specifically limited, For example, a solar power generation module etc. can be used.
  • the circuit board is not particularly limited, and a circuit board using, for example, polyimide as a base material can be used.
  • solder alloys having respective compositions shown in Table 1 were prepared, and then pulverized, and those having a particle size between 20 ⁇ m and 40 ⁇ m were classified to obtain lead-free solder alloy powders used for evaluation.
  • the solidus temperature was measured using a differential scanning calorimeter (EXSTAR 6000, manufactured by Seiko Instruments Inc.) with a measurement temperature range of 30 to 600 ° C. The results are shown in Table 1. In the measurement, those having an endothermic amount of 1.5 J / g or more were regarded as peaks derived from the measurement object, and peaks less than that were excluded from the viewpoint of analysis accuracy.
  • FIG. 1 is a plan view for explaining a method for measuring the bonding strength.
  • two copper plates 1 (5 mm ⁇ 50 mm, thickness 0.5 mm) were prepared, the short sides of the two copper plates 1 were put together, and each solder paste 2 (1 mm ⁇ 1) obtained by the above method in between. 5 mm, thickness 0.5 mm) was sandwiched between the two copper plates 1 by reflow melting under the reflow conditions shown in FIG.
  • the obtained sample was pulled in the arrow direction shown in FIG. 1 using a tensile tester (manufactured by SHIMADZU, EZ-L) at a pulling speed of 5 mm / min. ) was measured.
  • the results are shown in Table 1.
  • FIG. 3 is a cross-sectional view for explaining a creep time measurement method.
  • a test board provided with a copper land 4 (diameter 4.0 mm) on a glass epoxy board 3 was prepared, and a through hole 5 (hole diameter 1.0 mm) penetrating the glass epoxy board 3 and the copper land 4 was provided.
  • each solder paste obtained by the above method was used to prepare a 6.0 mm diameter circular solder 6 (having a weight of 2 g and a hole 6a having a diameter of 1.0 mm in the center).
  • Copper solder lands (conductor dimensions: 0.85 x 0.55 mm, conductor spacing: 0.85 mm) formed on a glass epoxy substrate are coated with each solder paste obtained by the above method using a metal mask with a thickness of 150 ⁇ mt. Used to print with a metal squeegee. Next, 1608CR chips plated with Sn were placed one by one on the printed film of the copper foil lands (10 pieces). And it heated on the reflow conditions shown in FIG. 2, and produced the test piece.
  • the shear strength of the chip was measured using a tensile tester (manufactured by SHIMADZU, EZ-L) under the condition of a pulling speed of 5 mm / min.
  • the results are shown in Table 1.
  • the result of Table 1 is an average value of 10 chips

Abstract

Provided is a lead-free solder alloy which makes possible lower soldering temperatures and improves the reliability of the soldered joint, and a solder paste and packaged components using the lead-free solder alloy. The lead-free solder alloy comprises 0.07~7.0 mass % Cu, 0.05 mass %~5.0 mass % Bi, 0.05~5.0 mass % Sb, 0.001~0.1 mass % Fe, 0.01~1.0 mass % of at least one metal selected from among Ni and Co, and 3.0 mass % or less of Ag, with the remainder being Sn, wherein the ratio between Fe and at least one metal selected from among Ni and Co (Fe / metal selected from among Ni and Co) is 0.002~5.0.

Description

鉛フリーはんだ合金と、これを用いたソルダペースト及び実装品Lead-free solder alloy, solder paste using this, and mounted product
　本発明は、回路基板に電子部品を実装するためのはんだ合金と、これを用いたソルダペースト及び実装品に関する。 The present invention relates to a solder alloy for mounting an electronic component on a circuit board, a solder paste using the solder alloy, and a mounted product.
　従来、電子機器の小型化及び薄型化に伴って、モジュール化された部品の実装や、ＩＣやＬＳＩ等の半導体素子その他の各種電子部品の組立ての中で、優れた導電性と高い接合信頼性の点から、６３Ｓｎ／３７Ｐｂ（Ｓｎ／Ｐｂの質量比が６３／３７）の共晶はんだ合金が広く使用されてきた。しかし近年、環境汚染の問題から鉛に対する規制が強化され、鉛フリーはんだ合金に切り替わりつつある。 Conventionally, with the miniaturization and thinning of electronic devices, excellent electrical conductivity and high bonding reliability have been achieved in the mounting of modularized components and the assembly of various electronic components such as ICs and LSIs. From this point, eutectic solder alloys having 63Sn / 37Pb (Sn / Pb mass ratio of 63/37) have been widely used. However, in recent years, regulations on lead have been strengthened due to the problem of environmental pollution, and are switching to lead-free solder alloys.
　例えば、特許文献１には、はんだ付け作業の際の有毒ガスの発生を抑制するために、燐及びゲルマニウムを含有するＳｎ－Ａｇ系はんだ合金が提案されている。特許文献２には、耐熱サイクル性を向上させるために、Ｂｉ及びＩｎの少なくとも一方を含有するＳｎ－Ｃｕ系はんだ合金が提案されている。特許文献３には、６３Ｓｎ／３７Ｐｂの共晶はんだ合金の使用温度条件に近づけるために、亜鉛を含有するＳｎ－Ａｇ系はんだ合金が提案されている。特許文献４には、はんだ付け性向上のために、燐を含有するＳｎ－Ｃｕ系はんだ合金が提案されている。 For example, Patent Document 1 proposes a Sn—Ag solder alloy containing phosphorus and germanium in order to suppress the generation of toxic gas during the soldering operation. Patent Document 2 proposes a Sn—Cu solder alloy containing at least one of Bi and In in order to improve the heat cycle resistance. Patent Document 3 proposes a Sn—Ag solder alloy containing zinc in order to approach the operating temperature condition of a 63Sn / 37Pb eutectic solder alloy. Patent Document 4 proposes an Sn—Cu based solder alloy containing phosphorus in order to improve solderability.
特開平１０－２２５７９０号公報JP-A-10-225790 特開２０００－１９００９０号公報Japanese Patent Laid-Open No. 2000-190090 特開２００４－３４０９９号公報JP 2004-34099 A 特開２００７－２６０７７９号公報JP 2007-26079 A
　はんだ付けの際に実装品の熱損傷を防ぐには、一般的なプリント基板の耐熱温度が２５０℃以下であることを考慮すると、はんだ合金として固相線温度（示差走査熱量測定（ＤＳＣ）における融解開始温度）が２２０℃以下のものを使用することが好ましい。これにより、はんだ付け温度を低減することができる。従来の鉛フリーはんだ合金であるＳｎ－Ａｇ系合金やＳｎ－Ｃｕ系合金の固相線温度を下げるには、Ｂｉを添加すればよいが、Ｂｉを大量に添加すると、はんだが非常に脆くなるため、はんだにより接合された箇所（以下、接合箇所という）の信頼性が低下するおそれがあった。 In order to prevent thermal damage of the mounted product during soldering, considering that the heat resistance temperature of a general printed circuit board is 250 ° C. or lower, the solidus temperature (in differential scanning calorimetry (DSC)) as a solder alloy It is preferable to use one having a melting start temperature) of 220 ° C. or lower. Thereby, soldering temperature can be reduced. Bi can be added to lower the solidus temperature of conventional lead-free solder alloys such as Sn-Ag alloys and Sn-Cu alloys, but if a large amount of Bi is added, the solder becomes very brittle. For this reason, there is a possibility that the reliability of a portion joined by solder (hereinafter referred to as a joined portion) may be reduced.
　本発明は、はんだ付け温度を低減できる上、接合箇所の信頼性を向上させることができる鉛フリーはんだ合金と、これを用いたソルダペースト及び実装品を提供する。 The present invention provides a lead-free solder alloy capable of reducing the soldering temperature and improving the reliability of the joint portion, and a solder paste and a mounted product using the lead-free solder alloy.
　本発明者らは、特定の元素を特定の組成範囲で含有する鉛フリーはんだ合金により、はんだ付け温度を低減できる上、接合箇所の信頼性を向上できることを見出し、本発明を完成するに至った。 The present inventors have found that a lead-free solder alloy containing a specific element in a specific composition range can reduce the soldering temperature and improve the reliability of the joint location, and have completed the present invention. .
　すなわち、本発明の鉛フリーはんだ合金は、Ｃｕ０．０７～７．０質量％、Ｂｉ０．０５～５．０質量％、Ｓｂ０．０５～５．０質量％、Ｆｅ０．００１～０．１質量％、Ｎｉ及びＣｏから選ばれる一種以上の金属０．０１～１．０質量％、Ａｇ３．０質量％以下、並びに残部Ｓｎからなる鉛フリーはんだ合金であって、Ｆｅと、Ｎｉ及びＣｏから選ばれる一種以上の金属との含有量の比率（Ｆｅ／Ｎｉ及びＣｏから選ばれる一種以上の金属）が、０．００２～５．０であることを特徴とする。 That is, the lead-free solder alloy of the present invention has Cu 0.07 to 7.0 mass%, Bi 0.05 to 5.0 mass%, Sb 0.05 to 5.0 mass%, Fe 0.001 to 0.1 mass%. A lead-free solder alloy comprising 0.01 to 1.0% by mass of one or more metals selected from Ni and Co, Ag of 3.0% by mass or less, and the balance Sn, selected from Fe, Ni and Co The ratio of the content with one or more metals (one or more metals selected from Fe / Ni and Co) is 0.002 to 5.0.
　本発明のソルダペーストは、上記本発明の鉛フリーはんだ合金と、フラックスとを含有することを特徴とする。 The solder paste of the present invention contains the above lead-free solder alloy of the present invention and a flux.
　本発明の実装品は、電子部品と、該電子部品がはんだ付けされている回路基板とを有する実装品であって、前記はんだ付けに使用されているはんだ合金が、上記本発明の鉛フリーはんだ合金であることを特徴とする。 The mounted product of the present invention is a mounted product having an electronic component and a circuit board on which the electronic component is soldered, and the solder alloy used for the soldering is the lead-free solder of the present invention. It is an alloy.
　本発明の鉛フリーはんだ合金によれば、はんだ付け温度を低減できる上、接合箇所の信頼性を向上できる。また、本発明のソルダペースト及び実装品によれば、本発明の鉛フリーはんだ合金を用いるため、はんだ付けの際の実装品の熱損傷を防ぐことができる上、接合強度やクリープ時間等を向上させることができる。 According to the lead-free solder alloy of the present invention, the soldering temperature can be reduced and the reliability of the joint location can be improved. Moreover, according to the solder paste and the mounting product of the present invention, the lead-free solder alloy of the present invention is used, so that it is possible to prevent thermal damage of the mounting product during soldering and to improve the bonding strength, the creep time, etc. Can be made.
実施例及び比較例における接合強度の測定方法を説明するための平面図である。It is a top view for demonstrating the measuring method of the joint strength in an Example and a comparative example. 実施例及び比較例におけるソルダペーストのリフロー条件を示すグラフである。It is a graph which shows the reflow conditions of the solder paste in an Example and a comparative example. 実施例及び比較例におけるクリープ時間の測定方法を説明するための断面図である。It is sectional drawing for demonstrating the measuring method of the creep time in an Example and a comparative example.
　本発明は、「鉛フリーはんだ合金」、即ち鉛が添加されていないはんだ合金を対象とする。ただし、はんだ合金中に、不可避的不純物として鉛が存在することは許容されるが、この場合、鉛の量は、１００ｐｐｍ以下であることが好ましい。以下、本発明の鉛フリーはんだ合金に含有される成分について説明する。 The present invention is directed to a “lead-free solder alloy”, that is, a solder alloy to which no lead is added. However, lead is allowed to be present as an inevitable impurity in the solder alloy, but in this case, the amount of lead is preferably 100 ppm or less. Hereinafter, the components contained in the lead-free solder alloy of the present invention will be described.
　（Ｃｕ）
　本発明の鉛フリーはんだ合金には、はんだによる接合強度を高めて接合箇所の信頼性を向上させるためにＣｕが含有される。Ｃｕの含有量は、接合強度向上の観点から、０．０７質量％以上であり、０．１質量％以上が好ましく、０．５質量％以上がより好ましい。また、はんだ付け温度の低減の観点から、７．０質量％以下であり、５．０質量％以下が好ましく、１．０質量％以下がより好ましい。 (Cu)
The lead-free solder alloy of the present invention contains Cu in order to increase the bonding strength by the solder and improve the reliability of the bonded portion. The Cu content is 0.07% by mass or more, preferably 0.1% by mass or more, and more preferably 0.5% by mass or more, from the viewpoint of improving the bonding strength. Moreover, from a viewpoint of reduction of soldering temperature, it is 7.0 mass% or less, 5.0 mass% or less is preferable and 1.0 mass% or less is more preferable.
　（Ｂｉ）
　本発明の鉛フリーはんだ合金には、固相線温度を低減させるためにＢｉが含有される。Ｂｉの含有量は、固相線温度低減の観点から、０．０５質量％以上であり、０．１質量％以上が好ましく、０．５質量％以上がより好ましい。また、Ｂｉの脆性に起因する接合箇所の信頼性低下を抑制する観点から、５．０質量％以下であり、３．５質量％以下が好ましく、２．０質量％以下がより好ましい。 (Bi)
The lead-free solder alloy of the present invention contains Bi in order to reduce the solidus temperature. The content of Bi is 0.05% by mass or more, preferably 0.1% by mass or more, and more preferably 0.5% by mass or more from the viewpoint of reducing the solidus temperature. Moreover, from a viewpoint of suppressing the reliability fall of the joining location resulting from the brittleness of Bi, it is 5.0 mass% or less, 3.5 mass% or less is preferable and 2.0 mass% or less is more preferable.
　（Ｓｂ）
　本発明の鉛フリーはんだ合金には、Ｂｉの脆性を改善することによって接合箇所の信頼性低下を抑制するためにＳｂが含有される。Ｓｂの含有量は、Ｂｉの脆性を改善する観点から０．０５質量％以上であり、０．１質量％以上が好ましく、０．３質量％以上がより好ましい。また、はんだ付け温度の低減の観点から、５．０質量％以下であり、３．５質量％以下が好ましく、２．０質量％以下がより好ましい。 (Sb)
The lead-free solder alloy of the present invention contains Sb in order to improve the brittleness of Bi so as to suppress a decrease in reliability of the joint portion. The content of Sb is 0.05% by mass or more from the viewpoint of improving the brittleness of Bi, preferably 0.1% by mass or more, and more preferably 0.3% by mass or more. Moreover, from a viewpoint of reduction of soldering temperature, it is 5.0 mass% or less, 3.5 mass% or less is preferable, and 2.0 mass% or less is more preferable.
　（Ｆｅ）
　本発明の鉛フリーはんだ合金には、はんだによる接合強度を高め、かつ後述するクリープ時間を増大させることによって接合箇所の信頼性を向上させるために、Ｆｅが含有される。Ｆｅの含有量は、接合箇所の信頼性向上の観点から、０．００１質量％以上であり、０．００５質量％以上が好ましく、０．０１質量％以上がより好ましい。また、はんだ付け温度の低減の観点から、０．１質量％以下であり、０．０８質量％以下が好ましく、０．０５質量％以下がより好ましい。 (Fe)
The lead-free solder alloy of the present invention contains Fe in order to increase the bonding strength by the solder and to improve the reliability of the bonded portion by increasing the creep time described later. The content of Fe is 0.001% by mass or more, preferably 0.005% by mass or more, and more preferably 0.01% by mass or more from the viewpoint of improving the reliability of the joint. Moreover, from a viewpoint of reduction of soldering temperature, it is 0.1 mass% or less, 0.08 mass% or less is preferable and 0.05 mass% or less is more preferable.
　（Ｎｉ及びＣｏから選ばれる一種以上の金属）
　本発明の鉛フリーはんだ合金には、はんだによる接合強度を高め、かつ後述するクリープ時間を増大させることによって接合箇所の信頼性を向上させるために、Ｎｉ及びＣｏから選ばれる一種以上の金属が含まれ、接合箇所の信頼性向上の観点から好ましくはＣｏが含まれる。Ｎｉ及びＣｏから選ばれる一種以上の金属の合計含有量は、接合箇所の信頼性向上の観点から、０．０１質量％以上であり、０．０５質量％以上が好ましく、０．１質量％以上がより好ましい。また、はんだ付け温度の低減の観点から、１．０質量％以下であり、０．５質量％以下が好ましく、０．３質量％以下がより好ましい。 (One or more metals selected from Ni and Co)
The lead-free solder alloy of the present invention contains one or more metals selected from Ni and Co in order to increase the joint strength by soldering and improve the reliability of the joint location by increasing the creep time described later. From the viewpoint of improving the reliability of the joint portion, Co is preferably included. The total content of one or more metals selected from Ni and Co is 0.01% by mass or more, preferably 0.05% by mass or more, and preferably 0.1% by mass or more, from the viewpoint of improving the reliability of the joint portion. Is more preferable. Moreover, from a viewpoint of reduction of soldering temperature, it is 1.0 mass% or less, 0.5 mass% or less is preferable and 0.3 mass% or less is more preferable.
　本発明の鉛フリーはんだ合金において、はんだによる接合強度を高め、かつ後述するクリープ時間を増大させることによって接合箇所の信頼性を向上させる観点から、Ｆｅと、Ｎｉ及びＣｏから選ばれる一種以上の金属との含有量の比率（Ｆｅ／Ｎｉ及びＣｏから選ばれる一種以上の金属）は、０．００２～５．０であり、０．０１～３．０であることが好ましく、０．０５～０．５であることがより好ましい。 In the lead-free solder alloy of the present invention, one or more metals selected from Fe, Ni, and Co are used from the viewpoint of improving the bonding strength by solder and improving the reliability of the joint by increasing the creep time described later. The content ratio (one or more metals selected from Fe / Ni and Co) is 0.002 to 5.0, preferably 0.01 to 3.0, and preferably 0.05 to 0. .5 is more preferable.
　（Ａｇ）
　本発明の鉛フリーはんだ合金には、はんだによる接合強度を高める観点から、Ａｇが含有されていることが好ましい。Ａｇの含有量は、接合強度向上の観点から、０．１質量％以上が好ましく、０．３質量％以上がより好ましく、０．５質量％以上が更に好ましい。また、はんだ付け温度の低減及びコスト低減の観点から、３．０質量％以下であり、２．０質量％以下が好ましく、１．０質量％以下がより好ましい。 (Ag)
The lead-free solder alloy of the present invention preferably contains Ag from the viewpoint of increasing the bonding strength by solder. The content of Ag is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, and still more preferably 0.5% by mass or more from the viewpoint of improving the bonding strength. Moreover, from a viewpoint of reduction of soldering temperature and cost reduction, it is 3.0 mass% or less, 2.0 mass% or less is preferable and 1.0 mass% or less is more preferable.
　（Ｓｎ及びその他の成分）
　本発明の鉛フリーはんだ合金は、上述した各元素が上記特定の組成範囲で含有され、その残部がＳｎである。ただし、はんだ合金中に、不可避的不純物として上述した各元素及びＳｎ以外の他の成分が存在することは許容されるが、この場合、他の成分の量は、１００ｐｐｍ以下であることが好ましい。Ｓｎの含有量は、接合箇所の信頼性向上の観点から、８０．５～９９．８質量％であることが好ましく、８７．０～９９．５質量％であることがより好ましく、９４．５～９８．５質量％であることが更に好ましい。 (Sn and other ingredients)
In the lead-free solder alloy of the present invention, each of the elements described above is contained in the specific composition range, and the balance is Sn. However, although it is allowed that other components other than the above-described elements and Sn as inevitable impurities are present in the solder alloy, in this case, the amount of the other components is preferably 100 ppm or less. The content of Sn is preferably 80.5 to 99.8% by mass, more preferably 87.0 to 99.5% by mass, from the viewpoint of improving the reliability of the joint portion, and 94.5 More preferably, it is ˜98.5% by mass.
　本発明の鉛フリーはんだ合金は、はんだ付け温度の低減の観点から、その固相線温度が２２０℃以下であることが好ましく、２１７℃以下であることがより好ましく、２１４℃以下であることが更に好ましい。固相線温度を上記範囲に制御するには、例えばＢｉの含有量を調整すればよい。 The lead-free solder alloy of the present invention has a solidus temperature of preferably 220 ° C. or lower, more preferably 217 ° C. or lower, and 214 ° C. or lower, from the viewpoint of reducing the soldering temperature. Further preferred. In order to control the solidus temperature within the above range, for example, the Bi content may be adjusted.
　本発明の鉛フリーはんだ合金は、粉末形状であることが好ましい。後述するフラックスへの分散性が向上するからである。 The lead-free solder alloy of the present invention is preferably in a powder form. This is because dispersibility in the flux described later is improved.
　次に、本発明のソルダペーストについて説明する。本発明のソルダペーストは、上述した本発明の鉛フリーはんだ合金と、フラックスとを含有する。フラックスとしては、特に限定されず、従来のソルダペーストで使用されている配合のものを使用できる。例えば、ロジン系樹脂、活性剤、チクソ剤、溶剤等を含有するロジン系樹脂含有フラックスや、熱硬化性樹脂、活性剤、チクソ剤、硬化剤等を含有する熱硬化性樹脂含有フラックス等が使用できる。なかでも、はんだ付け時の作業性及びリペアの容易性の観点から、ロジン系樹脂含有フラックスを使用するのが好ましい。 Next, the solder paste of the present invention will be described. The solder paste of the present invention contains the above-described lead-free solder alloy of the present invention and a flux. It does not specifically limit as a flux, The thing of the mixing | blending used with the conventional solder paste can be used. For example, rosin resin-containing flux containing rosin resin, activator, thixotropic agent, solvent, etc., thermosetting resin-containing flux containing thermosetting resin, activator, thixotropic agent, curing agent, etc. are used it can. Especially, it is preferable to use a rosin-based resin-containing flux from the viewpoint of workability during soldering and ease of repair.
　本発明のソルダペーストにおいて、フラックスの含有量は、９～１３質量％であることが好ましく、１０～１２質量％であることがより好ましい。上記範囲とすることにより、ペーストとしての粘性やチクソ性が良好となり、印刷やディスペンス塗布などの量産工程に適したソルダペーストが得られる。同様の観点から、本発明のソルダペーストにおいて、鉛フリーはんだ合金の含有量は、８１～９１質量％であることが好ましく、８８～９０質量％であることがより好ましい。 In the solder paste of the present invention, the content of the flux is preferably 9 to 13% by mass, and more preferably 10 to 12% by mass. By setting it as the said range, the viscosity and thixotropy as a paste will become favorable, and the solder paste suitable for mass-production processes, such as printing and dispensing application | coating, will be obtained. From the same viewpoint, the content of the lead-free solder alloy in the solder paste of the present invention is preferably 81 to 91% by mass, and more preferably 88 to 90% by mass.
　本発明のソルダペースト、又はソルダペーストに含まれるフラックスは、上述した成分に加えて、必要に応じて種々の添加剤、例えば界面活性剤、消泡剤、レベリング剤等の添加剤などを含有することができる。なかでも、界面活性剤を添加すると、はんだ濡れ広がり性が向上するため好ましい。 The solder paste of the present invention or the flux contained in the solder paste contains various additives as necessary, for example, additives such as surfactants, antifoaming agents, leveling agents, etc. in addition to the above-described components. be able to. Among these, it is preferable to add a surfactant because solder wettability is improved.
　本発明のソルダペーストは、接合箇所の信頼性向上の観点から、後述する実施例に記載の測定方法により測定した接合強度が７０ＭＰａ以上であることが好ましく、８０ＭＰａ以上であることがより好ましく、９０ＭＰａ以上であることが更に好ましい。なお、上記接合強度は、通常１ＧＰａ以下である。接合強度を上記範囲内に制御するには、例えば、Ｆｅ、Ｎｉ、Ｃｏ等の含有量や、Ｆｅと、Ｎｉ及びＣｏから選ばれる一種以上の金属との含有量の比率（Ｆｅ／Ｎｉ及びＣｏから選ばれる一種以上の金属）を調整すればよい。 The solder paste of the present invention preferably has a bonding strength of 70 MPa or more, more preferably 80 MPa or more, more preferably 90 MPa, from the viewpoint of improving the reliability of the joint location, as measured by the measurement method described in the examples described later. It is still more preferable that it is above. The bonding strength is usually 1 GPa or less. In order to control the bonding strength within the above range, for example, the content of Fe, Ni, Co or the like, or the ratio of the content of Fe and one or more metals selected from Ni and Co (Fe / Ni and Co) One or more metals selected from the above may be adjusted.
　本発明のソルダペーストは、接合箇所の熱的疲労による信頼性低下を抑制する観点から、後述する実施例に記載の測定方法により測定したクリープ時間が１６０時間以上であることが好ましく、１７０時間以上であることがより好ましく、１８０時間以上であることが更に好ましい。なお、上記クリープ時間は、通常１０００時間以下である。クリープ時間を上記範囲内に制御するには、例えば、Ｆｅ、Ｎｉ、Ｃｏ等の含有量や、Ｆｅと、Ｎｉ及びＣｏから選ばれる一種以上の金属との含有量の比率（Ｆｅ／Ｎｉ及びＣｏから選ばれる一種以上の金属）を調整すればよい。 The solder paste of the present invention preferably has a creep time of 160 hours or more, measured by the measurement method described in the examples described later, from the viewpoint of suppressing reliability deterioration due to thermal fatigue at the joints, and 170 hours or more. It is more preferable that it is 180 hours or more. The creep time is usually 1000 hours or less. In order to control the creep time within the above range, for example, the content of Fe, Ni, Co or the like, or the ratio of the content of Fe and one or more metals selected from Ni and Co (Fe / Ni and Co) One or more metals selected from the above may be adjusted.
　本発明のソルダペーストは、上述した必須成分及び必要に応じて添加される添加剤と共に混練処理することにより容易に製造することができる。 The solder paste of the present invention can be easily manufactured by kneading together with the above-described essential components and additives added as necessary.
　次に、本発明の実装品について説明する。本発明の実装品は、電子部品と回路基板とを有し、前記電子部品と前記回路基板とを接合するはんだ合金として、上述した本発明の鉛フリーはんだ合金が使用されている。例えば、前記電子部品と前記回路基板とが、上述した本発明のソルダペーストを用いてはんだ付けされた実装品が例示できる。なお、電子部品は特に限定されず、例えば太陽光発電モジュール等が使用できる。また、回路基板についても特に限定されず、例えばポリイミド等を基材の材料とする回路基板が使用できる。 Next, the mounted product of the present invention will be described. The mounted product of the present invention has an electronic component and a circuit board, and the above-described lead-free solder alloy of the present invention is used as a solder alloy for joining the electronic component and the circuit board. For example, a mounted product in which the electronic component and the circuit board are soldered using the solder paste of the present invention described above can be exemplified. In addition, an electronic component is not specifically limited, For example, a solar power generation module etc. can be used. Further, the circuit board is not particularly limited, and a circuit board using, for example, polyimide as a base material can be used.
　以下に実施例を示し、本発明をより具体的に説明する。これら実施例は、本発明における最良の実施形態の一例ではあるものの、本発明はこれら実施例により限定を受けるものではない。 Hereinafter, the present invention will be described more specifically with reference to examples. These examples are examples of the best mode of the present invention, but the present invention is not limited by these examples.
　（鉛フリーはんだ合金粉末の作製及び固相線温度測定）
　表１に示す各組成のはんだ合金を作製し、次いでそれらを粉末化し、粒径２０μｍから４０μｍの間にあるものを分級し、評価に使用する鉛フリーはんだ合金粉末を得た。得られた各鉛フリーはんだ合金粉末について、示差走査熱量計（セイコーインスツルメント社製、ＥＸＳＴＡＲ６０００）を用い、測定温度範囲を３０～６００℃として、固相線温度を測定した。結果を表１に示す。なお、測定の際は、吸熱量が１．５Ｊ／ｇ以上あるものを測定対象物由来のピークとし、それ未満のピークは、分析精度の観点から除外した。 (Preparation of lead-free solder alloy powder and measurement of solidus temperature)
Solder alloys having respective compositions shown in Table 1 were prepared, and then pulverized, and those having a particle size between 20 μm and 40 μm were classified to obtain lead-free solder alloy powders used for evaluation. With respect to each of the obtained lead-free solder alloy powders, the solidus temperature was measured using a differential scanning calorimeter (EXSTAR 6000, manufactured by Seiko Instruments Inc.) with a measurement temperature range of 30 to 600 ° C. The results are shown in Table 1. In the measurement, those having an endothermic amount of 1.5 J / g or more were regarded as peaks derived from the measurement object, and peaks less than that were excluded from the viewpoint of analysis accuracy.
　（ソルダペーストの調製）
　ロジン系樹脂（ハリマ化成社製　ハリフェノール５１２）４８質量％、チクソ剤（新日本理化社製　ゲルオールＤ）９質量％、活性剤（アジピン酸）８質量％、界面活性剤（ビックケミージャパン社製　ＢＹＫ３６１Ｎ）１質量％、及び溶剤としてヘキシルジグリコール３４質量％を同容器に計量し、らいかい機を用いて混合し、フラックスを調製した。得られたフラックスと、上記の方法で得られた各鉛フリーはんだ合金粉末とを、フラックス：はんだ粉末＝１０：９０の比率で計量し、これらを混練機にて２時間混合することで、ソルダペーストを調製した。このソルダペーストを用いて、後述する各種物性評価を行った。 (Preparation of solder paste)
Rosin resin (Harima Chemical Co., Ltd. Hariphenol 512) 48% by mass, thixotropic agent (Shin Nippon Rika Co., Ltd., Gelol D) 9% by mass, activator (adipic acid) 8% by mass, surfactant (Bic Chemie Japan, Inc.) BYK361N) 1% by mass and 34% by mass of hexyl diglycol as a solvent were weighed in the same container and mixed using a rough machine to prepare a flux. Solder was obtained by weighing the obtained flux and each lead-free solder alloy powder obtained by the above method in a ratio of flux: solder powder = 10: 90, and mixing them in a kneader for 2 hours. A paste was prepared. Using this solder paste, various physical property evaluations described later were performed.
　（接合強度の測定）
　接合強度の測定方法について、図１を参照しながら説明する。図１は、接合強度の測定方法を説明するための平面図である。まず、銅板１（５ｍｍ×５０ｍｍ、厚さ０．５ｍｍ）を２枚準備し、２枚の銅板１の短辺部同士を合わせ、その間に上記の方法で得られた各ソルダペースト２（１ｍｍ×５ｍｍ、厚さ０．５ｍｍ）を挟み、図２に示すリフロー条件にてリフロー溶融させることによって、２枚の銅板１同士を接合させた。得られた試料を、引張り試験機（ＳＨＩＭＡＤＺＵ社製、ＥＺ－Ｌ）を使用して、引っ張り速度５ｍｍ／ｍｉｎの条件で図１に示す矢印方向に引っ張って、接合強度（接合箇所が破断する強度）を測定した。結果を表１に示す。 (Measurement of bonding strength)
A method for measuring the bonding strength will be described with reference to FIG. FIG. 1 is a plan view for explaining a method for measuring the bonding strength. First, two copper plates 1 (5 mm × 50 mm, thickness 0.5 mm) were prepared, the short sides of the two copper plates 1 were put together, and each solder paste 2 (1 mm × 1) obtained by the above method in between. 5 mm, thickness 0.5 mm) was sandwiched between the two copper plates 1 by reflow melting under the reflow conditions shown in FIG. The obtained sample was pulled in the arrow direction shown in FIG. 1 using a tensile tester (manufactured by SHIMADZU, EZ-L) at a pulling speed of 5 mm / min. ) Was measured. The results are shown in Table 1.
　（クリープ時間の測定）
　クリープ時間の測定方法について、図３を参照しながら説明する。図３は、クリープ時間の測定方法を説明するための断面図である。まず、ガラスエポキシ基板３上に銅ランド４（径４．０ｍｍ）が設けられた試験基板を準備し、ガラスエポキシ基板３及び銅ランド４を貫通する貫通孔５（孔径１．０ｍｍ）を設けた。別途、上記の方法で得られた各ソルダペーストを用いて６．０ｍｍ径の円形はんだ６（重量２ｇ、中心に直径１．０ｍｍの孔６ａが設けられたもの）をそれぞれ作製した。次いで、貫通孔５に０．８ｍｍ径の銅線７を通し、更に銅線７の上部を円形はんだ６の孔６ａに通した状態で、図２に示すリフロー条件にてリフロー溶融させることによって、銅ランド４と銅線７とを固定した。次いで、銅線７の下部に錘８（重量２ｋｇ）を吊るし、１２５℃の恒温槽内に放置し、放置直後から錘８が落下するまでの時間をクリープ時間として記録した。結果を表１に示す。なお、クリープ時間が長いほど、接合箇所の熱的疲労による信頼性低下を抑制できる。 (Measurement of creep time)
A method for measuring the creep time will be described with reference to FIG. FIG. 3 is a cross-sectional view for explaining a creep time measurement method. First, a test board provided with a copper land 4 (diameter 4.0 mm) on a glass epoxy board 3 was prepared, and a through hole 5 (hole diameter 1.0 mm) penetrating the glass epoxy board 3 and the copper land 4 was provided. . Separately, each solder paste obtained by the above method was used to prepare a 6.0 mm diameter circular solder 6 (having a weight of 2 g and a hole 6a having a diameter of 1.0 mm in the center). Next, by passing a 0.8 mm diameter copper wire 7 through the through hole 5 and further passing the upper part of the copper wire 7 through the hole 6a of the circular solder 6, reflow melting is performed under the reflow conditions shown in FIG. The copper land 4 and the copper wire 7 were fixed. Next, a weight 8 (weight 2 kg) was hung under the copper wire 7 and left in a constant temperature bath at 125 ° C., and the time from immediately after being left until the weight 8 dropped was recorded as a creep time. The results are shown in Table 1. In addition, the longer the creep time, the lower the reliability due to thermal fatigue at the joint.
　（せん断強度の測定）
　ガラスエポキシ基板上に形成された銅箔ランド（導体寸法：０．８５×０．５５ｍｍ、導体間隔：０．８５ｍｍ）に、上記の方法で得られた各ソルダペーストを、厚み１５０μｍｔのメタルマスクを用いてメタルスキージで印刷した。次いで、Ｓｎめっきされた１６０８ＣＲチップを上記銅箔ランド（１０個）の印刷膜上に１つずつ載置した。そして、図２に示すリフロー条件で加熱して試験片を作製した。この試験片について、引張り試験機（ＳＨＩＭＡＤＺＵ社製、ＥＺ－Ｌ）を用いて、引っ張り速度５ｍｍ／ｍｉｎの条件でチップのせん断強度を測定した。結果を表１に示す。なお、表１の結果は、せん断強度を測定した１０個のチップの平均値である。 (Measurement of shear strength)
Copper solder lands (conductor dimensions: 0.85 x 0.55 mm, conductor spacing: 0.85 mm) formed on a glass epoxy substrate are coated with each solder paste obtained by the above method using a metal mask with a thickness of 150 μmt. Used to print with a metal squeegee. Next, 1608CR chips plated with Sn were placed one by one on the printed film of the copper foil lands (10 pieces). And it heated on the reflow conditions shown in FIG. 2, and produced the test piece. With respect to this test piece, the shear strength of the chip was measured using a tensile tester (manufactured by SHIMADZU, EZ-L) under the condition of a pulling speed of 5 mm / min. The results are shown in Table 1. In addition, the result of Table 1 is an average value of 10 chips | tips which measured shear strength.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　表１に示すように、本発明の実施例１～１２は、いずれの評価項目についても良好な結果が得られた。一方、比較例１～１１は、少なくとも１つの評価項目について実施例よりも劣る結果が得られた。 As shown in Table 1, in Examples 1 to 12 of the present invention, good results were obtained for any of the evaluation items. On the other hand, Comparative Examples 1 to 11 were inferior to the Examples for at least one evaluation item.
１　銅板
２　ソルダペースト
３　ガラスエポキシ基板
４　銅ランド
５　貫通孔
６　円形はんだ
６ａ　孔
７　銅線
８　錘 DESCRIPTION OF SYMBOLS 1 Copper plate 2 Solder paste 3 Glass epoxy board 4 Copper land 5 Through-hole 6 Circular solder 6a Hole 7 Copper wire 8 Weight

Claims (8)

  1. 　Ｃｕ０．０７～７．０質量％、Ｂｉ０．０５～５．０質量％、Ｓｂ０．０５～５．０質量％、Ｆｅ０．００１～０．１質量％、Ｎｉ及びＣｏから選ばれる一種以上の金属０．０１～１．０質量％、Ａｇ３．０質量％以下、並びに残部Ｓｎからなる鉛フリーはんだ合金であって、
    　Ｆｅと、Ｎｉ及びＣｏから選ばれる一種以上の金属との含有量の比率（Ｆｅ／Ｎｉ及びＣｏから選ばれる一種以上の金属）が、０．００２～５．０である、鉛フリーはんだ合金。     One or more metals selected from Cu 0.07 to 7.0 mass%, Bi 0.05 to 5.0 mass%, Sb 0.05 to 5.0 mass%, Fe 0.001 to 0.1 mass%, Ni and Co A lead-free solder alloy comprising 0.01 to 1.0 mass%, Ag 3.0 mass% or less, and the balance Sn,
    A lead-free solder alloy in which the content ratio of Fe to one or more metals selected from Ni and Co (one or more metals selected from Fe / Ni and Co) is 0.002 to 5.0.
  2. 　固相線温度が２２０℃以下である請求項１記載の鉛フリーはんだ合金。 The lead-free solder alloy according to claim 1, wherein the solidus temperature is 220 ° C or lower.
  3. 　粉末形状である請求項１又は２記載の鉛フリーはんだ合金。 The lead-free solder alloy according to claim 1 or 2, which is in a powder form.
  4. 　請求項１～３の何れか１項記載の鉛フリーはんだ合金と、フラックスとを含有するソルダペースト。 A solder paste containing the lead-free solder alloy according to any one of claims 1 to 3 and a flux.
  5. 　前記フラックスの含有量が９～１３質量％である請求項４記載のソルダペースト。 The solder paste according to claim 4, wherein the content of the flux is 9 to 13% by mass.
  6. 　接合強度が７０ＭＰａ以上である請求項４又は５記載のソルダペースト。 The solder paste according to claim 4 or 5, wherein the bonding strength is 70 MPa or more.
  7. 　クリープ時間が１６０時間以上である請求項４～６の何れか１項記載のソルダペースト。 The solder paste according to any one of claims 4 to 6, wherein the creep time is 160 hours or more.
  8. 　電子部品と、該電子部品がはんだ付けされている回路基板とを有する実装品であって、
    　前記はんだ付けに使用されているはんだ合金が、請求項１～３の何れか１項記載の鉛フリーはんだ合金である実装品。     A mounted product having an electronic component and a circuit board to which the electronic component is soldered,
    The mounted product, wherein the solder alloy used for the soldering is a lead-free solder alloy according to any one of claims 1 to 3.
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