WO2022261130A1 - High reliability lead-free solder pastes with mixed solder alloy powders - Google Patents
High reliability lead-free solder pastes with mixed solder alloy powders Download PDFInfo
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- WO2022261130A1 WO2022261130A1 PCT/US2022/032552 US2022032552W WO2022261130A1 WO 2022261130 A1 WO2022261130 A1 WO 2022261130A1 US 2022032552 W US2022032552 W US 2022032552W WO 2022261130 A1 WO2022261130 A1 WO 2022261130A1
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- WIPO (PCT)
- Prior art keywords
- solder
- alloy
- alloy powder
- remainder
- optionally
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 249
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 203
- 239000000956 alloy Substances 0.000 title claims abstract description 203
- 239000000843 powder Substances 0.000 title claims abstract description 86
- 230000004907 flux Effects 0.000 claims abstract description 15
- 229910001152 Bi alloy Inorganic materials 0.000 claims abstract description 12
- 229910017944 Ag—Cu Inorganic materials 0.000 claims abstract description 6
- 229910017932 Cu—Sb Inorganic materials 0.000 claims abstract description 6
- 229910020935 Sn-Sb Inorganic materials 0.000 claims abstract description 6
- 229910008757 Sn—Sb Inorganic materials 0.000 claims abstract description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 30
- 229910052748 manganese Inorganic materials 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 25
- 230000008569 process Effects 0.000 claims description 13
- 238000005476 soldering Methods 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 229910052797 bismuth Inorganic materials 0.000 claims description 4
- 238000002844 melting Methods 0.000 description 18
- 230000008018 melting Effects 0.000 description 18
- 238000005516 engineering process Methods 0.000 description 13
- 238000012360 testing method Methods 0.000 description 12
- 238000005382 thermal cycling Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 239000011800 void material Substances 0.000 description 5
- 235000011837 pasties Nutrition 0.000 description 3
- 229910000967 As alloy Inorganic materials 0.000 description 2
- 229910006913 SnSb Inorganic materials 0.000 description 2
- 230000002596 correlated effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 241001466538 Gymnogyps Species 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 231100001261 hazardous Toxicity 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Definitions
- Some implementations of the disclosure are directed to a solder paste including two or more metal solder powders and flux, where one of the solder powders can have a lower melting temperature than the other, comparable to or slightly lower than the melting temperature of traditional SnAgCu solder alloys, and the other solder powder can have a melting temperature comparable to or higher than traditional SnAgCu solder alloys because of the addition of Sb.
- the solder paste can reduce the peak reflow temperature, widen the process window, decrease voiding, and/or maintain comparable reliability or even improve the reliability of the high-reliability single powder counterpart paste.
- the solder paste consists essentially of: 10 wt% to 90 wt% of a first solder alloy powder, the first solder alloy powder consisting of a Sn-Sb alloy, a Sn- Ag-Cu-Sb alloy, a Sn-Ag-Cu-Sb-ln alloy, a Sn-Ag-Cu-Sb-Bi alloy, or Sn-Ag-Cu-Sb-Bi-ln alloy; 10 wt% to 90 wt% of a second solder alloy powder, the second solder alloy powder consisting of an Sn-Ag-Cu alloy or Sn-Ag-Cu-Bi alloy, and the second solder alloy powder having a lower solidus temperature than the first solder alloy powder; and flux.
- the solder paste consists essentially of 40 wt% to 90 wt% of the first solder alloy powder, 10 wt% to 60 wt% of the second solder alloy powder, and the flux.
- the first solder alloy powder has a solidus temperature of 210°C to 245°C; and the second solder alloy powder has a solidus temperature of 200°C to 217°C.
- the first solder alloy powder is: 2-10 wt% of Sb; optionally, 0.001-3.0 wt% of Ni, Co, Mn, P, or Zn; and a remainder of Sn; 1.5-4.0 wt% of Ag; 0.5-1.2 wt% of Cu; 3.5-6.5 wt% of Sb; optionally, 0.001-3.0 wt% of Ni, Co, Mn, P, or Zn; and a remainder of Sn; 1.5-4.0 wt% of Ag; 0.5-1.2wt% of Cu; 3.5-6.5wt% of Sb; 0.2-7.0 wt% of Bi; optionally, 0.001-3.0 wt% of Ni, Co, Mn, P, or Zn; and a remainder of Sn; 1.5-4.0 wt% of Ag; 0.5-1.2 wt% of Cu; 3.0-6.5 wt% of Sb; 0.2-7.0 wt% of Bi; 0.1-3.5 wt%
- the first solder powder is 1.5-4.0 wt% of Ag; 0.5-1.2 wt% of Cu; 9-15 wt% of Sb; optionally, 0.001-3.0 wt% of Ni, Co, Mn, P, or Zn; and a remainder of Sn; or 1.5-4.0 wt% of Ag; 0.5-1.2 wt% of Cu; 9-15 wt% of Sb; 0.1-3.5 wt% of In; optionally, 0.001-3.0 wt% of Ni, Co, Mn, P, or Zn; and a remainder of Sn.
- the second solder alloy powder is: 1.5-4.0wt% Ag, 0.5-1.2wt%Cu, and a remainder of Sn; or 1.5-4.0wt% Ag, 0.5-1.2wt%Cu, 1.0-7.0wt% Bi, and a remainder of Sn.
- the first solder alloy powder comprises 0.001-3.0 wt% of Ni, Co, Mn, P, or Zn.
- the first solder alloy powder is 95Sn-5Sb, 90.6Sn3.2Ag0.7Cu5.5Sb0.01Ni, 89.3Sn3.8Ag0.9Cu5.5Sb0.5ln, 89.7Sn3.8Agl.2Cu3.8Sbl.5Bi, 89Sn3.8Ag0.7Cu3.5Sb0.5Bi2.5ln, 86.7Sn3.2Ag0.7Cu5.5Sb3.2Bi0.5ln0.2Ni,
- the second solder alloy powder is 91.0Sn2.5Ag0.5Cu6.0Bi, 93.5Sn3.0Ag0.5Cu3.0Bi,
- a method comprises: applying a solder paste between two components to form an assembly, the solder paste consisting essentially of: 10 wt% to 90 wt% of a first solder alloy powder, the first solder alloy powder consisting of a Sn-Sb alloy, a Sn-Ag-Cu-Sb alloy, a Sn-Ag-Cu-Sb-ln alloy, a Sn-Ag-Cu-Sb-Bi alloy, or Sn-Ag-Cu-Sb-Bi-ln alloy; 10 wt% to 90 wt% of a second solder alloy powder, the second solder alloy powder consisting of an Sn-Ag-Cu alloy or Sn-Ag-Cu-Bi alloy, and the second alloy having a lower solidus temperature than the first alloy; and flux; and reflow soldering the assembly to form a solder joint from the solder paste.
- reflow soldering the assembly to form the solder joint comprises: reflow soldering the assembly at a peak temperature lower than required to form a solder joint from a solder paste consisting of the first solder alloy powder and the flux.
- the solder paste including the mixed solder alloy powder and flux may be reflow soldered at a temperature below 245°C (e.g., about 240°C)
- the peak temperature required to form solder joint from a solder paste consisting of the first solder alloy powder and the flux may be above 245°C, above 250°C, above 255°C, or even higher.
- the assembly is reflow soldered at a peak temperature below 245°C.
- the assembly is reflow soldered at a peak temperature from about 240°C to below 245°C. In some implementations, the assembly is reflow soldered at a peak temperature of about 240°C or lower. In some implementations, the assembly is reflow soldered at a peak temperature of about 235°C to about 240°C.
- a solder joint is formed by a process, the process comprising: applying a solder paste between two components to form an assembly, the solder paste consisting essentially of: 10 wt% to 90 wt% of a first solder alloy powder, the first solder alloy powder consisting of a Sn-Sb alloy, a Sn-Ag-Cu-Sb alloy, a Sn-Ag-Cu-Sb-ln alloy, a Sn-Ag- Cu-Sb-Bi alloy, or Sn-Ag-Cu-Sb-Bi-ln alloy; 10 wt% to 90 wt% of a second solder alloy powder, the second solder alloy powder consisting of an Sn-Ag-Cu alloy or Sn-Ag-Cu-Bi alloy, and the second alloy having a lower solidus temperature than the first alloy; and flux; an reflow soldering the assembly to form the solder joint from the solder paste.
- FIG. 1A is a plot showing the void percentage of three solder joints formed after reflow with the same reflow profile having a peak temperature of 240°C.
- FIG. IB is a plot showing the bond shear strength in megapascals of the three solder joints of FIG. 1A.
- FIG. 2 is a plot showing the void percentage of six solder joints formed after reflow with the same reflow profile having a peak temperature of 240°C.
- FIG. 3 illustrates the bond shear strength, at a temperature range from 25°C to 175°C, of Cu-Cu joints made from three different solder pastes, and reflowed under the same profile.
- FIG. 4A shows a cross-section of a solder joint formed from a mixed alloy powder solder paste after thermal cycling tests, in accordance with implementations of the disclosure.
- FIG. 4B shows a cross-section of a solder joint formed from a single alloy powder solder paste after thermal cycling tests.
- FIG. 5 is a plot showing the voiding percentage of nine solder joints formed after reflow with the same reflow profile having a peak temperature of 240°C.
- FIG. 6 is a plot showing the voiding percentage of seven solder joints of an MLF68 component on a test board, the solder joints formed after reflow with the same reflow profile having a peak temperature of 240°C.
- FIG. 7 shows the cross sections of seven solder joints after 2000 cycles of a thermal cycling test (-40/125°C).
- the traditional SAC reflow temperature of 235° to 240°C has to be increased by at least 10°C to 245-250 °C. This may narrow the process window when soldering with the Sb-containing SnAgCuSb alloy because some of the printed circuit board assembly (PCBA) components cannot withstand the increasing reflow temperature.
- PCBA printed circuit board assembly
- the high reliability Sn-rich solder alloys typically show worse voiding performance than SnAgCu alloys using the traditional SnAgCu process profile, possibly because of the wider pasty range from adding Sb.
- Sb in an amount of 5.0 to 9.0wt% to an SnAgCu solder alloy may significantly improve reliability, it will increase the solder alloy's melting temperature and widen the pasty range, which may lead to a higher reflow peak temperature, a narrower process window, and/or poor voiding performance compared to the mainstream lead-free solders such as SAC305 and SAC387.
- implementations of the disclosure are directed to a novel solder paste including two or more selected metal solder powders and a flux, where the solder paste is targeted at (1) reducing the reflow peak temperature, (2) widening the process window, (3) decreasing voiding, and/or (4) maintaining comparable reliability or even improving the reliability of the high-reliability single powder counterpart paste.
- One of the solder powders may have a lower melting temperature than the other, comparable to or slightly lower than the melting temperature of traditional SnAgCu solder alloys, and the other solder powder may have a melting temperature comparable to or higher than traditional SnAgCu solder alloys because of the addition of Sb.
- a first solder alloy powder has a higher solidus temperature that may range from 210 to 245 °C
- the second solder alloy powder has a lower solidus temperature that may range from 200 to 217 °C.
- the higher melting temperature solder alloy may comprise SnSb, SnAgCuSb, SnAgCuSbln, SnAgCuBiSb, SnAgCuBiSbln, or variations thereof.
- additives of Bi, In, Ni and/or Co may be included in the higher melting temperature solder alloy to enhance its ductility or improve wetting performance.
- Table 1 shows compositions of example higher melting temperature solder alloys in accordance with the disclosure (depicted as Alloys A to D, and I to K) as compared to traditional SnAgCu alloys (depicted as Alloys E to H).
- the higher melting temperature solder alloys in accordance with the disclosure may provide improved reliability and a higher melting temperature compared to the traditional Sn-rich SnAgCu solder alloys.
- the ratio of higher melting temperature solder alloy and the lower melting temperature solder alloy may be tuned. If the wt% of the lower solidus temperature solder alloy relative to the higher solidus temperature solder alloy is insufficient, the process temperature needed may be above 245°C. On the other hand, if the lower solidus temperature solder alloy is more than sufficient, the reliability of the solder joint may be compromised due to a shortage of the higher solidus temperature solder alloy. Therefore, the ratio of the first and the second solder alloys in the paste may need to be carefully designed so that both the high reliability performance and the low process temperature window will be satisfied.
- the higher solidus temperature solder powder may comprise 10wt% to 90wt% of the solder paste, and the lower solidus temperature solder powder may comprise 10wt% to 90wt% of the solder paste.
- the higher solidus temperature solder powder may comprise 40wt% to 10wt% to 60wt% of the solder paste.
- Table 2 illustrates example compositions of lead-free mixed solder powder pastes in accordance with the disclosure.
- the first, higher solidus temperature and higher reliability solder alloy (Alloy#A in Table 1) is Sn3.2Ag0.7Cu5.5Sb3.2Bi0.5ln0.2Ni
- the second, lower solidus temperature solder alloy is a SnAgCuBi solder alloy (either Alloy #H or #F in Table 1).
- Table 3 illustrates example compositions of lead-free mixed solder powder pastes in accordance with the disclosure.
- the first, higher solidus temperature and higher reliability solder alloy (Alloy#B in Table 1) is Sn3.2Ag0.7Cu5.5Sb0.01Ni
- the second, lower solidus temperature solder alloy is an SnAgCu solder alloy (Alloy#E) or SnAgCuBi solder alloy (Alloy#G).
- Table 4 illustrates example compositions of lead-free mixed solder powder pastes in accordance with the disclosure.
- the first, higher solidus temperature and higher reliability solder alloys are Alloy #A, #J, and #K in Table 1
- the second, lower solidus temperature solder alloys are SnAgCuBi solder alloys (Alloy #F and #H).
- Table 4 [0036] Table 5, below, lists the solidus and liquidus temperatures for single solder alloys (Alloy#A and H in Table 1) and eight alloys of mixed solder pastes (M#2-6 to 2-8 in Table 2 and M#4-l to 4-5 in Table 4), in accordance with the disclosure.
- the solidus and liquidus temperatures were measured by Differential Scanning Calorimeter (DSC) performed with TA
- FIGs. 1A-1B are plots respectively showing the void percentage (FIG. 1A) and bond shear strength in megapascals (MPa) (FIG. IB) of three solder joints formed after reflow with the same reflow profile having a peak temperature of 240°C.
- the three solder joints were formed using a single alloy (Alloy#A) solder paste and mixed solder pastes (M#2-6 and M#2- 8 in Table 2).
- a 3mmX3mm Cu die was reflowed to solder onto an organic solderability preservatives (OSP) substrate to form die-attach solder joints.
- the voids percentage was measured by X-ray and the bond shear strength was captured at different temperatures with a CONDOR 250 XYZTEC shear tester.
- M#2-6 60wt% of Alloy#A and 40wt% of Alloy#H
- M#2-8 80wt% of Alloy#A and 20wt% of Alloy#H
- FIG. 2 is a plot showing the void percentage of six solder joints formed after reflow with the same reflow profile having a peak temperature of 240°C.
- the six solder joints were formed using a single alloy (Alloy#A) solder paste and five mixed solder pastes (M#2-ll, M#2-13, M#2-14, M#2-15, and M#2-17 in Table 2).
- the trend of voiding performance with the quantity of the selected low solidus temperature solder alloy (#F) in the mixed solder paste (#A and #F) is recognized from the plot.
- the higher the quantity of alloy #F in the solder the lower the voiding percentage.
- the mixing ratio of Alloy#A and #F may need to be maintained above a certain level.
- FIG. 3 illustrates the bond shear strength, at a temperature range from 25°C to 175°C, of Cu-Cu joints made from Alloy#A, #F and M#2-14, and reflowed under the same profile.
- the solder joint made from the mixed solder paste M#2-14 exhibited higher bond strength throughout the whole temperature range than both solder joints made from single alloy solder pastes (#A and #F), indicating better reliability.
- This demonstrated that a 50wt% to 50wt% mixing ratio of Alloy#A and Alloy#F not only improves the voiding performance but also enhances the bond shear strength and possibly the associated reliability.
- Thermal fatigue reliability of solder joints comprising embodiments of M#2-14, consisting of 50wt% Alloy#A and 50wt% Alloy#F, was evaluated using an accelerated thermal cycling (ATC) test with assembled chip resistor test boards.
- the assembled chip resistor test boards which had two different sized resistors, 0603 and 0805, enabled electrical continuity testing, i.e., in-situ, continuous monitoring during thermal cycling.
- the nominal temperature cycling profiles for ATC were 1) from -40 to 125°C with a dwell time of 10 minutes at each extreme temperature (TCI), and 2) from -40 to 150°C with a dwell time of 10 minutes at each extreme temperature (TC2).
- FIGs. 4A-4B respectively show cross-sections of solder joints formed from M#2-14 (FIG. 4A) and Alloy#E (FIG. 4B) after 2500 cycles under TCI.
- the solder joint of Alloy#E exhibited severe cracking after 2500 cycles under TCI while the solder joint of M#2-14 was nearly intact.
- FIG. 5 is a plot showing the voiding percentage of nine solder joints formed after reflow with the same reflow profile having a peak temperature of 240°C.
- the nine solder joints were formed using a single alloy (Alloy#B) solder paste and eight mixed solder alloy pastes (M#3-2, M#3-4, M#3-6, M#3-8, and M#3-ll, M#3-13, M#3-15, M#3-17 in Table 3).
- the plot shows that having a higher ratio of the lower solidus temperature solder alloy (#E or #G) relative to the higher solidus temperature solder alloy (#B) in the mixed solder alloy paste generally correlated with better voiding performance.
- FIG. 6 is a plot showing the voiding percentage of seven solder joints formed after reflow with the same reflow profile having a peak temperature of 240°C.
- the solder joints were formed between a MicroLeadFrame ® component (MLF68) and a test board.
- the seven solder joints were formed using a single alloy (Alloy#A) solder paste and six mixed solder alloy pastes (M#2-14 in Table 2, and M#4-l to 4- 5 in Table 4).
- the plot shows that the mixed solder alloy pastes have better voiding performance than the single alloy solder paste.
- the plot also shows that having a higher ratio of the lower solidus temperature solder alloy (e.g., #F or #H) relative to the higher solidus temperature solder alloy (#A) in the mixed solder alloy paste generally correlated with better voiding performance.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP22741062.8A EP4351832A1 (en) | 2021-06-11 | 2022-06-07 | High reliability lead-free solder pastes with mixed solder alloy powders |
KR1020247001106A KR20240019350A (en) | 2021-06-11 | 2022-06-07 | High reliability lead-free solder paste with mixed solder alloy powder |
CN202280041582.0A CN117480029A (en) | 2021-06-11 | 2022-06-07 | High-reliability lead-free solder paste of mixed solder alloy powder |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US202163209585P | 2021-06-11 | 2021-06-11 | |
US63/209,585 | 2021-06-11 |
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WO2022261130A1 true WO2022261130A1 (en) | 2022-12-15 |
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PCT/US2022/032552 WO2022261130A1 (en) | 2021-06-11 | 2022-06-07 | High reliability lead-free solder pastes with mixed solder alloy powders |
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US (1) | US20220395936A1 (en) |
EP (1) | EP4351832A1 (en) |
KR (1) | KR20240019350A (en) |
CN (1) | CN117480029A (en) |
TW (1) | TW202317304A (en) |
WO (1) | WO2022261130A1 (en) |
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US20220395934A1 (en) * | 2018-10-31 | 2022-12-15 | Robert Bosch Gmbh | Mixed Alloy Solder Paste, Method of Making the Same and Soldering Method |
TWI814081B (en) * | 2019-09-02 | 2023-09-01 | 美商阿爾發金屬化工公司 | High temperature ultra-high reliability alloys, manufacturing method thereof, and applications thereof |
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US20220395934A1 (en) * | 2018-10-31 | 2022-12-15 | Robert Bosch Gmbh | Mixed Alloy Solder Paste, Method of Making the Same and Soldering Method |
TWI725664B (en) * | 2018-12-14 | 2021-04-21 | 日商千住金屬工業股份有限公司 | Solder alloys, solder pastes, solder preforms and solder joints |
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2022
- 2022-06-07 WO PCT/US2022/032552 patent/WO2022261130A1/en active Application Filing
- 2022-06-07 US US17/834,666 patent/US20220395936A1/en active Pending
- 2022-06-07 KR KR1020247001106A patent/KR20240019350A/en unknown
- 2022-06-07 EP EP22741062.8A patent/EP4351832A1/en active Pending
- 2022-06-07 CN CN202280041582.0A patent/CN117480029A/en active Pending
- 2022-06-10 TW TW111121623A patent/TW202317304A/en unknown
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WO2005099961A1 (en) * | 2004-04-15 | 2005-10-27 | Henkel Loctite Adhesives Limited | Lead-free, bismuth-free solder alloy powders and pastes and methods of production thereof |
EP2468450A1 (en) * | 2010-10-29 | 2012-06-27 | Harima Chemicals, Inc. | Low-silver-content solder alloy and solder paste composition |
EP2671667A1 (en) * | 2012-06-08 | 2013-12-11 | Nihon Almit Co., Ltd. | Solder paste for bonding micro components |
US20160279741A1 (en) * | 2015-03-24 | 2016-09-29 | Tamura Corporation | Lead-free solder alloy, electronic circuit board, and electronic control device |
WO2017192517A1 (en) * | 2016-05-06 | 2017-11-09 | Alpha Assembly Solutions Inc. | High reliability lead-free solder alloy |
JP2018058090A (en) * | 2016-10-06 | 2018-04-12 | 株式会社弘輝 | Solder paste and solder alloy powder |
EP3708290A1 (en) * | 2018-04-13 | 2020-09-16 | Senju Metal Industry Co., Ltd | Solder paste |
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EP4351832A1 (en) | 2024-04-17 |
CN117480029A (en) | 2024-01-30 |
US20220395936A1 (en) | 2022-12-15 |
KR20240019350A (en) | 2024-02-14 |
TW202317304A (en) | 2023-05-01 |
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