JP2018058090A - Solder paste and solder alloy powder - Google Patents
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 172
- 239000000843 powder Substances 0.000 title claims abstract description 131
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 130
- 239000000956 alloy Substances 0.000 title claims abstract description 130
- 230000004907 flux Effects 0.000 claims abstract description 14
- 239000000203 mixture Substances 0.000 claims abstract description 11
- 229910052797 bismuth Inorganic materials 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000002245 particle Substances 0.000 description 13
- 239000010949 copper Substances 0.000 description 10
- 238000009736 wetting Methods 0.000 description 7
- 229910052787 antimony Inorganic materials 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
本発明は、はんだペースト、及び、該はんだペースト用のはんだ合金粉に関する。 The present invention relates to a solder paste and a solder alloy powder for the solder paste.
従来から、電子部品等の接合部品と基板とを接続する際には、はんだ合金粉とフラックスとを含むはんだペーストが使用されている。該はんだペーストは、基板表面の電極部に塗布されると共に、該電極部に接合部品の電極部を接触させた状態で、所定温度（リフロー温度）で加熱される。これにより、はんだ合金粉が溶融してはんだ接合部が形成され、該はんだ接合部を介して基板と接合部品とが接合される。 Conventionally, when connecting a joining component such as an electronic component and a substrate, a solder paste containing a solder alloy powder and a flux has been used. The solder paste is applied to the electrode part on the surface of the substrate and heated at a predetermined temperature (reflow temperature) in a state where the electrode part of the joining component is in contact with the electrode part. As a result, the solder alloy powder is melted to form a solder joint, and the substrate and the joining component are joined via the solder joint.
前記はんだ合金粉としては、錫（以下、Ｓｎとも記す）を主成分とし、銀（以下、Ａｇとも記す）、及び、銅（以下、Ｃｕとも記す）を含有するもの（以下、ＳＡＣ系合金粉とも記す）が知られている。斯かるＳＡＣ系合金粉には、アンチモン（以下、Ｓｂとも記す）が含有される場合がある。Ｓｂを含有することで、前記はんだ接合部の耐熱性、接合強度、及び、接合信頼性を向上させることが可能となる。 The solder alloy powder is mainly composed of tin (hereinafter also referred to as Sn) and contains silver (hereinafter also referred to as Ag) and copper (hereinafter also referred to as Cu) (hereinafter referred to as SAC-based alloy powder). Is also known). Such SAC-based alloy powder may contain antimony (hereinafter also referred to as Sb). By containing Sb, it becomes possible to improve the heat resistance, joint strength, and joint reliability of the solder joint.
しかしながら、ＳＡＣ系合金粉は、Ｓｂを含有することで、Ｓｂを含有しない場合よりも融点が高くなるため、リフロー温度を高く設定する必要がある。このように、リフロー温度が高く設定されると、リフロー温度の影響によって基板や接合部品の品質が低下する虞がある。 However, since the SAC-based alloy powder contains Sb and has a higher melting point than when it does not contain Sb, the reflow temperature needs to be set high. Thus, when the reflow temperature is set high, there is a possibility that the quality of the substrate or the joining component is deteriorated due to the influence of the reflow temperature.
そこで、Ｓｂと共にビスマス（以下、Ｂｉとも記す）を含有させたＳＡＣ系合金粉が提案されている（特許文献１参照）。このようなＳｂ及びＢｉを含有するＳＡＣ系合金粉は、Ｂｉを含有しないものよりも融点が低くなるため、リフロー温度を低く設定することができ、基板や接合部品の品質の低下を抑制することが可能となる。 Therefore, a SAC-based alloy powder containing bismuth (hereinafter also referred to as Bi) together with Sb has been proposed (see Patent Document 1). Since the SAC-based alloy powder containing Sb and Bi has a lower melting point than that containing no Bi, the reflow temperature can be set low, and the deterioration of the quality of the substrate and the joining parts can be suppressed. Is possible.
しかしながら、Ｓｂに起因する融点の上昇を効果的に抑制し得る程度の含有量でＢｉを含有させることは、前記はんだ接合部の靱性が低下して接合信頼性にバラツキが生じる要因となる。このため、Ｂｉの含有量を低減させるべく、Ｓｂを含有したはんだ合金粉を用いたはんだペーストであってもリフロー温度の低いものが要求されている。 However, the inclusion of Bi with such a content that can effectively suppress the rise in melting point due to Sb is a factor in that the toughness of the solder joint portion is lowered and the joint reliability varies. For this reason, in order to reduce the content of Bi, a solder paste using a solder alloy powder containing Sb is required to have a low reflow temperature.
そこで、本願発明は、Ｓｂを含有するはんだ合金粉を用いたはんだペーストにおいて、比較的低いリフロー温度ではんだ接合が可能なはんだペーストを提供すると共に、該はんだペースト用のはんだ合金粉を提供することを課題とする。 Therefore, the present invention provides a solder paste that can be soldered at a relatively low reflow temperature in a solder paste using a solder alloy powder containing Sb, and also provides a solder alloy powder for the solder paste. Is an issue.
本発明に係るはんだペーストは、はんだ合金粉とフラックスとが混合されてなるはんだペーストであって、前記はんだ合金粉は、組成の異なる第一はんだ合金粉と第二はんだ合金粉とを含むものであり、前記第一はんだ合金粉は、Ａｇが０．１質量％以上４．０質量％以下、Ｃｕが０．１質量％以上０．８質量％以下、Ｂｉが０質量％以上６．０質量％以下、Ｓｂが０質量％以上２．５質量％以下、残部がＳｎからなり、前記第二はんだ合金粉は、Ａｇが０．１質量％以上４．０質量％以下、Ｃｕが０．１質量％以上０．８質量％以下、Ｂｉが０質量％以上６．０質量％以下、Ｓｂが２．５質量％を超え１６質量％以下、残部がＳｎからなり、且つ、Ｂｉの含有量が前記第一はんだ合金粉のＢｉの含有量以下である。 The solder paste according to the present invention is a solder paste in which a solder alloy powder and a flux are mixed, and the solder alloy powder includes a first solder alloy powder and a second solder alloy powder having different compositions. And the first solder alloy powder has an Ag of 0.1% by mass to 4.0% by mass, Cu of 0.1% by mass to 0.8% by mass, and Bi of 0% by mass to 6.0% by mass. %, Sb is 0 mass% or more and 2.5 mass% or less, and the balance is Sn. The second solder alloy powder has an Ag content of 0.1 mass% or more and 4.0 mass% or less, and Cu is 0.1 mass%. % By mass to 0.8% by mass, Bi from 0% by mass to 6.0% by mass, Sb exceeding 2.5% by mass and 16% by mass or less, the balance being Sn, and the Bi content being It is below the Bi content of the first solder alloy powder.
斯かる構成によれば、はんだペーストを構成するはんだ合金粉が第一はんだ合金粉及び第二はんだ合金粉を含み、第一はんだ合金粉及び第二はんだ合金粉のそれぞれにおけるＢｉ及びＳｂの含有量が上記の範囲であることで、Ｓｂを含有するはんだ合金粉（第一はんだ合金粉及び第二はんだ合金粉を含むもの）であっても比較的低いリフロー温度ではんだ接合を行うことができる。 According to such a configuration, the solder alloy powder constituting the solder paste includes the first solder alloy powder and the second solder alloy powder, and the contents of Bi and Sb in the first solder alloy powder and the second solder alloy powder, respectively. Is within the above range, it is possible to perform solder joining at a relatively low reflow temperature even for solder alloy powder containing Sb (including the first solder alloy powder and the second solder alloy powder).
前記第一はんだ合金粉及び前記第二はんだ合金粉の少なくとも一方は、Ｎｉ及びＣｏの少なくとも一方の成分を０．０１質量％以上０．１質量％以下含有してもよい。 At least one of the first solder alloy powder and the second solder alloy powder may contain 0.01% by mass or more and 0.1% by mass or less of at least one component of Ni and Co.
前記第一はんだ合金粉及び前記第二はんだ合金粉の少なくとも一方は、Ｇｅを０．００１質量％以上０．０５質量％以下含有してもよい。 At least one of said 1st solder alloy powder and said 2nd solder alloy powder may contain 0.001 mass% or more and 0.05 mass% or less of Ge.
前記はんだ合金粉は、前記第二はんだ合金粉に対する前記第一はんだ合金粉の割合が２５質量％以上７５質量％以下であってもよい。 In the solder alloy powder, a ratio of the first solder alloy powder to the second solder alloy powder may be 25 mass% or more and 75 mass% or less.
本発明に係るはんだ合金粉は、はんだ合金粉とフラックスとが混合されてなるはんだペースト用のはんだ合金粉であって、組成の異なる第一はんだ合金粉と第二はんだ合金粉とを含んでおり、前記第一はんだ合金粉は、Ａｇが０．１質量％以上４．０質量％以下、Ｃｕが０．１質量％以上０．８質量％以下、Ｂｉが０質量％以上６．０質量％以下、Ｓｂが０質量％以上２．５質量％以下、残部がＳｎからなり、前記第二はんだ合金粉は、Ａｇが０．１質量％以上４．０質量％以下、Ｃｕが０．１質量％以上０．８質量％以下、Ｂｉが０質量％以上６．０質量％以下、Ｓｂが２．５質量％を超え１６質量％以下、残部がＳｎからなり、且つ、Ｂｉの含有量が前記第一はんだ合金粉のＢｉの含有量以下である。 The solder alloy powder according to the present invention is a solder alloy powder for solder paste in which a solder alloy powder and a flux are mixed, and includes a first solder alloy powder and a second solder alloy powder having different compositions. In the first solder alloy powder, Ag is 0.1% by mass to 4.0% by mass, Cu is 0.1% by mass to 0.8% by mass, and Bi is 0% by mass to 6.0% by mass. Hereinafter, Sb is 0% by mass or more and 2.5% by mass or less, and the balance is Sn. The second solder alloy powder has an Ag of 0.1% by mass or more and 4.0% by mass or less, and Cu is 0.1% by mass. % To 0.8% by mass, Bi is 0% to 6.0% by mass, Sb is more than 2.5% by mass and 16% by mass or less, the balance is Sn, and the Bi content is It is below the Bi content of the first solder alloy powder.
以上のように、本発明によれば、Ｓｂを含有するはんだ合金粉を用いたはんだペーストにおいて、比較的低いリフロー温度ではんだ接合を行うことができる。 As described above, according to the present invention, solder bonding can be performed at a relatively low reflow temperature in a solder paste using a solder alloy powder containing Sb.
以下、本発明の実施形態について説明する。なお、本発明は、下記の実施形態に限定されるものではない。 Hereinafter, embodiments of the present invention will be described. In addition, this invention is not limited to the following embodiment.
本発明に係るはんだペーストは、はんだ合金粉とフラックスとが混合されて形成される。はんだ合金粉は、組成の異なる第一はんだ合金粉と、第二はんだ合金粉とを含む。 The solder paste according to the present invention is formed by mixing solder alloy powder and flux. The solder alloy powder includes a first solder alloy powder and a second solder alloy powder having different compositions.
第一はんだ合金粉は、銀（以下、Ａｇとも記す）が０．１質量％以上４．０質量％以下であり、３．０質量％以上３．５質量％以下であることが好ましい。また、第一はんだ合金粉は、銅（以下、Ｃｕとも記す）が０．１質量％以上０．８質量％以下であり、０．４質量％以上０．７質量％以下であることが好ましい。また、第一はんだ合金粉は、アンチモン（以下、Ｓｂとも記す）が０質量％以上２．５質量％以下であり、０質量％以上１．５質量％以下であることが好ましい。また、第一はんだ合金粉は、ビスマス（以下、Ｂｉとも記す）が０質量％以上６．０質量％以下であり、０質量％以上２．０質量％以下であることが好ましい。また、第一はんだ合金粉は、残部が錫（以下、Ｓｎとも記す）からなるものである。なお、残部とは、上記の各成分以外の成分であり、不可避不純物を含んでいてもよい。 In the first solder alloy powder, silver (hereinafter also referred to as Ag) is 0.1% by mass or more and 4.0% by mass or less, and preferably 3.0% by mass or more and 3.5% by mass or less. The first solder alloy powder is preferably 0.1% by mass or more and 0.8% by mass or less, and more preferably 0.4% by mass or more and 0.7% by mass or less of copper (hereinafter also referred to as Cu). . The first solder alloy powder has 0 to 2.5% by mass of antimony (hereinafter also referred to as Sb), and preferably 0 to 1.5% by mass. The first solder alloy powder has bismuth (hereinafter also referred to as Bi) of 0% by mass to 6.0% by mass, and preferably 0% by mass to 2.0% by mass. The first solder alloy powder is made of tin (hereinafter also referred to as Sn). The remainder is a component other than the above components, and may contain inevitable impurities.
第二はんだ合金粉は、Ａｇが０．１質量％以上４．０質量％以下であり、３．０質量％以上３．５質量％以下であることが好ましい。また、第二はんだ合金粉は、Ｃｕが０．１質量％以上０．８質量％以下であり、０．４質量％以上０．７質量％以下であることが好ましい。また、第二はんだ合金粉は、Ｓｂが２．５質量％を超え１６質量％以下であり、４質量％以上１０質量％以下であることが好ましい。また、第二はんだ合金粉は、Ｂｉが０質量％以上６．０質量％以下であり、０質量％以上１質量％以下であることが好ましい。また、第二はんだ合金粉は、残部がＳｎからなるものである。また、第二はんだ合金粉は、Ｂｉの含有量が第一はんだ合金粉のＢｉの含有量以下になるものである。なお、残部とは、上記の各成分以外の成分であり、不可避不純物を含んでいてもよい。 The second solder alloy powder has an Ag of 0.1% by mass to 4.0% by mass, and preferably 3.0% by mass to 3.5% by mass. Moreover, as for the 2nd solder alloy powder, it is preferable that Cu is 0.1 mass% or more and 0.8 mass% or less, and is 0.4 mass% or more and 0.7 mass% or less. Further, the second solder alloy powder has Sb of more than 2.5% by mass and 16% by mass or less, and preferably 4% by mass or more and 10% by mass or less. In the second solder alloy powder, Bi is 0% by mass or more and 6.0% by mass or less, and preferably 0% by mass or more and 1% by mass or less. The second solder alloy powder is composed of Sn as the remainder. The second solder alloy powder has a Bi content equal to or less than the Bi content of the first solder alloy powder. The remainder is a component other than the above components, and may contain inevitable impurities.
また、第一はんだ合金粉及び第二はんだ合金粉の少なくとも一方は、更に、ニッケル（以下、Ｎｉとも記す）及びコバルト（以下、Ｃｏとも記す）の少なくとも一方の成分を０．０１質量％以上０．１質量％以下含有することが好ましく、０．０３質量％以上０．０７質量％以下含有することがより好ましい。また、第一はんだ合金粉及び第二はんだ合金粉の少なくとも一方は、更に、ゲルマニウム（以下、Ｇｅとも記す）を０．００１質量％以上０．０５質量％以下含有することが好ましく、０．００５質量％以上０．０２質量％以下含有することがより好ましい。 Further, at least one of the first solder alloy powder and the second solder alloy powder further contains at least one component of nickel (hereinafter also referred to as Ni) and cobalt (hereinafter also referred to as Co) of 0.01% by mass or more and 0%. It is preferable to contain 1 mass% or less, and it is more preferable to contain 0.03 mass% or more and 0.07 mass% or less. Further, at least one of the first solder alloy powder and the second solder alloy powder preferably further contains germanium (hereinafter also referred to as Ge) in an amount of 0.001% by mass to 0.05% by mass. More preferably, it is contained in an amount of at least 0.02% by mass.
前記第一はんだ合金粉は、第二はんだ合金粉に対して２５質量％以上７５質量％以下であることが好ましく、４０質量％以上６０質量％以下であることがより好ましい。また、はんだ合金粉（具体的には、第一はんだ合金粉及び第二はんだ合金粉の全体）の粒径としては、特に限定されるものではない。例えば、平均粒径Ｄ５０（メジアン径）が、５μｍ以上４０μｍ以下であることが好ましく、８μｍ以上３５μｍ以下であることがより好ましい。また、９０％粒子径Ｄ９０が、４５μｍ以下であることが好ましく、３８μｍ以下であることがより好ましい。 The first solder alloy powder is preferably 25% by mass to 75% by mass and more preferably 40% by mass to 60% by mass with respect to the second solder alloy powder. Further, the particle size of the solder alloy powder (specifically, the whole of the first solder alloy powder and the second solder alloy powder) is not particularly limited. For example, the average particle diameter D50 (median diameter) is preferably 5 μm or more and 40 μm or less, and more preferably 8 μm or more and 35 μm or less. Further, the 90% particle diameter D90 is preferably 45 μm or less, and more preferably 38 μm or less.
なお、上記の「平均粒径Ｄ５０（メジアン径）」および「９０％粒子径Ｄ９０」とは、レーザー回折式粒度分布測定装置で測定される値をいう。 The above-mentioned “average particle diameter D50 (median diameter)” and “90% particle diameter D90” refer to values measured by a laser diffraction particle size distribution analyzer.
なお、前記はんだ合金粉を構成する金属粉として、第一はんだ合金粉及び第二はんだ合金粉以外の他の金属粒子を更に含んでもよい。 In addition, as metal powder which comprises the said solder alloy powder, you may further contain other metal particles other than 1st solder alloy powder and 2nd solder alloy powder.
前記フラックスとしては、特に限定されるものではなく、公知のフラックスを用いることができ、例えば、ロジン系、合成樹脂系等のフラックスを用いることができる。 It does not specifically limit as said flux, A well-known flux can be used, For example, fluxes, such as a rosin type and a synthetic resin type, can be used.
また、本発明に係るはんだペースト中のはんだ合金粉の含有量としては、特に限定されるものではなく、例えば、８０質量％以上９２質量％以下であることが好ましい。また、本発明に係るはんだペースト中のフラックスの含有量としては、特に限定されるものではなく、例えば、８質量％以上２０質量％以下であることが好ましい。 Moreover, it is not specifically limited as content of the solder alloy powder in the solder paste which concerns on this invention, For example, it is preferable that it is 80 to 92 mass%. Moreover, it does not specifically limit as content of the flux in the solder paste which concerns on this invention, For example, it is preferable that they are 8 mass% or more and 20 mass% or less.
以上のように、本発明に係るはんだペースト、及び、はんだ合金粉によれば、Ｓｂを含有するはんだ合金粉を用いたはんだペーストにおいて、比較的低いリフロー温度ではんだ接合を行うことができる。 As described above, according to the solder paste and the solder alloy powder according to the present invention, solder bonding can be performed at a relatively low reflow temperature in the solder paste using the solder alloy powder containing Sb.
即ち、はんだペーストを構成するはんだ合金粉が第一はんだ合金粉及び第二はんだ合金粉を含み、第一はんだ合金粉及び第二はんだ合金粉のそれぞれにおけるＢｉ及びＳｂの含有量が上記の範囲であることで、Ｓｂを含有するはんだ合金粉（第一はんだ合金粉及び第二はんだ合金粉を含むもの）であっても比較的低いリフロー温度ではんだ接合を行うことできる。 That is, the solder alloy powder constituting the solder paste includes the first solder alloy powder and the second solder alloy powder, and the contents of Bi and Sb in the first solder alloy powder and the second solder alloy powder are within the above ranges. As a result, even solder alloy powder containing Sb (including the first solder alloy powder and the second solder alloy powder) can be soldered at a relatively low reflow temperature.
なお、本発明に係るはんだペースト用フラックス、及び、はんだ合金粉は、上記実施形態に限定されるものではなく、本発明の要旨を逸脱しない範囲で種々の変更が可能である。また、上記した複数の実施形態の構成や方法等を任意に採用して組み合わせてもよい（１つの実施形態に係る構成や方法等を他の実施形態に係る構成や方法等に適用してもよい）ことは勿論である。 The flux for solder paste and the solder alloy powder according to the present invention are not limited to the above embodiment, and various modifications can be made without departing from the gist of the present invention. Further, the configurations and methods of the plurality of embodiments described above may be arbitrarily adopted and combined (even if the configurations and methods according to one embodiment are applied to the configurations and methods according to other embodiments). Of course.
以下、本発明の実施例について説明するが、本発明は、以下の実施例に限定されるものではない。 Examples of the present invention will be described below, but the present invention is not limited to the following examples.
＜使用材料＞
１．はんだ合金粉１，２
下記表１の組成を有する第一はんだ合金粉（平均粒径：３０μｍ）と、下記表１の組成を有する第二はんだ合金粉（平均粒径：３０μｍ）とを下記表１に示す割合で含むはんだ合金粉を用いた。なお、上記の平均粒径（Ｄ５０）は、ベックマンコールター製レーザー回折粒度分布測定装置によって測定されるものである。
２．はんだ合金粉３〜５
下記表１の組成を有するはんだ合金粉（平均粒径：３０μｍ）を用いた。なお、上記の平均粒径（Ｄ５０）は、ベックマンコールター製レーザー回折粒度分布測定装置によって測定されるものである。
３．フラックス
下記表２に示す組成のフラックスを用いた。
<Materials used>
1. Solder alloy powder 1, 2
The first solder alloy powder (average particle size: 30 μm) having the composition shown in Table 1 below and the second solder alloy powder (average particle size: 30 μm) having the composition shown in Table 1 below are included in the ratio shown in Table 1 below. Solder alloy powder was used. In addition, said average particle diameter (D50) is measured by the laser diffraction particle size distribution measuring apparatus by Beckman Coulter.
2. Solder alloy powder 3-5
A solder alloy powder (average particle size: 30 μm) having the composition shown in Table 1 below was used. In addition, said average particle diameter (D50) is measured by the laser diffraction particle size distribution measuring apparatus by Beckman Coulter.
3. Flux A flux having the composition shown in Table 2 below was used.
＜はんだペーストの作製＞
上記の各はんだ合金粉とフラックスとを下記表３の割合で混練してはんだペーストを作製した。
<Preparation of solder paste>
Each solder alloy powder and flux were kneaded at a ratio shown in Table 3 below to prepare a solder paste.
＜濡れ所要時間の測定＞
作製したはんだペーストを用い、濡れ所要時間の測定を行った。具体的には、Ｃｕ板上にはんだペーストを印刷し、該はんだペースト上にチップ抵抗を載せ、加熱後、１８５℃に達してからはんだペーストが溶融してチップ抵抗の電極側面を濡れ上がるまでの時間（濡れ所要時間）を測定した。前記チップ抵抗は、電極部分をＳｎメッキした幅３．２ｍｍ、奥行１．６ｍｍ、高さ０．６ｍｍのものを用いた。
加熱処理（リフロー処理）の温度条件としては、熱処理開始４０秒で常温から１５０℃まで昇温し、その後１２０秒で１８５℃まで昇温し、その後４０秒で２３５℃まで昇温し、その後３０秒間２３５℃を維持し、その後常温付近まで冷却する条件とした。また、加熱処理は、酸素濃度が５００ｐｐｍ以下の窒素雰囲気下で行った。
濡れ所要時間の測定結果については、下記表１に示す。
<Measurement of wet time>
Using the produced solder paste, the time required for wetting was measured. Specifically, a solder paste is printed on a Cu plate, a chip resistor is placed on the solder paste, and after heating reaches 185 ° C., the solder paste melts and wets the electrode side of the chip resistor. Time (time required for wetting) was measured. As the chip resistor, a Sn-plated electrode portion having a width of 3.2 mm, a depth of 1.6 mm, and a height of 0.6 mm was used.
As temperature conditions for the heat treatment (reflow treatment), the temperature was raised from room temperature to 150 ° C. in 40 seconds after the start of heat treatment, then raised to 185 ° C. in 120 seconds, then raised to 235 ° C. in 40 seconds, and then 30 The temperature was maintained at 235 ° C. for 2 seconds and then cooled to near room temperature. The heat treatment was performed in a nitrogen atmosphere with an oxygen concentration of 500 ppm or less.
The measurement results of the time required for wetting are shown in Table 1 below.
＜まとめ＞
表１の実施例１と比較例１とを比較すると実施例１の方が濡れ所要時間が短いことが認められる。また、実施例２と比較例２とを比較すると実施例２の方が濡れ所要時間が短いことが認められる。つまり、各実施例のはんだペーストは、はんだ合金粉に蓄積される熱量が少ない段階（即ち、はんだ合金粉自体の温度が低い状態）において、はんだ合金粉が溶融して良好な濡れ挙動を示すことが認められる。
<Summary>
When Example 1 in Table 1 is compared with Comparative Example 1, it is recognized that Example 1 has a shorter required time for wetting. Moreover, when Example 2 is compared with Comparative Example 2, it is recognized that Example 2 has a shorter required time for wetting. That is, the solder paste of each example exhibits good wetting behavior when the solder alloy powder melts at a stage where the amount of heat accumulated in the solder alloy powder is small (that is, the temperature of the solder alloy powder itself is low). Is recognized.
このため、本発明のように、組成の異なる第一はんだ合金粉と第二はんだ合金粉とから構成されるはんだ合金粉を用いたはんだペーストは、比較的低い温度で良好な濡れ挙動を示すため、リフロー温度を比較的低く設定することが可能となる。これにより、Ｓｂを含有するはんだ合金粉を用いたはんだペーストにおいても、リフロー温度を比較的低く設定することができるため、はんだ合金粉中のＢｉの含有量を低減することが可能となる。 For this reason, as in the present invention, the solder paste using the solder alloy powder composed of the first solder alloy powder and the second solder alloy powder having different compositions exhibits good wetting behavior at a relatively low temperature. The reflow temperature can be set relatively low. Thereby, also in the solder paste using the solder alloy powder containing Sb, the reflow temperature can be set relatively low, so that the Bi content in the solder alloy powder can be reduced.
Claims (5)
前記はんだ合金粉は、組成の異なる第一はんだ合金粉と第二はんだ合金粉とを含んでおり、
前記第一はんだ合金粉は、Ａｇが０．１質量％以上４．０質量％以下、Ｃｕが０．１質量％以上０．８質量％以下、Ｂｉが０質量％以上６．０質量％以下、Ｓｂが０質量％以上２．５質量％以下、残部がＳｎからなり、
前記第二はんだ合金粉は、Ａｇが０．１質量％以上４．０質量％以下、Ｃｕが０．１質量％以上０．８質量％以下、Ｂｉが０質量％以上６．０質量％以下、Ｓｂが２．５質量％を超え１６質量％以下、残部がＳｎからなり、且つ、Ｂｉの含有量が前記第一はんだ合金粉のＢｉの含有量以下であるはんだペースト。 A solder paste in which a solder alloy powder and a flux are mixed,
The solder alloy powder includes a first solder alloy powder and a second solder alloy powder having different compositions,
As for said 1st solder alloy powder, Ag is 0.1 mass% or more and 4.0 mass% or less, Cu is 0.1 mass% or more and 0.8 mass% or less, Bi is 0 mass% or more and 6.0 mass% or less. , Sb is 0% by mass to 2.5% by mass, and the balance is Sn.
As for said 2nd solder alloy powder, Ag is 0.1 mass% or more and 4.0 mass% or less, Cu is 0.1 mass% or more and 0.8 mass% or less, Bi is 0 mass% or more and 6.0 mass% or less. A solder paste in which Sb exceeds 2.5 mass% and 16 mass% or less, the remainder is made of Sn, and the Bi content is less than or equal to the Bi content of the first solder alloy powder.
組成の異なる第一はんだ合金粉と第二はんだ合金粉とを含んでおり、
前記第一はんだ合金粉は、Ａｇが０．１質量％以上４．０質量％以下、Ｃｕが０．１質量％以上０．８質量％以下、Ｂｉが０質量％以上６．０質量％以下、Ｓｂが０質量％以上２．５質量％以下、残部がＳｎからなり、
前記第二はんだ合金粉は、Ａｇが０．１質量％以上４．０質量％以下、Ｃｕが０．１質量％以上０．８質量％以下、Ｂｉが０質量％以上６．０質量％以下、Ｓｂが２．５質量％を超え１６質量％以下、残部がＳｎからなり、且つ、Ｂｉの含有量が前記第一はんだ合金粉のＢｉの含有量以下であるはんだ合金粉。 Solder alloy powder for solder paste formed by mixing solder alloy powder and flux,
The first solder alloy powder and the second solder alloy powder having different compositions are included,
As for said 1st solder alloy powder, Ag is 0.1 mass% or more and 4.0 mass% or less, Cu is 0.1 mass% or more and 0.8 mass% or less, Bi is 0 mass% or more and 6.0 mass% or less. , Sb is 0% by mass to 2.5% by mass, and the balance is Sn.
As for said 2nd solder alloy powder, Ag is 0.1 mass% or more and 4.0 mass% or less, Cu is 0.1 mass% or more and 0.8 mass% or less, Bi is 0 mass% or more and 6.0 mass% or less. A solder alloy powder in which Sb exceeds 2.5 mass% and is 16 mass% or less, the balance is Sn, and the Bi content is less than or equal to the Bi content of the first solder alloy powder.
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