HK1210647A1 - 存儲系統 - Google Patents
存儲系統Info
- Publication number
- HK1210647A1 HK1210647A1 HK15111373.7A HK15111373A HK1210647A1 HK 1210647 A1 HK1210647 A1 HK 1210647A1 HK 15111373 A HK15111373 A HK 15111373A HK 1210647 A1 HK1210647 A1 HK 1210647A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- memory system
- memory
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/26—Sensing or reading circuits; Data output circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C8/00—Arrangements for selecting an address in a digital store
- G11C8/08—Word line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, for word lines
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
- G11C11/5621—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using charge storage in a floating gate
- G11C11/5628—Programming or writing circuits; Data input circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0483—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells having several storage transistors connected in series
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/08—Address circuits; Decoders; Word-line control circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/30—Power supply circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/20—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels
- H10B41/23—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
- H10B41/27—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/20—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels
- H10B43/23—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
- H10B43/27—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Read Only Memory (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2013/072125 WO2015025357A1 (ja) | 2013-08-19 | 2013-08-19 | メモリシステム |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1210647A1 true HK1210647A1 (zh) | 2016-04-29 |
Family
ID=52483170
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK15111373.7A HK1210647A1 (zh) | 2013-08-19 | 2015-11-18 | 存儲系統 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9799406B2 (zh) |
JP (1) | JP5866032B2 (zh) |
CN (1) | CN104641418B (zh) |
HK (1) | HK1210647A1 (zh) |
SG (1) | SG11201507090PA (zh) |
WO (1) | WO2015025357A1 (zh) |
Families Citing this family (54)
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US8860117B2 (en) | 2011-04-28 | 2014-10-14 | Micron Technology, Inc. | Semiconductor apparatus with multiple tiers of memory cells with peripheral transistors, and methods |
US8964474B2 (en) | 2012-06-15 | 2015-02-24 | Micron Technology, Inc. | Architecture for 3-D NAND memory |
JP2014179148A (ja) * | 2013-03-15 | 2014-09-25 | Toshiba Corp | 不揮発性半導体記憶装置 |
US10402319B2 (en) * | 2014-07-25 | 2019-09-03 | Micron Technology, Inc. | Apparatuses and methods for concurrently accessing different memory planes of a memory |
US9691452B2 (en) | 2014-08-15 | 2017-06-27 | Micron Technology, Inc. | Apparatuses and methods for concurrently accessing different memory planes of a memory |
US11120884B2 (en) | 2015-09-30 | 2021-09-14 | Sunrise Memory Corporation | Implementing logic function and generating analog signals using NOR memory strings |
US9910594B2 (en) | 2015-11-05 | 2018-03-06 | Micron Technology, Inc. | Apparatuses and methods for concurrently accessing multiple memory planes of a memory during a memory access operation |
US10719237B2 (en) | 2016-01-11 | 2020-07-21 | Micron Technology, Inc. | Apparatuses and methods for concurrently accessing multiple partitions of a non-volatile memory |
US10096366B2 (en) | 2016-01-28 | 2018-10-09 | Toshiba Memory Corporation | Memory system including multi-plane flash memory and controller |
US9891945B2 (en) * | 2016-03-21 | 2018-02-13 | Qualcomm Incorporated | Storage resource management in virtualized environments |
US9792995B1 (en) | 2016-04-26 | 2017-10-17 | Sandisk Technologies Llc | Independent multi-plane read and low latency hybrid read |
US9679650B1 (en) | 2016-05-06 | 2017-06-13 | Micron Technology, Inc. | 3D NAND memory Z-decoder |
KR102600997B1 (ko) | 2016-06-02 | 2023-11-14 | 삼성전자주식회사 | 메모리 장치 |
JP2017224370A (ja) | 2016-06-15 | 2017-12-21 | 東芝メモリ株式会社 | 半導体記憶装置及びメモリシステム |
KR20180010368A (ko) | 2016-07-20 | 2018-01-31 | 삼성전자주식회사 | 메모리 장치 |
US10684795B2 (en) | 2016-07-25 | 2020-06-16 | Toshiba Memory Corporation | Storage device and storage control method |
US11017838B2 (en) | 2016-08-04 | 2021-05-25 | Samsung Electronics Co., Ltd. | Nonvolatile memory devices |
KR102620562B1 (ko) * | 2016-08-04 | 2024-01-03 | 삼성전자주식회사 | 비휘발성 메모리 장치 |
EP3504728A4 (en) * | 2016-08-26 | 2020-09-09 | Sunrise Memory Corporation | CAPACITIVE-COUPLING NON-VOLATILE THIN-LAYER TRANSISTOR CHAIN IN THREE-DIMENSIONAL NETWORKS |
JP6753746B2 (ja) * | 2016-09-15 | 2020-09-09 | キオクシア株式会社 | 半導体記憶装置 |
JP2018045750A (ja) | 2016-09-16 | 2018-03-22 | 東芝メモリ株式会社 | 半導体記憶装置 |
US20190187839A1 (en) * | 2017-02-10 | 2019-06-20 | Philio Technology Corporation | Modular wireless wall-mounted switch device |
JP6856400B2 (ja) | 2017-02-20 | 2021-04-07 | キオクシア株式会社 | 半導体記憶装置及びメモリシステム |
CN108630249B (zh) * | 2017-03-24 | 2022-03-04 | 铠侠股份有限公司 | 半导体存储装置 |
CN108735263A (zh) * | 2017-04-19 | 2018-11-02 | 北京兆易创新科技股份有限公司 | 一种提高操作效率的方法和装置 |
KR20190019712A (ko) * | 2017-08-18 | 2019-02-27 | 에스케이하이닉스 주식회사 | 데이터 저장 장치 및 그것의 동작 방법 |
KR102474035B1 (ko) * | 2017-08-18 | 2022-12-06 | 에스케이하이닉스 주식회사 | 데이터 저장 장치 및 그것의 동작 방법 |
US10431596B2 (en) | 2017-08-28 | 2019-10-01 | Sunrise Memory Corporation | Staggered word line architecture for reduced disturb in 3-dimensional NOR memory arrays |
KR20190031683A (ko) * | 2017-09-18 | 2019-03-27 | 에스케이하이닉스 주식회사 | 메모리 시스템 및 메모리 시스템의 동작 방법 |
US10438656B2 (en) * | 2017-12-18 | 2019-10-08 | Intel Corporation | System and method for performing a concurrent multiple page read of a memory array |
KR102514772B1 (ko) * | 2017-12-28 | 2023-03-28 | 삼성전자주식회사 | 비동기적 동작 수행이 가능한 비휘발성 메모리 장치와 이를 포함하는 메모리 시스템, 그리고 이의 동작 수행 방법 |
CN108628759B (zh) * | 2017-12-29 | 2020-09-01 | 贵阳忆芯科技有限公司 | 乱序执行nvm命令的方法与装置 |
US11101001B2 (en) * | 2018-05-08 | 2021-08-24 | Sandisk Technologies Llc | Non-volatile memory with multi-plane mixed sub-block programming |
JP2019204565A (ja) * | 2018-05-22 | 2019-11-28 | 東芝メモリ株式会社 | 半導体記憶装置及びメモリシステム |
US10943651B2 (en) | 2018-08-03 | 2021-03-09 | Toshiba Memory Corporation | Semiconductor memory device, memory system, and write method |
US11621039B2 (en) | 2018-08-03 | 2023-04-04 | Kioxia Corporation | Semiconductor memory device, memory system, and write method |
JP2020047348A (ja) * | 2018-09-19 | 2020-03-26 | キオクシア株式会社 | 半導体記憶装置及びその制御方法 |
KR20200055281A (ko) * | 2018-11-13 | 2020-05-21 | 에스케이하이닉스 주식회사 | 메모리 시스템 및 메모리 시스템의 동작방법 |
CN112035053A (zh) * | 2019-06-04 | 2020-12-04 | 华邦电子股份有限公司 | 存储器存储装置及其运作方法 |
JP6770140B1 (ja) * | 2019-06-20 | 2020-10-14 | ウィンボンド エレクトロニクス コーポレーション | 半導体装置およびその動作方法 |
US11450381B2 (en) | 2019-08-21 | 2022-09-20 | Micron Technology, Inc. | Multi-deck memory device including buffer circuitry under array |
JP7293063B2 (ja) | 2019-09-19 | 2023-06-19 | キオクシア株式会社 | メモリシステムおよび記憶装置 |
US11515309B2 (en) | 2019-12-19 | 2022-11-29 | Sunrise Memory Corporation | Process for preparing a channel region of a thin-film transistor in a 3-dimensional thin-film transistor array |
US11675500B2 (en) | 2020-02-07 | 2023-06-13 | Sunrise Memory Corporation | High capacity memory circuit with low effective latency |
US11126369B1 (en) | 2020-02-28 | 2021-09-21 | Western Digital Technologies, Inc. | Data storage with improved suspend resume performance |
US11681465B2 (en) * | 2020-06-12 | 2023-06-20 | Advanced Micro Devices, Inc. | Dynamic multi-bank memory command coalescing |
US11842777B2 (en) | 2020-11-17 | 2023-12-12 | Sunrise Memory Corporation | Methods for reducing disturb errors by refreshing data alongside programming or erase operations |
US11848056B2 (en) | 2020-12-08 | 2023-12-19 | Sunrise Memory Corporation | Quasi-volatile memory with enhanced sense amplifier operation |
KR20220087785A (ko) | 2020-12-18 | 2022-06-27 | 에스케이하이닉스 주식회사 | 메모리 컨트롤러 및 이를 포함하는 저장 장치 |
KR20220087782A (ko) * | 2020-12-18 | 2022-06-27 | 에스케이하이닉스 주식회사 | 메모리 컨트롤러 및 이를 포함하는 저장 장치 |
CN113129952B (zh) * | 2021-05-14 | 2023-04-18 | 长江存储科技有限责任公司 | 非易失性存储器及其控制方法 |
TW202310429A (zh) | 2021-07-16 | 2023-03-01 | 美商日升存儲公司 | 薄膜鐵電電晶體的三維記憶體串陣列 |
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JP2002176114A (ja) | 2000-09-26 | 2002-06-21 | Toshiba Corp | 半導体装置及びその製造方法 |
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JP5178167B2 (ja) | 2007-12-04 | 2013-04-10 | 株式会社東芝 | 半導体記憶装置及びそのデータ書き込み方法 |
KR101448169B1 (ko) | 2008-01-02 | 2014-10-13 | 삼성전자주식회사 | 멀티-플레인 구조의 3차원 메모리 장치 |
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JP5283960B2 (ja) | 2008-04-23 | 2013-09-04 | 株式会社東芝 | 三次元積層不揮発性半導体メモリ |
JP2009266944A (ja) | 2008-04-23 | 2009-11-12 | Toshiba Corp | 三次元積層不揮発性半導体メモリ |
JP2010009646A (ja) | 2008-06-24 | 2010-01-14 | Toshiba Memory Systems Co Ltd | 半導体記憶装置 |
JP5459999B2 (ja) | 2008-08-08 | 2014-04-02 | 株式会社東芝 | 不揮発性半導体記憶素子、不揮発性半導体装置及び不揮発性半導体素子の動作方法 |
JP5305856B2 (ja) * | 2008-11-19 | 2013-10-02 | 株式会社東芝 | 不揮発性半導体メモリ |
US8055816B2 (en) * | 2009-04-09 | 2011-11-08 | Micron Technology, Inc. | Memory controllers, memory systems, solid state drives and methods for processing a number of commands |
JP2011008857A (ja) * | 2009-06-25 | 2011-01-13 | Toshiba Corp | 不揮発性半導体記憶装置およびその書き込み方法 |
KR101682660B1 (ko) | 2010-06-28 | 2016-12-06 | 삼성전자주식회사 | 불휘발성 메모리 장치, 그것의 읽기 방법, 그리고 그것을 포함하는 메모리 시스템 |
US9230665B2 (en) | 2010-09-24 | 2016-01-05 | Kabushiki Kaisha Toshiba | Nonvolatile semiconductor memory device |
JP2011060415A (ja) * | 2010-10-29 | 2011-03-24 | Renesas Electronics Corp | 不揮発性半導体記憶装置及びデータ記憶システム |
KR20140043710A (ko) | 2010-12-14 | 2014-04-10 | 쌘디스크 3디 엘엘씨 | 로우 선택을 위한 3 디바이스 드라이버를 갖는 삼차원 비휘발성 저장 |
JP5537508B2 (ja) | 2011-07-08 | 2014-07-02 | 株式会社東芝 | 半導体記憶装置 |
JP5547148B2 (ja) * | 2011-09-13 | 2014-07-09 | 株式会社東芝 | メモリデバイス |
JP5323170B2 (ja) * | 2011-12-05 | 2013-10-23 | ウィンボンド エレクトロニクス コーポレーション | 不揮発性半導体メモリおよびそのデータの読出し方法 |
-
2013
- 2013-08-19 CN CN201380033765.9A patent/CN104641418B/zh active Active
- 2013-08-19 SG SG11201507090PA patent/SG11201507090PA/en unknown
- 2013-08-19 JP JP2014551861A patent/JP5866032B2/ja active Active
- 2013-08-19 WO PCT/JP2013/072125 patent/WO2015025357A1/ja active Application Filing
-
2015
- 2015-09-02 US US14/843,878 patent/US9799406B2/en active Active
- 2015-11-18 HK HK15111373.7A patent/HK1210647A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2015025357A1 (ja) | 2015-02-26 |
US20150380097A1 (en) | 2015-12-31 |
US9799406B2 (en) | 2017-10-24 |
CN104641418B (zh) | 2018-09-28 |
JP5866032B2 (ja) | 2016-02-17 |
SG11201507090PA (en) | 2015-10-29 |
JPWO2015025357A1 (ja) | 2017-03-02 |
CN104641418A (zh) | 2015-05-20 |
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