EP3504728A4 - Capacitive-coupled non-volatile thin-film transistor strings in three dimensional arrays - Google Patents
Capacitive-coupled non-volatile thin-film transistor strings in three dimensional arrays Download PDFInfo
- Publication number
- EP3504728A4 EP3504728A4 EP17844550.8A EP17844550A EP3504728A4 EP 3504728 A4 EP3504728 A4 EP 3504728A4 EP 17844550 A EP17844550 A EP 17844550A EP 3504728 A4 EP3504728 A4 EP 3504728A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- capacitive
- film transistor
- dimensional arrays
- coupled non
- transistor strings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003491 array Methods 0.000 title 1
- 239000010409 thin film Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/20—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/08—Address circuits; Decoders; Word-line control circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78618—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/20—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
- H01L2924/143—Digital devices
- H01L2924/1434—Memory
- H01L2924/1435—Random access memory [RAM]
- H01L2924/1443—Non-volatile random-access memory [NVRAM]
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/248,420 US10121553B2 (en) | 2015-09-30 | 2016-08-26 | Capacitive-coupled non-volatile thin-film transistor NOR strings in three-dimensional arrays |
PCT/US2017/048768 WO2018039654A1 (en) | 2016-08-26 | 2017-08-25 | Capacitive-coupled non-volatile thin-film transistor strings in three dimensional arrays |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3504728A1 EP3504728A1 (en) | 2019-07-03 |
EP3504728A4 true EP3504728A4 (en) | 2020-09-09 |
Family
ID=61246301
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP17844550.8A Pending EP3504728A4 (en) | 2016-08-26 | 2017-08-25 | Capacitive-coupled non-volatile thin-film transistor strings in three dimensional arrays |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP3504728A4 (en) |
JP (2) | JP7089505B2 (en) |
KR (2) | KR102626193B1 (en) |
CN (1) | CN109863575B (en) |
WO (1) | WO2018039654A1 (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7203054B2 (en) * | 2017-06-20 | 2023-01-12 | サンライズ メモリー コーポレイション | Three-dimensional NOR-type memory array architecture and method of manufacturing the same |
CN113169170A (en) * | 2018-12-04 | 2021-07-23 | 日升存储公司 | Method for forming multi-layer horizontal NOR type thin film memory string |
TWI764128B (en) | 2019-04-09 | 2022-05-11 | 美商森恩萊斯記憶體公司 | Quasi-volatile memory device with a back-channel usage |
KR20220031033A (en) * | 2019-07-09 | 2022-03-11 | 선라이즈 메모리 코포레이션 | Process for 3D Array of Horizontal NOR-type Memory Strings |
CN113302738B (en) * | 2019-09-10 | 2024-02-09 | 铠侠股份有限公司 | Memory device |
KR20210036535A (en) * | 2019-09-26 | 2021-04-05 | 에스케이하이닉스 주식회사 | Semiconductor device |
US11580038B2 (en) * | 2020-02-07 | 2023-02-14 | Sunrise Memory Corporation | Quasi-volatile system-level memory |
CN111326864B (en) * | 2020-03-13 | 2021-06-18 | 天津大学 | Coupling differential feed double compression mode patch antenna and solar cell integration |
JP2021150486A (en) | 2020-03-19 | 2021-09-27 | キオクシア株式会社 | Semiconductor storage device |
US11653500B2 (en) * | 2020-06-25 | 2023-05-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Memory array contact structures |
CN112909015B (en) * | 2021-03-08 | 2023-10-17 | 中国科学院微电子研究所 | NOR type memory device, method of manufacturing the same, and electronic apparatus including the same |
KR102429142B1 (en) * | 2021-07-22 | 2022-08-03 | 란데몬 에스피. 제트 오.오. | Method and apparatus for highly effective on-chip true random number generator utilizing beta decay |
CN113782070A (en) * | 2021-09-02 | 2021-12-10 | 西安紫光国芯半导体有限公司 | Self-powered nonvolatile programmable chip and storage device |
WO2023112236A1 (en) * | 2021-12-16 | 2023-06-22 | キオクシア株式会社 | Semiconductor memory device |
WO2024060021A1 (en) * | 2022-09-20 | 2024-03-28 | 华为技术有限公司 | Three-dimensional memory array, memory, and electronic device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20120085591A (en) * | 2011-01-24 | 2012-08-01 | 김진선 | Non-volatile memory device, method of operating the same, and method of fabricating the same |
US20160086970A1 (en) * | 2014-09-23 | 2016-03-24 | Haibing Peng | Three-dimensional non-volatile nor-type flash memory |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5525529A (en) * | 1994-11-16 | 1996-06-11 | Texas Instruments Incorporated | Method for reducing dopant diffusion |
JP3543905B2 (en) * | 1997-03-19 | 2004-07-21 | シャープ株式会社 | Semiconductor storage device |
US6363389B1 (en) * | 1998-09-24 | 2002-03-26 | International Business Machines Corporation | Technique for creating a unique quasi-random row identifier |
JP2000285016A (en) * | 1999-03-30 | 2000-10-13 | Sanyo Electric Co Ltd | Memory control circuit |
JP2000339978A (en) * | 1999-05-24 | 2000-12-08 | Sony Corp | Nonvolatile semiconductor memory device and its reading method |
US7312505B2 (en) * | 2004-03-31 | 2007-12-25 | Intel Corporation | Semiconductor substrate with interconnections and embedded circuit elements |
US7315916B2 (en) | 2004-12-16 | 2008-01-01 | Sandisk Corporation | Scratch pad block |
US7450433B2 (en) * | 2004-12-29 | 2008-11-11 | Sandisk Corporation | Word line compensation in non-volatile memory erase operations |
JP2006252624A (en) * | 2005-03-09 | 2006-09-21 | Toshiba Corp | Semiconductor memory device |
JP2007280505A (en) * | 2006-04-06 | 2007-10-25 | Toshiba Corp | Semiconductor memory device |
JP2008276858A (en) | 2007-04-27 | 2008-11-13 | Spansion Llc | Nonvolatile storage device and bias control method therefor |
KR101391881B1 (en) * | 2007-10-23 | 2014-05-07 | 삼성전자주식회사 | Multi-bit flash memory device and program and read methods thereof |
JP2009206451A (en) * | 2008-02-29 | 2009-09-10 | Toshiba Corp | Nonvolatile semiconductor storage device and manufacturing method thereof |
KR101559868B1 (en) * | 2008-02-29 | 2015-10-14 | 삼성전자주식회사 | .Vertical type semiconductor device and method for manufacturing the same |
US7898857B2 (en) * | 2008-03-20 | 2011-03-01 | Micron Technology, Inc. | Memory structure having volatile and non-volatile memory portions |
JP6006911B2 (en) | 2008-10-30 | 2016-10-12 | ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. | Semiconductor memory device |
KR20100059655A (en) * | 2008-11-25 | 2010-06-04 | 삼성전자주식회사 | Three-dimensional semiconductor device and method of operating the same |
US8148763B2 (en) | 2008-11-25 | 2012-04-03 | Samsung Electronics Co., Ltd. | Three-dimensional semiconductor devices |
KR101532366B1 (en) * | 2009-02-25 | 2015-07-01 | 삼성전자주식회사 | Semiconductor memory devices |
JP2010251572A (en) * | 2009-04-16 | 2010-11-04 | Toshiba Corp | Nonvolatile semiconductor storage device |
JP2011028540A (en) | 2009-07-27 | 2011-02-10 | Renesas Electronics Corp | Information processing system, method for controlling cache memory, program and compiler |
KR101137929B1 (en) * | 2010-05-31 | 2012-05-09 | 에스케이하이닉스 주식회사 | Nonvolatile memory device and method for manufacturing the same |
US8603890B2 (en) * | 2010-06-19 | 2013-12-10 | Sandisk Technologies Inc. | Air gap isolation in non-volatile memory |
US8527695B2 (en) | 2011-07-29 | 2013-09-03 | The Boeing Company | System for updating an associative memory |
KR102072449B1 (en) * | 2012-06-01 | 2020-02-04 | 삼성전자주식회사 | Storage device including non-volatile memory device and repair method thereof |
CN104641418B (en) | 2013-08-19 | 2018-09-28 | 东芝存储器株式会社 | Storage system |
JP6431536B2 (en) | 2013-10-21 | 2018-11-28 | マーベル インターナショナル リミテッド | Final level cache system and corresponding method |
CN105870121B (en) * | 2014-12-28 | 2018-09-21 | 苏州诺存微电子有限公司 | Three dimensional nonvolatile NOR type flash memory |
US9356105B1 (en) * | 2014-12-29 | 2016-05-31 | Macronix International Co., Ltd. | Ring gate transistor design for flash memory |
-
2017
- 2017-08-25 KR KR1020237009566A patent/KR102626193B1/en active IP Right Grant
- 2017-08-25 KR KR1020197008535A patent/KR102513489B1/en active IP Right Grant
- 2017-08-25 JP JP2019511578A patent/JP7089505B2/en active Active
- 2017-08-25 EP EP17844550.8A patent/EP3504728A4/en active Pending
- 2017-08-25 WO PCT/US2017/048768 patent/WO2018039654A1/en unknown
- 2017-08-25 CN CN201780065559.4A patent/CN109863575B/en active Active
-
2022
- 2022-06-10 JP JP2022094508A patent/JP7379593B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20120085591A (en) * | 2011-01-24 | 2012-08-01 | 김진선 | Non-volatile memory device, method of operating the same, and method of fabricating the same |
US20160086970A1 (en) * | 2014-09-23 | 2016-03-24 | Haibing Peng | Three-dimensional non-volatile nor-type flash memory |
Also Published As
Publication number | Publication date |
---|---|
EP3504728A1 (en) | 2019-07-03 |
JP2019526934A (en) | 2019-09-19 |
CN109863575A (en) | 2019-06-07 |
JP7089505B2 (en) | 2022-06-22 |
JP2022123017A (en) | 2022-08-23 |
KR102513489B1 (en) | 2023-03-23 |
CN109863575B (en) | 2024-01-30 |
WO2018039654A1 (en) | 2018-03-01 |
KR20230042417A (en) | 2023-03-28 |
JP7379593B2 (en) | 2023-11-14 |
KR102626193B1 (en) | 2024-01-18 |
WO2018039654A4 (en) | 2018-04-19 |
KR20190057065A (en) | 2019-05-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3504728A4 (en) | Capacitive-coupled non-volatile thin-film transistor strings in three dimensional arrays | |
EP3635782A4 (en) | Memory arrays | |
EP3635783A4 (en) | Memory arrays | |
EP3161832A4 (en) | Reference architecture in a cross-point memory | |
EP3432688A4 (en) | Organic electroluminescence element | |
EP3392655A4 (en) | Immunochromatographic kit | |
EP3114781A4 (en) | Antenna array self-calibration | |
EP3152663A4 (en) | Transparent array migration | |
GB201705910D0 (en) | Thin-film transistor array substrate | |
EP3109942A4 (en) | Array antenna | |
EP3563166A4 (en) | Antenna arrays | |
EP3172765A4 (en) | Through array routing for non-volatile memory | |
EP3468667A4 (en) | Trajectory optimization in radiotherapy using sectioning | |
EP2943959A4 (en) | Nonvolatile memory array logic | |
EP3458678A4 (en) | Multi-spacing array tool | |
EP3066571A4 (en) | Cache memory budgeted by ways on memory access type | |
EP3465291A4 (en) | Microlens array diffusers | |
EP3507808A4 (en) | Memory arrays | |
EP3546337A4 (en) | Floating structure | |
EP3265848A4 (en) | Three dimensional antenna with floating fence | |
EP3685439A4 (en) | Three dimensional memory arrays | |
EP3545623A4 (en) | Transistor cell | |
EP3268864A4 (en) | High performance non-volatile memory module | |
EP3367943A4 (en) | Foldable 2-d cmut-on-cmos arrays | |
EP3338373A4 (en) | Artificially mutual-coupled antenna arrays |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
|
17P | Request for examination filed |
Effective date: 20190325 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
AX | Request for extension of the european patent |
Extension state: BA ME |
|
DAV | Request for validation of the european patent (deleted) | ||
DAX | Request for extension of the european patent (deleted) | ||
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R079 Free format text: PREVIOUS MAIN CLASS: H01L0021020000 Ipc: H01L0027115780 |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20200812 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: G11C 11/34 20060101ALI20200806BHEP Ipc: H01L 27/11568 20170101ALI20200806BHEP Ipc: H01L 29/792 20060101ALI20200806BHEP Ipc: H01L 27/11578 20170101AFI20200806BHEP Ipc: G11C 16/04 20060101ALI20200806BHEP Ipc: G11C 16/06 20060101ALI20200806BHEP |
|
RAP3 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: SUNRISE MEMORY CORPORATION |
|
P01 | Opt-out of the competence of the unified patent court (upc) registered |
Effective date: 20230426 |