HK1157048A1 - Conductive particle, anisotropic conductive film, joined structure, and joining method - Google Patents

Conductive particle, anisotropic conductive film, joined structure, and joining method

Info

Publication number
HK1157048A1
HK1157048A1 HK11110092A HK11110092A HK1157048A1 HK 1157048 A1 HK1157048 A1 HK 1157048A1 HK 11110092 A HK11110092 A HK 11110092A HK 11110092 A HK11110092 A HK 11110092A HK 1157048 A1 HK1157048 A1 HK 1157048A1
Authority
HK
Hong Kong
Prior art keywords
joining method
joined structure
conductive film
anisotropic conductive
conductive particle
Prior art date
Application number
HK11110092A
Other languages
English (en)
Inventor
Tomoyuki Ishimatsu
Hiroki Ozeki
Hiroshi Hamachi
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of HK1157048A1 publication Critical patent/HK1157048A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/04—Processes of manufacture in general
    • H01M4/0402—Methods of deposition of the material
    • H01M4/0407—Methods of deposition of the material by coating on an electrolyte layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
HK11110092A 2008-07-24 2011-09-23 Conductive particle, anisotropic conductive film, joined structure, and joining method HK1157048A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008191098A JP5430093B2 (ja) 2008-07-24 2008-07-24 導電性粒子、異方性導電フィルム、及び接合体、並びに、接続方法
PCT/JP2009/061176 WO2010010768A1 (ja) 2008-07-24 2009-06-19 導電性粒子、異方性導電フィルム、及び接合体、並びに、接続方法

Publications (1)

Publication Number Publication Date
HK1157048A1 true HK1157048A1 (en) 2012-06-22

Family

ID=41570234

Family Applications (1)

Application Number Title Priority Date Filing Date
HK11110092A HK1157048A1 (en) 2008-07-24 2011-09-23 Conductive particle, anisotropic conductive film, joined structure, and joining method

Country Status (7)

Country Link
US (1) US8395052B2 (xx)
JP (1) JP5430093B2 (xx)
KR (1) KR101592057B1 (xx)
CN (1) CN102089832B (xx)
HK (1) HK1157048A1 (xx)
TW (1) TWI502608B (xx)
WO (1) WO2010010768A1 (xx)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011132647A1 (ja) 2010-04-19 2011-10-27 日東電工株式会社 フリップチップ型半導体裏面用フィルム
JP5619675B2 (ja) * 2010-08-16 2014-11-05 株式会社日本触媒 導電性微粒子および異方性導電材料
KR101695353B1 (ko) * 2010-10-06 2017-01-11 삼성전자 주식회사 반도체 패키지 및 반도체 패키지 모듈
JP5653737B2 (ja) * 2010-12-08 2015-01-14 株式会社日本触媒 樹脂粒子およびこれを用いた絶縁化導電性粒子並びに異方性導電材料
KR101309821B1 (ko) 2010-12-31 2013-09-23 제일모직주식회사 이방 전도성 필름 조성물
JP5916334B2 (ja) * 2011-10-07 2016-05-11 デクセリアルズ株式会社 異方性導電接着剤及びその製造方法、発光装置及びその製造方法
WO2013069919A1 (ko) * 2011-11-09 2013-05-16 제일모직 주식회사 디스플레이 패널 및 이를 포함하는 디스플레이 장치
KR101151366B1 (ko) 2011-11-24 2012-06-08 한화케미칼 주식회사 도전성 입자 및 이의 제조방법
KR101941721B1 (ko) * 2011-12-21 2019-01-23 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 도전 재료 및 접속 구조체
JP6049461B2 (ja) * 2011-12-21 2016-12-21 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
TWI467718B (zh) 2011-12-30 2015-01-01 Ind Tech Res Inst 凸塊結構以及電子封裝接點結構及其製造方法
JP6066734B2 (ja) * 2012-01-20 2017-01-25 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6245792B2 (ja) 2012-03-29 2017-12-13 デクセリアルズ株式会社 導電性粒子、回路接続材料、実装体、及び実装体の製造方法
JP5941328B2 (ja) * 2012-04-10 2016-06-29 日本化学工業株式会社 導電性粒子及びそれを含む導電性材料
JP5973257B2 (ja) * 2012-07-03 2016-08-23 日本化学工業株式会社 導電性粒子及びそれを含む導電性材料
JP5636118B2 (ja) * 2012-10-02 2014-12-03 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP2014096531A (ja) * 2012-11-12 2014-05-22 Dexerials Corp 接続構造体の製造方法及び接続方法
WO2014088095A1 (ja) * 2012-12-06 2014-06-12 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
KR101298101B1 (ko) * 2012-12-26 2013-08-20 덕산하이메탈(주) 도전입자, 이를 포함하는 도전 재료
CN104704579B (zh) * 2013-01-24 2018-09-28 积水化学工业株式会社 基材粒子、导电性粒子、导电材料及连接结构体
JP5985414B2 (ja) * 2013-02-19 2016-09-06 デクセリアルズ株式会社 異方性導電接着剤、発光装置及び異方性導電接着剤の製造方法
KR20140128739A (ko) 2013-04-29 2014-11-06 삼성디스플레이 주식회사 도전성 입자 및 이를 포함하는 표시 장치
JP6581330B2 (ja) * 2013-06-13 2019-09-25 アクゾ ノーベル コーティングス インターナショナル ビー ヴィ 塗料組成物及びこれを塗装して得られる塗膜
JP5695768B2 (ja) * 2014-02-04 2015-04-08 日本化学工業株式会社 導電性粉体及びそれを含む導電性材料
JP5975054B2 (ja) * 2014-03-10 2016-08-23 日立化成株式会社 導電粒子、異方導電性接着剤、接続構造体及び導電粒子の製造方法
JP2015195178A (ja) * 2014-03-26 2015-11-05 デクセリアルズ株式会社 導電性粒子、導電性接着剤、接続体の製造方法、電子部品の接続方法、及び接続体
WO2015151874A1 (ja) * 2014-03-31 2015-10-08 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
CN106233396B (zh) * 2014-05-12 2018-05-04 积水化学工业株式会社 导电性粒子、导电材料及连接结构体
JP6337630B2 (ja) * 2014-06-12 2018-06-06 日立化成株式会社 回路接続材料及び回路接続構造体
JP6379761B2 (ja) * 2014-07-09 2018-08-29 日立化成株式会社 導電粒子、絶縁被覆導電粒子、異方導電性接着剤、接続構造体及び導電粒子の製造方法
JP6567921B2 (ja) * 2014-08-29 2019-08-28 Ｄｏｗａエレクトロニクス株式会社 銀被覆銅粉およびその製造方法
JP2016089153A (ja) * 2014-10-29 2016-05-23 デクセリアルズ株式会社 導電材料
WO2016068165A1 (ja) * 2014-10-29 2016-05-06 デクセリアルズ株式会社 導電材料
JP6888903B2 (ja) * 2014-11-04 2021-06-18 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
US10875095B2 (en) * 2015-03-19 2020-12-29 Murata Manufacturing Co., Ltd. Electronic component comprising magnetic metal powder
JP2017059471A (ja) * 2015-09-18 2017-03-23 デクセリアルズ株式会社 接続材料
CN106125410B (zh) * 2016-06-28 2019-08-02 京东方科技集团股份有限公司 导电球及其制备方法、各向异性导电胶、显示装置
KR20190035735A (ko) * 2016-08-08 2019-04-03 세키스이가가쿠 고교가부시키가이샤 도통 검사 장치용 부재 및 도통 검사 장치
US9942986B1 (en) * 2016-09-23 2018-04-10 Apple Inc. System with field-assisted conductive adhesive bonds
CN107393633A (zh) * 2017-06-26 2017-11-24 张家港康得新光电材料有限公司 导电金属球及3d显示装置
WO2019059266A1 (ja) * 2017-09-20 2019-03-28 積水化学工業株式会社 金属含有粒子、接続材料、接続構造体、接続構造体の製造方法、導通検査用部材及び導通検査装置
KR102438492B1 (ko) * 2017-11-06 2022-08-30 에스케이온 주식회사 전극 구조체 및 이를 포함하는 이차 전지
US20190355277A1 (en) 2018-05-18 2019-11-21 Aidmics Biotechnology (Hk) Co., Limited Hand-made circuit board
US11311934B2 (en) * 2018-07-10 2022-04-26 Nippon Chemical Industrial Co., Ltd. Covered particle
CN111383793B (zh) * 2018-12-31 2021-10-26 德山金属株式会社 导电粒子、导电材料以及接触结构体
KR102364813B1 (ko) * 2020-03-09 2022-02-17 성균관대학교산학협력단 투명 유연성 박막 및 이의 제조 방법
CN113448127A (zh) * 2021-06-30 2021-09-28 Tcl华星光电技术有限公司 一种导电球及显示面板
KR102612482B1 (ko) * 2021-11-16 2023-12-11 덕산네오룩스 주식회사 도전입자, 도전재료 및 접속 구조체

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5183594A (en) * 1988-08-29 1993-02-02 Matsushita Electric Industrial Co., Ltd. Conductive resin composition containing zinc oxide whiskers having a tetrapod structure
JPH0353253A (ja) * 1989-07-21 1991-03-07 Fuji Photo Film Co Ltd 静電記録フイルム
JPH0652715A (ja) * 1992-07-30 1994-02-25 Fuji Kobunshi Kogyo Kk 異方導電性接着剤組成物
US5618394A (en) * 1996-01-16 1997-04-08 Patterson; James A. System and electrolytic cell having inert spherical core catalytic elements for heating a liquid electrolyte
DE19650300A1 (de) * 1996-12-04 1998-06-10 Gerd Hugo Anstrichstoff
KR20050084537A (ko) * 1997-04-17 2005-08-26 세키스이가가쿠 고교가부시키가이샤 도전성 미립자의 제조장치
US6120885A (en) * 1997-07-10 2000-09-19 International Business Machines Corporation Structure, materials, and methods for socketable ball grid
US6322685B1 (en) * 1998-05-13 2001-11-27 International Business Machines Corporation Apparatus and method for plating coatings on to fine powder materials and use of the powder therefrom
WO2000024941A1 (en) * 1998-10-27 2000-05-04 Clinical Micro Sensors, Inc. Detection of target analytes using particles and electrodes
JP3696429B2 (ja) * 1999-02-22 2005-09-21 日本化学工業株式会社 導電性無電解めっき粉体とその製造方法並びに該めっき粉体からなる導電性材料
US6372376B1 (en) * 1999-12-07 2002-04-16 General Motors Corporation Corrosion resistant PEM fuel cell
JP2002025345A (ja) * 2000-07-05 2002-01-25 Nisshin Steel Co Ltd 耐マイグレーション性に優れた導電性粒子
US6352775B1 (en) * 2000-08-01 2002-03-05 Takeda Chemical Industries, Ltd. Conductive, multilayer-structured resin particles and anisotropic conductive adhesives using the same
TWI334880B (en) * 2000-12-28 2010-12-21 Hitachi Chemical Co Ltd Circuit connecting adhesive with anisotropic conductivity connecting method of circuit board and circuit connecting construction by using the adhesive
JP4814476B2 (ja) * 2001-04-20 2011-11-16 Ｔｄｋ株式会社 光情報媒体の再生方法
GB0204430D0 (en) * 2002-02-26 2002-04-10 Leuven K U Res & Dev Magnet
US7183891B2 (en) * 2002-04-08 2007-02-27 Littelfuse, Inc. Direct application voltage variable material, devices employing same and methods of manufacturing such devices
JP3940638B2 (ja) * 2002-06-10 2007-07-04 積水化学工業株式会社 導電性微粒子及び導電性微粒子の製造方法
AU2003298904A1 (en) 2002-12-05 2004-06-30 Surfect Technologies, Inc. Coated and magnetic particles and applications thereof
EP2282374A1 (en) * 2003-06-25 2011-02-09 Hitachi Chemical Company, Ltd. Circuit material
JP5247968B2 (ja) * 2003-12-02 2013-07-24 日立化成株式会社 回路接続材料、及びこれを用いた回路部材の接続構造
US20100025089A1 (en) * 2004-01-07 2010-02-04 Jun Taketatsu Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof
JP2007324138A (ja) * 2004-01-30 2007-12-13 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料
CN1906705B (zh) * 2004-01-30 2010-04-21 积水化学工业株式会社 导电性微粒和各向异性导电材料
EP1754762A4 (en) * 2004-06-09 2009-07-22 Hitachi Chemical Co Ltd ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING CONSTRUCTION FOR CIRCUIT ELEMENT AND SEMICONDUCTOR DEVICE
WO2006104279A1 (en) * 2005-03-31 2006-10-05 Fujifilm Corporation Surface graft material and its manufacturing method, electrically conductive material and its manufacturing method, and electrically conductive pattern material
US20060257555A1 (en) * 2005-05-12 2006-11-16 Brady Brian K Sub-layer for adhesion promotion of fuel cell bipolar plate coatings
KR100720895B1 (ko) * 2005-07-05 2007-05-22 제일모직주식회사 농도 구배를 갖는 이종(異種) 복합 금속층이 형성된 전도성미립자, 그 제조방법 및 이를 이용한 이방 전도성 접착제조성물
JP4718926B2 (ja) * 2005-07-29 2011-07-06 積水化学工業株式会社 導電性微粒子、及び、異方性導電材料
KR100732787B1 (ko) * 2005-10-14 2007-06-27 한화석유화학 주식회사 분산성 및 밀착성이 우수한 도전성 무전해 도금분체의제조방법
WO2007058142A1 (ja) * 2005-11-21 2007-05-24 Matsushita Electric Industrial Co., Ltd. 電子部品を実装した回路基板を製造する方法
KR100719802B1 (ko) * 2005-12-28 2007-05-18 제일모직주식회사 이방 전도 접속용 고신뢰성 전도성 미립자
US8133591B2 (en) * 2006-06-27 2012-03-13 GM Global Technology Operations LLC Adhesion of polymeric coatings to bipolar plate surfaces using silane coupling agents
US20080038871A1 (en) * 2006-08-10 2008-02-14 George Liang-Tai Chiu Multipath soldered thermal interface between a chip and its heat sink
FR2906160B1 (fr) * 2006-09-25 2009-06-05 Air Liquide Procede psa a lit d'adsorption composite forme d'un adsorbant et d'agglomerats de mcp
WO2008056458A1 (fr) * 2006-11-10 2008-05-15 Tohoku University Analyseur de gaz et méthode d'analyse de gaz
US20080152957A1 (en) * 2006-12-21 2008-06-26 Gm Global Technology Operations, Inc. Non-functional fuel cell for fuel cell stack
US7538413B2 (en) * 2006-12-28 2009-05-26 Micron Technology, Inc. Semiconductor components having through interconnects
JP5028619B2 (ja) * 2007-03-09 2012-09-19 国立大学法人 香川大学 パターン状の微粒子膜およびパターン状の微粒子膜の製造方法
JP5079396B2 (ja) * 2007-03-30 2012-11-21 富士フイルム株式会社 導電性物質吸着性樹脂フイルム、導電性物質吸着性樹脂フイルムの製造方法、それを用いた金属層付き樹脂フイルム、及び、金属層付き樹脂フイルムの製造方法
WO2008142070A2 (de) * 2007-05-24 2008-11-27 Basf Se Verfahren zur herstellung von polymerbeschichteten metallfolien sowie verwendung davon

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JP2010027569A (ja) 2010-02-04
JP5430093B2 (ja) 2014-02-26
CN102089832B (zh) 2014-03-26
WO2010010768A1 (ja) 2010-01-28
US20110088935A1 (en) 2011-04-21
TW201005760A (en) 2010-02-01
US8395052B2 (en) 2013-03-12
KR101592057B1 (ko) 2016-02-05

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