JP5636118B2 - 導電性粒子、導電材料及び接続構造体 - Google Patents
導電性粒子、導電材料及び接続構造体 Download PDFInfo
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- JP5636118B2 JP5636118B2 JP2013546501A JP2013546501A JP5636118B2 JP 5636118 B2 JP5636118 B2 JP 5636118B2 JP 2013546501 A JP2013546501 A JP 2013546501A JP 2013546501 A JP2013546501 A JP 2013546501A JP 5636118 B2 JP5636118 B2 JP 5636118B2
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- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
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Description
本発明に係る導電性粒子は、基材粒子と、該基材粒子の表面上の一部の領域に配置された導電材とを備える。上記導電材の材質が、ニッケルよりもモース硬度が高い材質である。
導電性粒子1は、複数の導電材4を備える。複数の導電材4が、基材粒子2の表面上の一部の領域に配置されており、導電層3内に埋め込まれている。導電材4は、基材粒子2の表面上の全ての領域に配置されていない。導電材4は、基材粒子2の表面全体を被覆していない。導電材4が基材粒子2の表面上の一部の領域に配置されているので、基材粒子2は、導電材4に接していない表面の領域を有する。導電材4は、突起3aの内側に配置されている。1つの突起3aの内側に1つの導電材4が配置されている。複数の導電材4により導電層3の外側の表面が隆起されており、複数の突起3aが形成されている。導電性粒子が複数の導電材を備えることで、導電性粒子の外側の表面に複数の突起を形成することが容易である。
導電材4は粒子である。導電材4が粒子であるため、基材粒子2の表面上の一部の領域に、導電材4が配置されている。
導電材4は、基材粒子2に接している。基材粒子の表面と導電材の表面との間に、導電層が配置されていてもよい。導電材が基材粒子に接しておらず、基材粒子の表面と導電材の表面とが距離を隔てていてもよい。
絶縁性物質5は、導電層3の表面上に配置されている。絶縁性物質5は絶縁性粒子である。絶縁性物質5は、絶縁性を有する材料により形成されている。導電性粒子は絶縁性物質を、必ずしも備えていなくてもよい。また、導電性粒子は、絶縁性物質として、絶縁粒子にかえて導電層の外側の表面を被覆している絶縁層を備えていてもよい。
図2は、本発明の第2の実施形態に係る導電性粒子を示す断面図である。
図2に示す導電性粒子11は、基材粒子2と、第1の導電層12と、第2の導電層13と、複数の導電材4と、複数の絶縁性物質5とを備える。
導電性粒子1と導電性粒子11とでは、導電層のみが異なっている。すなわち、導電性粒子1では、1層構造の導電層が形成されているのに対し、導電性粒子11では、2層構造の第1の導電層12及び第2の導電層13が形成されている。導電材4は、第1の導電層11及び導電層13内に埋め込まれている。
第1の導電層12は、基材粒子2の表面上に配置されている。基材粒子2と第2の導電層13との間に、第1の導電層12が配置されている。第1の導電層12は、基材粒子2側に位置しており、基材粒子2に接する導電層である。第2の導電層13は、基材粒子2側とは反対側に位置しており、基材粒子2に接していない。従って、基材粒子2の表面上に第1の導電層12が配置されており、第1の導電層12の表面上に第2の導電層13が配置されている。第2の導電層13は外表面に、複数の突起13aを有する。導電性粒子11は導電性の表面に、複数の突起11aを有する。
図3は、本発明の第3の実施形態に係る導電性粒子を示す断面図である。
図3に示す導電性粒子21は、基材粒子2と、導電層22と、複数の導電材4とを備える。導電層22は、基材粒子2の表面上に配置されている。導電材4は、導電層22内に埋め込まれている。
導電性粒子21は表面に突起を有さない。導電性粒子21は球状である。導電層22は外側の表面に突起を有さない。このように、本発明に係る導電性粒子は突起を有していなくてもよく、球状であってもよい。また、導電性粒子21は、絶縁性物質を有さない。但し、導電性粒子21は、導電層22の表面上に配置された絶縁性物質を備えていてもよい。
以下、導電性粒子をより詳細に説明する。
[基材粒子]
上記基材粒子としては、樹脂粒子、金属粒子を除く無機粒子、有機無機ハイブリッド粒子及び金属粒子等が挙げられる。なかでも、金属粒子を除く基材粒子が好ましく、樹脂粒子、金属粒子を除く無機粒子又は有機無機ハイブリッド粒子がより好ましい。
上記樹脂粒子を形成するための樹脂として、種々の有機物が好適に用いられる。上記樹脂粒子を形成するための樹脂としては、例えば、ポリエチレン、ポリプロピレン、ポリスチレン、ポリ塩化ビニル、ポリ塩化ビニリデン、ポリイソブチレン、ポリブタジエン等のポリオレフィン樹脂;ポリメチルメタクリレート及びポリメチルアクリレート等のアクリル樹脂;ポリアルキレンテレフタレート、ポリカーボネート、ポリアミド、フェノールホルムアルデヒド樹脂、メラミンホルムアルデヒド樹脂、ベンゾグアナミンホルムアルデヒド樹脂、尿素ホルムアルデヒド樹脂、フェノール樹脂、メラミン樹脂、ベンゾグアナミン樹脂、尿素樹脂、エポキシ樹脂、不飽和ポリエステル樹脂、飽和ポリエステル樹脂、ポリエチレンテレフタレート、ポリスルホン、ポリフェニレンオキサイド、ポリアセタール、ポリイミド、ポリアミドイミド、ポリエーテルエーテルケトン、ポリエーテルスルホン、ジビニルベンゼン重合体、並びにジビニルベンゼン系共重合体等が挙げられる。上記ジビニルベンゼン系共重合体等としては、ジビニルベンゼン−スチレン共重合体及びジビニルベンゼン−(メタ)アクリル酸エステル共重合体等が挙げられる。上記樹脂粒子の硬度を好適な範囲に容易に制御できるので、上記樹脂粒子を形成するための樹脂は、エチレン性不飽和基を有する重合性単量体を1種又は2種以上重合させた重合体であることが好ましい。
上記樹脂粒子を、エチレン性不飽和基を有する単量体を重合させて得る場合には、該エチレン性不飽和基を有する単量体としては、非架橋性の単量体と架橋性の単量体とが挙げられる。
上記非架橋性の単量体としては、例えば、スチレン、α−メチルスチレン等のスチレン系単量体;(メタ)アクリル酸、マレイン酸、無水マレイン酸等のカルボキシル基含有単量体;メチル(メタ)アクリレート、エチル(メタ)アクリレート、プロピル(メタ)アクリレート、ブチル(メタ)アクリレート、2−エチルヘキシル(メタ)アクリレート、ラウリル(メタ)アクリレート、セチル(メタ)アクリレート、ステアリル(メタ)アクリレート、シクロヘキシル(メタ)アクリレート、イソボルニル(メタ)アクリレート等のアルキル(メタ)アクリレート類;2−ヒドロキシエチル(メタ)アクリレート、グリセロール(メタ)アクリレート、ポリオキシエチレン(メタ)アクリレート、グリシジル(メタ)アクリレート等の酸素原子含有(メタ)アクリレート類;(メタ)アクリロニトリル等のニトリル含有単量体;メチルビニルエーテル、エチルビニルエーテル、プロピルビニルエーテル等のビニルエーテル類;酢酸ビニル、酪酸ビニル、ラウリン酸ビニル、ステアリン酸ビニル等の酸ビニルエステル類;エチレン、プロピレン、イソプレン、ブタジエン等の不飽和炭化水素;トリフルオロメチル(メタ)アクリレート、ペンタフルオロエチル(メタ)アクリレート、塩化ビニル、フッ化ビニル、クロルスチレン等のハロゲン含有単量体等が挙げられる。
上記架橋性の単量体としては、例えば、テトラメチロールメタンテトラ(メタ)アクリレート、テトラメチロールメタントリ(メタ)アクリレート、テトラメチロールメタンジ(メタ)アクリレート、トリメチロールプロパントリ(メタ)アクリレート、ジペンタエリスリトールヘキサ(メタ)アクリレート、ジペンタエリスリトールペンタ(メタ)アクリレート、グリセロールトリ(メタ)アクリレート、グリセロールジ(メタ)アクリレート、(ポリ)エチレングリコールジ(メタ)アクリレート、(ポリ)プロピレングリコールジ(メタ)アクリレート、(ポリ)テトラメチレングリコールジ(メタ)アクリレート、1,4−ブタンジオールジ(メタ)アクリレート等の多官能(メタ)アクリレート類;トリアリル(イソ)シアヌレート、トリアリルトリメリテート、ジビニルベンゼン、ジアリルフタレート、ジアリルアクリルアミド、ジアリルエーテル、γ−(メタ)アクリロキシプロピルトリメトキシシラン、トリメトキシシリルスチレン、ビニルトリメトキシシラン等のシラン含有単量体等が挙げられる。
本発明に係る導電性粒子は、基材粒子の表面上に配置されている導電層を有する。
本発明に係る導電性粒子は、基材粒子の表面上に配置された導電材を備える。該導電材の材質は、モリブデン(Mo)(モース硬度5.5)、タングステン(W)(モース硬度7.5)、炭化タングステン(WC)(モース硬度9)、炭化チタン(TiC)(モース硬度9)、又は炭化タンタル(TaC)(モース硬度9)であることが好ましい。導電性粒子が、この特定の材質の導電材を備えることで、導電性粒子の導電性の表面が十分に硬くなって、電極間の接続抵抗をかなり低くすることができる。上記導電材の材質のモース硬度は、ニッケル(Ni)(モース硬度5.0)のモース硬度よりも高い。上記導電材の材質は、炭化タングステン又は炭化タンタルであることが好ましい。上記導電材の材質は、モリブデンであることが好ましく、タングステンであることが好ましく、炭化タングステンであることが好ましく、炭化チタンであることが好ましく、炭化タンタルであることが好ましい。
本発明に係る導電性粒子は、上記導電層の表面上に配置された絶縁性物質を備えることが好ましい。この場合には、導電性粒子を電極間の接続に用いると、隣接する電極間の短絡をより一層防止できる。具体的には、複数の導電性粒子が接触したときに、複数の電極間に絶縁性物質が存在するので、上下の電極間ではなく横方向に隣り合う電極間の短絡を防止できる。なお、電極間の接続の際に、2つの電極で導電性粒子を加圧することにより、導電性粒子の導電層と電極との間の絶縁性物質を容易に排除できる。導電性粒子が導電層の外側の表面に複数の突起を有する場合には、導電性粒子の導電層と電極との間の絶縁性物質を容易に排除できる。
本発明に係る導電材料は、上述した導電性粒子と、バインダー樹脂とを含む。本発明に係る導電性粒子は、バインダー樹脂中に分散され、導電材料として用いられることが好ましい。上記導電材料は、異方性導電材料であることが好ましい。
本発明の導電性粒子を用いて、又は該導電性粒子とバインダー樹脂とを含む導電材料を用いて、接続対象部材を接続することにより、接続構造体を得ることができる。
(1)パラジウム付着工程
粒子径が3.0μmであるジビニルベンゼン樹脂粒子(積水化学工業社製「ミクロパールSP−205」)を用意した。この樹脂粒子をエッチングし、水洗した。次に、パラジウム触媒を8重量%含むパラジウム触媒化液100mL中に樹脂粒子を添加し、攪拌した。その後、ろ過し、洗浄した。pH6の0.5重量%ジメチルアミンボラン液に樹脂粒子を添加し、パラジウムが付着した樹脂粒子を得た。
パラジウムが付着した樹脂粒子をイオン交換水400mL中で3分間攪拌し、分散させ、分散液を得た。次に、炭化タングステン粒子(平均粒子径100nm)を5重量%含むスラリー400gを、得られた分散液に3分間かけて添加し、導電材が付着した樹脂粒子を含む懸濁液を得た。
硫酸ニッケル0.23mol/L、ジメチルアミンボラン0.92mol/L、及びクエン酸ナトリウム0.5mol/Lを含むニッケルめっき液(pH8.5)を用意した。
炭化タングステン粒子(平均粒子径100nm)を、タングステン粒子(平均粒子径100nm)に変更したこと以外は実施例1と同様にして、導電性粒子を得た。
炭化タングステン粒子(平均粒子径100nm)を、炭化タンタル粒子(平均粒子径100nm)に変更したこと以外は実施例1と同様にして、導電性粒子を得た。
炭化タングステン粒子(平均粒子径100nm)をを、モリブデン粒子(平均粒子径100nm)に変更したこと以外は実施例1と同様にして、導電性粒子を得た。
(1)絶縁性粒子の作製
4ツ口セパラブルカバー、攪拌翼、三方コック、冷却管及び温度プローブが取り付けられた1000mLのセパラブルフラスコに、メタクリル酸メチル100mmolと、N,N,N−トリメチル−N−2−メタクリロイルオキシエチルアンモニウムクロライド1mmolと、2,2’−アゾビス(2−アミジノプロパン)二塩酸塩1mmolとを含むモノマー組成物を固形分率が5重量%となるようにイオン交換水に秤取した後、200rpmで攪拌し、窒素雰囲気下70℃で24時間重合を行った。反応終了後、凍結乾燥して、表面にアンモニウム基を有し、平均粒子径220nm及びCV値10%の絶縁性粒子を得た。
絶縁性粒子を超音波照射下でイオン交換水に分散させ、絶縁性粒子の10重量%水分散液を得た。
絶縁性粒子を付着させる前の実施例1で得られた導電性粒子を、実施例2で得られた導電性粒子に変更したこと以外は実施例5と同様にして、導電性粒子を得た。
絶縁性粒子を付着させる前の実施例1で得られた導電性粒子を、実施例3で得られた導電性粒子に変更したこと以外は実施例5と同様にして、導電性粒子を得た。
絶縁性粒子を付着させる前の実施例1で得られた導電性粒子を、実施例4で得られた導電性粒子に変更したこと以外は実施例5と同様にして、導電性粒子を得た。
実施例1で得られた導電性粒子10gを、イオン交換水500mLに添加し、超音波処理機により充分に分散させて、懸濁液を得た。この懸濁液を50℃で攪拌しながら、硫酸パラジウム0.02mol/L、錯化剤としてエチレンジアミン0.04mol/L、還元剤として蟻酸ナトリウム0.06mol/L及び結晶調整剤を含むpH10.0の無電解めっき液を用意した。
パラジウム層を形成する前の実施例1で得られた導電性粒子を、実施例2で得られた導電性粒子に変更したこと以外は実施例9と同様にして、導電性粒子を得た。
パラジウム層を形成する前の実施例1で得られた導電性粒子を、実施例3で得られた導電性粒子に変更したこと以外は実施例9と同様にして、導電性粒子を得た。
パラジウム層を形成する前の実施例1で得られた導電性粒子を、実施例4で得られた導電性粒子に変更したこと以外は実施例9と同様にして、導電性粒子を得た。
粒子径が3.0μmであるジビニルベンゼン樹脂粒子(積水化学工業社製「ミクロパールSP−203」)を、粒子径が2.5μmであるジビニルベンゼン樹脂粒子(積水化学工業社製「ミクロパールSP−2025」)に変更したこと以外は実施例1と同様にして、導電性粒子を得た。
(1)パラジウム付着工程
粒子径が3.0μmであるジビニルベンゼン樹脂粒子(積水化学工業社製「ミクロパールSP−203」)を用意した。この樹脂粒子をエッチングし、水洗した。次に、パラジウム触媒を8重量%含むパラジウム触媒化液100mL中に樹脂粒子を添加し、攪拌した。その後、ろ過し、洗浄した。pH6の0.5重量%ジメチルアミンボラン液に樹脂粒子を添加し、パラジウムが付着した樹脂粒子を得た。
パラジウムが付着した樹脂粒子をイオン交換水400mL中で3分間攪拌し、分散させ、分散液を得た。次に、炭化タングステン粒子(平均粒子径100nm)を5重量%含むスラリー400gを、得られた分散液に3分間かけて添加し、導電材が付着した樹脂粒子を含む懸濁液を得た。
硫酸ニッケル0.25mol/L、次亜リン酸ナトリウム0.25mol/L及びクエン酸ナトリウム0.15mol/Lを含むニッケルめっき液(pH9.0)を用意した。
(1)パラジウム付着工程
粒子径が3.0μmであるジビニルベンゼン樹脂粒子(積水化学工業社製「ミクロパールSP−203」)を用意した。この樹脂粒子をエッチングし、水洗した。次に、パラジウム触媒を8重量%含むパラジウム触媒化液100mL中に樹脂粒子を添加し、攪拌した。その後、ろ過し、洗浄した。pH6の0.5重量%ジメチルアミンボラン液に樹脂粒子を添加し、パラジウムが付着した樹脂粒子を得た。
パラジウムが付着した樹脂粒子をイオン交換水400mL中で3分間攪拌し、分散させ、分散液を得た。次に、炭化タングステン粒子(平均粒子径100nm)を5重量%含むスラリー400gを、得られた分散液に3分間かけて添加し、導電材が付着した樹脂粒子を含む懸濁液を得た。
硫酸ニッケル0.25mol/L、次亜リン酸ナトリウム0.25mol/L及びクエン酸ナトリウム0.15mol/Lを含むニッケルめっき液(pH6.0)を用意した。
(1)パラジウム付着工程
粒子径が3.0μmであるジビニルベンゼン樹脂粒子(積水化学工業社製「ミクロパールSP−203」)を用意した。この樹脂粒子をエッチングし、水洗した。次に、パラジウム触媒を8重量%含むパラジウム触媒化液100mL中に樹脂粒子を添加し、攪拌した。その後、ろ過し、洗浄した。pH6の0.5重量%ジメチルアミンボラン液に樹脂粒子を添加し、パラジウムが付着した樹脂粒子を得た。
パラジウムが付着した樹脂粒子をイオン交換水400mL中で3分間攪拌し、分散させ、分散液を得た。次に、炭化タングステン粒子(平均粒子径100nm)を5重量%含むスラリー400gを、得られた分散液に3分間かけて添加し、導電材が付着した樹脂粒子を含む懸濁液を得た。
硫酸ニッケル0.23mol/L、ジメチルアミンボラン0.92mol/L、クエン酸ナトリウム0.5mol/L及びタングステン酸ナトリウム0.01mol/Lを含むニッケルめっき液(pH8.5)を用意した。
炭化タングステン粒子(平均粒子径100nm)を、ニッケル粒子(平均粒子径100nm)に変更したこと以外は実施例1と同様にして、導電性粒子を得た。
炭化タングステン粒子(平均粒子径100nm)を、銅粒子(平均粒子径100nm)に変更したこと以外は実施例1と同様にして、導電性粒子を得た。
炭化タングステン粒子(平均粒子径100nm)を、シリカ粒子(平均粒子径100nm)に変更したこと以外は実施例1と同様にして、導電性粒子を得た。
(1)パラジウム付着工程
粒子径が3.0μmであるジビニルベンゼン樹脂粒子(積水化学工業社製「ミクロパールSP−203」)を用意した。この樹脂粒子をエッチングし、水洗した。次に、パラジウム触媒を8重量%含むパラジウム触媒化液100mL中に樹脂粒子を添加し、攪拌した。その後、ろ過し、洗浄した。pH6の0.5重量%ジメチルアミンボラン液に樹脂粒子を添加し、パラジウムが付着した樹脂粒子を得た。
パラジウムが付着した樹脂粒子をイオン交換水400mL中で3分間攪拌し、分散させ、分散液を得た。次に、炭化タングステン粒子(平均粒子径100nm)を5重量%含むスラリー400gを、得られた分散液に3分間かけて添加し、導電材が付着した樹脂粒子を含む懸濁液を得た。
硫酸銅0.23mol/L、エチレンジアミン四酢酸塩2.3mol/L、ホルマリン0.5mol/Lを含む銅めっき液(pH12.5)を用意した。得られた懸濁液を60℃にて攪拌しながら、上記銅めっき液を懸濁液に徐々に滴下し、無電解銅めっきを行った。その後、懸濁液を濾過することにより、粒子を取り出し、水洗し、乾燥することにより、樹脂粒子の表面上に銅導電層(厚み0.1μm)配置された導電性粒子を得た。
(1)接続抵抗
接続構造体の作製:
ビスフェノールA型エポキシ樹脂(三菱化学社製「エピコート1009」)10重量部と、アクリルゴム(重量平均分子量約80万)40重量部と、メチルエチルケトン200重量部と、マイクロカプセル型硬化剤(旭化成ケミカルズ社製「HX3941HP」)50重量部と、シランカップリング剤(東レダウコーニングシリコーン社製「SH6040」)2重量部とを混合し、導電性粒子を含有量が3重量%となるように添加し、分散させ、樹脂組成物を得た。
得られた接続構造体の対向する電極間の接続抵抗を4端子法により測定した。また、接続抵抗を下記の基準で判定した。
○○:参考例1の導電性粒子を用いた場合の接続抵抗の90%未満
○:参考例1の導電性粒子を用いた場合の接続抵抗の90%以上、95%未満
△:参考例1の導電性粒子を用いた場合の接続抵抗の95%以上、105%未満
×:参考例1の導電性粒子を用いた場合の接続抵抗の105%以上
1a…突起
2…基材粒子
3…導電層
3a…突起
4…導電材
5…絶縁性物質
11…導電性粒子
11a…突起
12…第1の導電層
13…第2の導電層
13a…突起
21…導電性粒子
22…導電層
51…接続構造体
52…第1の接続対象部材
52a…第1の電極
53…第2の接続対象部材
53a…第2の電極
54…接続部
Claims (8)
- 基材粒子と、
前記基材粒子の表面上に配置されている導電層と、
前記基材粒子の表面上の一部の領域に配置された複数の導電材とを備え、
前記導電材が粒子であり、
前記導電材が、前記導電層内に埋め込まれており、
前記導電材の材質が、モリブデン、炭化タングステン、タングステン、炭化チタン又は炭化タンタルである、導電性粒子。 - 前記導電層が外側の表面に突起を有し、前記導電層の前記突起の内側に前記導電材が配置されている、請求項1に記載の導電性粒子。
- 前記導電層がニッケル層を有する、請求項1又は2に記載の導電性粒子。
- 前記導電層が、前記基材粒子側にニッケル層と、前記基材粒子側とは反対側にパラジウム層とを有する、請求項1〜3のいずれか1項に記載の導電性粒子。
- 前記導電層の表面に付着している絶縁性物質をさらに備える、請求項1〜4のいずれか1項に記載の導電性粒子。
- 前記基材粒子と、
前記基材粒子の表面上の一部の領域に配置された前記導電材とを備え、
前記導電材の材質が、モリブデン、炭化タングステン、タングステン又は炭化タンタルである、請求項1〜5のいずれか1項に記載の導電性粒子。 - 請求項1〜6のいずれか1項に記載の導電性粒子と、バインダー樹脂とを含む、導電材料。
- 第1の電極を表面に有する第1の接続対象部材と、
第2の電極を表面に有する第2の接続対象部材と、
前記第1の接続対象部材と前記第2の接続対象部材を接続している接続部とを備え、
前記接続部が、請求項1〜6のいずれか1項に記載の導電性粒子により形成されているか、又は前記導電性粒子とバインダー樹脂とを含む導電材料により形成されており、
前記第1の電極と前記第2の電極とが前記導電性粒子により電気的に接続されている、接続構造体。
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