HK1202132A1 - Anisotropic electroconductive adhesive and method for manufacturing connected structure using the anisotropic electroconductive adhesive - Google Patents

Anisotropic electroconductive adhesive and method for manufacturing connected structure using the anisotropic electroconductive adhesive

Info

Publication number
HK1202132A1
HK1202132A1 HK15102693.9A HK15102693A HK1202132A1 HK 1202132 A1 HK1202132 A1 HK 1202132A1 HK 15102693 A HK15102693 A HK 15102693A HK 1202132 A1 HK1202132 A1 HK 1202132A1
Authority
HK
Hong Kong
Prior art keywords
electroconductive adhesive
anisotropic electroconductive
connected structure
anisotropic
manufacturing connected
Prior art date
Application number
HK15102693.9A
Other languages
Chinese (zh)
Inventor
佐藤大祐
林慎
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of HK1202132A1 publication Critical patent/HK1202132A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/56—Polyhydroxyethers, e.g. phenoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2409/00—Presence of diene rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
HK15102693.9A 2008-09-30 2015-03-17 Anisotropic electroconductive adhesive and method for manufacturing connected structure using the anisotropic electroconductive adhesive HK1202132A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008254323 2008-09-30

Publications (1)

Publication Number Publication Date
HK1202132A1 true HK1202132A1 (en) 2015-09-18

Family

ID=42073514

Family Applications (2)

Application Number Title Priority Date Filing Date
HK11111342.9A HK1156963A1 (en) 2008-09-30 2011-10-20 Anisotropic electroconductive adhesive and method for manufacturing connected structure using the anisotropic electroconductive adhesive
HK15102693.9A HK1202132A1 (en) 2008-09-30 2015-03-17 Anisotropic electroconductive adhesive and method for manufacturing connected structure using the anisotropic electroconductive adhesive

Family Applications Before (1)

Application Number Title Priority Date Filing Date
HK11111342.9A HK1156963A1 (en) 2008-09-30 2011-10-20 Anisotropic electroconductive adhesive and method for manufacturing connected structure using the anisotropic electroconductive adhesive

Country Status (6)

Country Link
JP (2) JP5728803B2 (en)
KR (1) KR101683312B1 (en)
CN (2) CN104059547B (en)
HK (2) HK1156963A1 (en)
TW (2) TWI541318B (en)
WO (1) WO2010038753A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5840418B2 (en) * 2011-08-23 2016-01-06 デクセリアルズ株式会社 Conductive adhesive and solar cell module
AT511655B1 (en) * 2011-10-20 2013-02-15 Prelonic Technologies Gmbh METHOD FOR BONDING CIRCUIT ELEMENTS AND ADHESIVES
KR101355854B1 (en) * 2011-12-16 2014-01-29 제일모직주식회사 Anisotropic conductive film
KR101355857B1 (en) * 2011-12-16 2014-01-27 제일모직주식회사 Anisotropic conductive film composition, the anisotropic conductive film thereof and semiconductor device
KR101355856B1 (en) * 2011-12-26 2014-01-27 제일모직주식회사 A composition for use of an anisotropic conductive film and anisotropic conductive film using the same
JP5934528B2 (en) * 2012-03-12 2016-06-15 デクセリアルズ株式会社 CIRCUIT CONNECTION MATERIAL, AND METHOD FOR MANUFACTURING MOUNTING BODY USING THE SAME
JP6029922B2 (en) * 2012-10-05 2016-11-24 デクセリアルズ株式会社 CIRCUIT CONNECTION MATERIAL, ITS MANUFACTURING METHOD, AND MOUNTING BODY MANUFACTURING METHOD USING THE SAME
JP6330346B2 (en) * 2014-01-29 2018-05-30 日立化成株式会社 Adhesive composition, electronic member using adhesive composition, and method for manufacturing semiconductor device
JP6337630B2 (en) * 2014-06-12 2018-06-06 日立化成株式会社 Circuit connection material and circuit connection structure
JP7386773B2 (en) * 2015-03-20 2023-11-27 デクセリアルズ株式会社 Anisotropic conductive adhesive, connected structure, anisotropic conductive connection method, and method for manufacturing connected structure
JP2016178225A (en) * 2015-03-20 2016-10-06 デクセリアルズ株式会社 Anisotropic conductive connection structure, anisotropic conductive connection method, and anisotropic conductive adhesive
JP6750197B2 (en) * 2015-07-13 2020-09-02 デクセリアルズ株式会社 Anisotropic conductive film and connection structure
US10913806B2 (en) 2016-09-20 2021-02-09 Osaka Organic Chemical Industry Ltd. (Meth)acrylic conductive material
CN109389903B (en) * 2017-08-04 2021-01-29 京东方科技集团股份有限公司 Flexible substrate, processing method thereof and processing system thereof
TWI786193B (en) * 2017-12-19 2022-12-11 日商琳得科股份有限公司 Adhesive for repetitive bending device, adhesive sheet, repetitive bending laminated member, and repetitive bending device
JP7032367B2 (en) * 2019-10-25 2022-03-08 デクセリアルズ株式会社 Manufacturing method of connecting body, anisotropic conductive bonding material, and connecting body

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JP3248149B2 (en) * 1995-11-21 2002-01-21 シャープ株式会社 Resin-sealed semiconductor device and method of manufacturing the same
JP3477367B2 (en) * 1998-05-12 2003-12-10 ソニーケミカル株式会社 Anisotropic conductive adhesive film
JP3507705B2 (en) * 1998-07-28 2004-03-15 ソニーケミカル株式会社 Insulating adhesive film
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JP3714147B2 (en) * 1999-10-22 2005-11-09 ソニーケミカル株式会社 Low temperature curing anisotropic conductive connecting material
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Also Published As

Publication number Publication date
WO2010038753A1 (en) 2010-04-08
KR101683312B1 (en) 2016-12-06
KR20110063500A (en) 2011-06-10
JP5728803B2 (en) 2015-06-03
JP5975088B2 (en) 2016-08-23
JP2010106261A (en) 2010-05-13
JP2015083681A (en) 2015-04-30
CN104059547B (en) 2016-08-24
HK1156963A1 (en) 2012-06-22
CN104059547A (en) 2014-09-24
CN102171306B (en) 2014-08-13
TW201012894A (en) 2010-04-01
CN102171306A (en) 2011-08-31
TW201406921A (en) 2014-02-16
TWI548719B (en) 2016-09-11
TWI541318B (en) 2016-07-11

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