HK1104676A1 - Exposure equipment, exposure method and device manufacturing method - Google Patents

Exposure equipment, exposure method and device manufacturing method

Info

Publication number
HK1104676A1
HK1104676A1 HK07112533.2A HK07112533A HK1104676A1 HK 1104676 A1 HK1104676 A1 HK 1104676A1 HK 07112533 A HK07112533 A HK 07112533A HK 1104676 A1 HK1104676 A1 HK 1104676A1
Authority
HK
Hong Kong
Prior art keywords
exposure
liquid immersion
optical system
projection optical
liquid
Prior art date
Application number
HK07112533.2A
Other languages
English (en)
Inventor
Soichi Owa
H Nagasaka
Ryu Sugawara
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=35787091&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1104676(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of HK1104676A1 publication Critical patent/HK1104676A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
HK07112533.2A 2004-08-03 2007-11-16 Exposure equipment, exposure method and device manufacturing method HK1104676A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004227226 2004-08-03
JP2005079113 2005-03-18
PCT/JP2005/014011 WO2006013806A1 (ja) 2004-08-03 2005-08-01 露光装置、露光方法及びデバイス製造方法

Publications (1)

Publication Number Publication Date
HK1104676A1 true HK1104676A1 (en) 2008-01-18

Family

ID=35787091

Family Applications (5)

Application Number Title Priority Date Filing Date
HK07112533.2A HK1104676A1 (en) 2004-08-03 2007-11-16 Exposure equipment, exposure method and device manufacturing method
HK16111880.2A HK1223688A1 (zh) 2004-08-03 2011-03-07 曝光裝置、曝光方法及組件製造方法
HK16100769.1A HK1212782A1 (zh) 2004-08-03 2016-01-22 曝光裝置的控制方法
HK18103000.2A HK1243776B (zh) 2004-08-03 2018-03-01 曝光裝置、曝光方法及組件製造方法
HK18103021.7A HK1244064B (zh) 2004-08-03 2018-03-02 曝光裝置、曝光方法以及用於製造設備的方法

Family Applications After (4)

Application Number Title Priority Date Filing Date
HK16111880.2A HK1223688A1 (zh) 2004-08-03 2011-03-07 曝光裝置、曝光方法及組件製造方法
HK16100769.1A HK1212782A1 (zh) 2004-08-03 2016-01-22 曝光裝置的控制方法
HK18103000.2A HK1243776B (zh) 2004-08-03 2018-03-01 曝光裝置、曝光方法及組件製造方法
HK18103021.7A HK1244064B (zh) 2004-08-03 2018-03-02 曝光裝置、曝光方法以及用於製造設備的方法

Country Status (10)

Country Link
US (2) US8169591B2 (xx)
EP (5) EP1791164B2 (xx)
JP (2) JP5152356B2 (xx)
KR (3) KR101230712B1 (xx)
CN (3) CN105204296B (xx)
AT (1) ATE470235T1 (xx)
DE (1) DE602005021653D1 (xx)
HK (5) HK1104676A1 (xx)
TW (1) TWI460544B (xx)
WO (1) WO2006013806A1 (xx)

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CN109416516B (zh) * 2016-07-04 2020-08-11 Asml荷兰有限公司 检查衬底和检查方法
CN107991843B (zh) * 2017-12-21 2023-07-21 浙江启尔机电技术有限公司 一种用于浸没式光刻机的微流道气液分离回收装置
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