HK1099963A1 - Transparent coating member for light-emitting diodes and fluorescent color light source - Google Patents
Transparent coating member for light-emitting diodes and fluorescent color light sourceInfo
- Publication number
- HK1099963A1 HK1099963A1 HK07107575.1A HK07107575A HK1099963A1 HK 1099963 A1 HK1099963 A1 HK 1099963A1 HK 07107575 A HK07107575 A HK 07107575A HK 1099963 A1 HK1099963 A1 HK 1099963A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- coating member
- transparent coating
- light source
- fluorescent
- fluorescent color
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/04—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages the fastening being onto or by the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
- F21Y2115/15—Organic light-emitting diodes [OLED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18103597 | 1997-07-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1099963A1 true HK1099963A1 (en) | 2007-08-31 |
Family
ID=16093633
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK07107575.1A HK1099963A1 (en) | 1997-07-07 | 2007-07-16 | Transparent coating member for light-emitting diodes and fluorescent color light source |
Country Status (5)
Country | Link |
---|---|
EP (3) | EP1753037B1 (xx) |
JP (4) | JP4271747B2 (xx) |
AT (2) | ATE343853T1 (xx) |
DE (1) | DE69836245T2 (xx) |
HK (1) | HK1099963A1 (xx) |
Families Citing this family (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW383508B (en) * | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
US6351069B1 (en) * | 1999-02-18 | 2002-02-26 | Lumileds Lighting, U.S., Llc | Red-deficiency-compensating phosphor LED |
US6680569B2 (en) | 1999-02-18 | 2004-01-20 | Lumileds Lighting U.S. Llc | Red-deficiency compensating phosphor light emitting device |
JP4606530B2 (ja) * | 1999-05-14 | 2011-01-05 | 株式会社朝日ラバー | シート部材およびそれを用いた発光装置 |
CN1224112C (zh) | 1999-06-23 | 2005-10-19 | 西铁城电子股份有限公司 | 发光二极管 |
US6504301B1 (en) | 1999-09-03 | 2003-01-07 | Lumileds Lighting, U.S., Llc | Non-incandescent lightbulb package using light emitting diodes |
JP4542656B2 (ja) * | 2000-02-15 | 2010-09-15 | 株式会社朝日ラバー | 発光ダイオードの包装装置 |
JP3609709B2 (ja) * | 2000-09-29 | 2005-01-12 | 株式会社シチズン電子 | 発光ダイオード |
JP2002133925A (ja) * | 2000-10-25 | 2002-05-10 | Sanken Electric Co Ltd | 蛍光カバー及び半導体発光装置 |
JP4101468B2 (ja) | 2001-04-09 | 2008-06-18 | 豊田合成株式会社 | 発光装置の製造方法 |
JP2003152227A (ja) | 2001-11-14 | 2003-05-23 | Citizen Electronics Co Ltd | Ledの色補正手段および色補正方法 |
JP4360788B2 (ja) * | 2002-08-29 | 2009-11-11 | シチズン電子株式会社 | 液晶表示板用のバックライト及びそれに用いる発光ダイオードの製造方法 |
US7029935B2 (en) * | 2003-09-09 | 2006-04-18 | Cree, Inc. | Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same |
DE10347541B4 (de) * | 2003-10-09 | 2012-02-16 | Odelo Led Gmbh | Verfahren zum Herstellen eines lichtleitenden LED-Körpers in mindestens zwei Fertigungsstufen |
JP2005327841A (ja) * | 2004-05-13 | 2005-11-24 | Asahi Rubber:Kk | 発光ダイオード用キャップ及び発光ダイオード装置 |
JP2005333014A (ja) * | 2004-05-20 | 2005-12-02 | Koha Co Ltd | Ledランプ |
JP2007035802A (ja) * | 2005-07-25 | 2007-02-08 | Matsushita Electric Works Ltd | 発光装置 |
KR20080064854A (ko) * | 2005-10-05 | 2008-07-09 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 흡수 필터를 갖는 인광체-변환 전계발광 소자 |
US7344952B2 (en) | 2005-10-28 | 2008-03-18 | Philips Lumileds Lighting Company, Llc | Laminating encapsulant film containing phosphor over LEDs |
JP2007173673A (ja) * | 2005-12-26 | 2007-07-05 | Okaya Electric Ind Co Ltd | カラー発光ダイオード |
EP3264542B1 (en) | 2006-03-10 | 2019-06-05 | Nichia Corporation | Light-emitting device |
JP4980640B2 (ja) * | 2006-03-31 | 2012-07-18 | 三洋電機株式会社 | 照明装置 |
US20080035942A1 (en) | 2006-08-08 | 2008-02-14 | Lg Electronics Inc. | Light emitting device package and method for manufacturing the same |
US7942556B2 (en) | 2007-06-18 | 2011-05-17 | Xicato, Inc. | Solid state illumination device |
JP4807522B2 (ja) * | 2007-09-18 | 2011-11-02 | 株式会社朝日ラバー | 半導体光学素子部品のはんだ付け方法及び半導体光学素子部品 |
JP5128888B2 (ja) * | 2007-10-01 | 2013-01-23 | 株式会社朝日ラバー | 発光デバイス及びそれを用いた照明装置 |
US7984999B2 (en) | 2007-10-17 | 2011-07-26 | Xicato, Inc. | Illumination device with light emitting diodes and moveable light adjustment member |
US9086213B2 (en) | 2007-10-17 | 2015-07-21 | Xicato, Inc. | Illumination device with light emitting diodes |
JP5111286B2 (ja) * | 2008-08-08 | 2013-01-09 | シャープ株式会社 | Ledランプ駆動方法及びledランプ装置 |
JP2010050585A (ja) | 2008-08-20 | 2010-03-04 | Funai Electric Co Ltd | 操作キーユニットの取付構造 |
US8220971B2 (en) | 2008-11-21 | 2012-07-17 | Xicato, Inc. | Light emitting diode module with three part color matching |
KR101102237B1 (ko) * | 2008-12-23 | 2012-01-03 | (주) 아모엘이디 | 엘이디 패키지, 엘이디 패키지의 제조방법, 및 백라이트 유니트와 조명장치 |
JP2010171342A (ja) | 2009-01-26 | 2010-08-05 | Sony Corp | 色変換部材およびその製造方法、発光装置、表示装置 |
JP2011205051A (ja) | 2009-06-26 | 2011-10-13 | Fujifilm Corp | 光反射基板およびその製造方法 |
JP5342368B2 (ja) * | 2009-08-06 | 2013-11-13 | 株式会社朝日ラバー | 発光ダイオード |
FR2949165B1 (fr) * | 2009-08-11 | 2011-10-07 | Oberthur Technologies | Carte a microcircuit comprenant une diode electroluminescente |
CN102666940A (zh) | 2009-12-25 | 2012-09-12 | 富士胶片株式会社 | 绝缘基板、绝缘基板制备方法、配线形成方法、配线基板、和发光器件 |
EP2362207A1 (de) * | 2010-01-28 | 2011-08-31 | F. Hoffmann-La Roche AG | Messsystem und Messverfahren insbesondere zur Blutzuckerbestimmung |
US8104908B2 (en) | 2010-03-04 | 2012-01-31 | Xicato, Inc. | Efficient LED-based illumination module with high color rendering index |
JP5706631B2 (ja) * | 2010-05-07 | 2015-04-22 | 株式会社八洲測器 | 対面調光ledデバイス |
US20120051045A1 (en) | 2010-08-27 | 2012-03-01 | Xicato, Inc. | Led Based Illumination Module Color Matched To An Arbitrary Light Source |
JP5292368B2 (ja) * | 2010-08-27 | 2013-09-18 | 株式会社朝日ラバー | 発光色変換シートおよびそれを用いた発光装置 |
JP2012079763A (ja) * | 2010-09-30 | 2012-04-19 | Keii Kagi Kofun Yugenkoshi | 発光ダイオードのモールド製造プロセス、及び前記製造プロセスで製造したカバー構造 |
JP5355640B2 (ja) * | 2011-08-24 | 2013-11-27 | シャープ株式会社 | Ledランプ駆動方法 |
EP2924744B1 (en) | 2011-11-29 | 2019-03-06 | Sharp Kabushiki Kaisha | Manufacturing method for light-emitting device |
JP2012199589A (ja) * | 2012-06-19 | 2012-10-18 | Sharp Corp | Ledランプ装置および表示装置 |
US9462653B2 (en) | 2013-10-22 | 2016-10-04 | Daisho Denki Inc. | Illumination system |
DE102014100837A1 (de) * | 2014-01-24 | 2015-07-30 | Osram Opto Semiconductors Gmbh | Lichtemittierendes Bauelement und Verfahren zur Herstellung eines lichtemittierenden Bauelements |
US9590148B2 (en) | 2014-03-18 | 2017-03-07 | GE Lighting Solutions, LLC | Encapsulant modification in heavily phosphor loaded LED packages for improved stability |
US9680067B2 (en) | 2014-03-18 | 2017-06-13 | GE Lighting Solutions, LLC | Heavily phosphor loaded LED packages having higher stability |
WO2020144882A1 (ja) * | 2019-01-11 | 2020-07-16 | 株式会社朝日ラバー | 光源、led装置及び発光表示構造 |
JP7361291B2 (ja) * | 2018-01-15 | 2023-10-16 | 株式会社朝日ラバー | Led装置及び発光表示構造 |
KR102334956B1 (ko) * | 2018-11-01 | 2021-12-02 | 주식회사 엘지화학 | 차량용 램프 및 이의 제조 방법 |
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US3593055A (en) * | 1969-04-16 | 1971-07-13 | Bell Telephone Labor Inc | Electro-luminescent device |
US3932881A (en) * | 1972-09-05 | 1976-01-13 | Nippon Electric Co., Inc. | Electroluminescent device including dichroic and infrared reflecting components |
JPS5079379A (xx) * | 1973-11-13 | 1975-06-27 | ||
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US3959655A (en) * | 1975-02-06 | 1976-05-25 | Eastman Kodak Company | Light source for optical sound recording and reproduction apparatus |
JPS5330783U (xx) * | 1976-08-24 | 1978-03-16 | ||
JPS5330783A (en) * | 1976-09-02 | 1978-03-23 | Tokyo Shibaura Electric Co | Dc breaker |
US4599537A (en) * | 1982-04-30 | 1986-07-08 | Shigeaki Yamashita | IR light emitting apparatus with visible detection means |
JPS58196067A (ja) * | 1982-05-11 | 1983-11-15 | Colpo Co Ltd | 発光ダイオ−ドを光源とする発光体 |
GB2153256B (en) * | 1984-01-20 | 1987-07-15 | Pa Consulting Services | Improved toothstick and methods of production |
JPS60179056U (ja) * | 1984-05-07 | 1985-11-28 | 日本デンヨ−株式会社 | Ledランプのレンズキャップ装置 |
JPS61185980A (ja) * | 1985-02-13 | 1986-08-19 | Stanley Electric Co Ltd | 発光ダイオ−ド |
JPS61187384A (ja) * | 1985-02-15 | 1986-08-21 | Stanley Electric Co Ltd | 発光ダイオ−ド |
JPS63280467A (ja) * | 1987-05-12 | 1988-11-17 | Toshiba Corp | 光半導体素子 |
DE3804293A1 (de) * | 1988-02-12 | 1989-08-24 | Philips Patentverwaltung | Anordnung mit einer elektrolumineszenz- oder laserdiode |
JPH01260707A (ja) * | 1988-04-11 | 1989-10-18 | Idec Izumi Corp | 白色発光装置 |
JPH04226095A (ja) * | 1990-04-27 | 1992-08-14 | Omron Corp | 半導体発光装置 |
US5208462A (en) * | 1991-12-19 | 1993-05-04 | Allied-Signal Inc. | Wide bandwidth solid state optical source |
JP3199483B2 (ja) * | 1992-08-21 | 2001-08-20 | アルパイン株式会社 | 照光装置 |
JPH06104491A (ja) * | 1992-09-17 | 1994-04-15 | Rohm Co Ltd | 発光ダイオードランプ |
JPH07193281A (ja) * | 1993-12-27 | 1995-07-28 | Mitsubishi Materials Corp | 指向性の少ない赤外可視変換発光ダイオード |
JPH0864860A (ja) * | 1994-08-17 | 1996-03-08 | Mitsubishi Materials Corp | 色純度の高い赤外可視変換青色発光ダイオード |
JP3419116B2 (ja) * | 1994-10-18 | 2003-06-23 | 株式会社島津製作所 | X線ct装置 |
JPH08279627A (ja) * | 1995-04-07 | 1996-10-22 | Showa Denko Kk | 発光素子 |
JPH0927642A (ja) * | 1995-07-13 | 1997-01-28 | Clarion Co Ltd | 照明装置 |
JP3773541B2 (ja) * | 1996-06-26 | 2006-05-10 | シーメンス アクチエンゲゼルシヤフト | ルミネセンス変換エレメントを有する半導体発光素子 |
JP3434658B2 (ja) * | 1997-01-14 | 2003-08-11 | サンケン電気株式会社 | 半導体発光装置 |
US6274890B1 (en) * | 1997-01-15 | 2001-08-14 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device and its manufacturing method |
JP3167641B2 (ja) * | 1997-03-31 | 2001-05-21 | 和泉電気株式会社 | Led球 |
EP0883195A1 (en) * | 1997-06-03 | 1998-12-09 | BARR & STROUD LIMITED | Head tracking system comprising LED with fluorescent coating |
-
1998
- 1998-06-12 JP JP16559898A patent/JP4271747B2/ja not_active Expired - Fee Related
- 1998-07-07 DE DE69836245T patent/DE69836245T2/de not_active Expired - Lifetime
- 1998-07-07 EP EP06021272A patent/EP1753037B1/en not_active Expired - Lifetime
- 1998-07-07 EP EP98112602A patent/EP0890996B1/en not_active Expired - Lifetime
- 1998-07-07 AT AT98112602T patent/ATE343853T1/de not_active IP Right Cessation
- 1998-07-07 AT AT06021272T patent/ATE510307T1/de not_active IP Right Cessation
- 1998-07-07 EP EP10011258A patent/EP2270885A3/en not_active Withdrawn
-
2007
- 2007-07-16 HK HK07107575.1A patent/HK1099963A1/xx not_active IP Right Cessation
-
2008
- 2008-06-09 JP JP2008150586A patent/JP4937964B2/ja not_active Expired - Fee Related
- 2008-06-09 JP JP2008150588A patent/JP4937966B2/ja not_active Expired - Fee Related
- 2008-06-09 JP JP2008150587A patent/JP4937965B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH1187784A (ja) | 1999-03-30 |
ATE343853T1 (de) | 2006-11-15 |
JP4937964B2 (ja) | 2012-05-23 |
JP2008270831A (ja) | 2008-11-06 |
DE69836245D1 (de) | 2006-12-07 |
JP2008252119A (ja) | 2008-10-16 |
JP4937965B2 (ja) | 2012-05-23 |
JP2008211262A (ja) | 2008-09-11 |
ATE510307T1 (de) | 2011-06-15 |
EP0890996B1 (en) | 2006-10-25 |
EP1753037B1 (en) | 2011-05-18 |
EP2270885A2 (en) | 2011-01-05 |
JP4937966B2 (ja) | 2012-05-23 |
EP0890996A3 (en) | 2000-05-10 |
EP1753037A1 (en) | 2007-02-14 |
EP0890996A2 (en) | 1999-01-13 |
DE69836245T2 (de) | 2007-04-19 |
EP2270885A3 (en) | 2012-12-12 |
JP4271747B2 (ja) | 2009-06-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PE | Patent expired |
Effective date: 20180706 |