DE69836245D1 - Durchsichtige Beschichtung für Leuchtdioden und fluoreszierende Lichtquellen - Google Patents

Durchsichtige Beschichtung für Leuchtdioden und fluoreszierende Lichtquellen

Info

Publication number
DE69836245D1
DE69836245D1 DE69836245T DE69836245T DE69836245D1 DE 69836245 D1 DE69836245 D1 DE 69836245D1 DE 69836245 T DE69836245 T DE 69836245T DE 69836245 T DE69836245 T DE 69836245T DE 69836245 D1 DE69836245 D1 DE 69836245D1
Authority
DE
Germany
Prior art keywords
fluorescent
transparent coating
emitting diodes
light emitting
light sources
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69836245T
Other languages
English (en)
Other versions
DE69836245T2 (de
Inventor
Masutsugu Tasaki
Akira Ichikawa
Tsutomu Odaki
Kazuhisa Takagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Asahi Rubber Inc
Original Assignee
Sanken Electric Co Ltd
Asahi Rubber Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd, Asahi Rubber Inc filed Critical Sanken Electric Co Ltd
Publication of DE69836245D1 publication Critical patent/DE69836245D1/de
Application granted granted Critical
Publication of DE69836245T2 publication Critical patent/DE69836245T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/04—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages the fastening being onto or by the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F21Y2115/15—Organic light-emitting diodes [OLED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
DE69836245T 1997-07-07 1998-07-07 Durchsichtige Beschichtung für Leuchtdioden und fluoreszierende Lichtquellen Expired - Lifetime DE69836245T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP18103597 1997-07-07
JP18103597 1997-07-07

Publications (2)

Publication Number Publication Date
DE69836245D1 true DE69836245D1 (de) 2006-12-07
DE69836245T2 DE69836245T2 (de) 2007-04-19

Family

ID=16093633

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69836245T Expired - Lifetime DE69836245T2 (de) 1997-07-07 1998-07-07 Durchsichtige Beschichtung für Leuchtdioden und fluoreszierende Lichtquellen

Country Status (5)

Country Link
EP (3) EP1753037B1 (de)
JP (4) JP4271747B2 (de)
AT (2) ATE343853T1 (de)
DE (1) DE69836245T2 (de)
HK (1) HK1099963A1 (de)

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JP5128888B2 (ja) * 2007-10-01 2013-01-23 株式会社朝日ラバー 発光デバイス及びそれを用いた照明装置
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JP5342368B2 (ja) * 2009-08-06 2013-11-13 株式会社朝日ラバー 発光ダイオード
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Also Published As

Publication number Publication date
JPH1187784A (ja) 1999-03-30
ATE343853T1 (de) 2006-11-15
JP4937964B2 (ja) 2012-05-23
JP2008270831A (ja) 2008-11-06
HK1099963A1 (en) 2007-08-31
JP2008252119A (ja) 2008-10-16
JP4937965B2 (ja) 2012-05-23
JP2008211262A (ja) 2008-09-11
ATE510307T1 (de) 2011-06-15
EP0890996B1 (de) 2006-10-25
EP1753037B1 (de) 2011-05-18
EP2270885A2 (de) 2011-01-05
JP4937966B2 (ja) 2012-05-23
EP0890996A3 (de) 2000-05-10
EP1753037A1 (de) 2007-02-14
EP0890996A2 (de) 1999-01-13
DE69836245T2 (de) 2007-04-19
EP2270885A3 (de) 2012-12-12
JP4271747B2 (ja) 2009-06-03

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