HK1090752A1 - Interconnect structure with wings - Google Patents

Interconnect structure with wings

Info

Publication number
HK1090752A1
HK1090752A1 HK06111271.1A HK06111271A HK1090752A1 HK 1090752 A1 HK1090752 A1 HK 1090752A1 HK 06111271 A HK06111271 A HK 06111271A HK 1090752 A1 HK1090752 A1 HK 1090752A1
Authority
HK
Hong Kong
Prior art keywords
plane
metal layer
terminal communicates
wings
interconnect structure
Prior art date
Application number
HK06111271.1A
Other languages
English (en)
Inventor
Sehat Sutardja
Original Assignee
Marvell World Trade Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marvell World Trade Ltd filed Critical Marvell World Trade Ltd
Publication of HK1090752A1 publication Critical patent/HK1090752A1/xx

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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4824—Pads with extended contours, e.g. grid structure, branch structure, finger structure
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    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386—Geometry or layout of the interconnection structure
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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Junction Field-Effect Transistors (AREA)
HK06111271.1A 2004-01-26 2006-10-13 Interconnect structure with wings HK1090752A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/765,474 US7265448B2 (en) 2004-01-26 2004-01-26 Interconnect structure for power transistors

Publications (1)

Publication Number Publication Date
HK1090752A1 true HK1090752A1 (en) 2006-12-29

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Family Applications (1)

Application Number Title Priority Date Filing Date
HK06111271.1A HK1090752A1 (en) 2004-01-26 2006-10-13 Interconnect structure with wings

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Country Link
US (2) US7265448B2 (xx)
EP (3) EP1571708B1 (xx)
JP (3) JP4596925B2 (xx)
CN (3) CN100435330C (xx)
HK (1) HK1090752A1 (xx)
TW (3) TWI354369B (xx)

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US7851872B2 (en) 2003-10-22 2010-12-14 Marvell World Trade Ltd. Efficient transistor structure
US7414275B2 (en) 2005-06-24 2008-08-19 International Business Machines Corporation Multi-level interconnections for an integrated circuit chip
JP4424331B2 (ja) * 2005-08-01 2010-03-03 セイコーエプソン株式会社 静電アクチュエータ、液滴吐出ヘッド、液滴吐出ヘッドの駆動方法及び静電アクチュエータの製造方法
WO2007050990A2 (en) * 2005-10-27 2007-05-03 Rosetta Inpharmatics Llc Nucleic acid amplification using non-random primers
US9147644B2 (en) 2008-02-26 2015-09-29 International Rectifier Corporation Semiconductor device and passive component integration in a semiconductor package
US8786072B2 (en) * 2007-02-27 2014-07-22 International Rectifier Corporation Semiconductor package
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US8018027B2 (en) * 2009-10-30 2011-09-13 Murata Manufacturing Co., Ltd. Flip-bonded dual-substrate inductor, flip-bonded dual-substrate inductor, and integrated passive device including a flip-bonded dual-substrate inductor
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