GB2166589B - Ic card - Google Patents

Ic card

Info

Publication number
GB2166589B
GB2166589B GB8524271A GB8524271A GB2166589B GB 2166589 B GB2166589 B GB 2166589B GB 8524271 A GB8524271 A GB 8524271A GB 8524271 A GB8524271 A GB 8524271A GB 2166589 B GB2166589 B GB 2166589B
Authority
GB
United Kingdom
Prior art keywords
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8524271A
Other languages
English (en)
Other versions
GB2166589A (en
GB8524271D0 (en
Inventor
Kazuya Hara
Kenji Rikuna
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Casio Computer Co Ltd
Original Assignee
Casio Computer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Casio Computer Co Ltd filed Critical Casio Computer Co Ltd
Publication of GB8524271D0 publication Critical patent/GB8524271D0/en
Publication of GB2166589A publication Critical patent/GB2166589A/en
Application granted granted Critical
Publication of GB2166589B publication Critical patent/GB2166589B/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/699—Insulating or insulated package substrates; Interposers; Redistribution layers for flat cards, e.g. credit cards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S283/00—Printed matter
    • Y10S283/904—Credit card
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/22—Nonparticulate element embedded or inlaid in substrate and visible
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y10T428/24331—Composite web or sheet including nonapertured component

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
GB8524271A 1984-11-05 1985-10-02 Ic card Expired GB2166589B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59232834A JPS61123990A (ja) 1984-11-05 1984-11-05 Ｉｃカ−ド

Publications (3)

Publication Number Publication Date
GB8524271D0 GB8524271D0 (en) 1985-11-06
GB2166589A GB2166589A (en) 1986-05-08
GB2166589B true GB2166589B (en) 1989-04-26

Family

ID=16945516

Family Applications (2)

Application Number Title Priority Date Filing Date
GB8524271A Expired GB2166589B (en) 1984-11-05 1985-10-02 Ic card
GB8813471A Expired GB2204182B (en) 1984-11-05 1988-06-08 Ic card

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB8813471A Expired GB2204182B (en) 1984-11-05 1988-06-08 Ic card

Country Status (6)

Country Link
US (1) US4719140A (enExample)
JP (1) JPS61123990A (enExample)
KR (1) KR900001698B1 (enExample)
DE (1) DE3535791A1 (enExample)
FR (1) FR2572826B1 (enExample)
GB (2) GB2166589B (enExample)

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0751390B2 (ja) * 1985-07-10 1995-06-05 カシオ計算機株式会社 Ｉｃカ−ド
JPH0524551Y2 (enExample) * 1985-07-26 1993-06-22
DE3689094T2 (de) * 1985-07-27 1994-03-10 Dainippon Printing Co Ltd IC-Karte.
FR2590052B1 (fr) * 1985-11-08 1991-03-01 Eurotechnique Sa Procede de recyclage d'une carte comportant un composant, carte prevue pour etre recyclee
JP2502511B2 (ja) * 1986-02-06 1996-05-29 日立マクセル株式会社 半導体装置の製造方法
DE3639630A1 (de) * 1986-11-20 1988-06-01 Gao Ges Automation Org Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
JPS6387064U (enExample) * 1986-11-27 1988-06-07
JPH0696357B2 (ja) * 1986-12-11 1994-11-30 三菱電機株式会社 Ｉｃカードの製造方法
JP2796625B2 (ja) * 1988-01-09 1998-09-10 カシオ計算機株式会社 電子桟器
JPH0780371B2 (ja) * 1987-05-13 1995-08-30 株式会社トクヤマ エレクトロクロミツクデイスプレイカ−ド
FR2641102B1 (enExample) * 1988-12-27 1991-02-22 Ebauchesfabrik Eta Ag
JPH0687484B2 (ja) * 1989-04-06 1994-11-02 三菱電機株式会社 Ｉｃカード用モジュール
DE3941070A1 (de) * 1989-12-08 1991-06-13 Dirk Lehnartz Informations- und werbetraeger, insbesondere praesentations- und / oder geschaeftskarte
US5611140A (en) * 1989-12-18 1997-03-18 Epoxy Technology, Inc. Method of forming electrically conductive polymer interconnects on electrical substrates
US5227338A (en) * 1990-04-30 1993-07-13 International Business Machines Corporation Three-dimensional memory card structure with internal direct chip attachment
DE4028966A1 (de) * 1990-09-12 1992-03-19 Rudolf Dr Goedecke Anschluesse an ic - speicherkarten und steckmodule, ueber die analoge oder digitale signale in ein datenverarbeitungsgeraet ein- und ausgegeben werden koennen
CA2051836C (en) * 1990-11-30 1996-07-23 Richard Michael Flynn Personal data card construction
EP0569401A1 (de) * 1991-01-28 1993-11-18 Siemens Aktiengesellschaft Verfahren zur herstellung einer tragbaren datenträgeranordnung
DE9113565U1 (de) * 1991-08-27 1992-01-02 Pelzer, Guido, 50374 Erftstadt Mobiler Datenträger
DE9113601U1 (de) * 1991-10-31 1993-03-04 Schneider, Edgar, 8057 Günzenhausen Multifunktionaler Schutzschild für mikroelektronische Schaltungen und Sensoren insbesondere für sog. Chip-Karten
DE4223371A1 (de) * 1992-07-16 1994-01-20 Thomson Brandt Gmbh Verfahren und Platine zur Montage von Bauelementen
JP3169965B2 (ja) * 1992-08-12 2001-05-28 沖電気工業株式会社 Ｉｃカード
JPH06122297A (ja) * 1992-08-31 1994-05-06 Sony Chem Corp Ｉｃカード及びその製造方法
DE4234158A1 (de) * 1992-10-10 1994-04-14 Walter Holzer Duale Datenträgerkarte
DE69431023T2 (de) * 1993-09-01 2003-02-06 Kabushiki Kaisha Toshiba, Kawasaki Halbleiteraufbau und Verfahren zur Herstellung
JPH07101188A (ja) * 1993-10-05 1995-04-18 Canon Inc 複合カード
JPH07221590A (ja) * 1994-01-31 1995-08-18 Matsushita Electric Ind Co Ltd 電子部品とその製造方法
EP0688050A1 (fr) * 1994-06-15 1995-12-20 Philips Cartes Et Systemes Procédé d'assemblage de carte à circuit intégré et carte ainsi obtenue
ES2135656T3 (es) * 1994-06-15 1999-11-01 Rue Cartes Et Systemes De Procedimiento de fabricacion y ensamblaje de una tarjeta con circuito integrado.
US5588678A (en) * 1994-06-27 1996-12-31 Great Western Press, Inc. Talking trading card
US5451763A (en) * 1994-07-05 1995-09-19 Alto Corporation Personal medical IC card and read/write unit
DE4443980C2 (de) * 1994-12-11 1997-07-17 Angewandte Digital Elektronik Verfahren zur Herstellung von Chipkarten und Chipkarte hergestellt nach diesem Verfahren
AU1750995A (en) * 1995-01-27 1996-08-14 Interprint Formularios Ltda. Memory card and method of producing same
JP2814477B2 (ja) * 1995-04-13 1998-10-22 ソニーケミカル株式会社 非接触式ｉｃカード及びその製造方法
JPH08310172A (ja) * 1995-05-23 1996-11-26 Hitachi Ltd 半導体装置
DE29515521U1 (de) * 1995-09-28 1996-02-29 TELBUS Gesellschaft für elektronische Kommunikations-Systeme mbH, 85391 Allershausen Multi-Chip-Modul
DE29516811U1 (de) * 1995-10-25 1995-12-21 Hornig, Wolfgang, Dr.-Ing., 90542 Eckental Chipkarten aus Metall
DE19602821C1 (de) 1996-01-26 1997-06-26 Siemens Ag Verfahren zur Herstellung einer Datenkarte
EP0836155A3 (en) * 1996-10-09 1999-03-31 Canon Kabushiki Kaisha Information recording medium
SE9701612D0 (sv) * 1997-04-29 1997-04-29 Johan Asplund Smartcard and method for its manufacture
DE19735171A1 (de) * 1997-08-13 1999-01-07 Siemens Ag Halbleitermodul
US6124546A (en) * 1997-12-03 2000-09-26 Advanced Micro Devices, Inc. Integrated circuit chip package and method of making the same
EP1110243A1 (de) 1998-07-28 2001-06-27 Infineon Technologies AG Integriertes bauelement, verbundkörper aus einem integrierten bauelement und einer leiterstruktur, chip-karte und verfahren zur herstellung des integrierten bauelementes
JP2000099678A (ja) * 1998-09-18 2000-04-07 Hitachi Ltd Ｉｃカード及びその製造方法
US6404643B1 (en) 1998-10-15 2002-06-11 Amerasia International Technology, Inc. Article having an embedded electronic device, and method of making same
SG80077A1 (en) 1998-10-19 2001-04-17 Sony Corp Semiconductor integrated circuit card manufacturing method, and semiconductor integrated circuit card
JP4470242B2 (ja) * 1999-04-23 2010-06-02 ソニー株式会社 半導体メモリカード
US6421013B1 (en) 1999-10-04 2002-07-16 Amerasia International Technology, Inc. Tamper-resistant wireless article including an antenna
ATE263398T1 (de) 1999-12-02 2004-04-15 Infineon Technologies Ag Chipkartenmodul mit anisotrop leitfähiger trägerfolie
FR2806189B1 (fr) * 2000-03-10 2002-05-31 Schlumberger Systems & Service Circuit integre renforce et procede de renforcement de circuits integres
DE10042312A1 (de) * 2000-08-29 2002-03-14 Orga Kartensysteme Gmbh Verfahren zur Herstellung eines Trägerelementes für einen IC-Baustein
JP4873776B2 (ja) * 2000-11-30 2012-02-08 ソニー株式会社 非接触ｉｃカード
DE10139395A1 (de) * 2001-08-10 2003-03-06 Infineon Technologies Ag Kontaktierung von Halbleiterchips in Chipkarten
DE10340129B4 (de) * 2003-08-28 2006-07-13 Infineon Technologies Ag Elektronisches Modul mit Steckkontakten und Verfahren zur Herstellung desselben
WO2006120309A2 (fr) * 2005-05-11 2006-11-16 Stmicroelectronics Sa Microplaquette de silicium ayant des plages de contact inclinees et module electronique comprenant une telle microplaquette
CN104102941B (zh) * 2013-04-11 2023-10-13 德昌电机(深圳)有限公司 智能卡、身份识别卡、银行卡、智能卡触板及表面抗氧化方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0071311A2 (de) * 1981-07-31 1983-02-09 Philips Patentverwaltung GmbH Verfahhren zur Herstellung von auf AnschluBflächen eines integrierten Bausteins aufgesetzten Kontaktelementen
GB2112324A (en) * 1981-12-24 1983-07-20 Gao Ges Automation Org An identification card with an ic module
GB2130142A (en) * 1982-09-09 1984-05-31 Sony Corp Memory cards
GB2149209A (en) * 1980-08-05 1985-06-05 Gao Ges Automation Org An identification card or similar data carrier incorporating a carrier element for an ic module

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Publication number Priority date Publication date Assignee Title
JPS592179B2 (ja) * 1975-03-03 1984-01-17 セイコーエプソン株式会社 電気的部材の製造方法
US4222516A (en) * 1975-12-31 1980-09-16 Compagnie Internationale Pour L'informatique Cii-Honeywell Bull Standardized information card
DE2920012C2 (de) * 1979-05-17 1988-09-29 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit IC-Baustein und Verfahren zur Herstellung einer derartigen Ausweiskarte
DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
US4483067A (en) * 1981-09-11 1984-11-20 U.S. Philips Corporation Method of manufacturing an identification card and an identification manufactured, for example, by this method
US4447716A (en) * 1982-03-01 1984-05-08 Seiichiro Aigo Information card
JPS58213160A (ja) * 1982-06-04 1983-12-12 株式会社東芝 冷凍サイクル装置
DE3248385A1 (de) * 1982-12-28 1984-06-28 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit integriertem schaltkreis

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2149209A (en) * 1980-08-05 1985-06-05 Gao Ges Automation Org An identification card or similar data carrier incorporating a carrier element for an ic module
EP0071311A2 (de) * 1981-07-31 1983-02-09 Philips Patentverwaltung GmbH Verfahhren zur Herstellung von auf AnschluBflächen eines integrierten Bausteins aufgesetzten Kontaktelementen
GB2112324A (en) * 1981-12-24 1983-07-20 Gao Ges Automation Org An identification card with an ic module
GB2130142A (en) * 1982-09-09 1984-05-31 Sony Corp Memory cards

Also Published As

Publication number Publication date
KR900001698B1 (ko) 1990-03-19
FR2572826B1 (fr) 1991-02-22
GB8813471D0 (en) 1988-07-13
JPS61123990A (ja) 1986-06-11
DE3535791A1 (de) 1986-05-07
FR2572826A1 (fr) 1986-05-09
GB2204182A (en) 1988-11-02
GB2166589A (en) 1986-05-08
GB2204182B (en) 1989-04-19
KR860004370A (ko) 1986-06-20
US4719140A (en) 1988-01-12
GB8524271D0 (en) 1985-11-06
DE3535791C2 (enExample) 1989-02-23

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19991002