GB1443363A - Methode of manufacturing lsi chips - Google Patents

Methode of manufacturing lsi chips

Info

Publication number
GB1443363A
GB1443363A GB2040675A GB2040675A GB1443363A GB 1443363 A GB1443363 A GB 1443363A GB 2040675 A GB2040675 A GB 2040675A GB 2040675 A GB2040675 A GB 2040675A GB 1443363 A GB1443363 A GB 1443363A
Authority
GB
United Kingdom
Prior art keywords
semi
lsi chips
methode
bodies
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2040675A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu IT Holdings Inc
Original Assignee
Amdahl Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amdahl Corp filed Critical Amdahl Corp
Publication of GB1443363A publication Critical patent/GB1443363A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/90—Masterslice integrated circuits
    • H10D84/901—Masterslice integrated circuits comprising bipolar technology
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/497—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/02—Contacts, special
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/037—Diffusion-deposition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/085—Isolated-integrated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/106—Masks, special

Landscapes

  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Air Bags (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Forging (AREA)
  • Logic Circuits (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Measurement Of Radiation (AREA)
  • Bipolar Transistors (AREA)
GB2040675A 1972-07-10 1973-06-25 Methode of manufacturing lsi chips Expired GB1443363A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00270449A US3808475A (en) 1972-07-10 1972-07-10 Lsi chip construction and method

Publications (1)

Publication Number Publication Date
GB1443363A true GB1443363A (en) 1976-07-21

Family

ID=23031365

Family Applications (3)

Application Number Title Priority Date Filing Date
GB2040675A Expired GB1443363A (en) 1972-07-10 1973-06-25 Methode of manufacturing lsi chips
GB2996673A Expired GB1443361A (en) 1972-07-10 1973-06-25 Lsi chip construction
GB812076A Expired GB1443365A (en) 1972-07-10 1973-06-25 Lsi chip construction

Family Applications After (2)

Application Number Title Priority Date Filing Date
GB2996673A Expired GB1443361A (en) 1972-07-10 1973-06-25 Lsi chip construction
GB812076A Expired GB1443365A (en) 1972-07-10 1973-06-25 Lsi chip construction

Country Status (17)

Country Link
US (1) US3808475A (https=)
JP (1) JPS5531624B2 (https=)
AT (1) AT371628B (https=)
AU (1) AU467309B2 (https=)
BE (1) BE801909A (https=)
BR (1) BR7305011D0 (https=)
CA (1) CA990414A (https=)
CH (2) CH599679A5 (https=)
DE (1) DE2334405C3 (https=)
DK (1) DK139208B (https=)
ES (1) ES417198A1 (https=)
FR (1) FR2192383B1 (https=)
GB (3) GB1443363A (https=)
IT (1) IT991086B (https=)
NL (1) NL7309342A (https=)
NO (2) NO141623C (https=)
SE (1) SE409628B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0001209A1 (de) * 1977-09-06 1979-04-04 International Business Machines Corporation Integrierte Halbleiterschaltung
US4259935A (en) * 1978-04-05 1981-04-07 Toyota Jidosha Kogyo Kabushiki Kaisha Fuel injection type throttle valve

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3916434A (en) * 1972-11-30 1975-10-28 Power Hybrids Inc Hermetically sealed encapsulation of semiconductor devices
CA1024661A (en) * 1974-06-26 1978-01-17 International Business Machines Corporation Wireable planar integrated circuit chip structure
US3999214A (en) * 1974-06-26 1976-12-21 Ibm Corporation Wireable planar integrated circuit chip structure
GB1584004A (en) * 1976-06-07 1981-02-04 Amdahl Corp Data processing system
JPS5519005Y2 (https=) * 1976-11-24 1980-05-06
US4969029A (en) * 1977-11-01 1990-11-06 Fujitsu Limited Cellular integrated circuit and hierarchial method
JPS60953B2 (ja) * 1977-12-30 1985-01-11 富士通株式会社 半導体集積回路装置
JPS5493376A (en) * 1977-12-30 1979-07-24 Fujitsu Ltd Semiconductor integrated circuit device
FR2426334A1 (fr) * 1978-05-19 1979-12-14 Fujitsu Ltd Dispositif de connexion de semi-conducteurs et son procede de fabrication
JPS5555541A (en) * 1978-10-20 1980-04-23 Hitachi Ltd Semiconductor element
GB2035688A (en) * 1978-11-13 1980-06-18 Hughes Aircraft Co A multi-function large scale integrated circuit
US4278897A (en) * 1978-12-28 1981-07-14 Fujitsu Limited Large scale semiconductor integrated circuit device
EP0020116B1 (en) * 1979-05-24 1984-03-14 Fujitsu Limited Masterslice semiconductor device and method of producing it
US4320438A (en) * 1980-05-15 1982-03-16 Cts Corporation Multi-layer ceramic package
JPS57153464A (en) * 1981-03-18 1982-09-22 Toshiba Corp Injection type semiconductor integrated logic circuit
US4413271A (en) * 1981-03-30 1983-11-01 Sprague Electric Company Integrated circuit including test portion and method for making
US4475119A (en) * 1981-04-14 1984-10-02 Fairchild Camera & Instrument Corporation Integrated circuit power transmission array
JPS5844743A (ja) * 1981-09-10 1983-03-15 Fujitsu Ltd 半導体集積回路
JPS5884445A (ja) * 1981-11-16 1983-05-20 Hitachi Ltd 大規模集積回路
AU87287S (en) 1982-01-14 1983-07-01 Fujitsu Ltd Integrated circuit
EP0087979B1 (en) * 1982-03-03 1989-09-06 Fujitsu Limited A semiconductor memory device
DE3382727D1 (de) * 1982-06-30 1994-01-27 Fujitsu Ltd Integrierte Halbleiterschaltungsanordnung.
US4511914A (en) * 1982-07-01 1985-04-16 Motorola, Inc. Power bus routing for providing noise isolation in gate arrays
US4549262A (en) * 1983-06-20 1985-10-22 Western Digital Corporation Chip topography for a MOS disk memory controller circuit
EP0130262B1 (fr) * 1983-06-30 1987-11-19 International Business Machines Corporation Circuits logiques permettant de constituer des réseaux logiques très denses
US4593205A (en) * 1983-07-01 1986-06-03 Motorola, Inc. Macrocell array having an on-chip clock generator
JPS6030152A (ja) * 1983-07-28 1985-02-15 Toshiba Corp 集積回路
US4583111A (en) * 1983-09-09 1986-04-15 Fairchild Semiconductor Corporation Integrated circuit chip wiring arrangement providing reduced circuit inductance and controlled voltage gradients
US4575744A (en) * 1983-09-16 1986-03-11 International Business Machines Corporation Interconnection of elements on integrated circuit substrate
US4737836A (en) * 1983-12-30 1988-04-12 International Business Machines Corporation VLSI integrated circuit having parallel bonding areas
JPS60152039A (ja) * 1984-01-20 1985-08-10 Toshiba Corp ＧａＡｓゲ−トアレイ集積回路
KR960009090B1 (ko) * 1984-03-22 1996-07-10 에스지에스 톰슨 마이크로일렉트로닉스, 인코 오포레이티드 표준 배열의 접촉 패드를 가진 집적회로
JPS61501533A (ja) * 1984-03-22 1986-07-24 モステック・コ−ポレイション 集積回路の付加部品
JPS6112042A (ja) * 1984-06-27 1986-01-20 Toshiba Corp マスタ−スライス型半導体装置
GB2168840A (en) * 1984-08-22 1986-06-25 Plessey Co Plc Customerisation of integrated logic devices
JPS61241964A (ja) * 1985-04-19 1986-10-28 Hitachi Ltd 半導体装置
US4789889A (en) * 1985-11-20 1988-12-06 Ge Solid State Patents, Inc. Integrated circuit device having slanted peripheral circuits
US4959751A (en) * 1988-08-16 1990-09-25 Delco Electronics Corporation Ceramic hybrid integrated circuit having surface mount device solder stress reduction
US5121298A (en) * 1988-08-16 1992-06-09 Delco Electronics Corporation Controlled adhesion conductor
JPH0727968B2 (ja) * 1988-12-20 1995-03-29 株式会社東芝 半導体集積回路装置
US5126822A (en) * 1989-02-14 1992-06-30 North American Philips Corporation Supply pin rearrangement for an I.C.
EP0382948B1 (en) * 1989-02-14 2003-10-08 Koninklijke Philips Electronics N.V. Supply pin rearrangement for an integrated circuit
NL8901822A (nl) * 1989-07-14 1991-02-01 Philips Nv Geintegreerde schakeling met stroomdetectie.
GB9007492D0 (en) * 1990-04-03 1990-05-30 Pilkington Micro Electronics Semiconductor integrated circuit
JPH04132252A (ja) * 1990-09-21 1992-05-06 Hitachi Ltd 半導体集積回路装置
US5446410A (en) * 1992-04-20 1995-08-29 Matsushita Electric Industrial Co.,Ltd. Semiconductor integrated circuit
JPH0824177B2 (ja) * 1992-11-13 1996-03-06 セイコーエプソン株式会社 半導体装置
US6675361B1 (en) * 1993-12-27 2004-01-06 Hyundai Electronics America Method of constructing an integrated circuit comprising an embedded macro
US5671397A (en) * 1993-12-27 1997-09-23 At&T Global Information Solutions Company Sea-of-cells array of transistors
US5440153A (en) * 1994-04-01 1995-08-08 United Technologies Corporation Array architecture with enhanced routing for linear asics
US5757041A (en) 1996-09-11 1998-05-26 Northrop Grumman Corporation Adaptable MMIC array
US6137181A (en) * 1999-09-24 2000-10-24 Nguyen; Dzung Method for locating active support circuitry on an integrated circuit fabrication die

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL121810C (https=) * 1955-11-04
US3312871A (en) * 1964-12-23 1967-04-04 Ibm Interconnection arrangement for integrated circuits
US3639814A (en) * 1967-05-24 1972-02-01 Telefunken Patent Integrated semiconductor circuit having increased barrier layer capacitance
US3643232A (en) * 1967-06-05 1972-02-15 Texas Instruments Inc Large-scale integration of electronic systems in microminiature form
US3365707A (en) * 1967-06-23 1968-01-23 Rca Corp Lsi array and standard cells
US3584269A (en) * 1968-10-11 1971-06-08 Ibm Diffused equal impedance interconnections for integrated circuits
JPS492796B1 (https=) * 1969-02-28 1974-01-22
JPS492798B1 (https=) * 1969-04-16 1974-01-22
US3656028A (en) * 1969-05-12 1972-04-11 Ibm Construction of monolithic chip and method of distributing power therein for individual electronic devices constructed thereon
DE2033130A1 (de) * 1969-07-04 1971-02-04 Hitachi Ltd , Tokio Verfahren zur Herstellung einer mte gnerten Großschaltung
DE2109803C3 (de) * 1970-03-12 1981-09-10 Honeywell Information Systems Italia S.p.A., Caluso, Torino Integrierter Elementarstromkreis mit Feldeffekt-Transistoren
US3621562A (en) * 1970-04-29 1971-11-23 Sylvania Electric Prod Method of manufacturing integrated circuit arrays
US3689803A (en) * 1971-03-30 1972-09-05 Ibm Integrated circuit structure having a unique surface metallization layout

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0001209A1 (de) * 1977-09-06 1979-04-04 International Business Machines Corporation Integrierte Halbleiterschaltung
US4259935A (en) * 1978-04-05 1981-04-07 Toyota Jidosha Kogyo Kabushiki Kaisha Fuel injection type throttle valve

Also Published As

Publication number Publication date
NL7309342A (https=) 1974-01-14
NO141623C (no) 1980-04-16
JPS5531624B2 (https=) 1980-08-19
SE409628B (sv) 1979-08-27
US3808475A (en) 1974-04-30
ATA594873A (de) 1982-11-15
CH600568A5 (https=) 1978-06-15
AT371628B (de) 1983-07-11
DK139208C (https=) 1979-07-16
AU467309B2 (en) 1975-11-27
FR2192383A1 (https=) 1974-02-08
DK139208B (da) 1979-01-08
GB1443361A (en) 1976-07-21
NO141623B (no) 1980-01-02
CA990414A (en) 1976-06-01
DE2334405A1 (de) 1974-01-31
CH599679A5 (https=) 1978-05-31
GB1443365A (en) 1976-07-21
DE2334405C3 (de) 1987-01-22
DE2334405B2 (de) 1980-08-14
JPS4939388A (https=) 1974-04-12
NO783892L (no) 1974-01-11
IT991086B (it) 1975-07-30
ES417198A1 (es) 1976-06-16
BE801909A (fr) 1973-11-05
AU5794673A (en) 1975-02-06
FR2192383B1 (https=) 1978-09-08
BR7305011D0 (pt) 1974-08-22

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee