JPS5531624B2 - - Google Patents
Info
- Publication number
- JPS5531624B2 JPS5531624B2 JP11464472A JP11464472A JPS5531624B2 JP S5531624 B2 JPS5531624 B2 JP S5531624B2 JP 11464472 A JP11464472 A JP 11464472A JP 11464472 A JP11464472 A JP 11464472A JP S5531624 B2 JPS5531624 B2 JP S5531624B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/118—Masterslice integrated circuits
- H01L27/11801—Masterslice integrated circuits using bipolar technology
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/02—Contacts, special
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/037—Diffusion-deposition
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/085—Isolated-integrated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/106—Masks, special
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US00270449A US3808475A (en) | 1972-07-10 | 1972-07-10 | Lsi chip construction and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4939388A JPS4939388A (ja) | 1974-04-12 |
| JPS5531624B2 true JPS5531624B2 (ja) | 1980-08-19 |
Family
ID=23031365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11464472A Expired JPS5531624B2 (ja) | 1972-07-10 | 1972-11-14 |
Country Status (17)
| Country | Link |
|---|---|
| US (1) | US3808475A (ja) |
| JP (1) | JPS5531624B2 (ja) |
| AT (1) | AT371628B (ja) |
| AU (1) | AU467309B2 (ja) |
| BE (1) | BE801909A (ja) |
| BR (1) | BR7305011D0 (ja) |
| CA (1) | CA990414A (ja) |
| CH (2) | CH599679A5 (ja) |
| DE (1) | DE2334405B2 (ja) |
| DK (1) | DK139208B (ja) |
| ES (1) | ES417198A1 (ja) |
| FR (1) | FR2192383B1 (ja) |
| GB (3) | GB1443361A (ja) |
| IT (1) | IT991086B (ja) |
| NL (1) | NL7309342A (ja) |
| NO (2) | NO141623C (ja) |
| SE (1) | SE409628B (ja) |
Families Citing this family (53)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3916434A (en) * | 1972-11-30 | 1975-10-28 | Power Hybrids Inc | Hermetically sealed encapsulation of semiconductor devices |
| CA1024661A (en) * | 1974-06-26 | 1978-01-17 | International Business Machines Corporation | Wireable planar integrated circuit chip structure |
| US3999214A (en) * | 1974-06-26 | 1976-12-21 | Ibm Corporation | Wireable planar integrated circuit chip structure |
| GB1584003A (en) * | 1976-06-07 | 1981-02-04 | Amdahl Corp | Data processing system and information scanout |
| JPS5519005Y2 (ja) * | 1976-11-24 | 1980-05-06 | ||
| US4969029A (en) * | 1977-11-01 | 1990-11-06 | Fujitsu Limited | Cellular integrated circuit and hierarchial method |
| CA1102009A (en) * | 1977-09-06 | 1981-05-26 | Algirdas J. Gruodis | Integrated circuit layout utilizing separated active circuit and wiring regions |
| JPS60953B2 (ja) * | 1977-12-30 | 1985-01-11 | 富士通株式会社 | 半導体集積回路装置 |
| JPS5493376A (en) * | 1977-12-30 | 1979-07-24 | Fujitsu Ltd | Semiconductor integrated circuit device |
| US4259935A (en) * | 1978-04-05 | 1981-04-07 | Toyota Jidosha Kogyo Kabushiki Kaisha | Fuel injection type throttle valve |
| FR2426334A1 (fr) * | 1978-05-19 | 1979-12-14 | Fujitsu Ltd | Dispositif de connexion de semi-conducteurs et son procede de fabrication |
| JPS5555541A (en) * | 1978-10-20 | 1980-04-23 | Hitachi Ltd | Semiconductor element |
| GB2035688A (en) * | 1978-11-13 | 1980-06-18 | Hughes Aircraft Co | A multi-function large scale integrated circuit |
| US4278897A (en) * | 1978-12-28 | 1981-07-14 | Fujitsu Limited | Large scale semiconductor integrated circuit device |
| EP0020116B1 (en) * | 1979-05-24 | 1984-03-14 | Fujitsu Limited | Masterslice semiconductor device and method of producing it |
| US4320438A (en) * | 1980-05-15 | 1982-03-16 | Cts Corporation | Multi-layer ceramic package |
| JPS57153464A (en) * | 1981-03-18 | 1982-09-22 | Toshiba Corp | Injection type semiconductor integrated logic circuit |
| US4413271A (en) * | 1981-03-30 | 1983-11-01 | Sprague Electric Company | Integrated circuit including test portion and method for making |
| US4475119A (en) * | 1981-04-14 | 1984-10-02 | Fairchild Camera & Instrument Corporation | Integrated circuit power transmission array |
| JPS5844743A (ja) * | 1981-09-10 | 1983-03-15 | Fujitsu Ltd | 半導体集積回路 |
| JPS5884445A (ja) * | 1981-11-16 | 1983-05-20 | Hitachi Ltd | 大規模集積回路 |
| EP0087979B1 (en) * | 1982-03-03 | 1989-09-06 | Fujitsu Limited | A semiconductor memory device |
| DE3382727D1 (de) * | 1982-06-30 | 1994-01-27 | Fujitsu Ltd | Integrierte Halbleiterschaltungsanordnung. |
| US4511914A (en) * | 1982-07-01 | 1985-04-16 | Motorola, Inc. | Power bus routing for providing noise isolation in gate arrays |
| US4549262A (en) * | 1983-06-20 | 1985-10-22 | Western Digital Corporation | Chip topography for a MOS disk memory controller circuit |
| DE3374638D1 (en) * | 1983-06-30 | 1987-12-23 | Ibm | Logic circuits for creating very dense logic networks |
| US4593205A (en) * | 1983-07-01 | 1986-06-03 | Motorola, Inc. | Macrocell array having an on-chip clock generator |
| JPS6030152A (ja) * | 1983-07-28 | 1985-02-15 | Toshiba Corp | 集積回路 |
| US4583111A (en) * | 1983-09-09 | 1986-04-15 | Fairchild Semiconductor Corporation | Integrated circuit chip wiring arrangement providing reduced circuit inductance and controlled voltage gradients |
| US4575744A (en) * | 1983-09-16 | 1986-03-11 | International Business Machines Corporation | Interconnection of elements on integrated circuit substrate |
| US4737836A (en) * | 1983-12-30 | 1988-04-12 | International Business Machines Corporation | VLSI integrated circuit having parallel bonding areas |
| JPS60152039A (ja) * | 1984-01-20 | 1985-08-10 | Toshiba Corp | ＧａＡｓゲ−トアレイ集積回路 |
| WO1985004518A1 (en) * | 1984-03-22 | 1985-10-10 | Mostek Corporation | Integrated circuits with contact pads in a standard array |
| JPS61501533A (ja) * | 1984-03-22 | 1986-07-24 | モステック・コ−ポレイション | 集積回路の付加部品 |
| JPS6112042A (ja) * | 1984-06-27 | 1986-01-20 | Toshiba Corp | マスタ−スライス型半導体装置 |
| GB2168840A (en) * | 1984-08-22 | 1986-06-25 | Plessey Co Plc | Customerisation of integrated logic devices |
| JPS61241964A (ja) * | 1985-04-19 | 1986-10-28 | Hitachi Ltd | 半導体装置 |
| US4789889A (en) * | 1985-11-20 | 1988-12-06 | Ge Solid State Patents, Inc. | Integrated circuit device having slanted peripheral circuits |
| US4959751A (en) * | 1988-08-16 | 1990-09-25 | Delco Electronics Corporation | Ceramic hybrid integrated circuit having surface mount device solder stress reduction |
| US5121298A (en) * | 1988-08-16 | 1992-06-09 | Delco Electronics Corporation | Controlled adhesion conductor |
| JPH0727968B2 (ja) * | 1988-12-20 | 1995-03-29 | 株式会社東芝 | 半導体集積回路装置 |
| ES2208631T3 (es) * | 1989-02-14 | 2004-06-16 | Koninklijke Philips Electronics N.V. | Disposicion de clavijas de alimentacion para un circuito integrado. |
| US5126822A (en) * | 1989-02-14 | 1992-06-30 | North American Philips Corporation | Supply pin rearrangement for an I.C. |
| NL8901822A (nl) * | 1989-07-14 | 1991-02-01 | Philips Nv | Geintegreerde schakeling met stroomdetectie. |
| GB9007492D0 (en) * | 1990-04-03 | 1990-05-30 | Pilkington Micro Electronics | Semiconductor integrated circuit |
| JPH04132252A (ja) * | 1990-09-21 | 1992-05-06 | Hitachi Ltd | 半導体集積回路装置 |
| US5446410A (en) * | 1992-04-20 | 1995-08-29 | Matsushita Electric Industrial Co.,Ltd. | Semiconductor integrated circuit |
| JPH0824177B2 (ja) * | 1992-11-13 | 1996-03-06 | セイコーエプソン株式会社 | 半導体装置 |
| US6675361B1 (en) * | 1993-12-27 | 2004-01-06 | Hyundai Electronics America | Method of constructing an integrated circuit comprising an embedded macro |
| US5671397A (en) * | 1993-12-27 | 1997-09-23 | At&T Global Information Solutions Company | Sea-of-cells array of transistors |
| US5440153A (en) * | 1994-04-01 | 1995-08-08 | United Technologies Corporation | Array architecture with enhanced routing for linear asics |
| US5757041A (en) | 1996-09-11 | 1998-05-26 | Northrop Grumman Corporation | Adaptable MMIC array |
| US6137181A (en) * | 1999-09-24 | 2000-10-24 | Nguyen; Dzung | Method for locating active support circuitry on an integrated circuit fabrication die |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL251064A (ja) * | 1955-11-04 | |||
| US3312871A (en) * | 1964-12-23 | 1967-04-04 | Ibm | Interconnection arrangement for integrated circuits |
| US3639814A (en) * | 1967-05-24 | 1972-02-01 | Telefunken Patent | Integrated semiconductor circuit having increased barrier layer capacitance |
| US3643232A (en) * | 1967-06-05 | 1972-02-15 | Texas Instruments Inc | Large-scale integration of electronic systems in microminiature form |
| US3365707A (en) * | 1967-06-23 | 1968-01-23 | Rca Corp | Lsi array and standard cells |
| US3584269A (en) * | 1968-10-11 | 1971-06-08 | Ibm | Diffused equal impedance interconnections for integrated circuits |
| JPS492796B1 (ja) * | 1969-02-28 | 1974-01-22 | ||
| JPS492798B1 (ja) * | 1969-04-16 | 1974-01-22 | ||
| US3656028A (en) * | 1969-05-12 | 1972-04-11 | Ibm | Construction of monolithic chip and method of distributing power therein for individual electronic devices constructed thereon |
| GB1277172A (en) * | 1969-07-04 | 1972-06-07 | Hitachi Ltd | Method of making a large integrated circuit |
| DE2109803C3 (de) * | 1970-03-12 | 1981-09-10 | Honeywell Information Systems Italia S.p.A., Caluso, Torino | Integrierter Elementarstromkreis mit Feldeffekt-Transistoren |
| US3621562A (en) * | 1970-04-29 | 1971-11-23 | Sylvania Electric Prod | Method of manufacturing integrated circuit arrays |
| US3689803A (en) * | 1971-03-30 | 1972-09-05 | Ibm | Integrated circuit structure having a unique surface metallization layout |
-
1972
- 1972-07-10 US US00270449A patent/US3808475A/en not_active Expired - Lifetime
- 1972-11-14 JP JP11464472A patent/JPS5531624B2/ja not_active Expired
-
1973
- 1973-06-15 CA CA174,134A patent/CA990414A/en not_active Expired
- 1973-06-25 GB GB2996673A patent/GB1443361A/en not_active Expired
- 1973-06-25 GB GB812076A patent/GB1443365A/en not_active Expired
- 1973-06-25 GB GB2040675A patent/GB1443363A/en not_active Expired
- 1973-07-04 BE BE133113A patent/BE801909A/xx not_active IP Right Cessation
- 1973-07-04 NL NL7309342A patent/NL7309342A/xx not_active Application Discontinuation
- 1973-07-05 AT AT0594873A patent/AT371628B/de not_active IP Right Cessation
- 1973-07-05 BR BR5011/73A patent/BR7305011D0/pt unknown
- 1973-07-06 DE DE2334405A patent/DE2334405B2/de active Granted
- 1973-07-06 CH CH666577A patent/CH599679A5/xx not_active IP Right Cessation
- 1973-07-06 CH CH988773A patent/CH600568A5/xx not_active IP Right Cessation
- 1973-07-09 NO NO2814/73A patent/NO141623C/no unknown
- 1973-07-09 SE SE7309608A patent/SE409628B/xx unknown
- 1973-07-09 DK DK380473AA patent/DK139208B/da not_active IP Right Cessation
- 1973-07-09 IT IT26385/73A patent/IT991086B/it active
- 1973-07-10 ES ES417198A patent/ES417198A1/es not_active Expired
- 1973-07-10 FR FR7325287A patent/FR2192383B1/fr not_active Expired
- 1973-07-10 AU AU57946/73A patent/AU467309B2/en not_active Expired
-
1978
- 1978-11-17 NO NO783892A patent/NO783892L/no unknown
Also Published As
| Publication number | Publication date |
|---|---|
| GB1443363A (en) | 1976-07-21 |
| CA990414A (en) | 1976-06-01 |
| DE2334405A1 (de) | 1974-01-31 |
| NO141623B (no) | 1980-01-02 |
| DE2334405B2 (de) | 1980-08-14 |
| NO783892L (no) | 1974-01-11 |
| AU467309B2 (en) | 1975-11-27 |
| DK139208B (da) | 1979-01-08 |
| JPS4939388A (ja) | 1974-04-12 |
| DE2334405C3 (ja) | 1987-01-22 |
| GB1443365A (en) | 1976-07-21 |
| NO141623C (no) | 1980-04-16 |
| ATA594873A (de) | 1982-11-15 |
| AU5794673A (en) | 1975-02-06 |
| AT371628B (de) | 1983-07-11 |
| NL7309342A (ja) | 1974-01-14 |
| ES417198A1 (es) | 1976-06-16 |
| FR2192383A1 (ja) | 1974-02-08 |
| FR2192383B1 (ja) | 1978-09-08 |
| CH599679A5 (ja) | 1978-05-31 |
| CH600568A5 (ja) | 1978-06-15 |
| BR7305011D0 (pt) | 1974-08-22 |
| US3808475A (en) | 1974-04-30 |
| BE801909A (fr) | 1973-11-05 |
| DK139208C (ja) | 1979-07-16 |
| GB1443361A (en) | 1976-07-21 |
| SE409628B (sv) | 1979-08-27 |
| IT991086B (it) | 1975-07-30 |