FR2220879B1 - - Google Patents

Info

Publication number
FR2220879B1
FR2220879B1 FR7407977A FR7407977A FR2220879B1 FR 2220879 B1 FR2220879 B1 FR 2220879B1 FR 7407977 A FR7407977 A FR 7407977A FR 7407977 A FR7407977 A FR 7407977A FR 2220879 B1 FR2220879 B1 FR 2220879B1
Authority
FR
France
Prior art keywords
layer
semiconductor chips
conductive layer
windows
thermoplastic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7407977A
Other languages
English (en)
French (fr)
Other versions
FR2220879A1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Publication of FR2220879A1 publication Critical patent/FR2220879A1/fr
Application granted granted Critical
Publication of FR2220879B1 publication Critical patent/FR2220879B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H10W40/258—
    • H10W40/10—
    • H10W70/093—
    • H10W70/60—
    • H10W70/614—
    • H10W70/6875—
    • H10W72/0711—
    • H10W70/099—
    • H10W70/682—
    • H10W72/073—
    • H10W72/07337—
    • H10W72/874—
    • H10W90/00—
    • H10W90/10—
    • H10W90/736—

Landscapes

  • Wire Bonding (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
FR7407977A 1973-03-10 1974-03-08 Expired FR2220879B1 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1973030099U JPS49131863U (enExample) 1973-03-10 1973-03-10

Publications (2)

Publication Number Publication Date
FR2220879A1 FR2220879A1 (enExample) 1974-10-04
FR2220879B1 true FR2220879B1 (enExample) 1978-01-06

Family

ID=12294316

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7407977A Expired FR2220879B1 (enExample) 1973-03-10 1974-03-08

Country Status (6)

Country Link
US (1) US3903590A (enExample)
JP (1) JPS49131863U (enExample)
CA (1) CA994004A (enExample)
DE (1) DE2411259C3 (enExample)
FR (1) FR2220879B1 (enExample)
GB (1) GB1426539A (enExample)

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DE102004025684B4 (de) 2004-04-29 2024-08-22 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum Ausbilden einer Kontaktstruktur zur elektrischen Kontaktierung eines optoelektronischen Halbleiterchips
JP4575071B2 (ja) * 2004-08-02 2010-11-04 新光電気工業株式会社 電子部品内蔵基板の製造方法
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JP5164362B2 (ja) 2005-11-02 2013-03-21 キヤノン株式会社 半導体内臓基板およびその製造方法
KR100656300B1 (ko) * 2005-12-29 2006-12-11 (주)웨이브닉스이에스피 3차원 알루미늄 패키지 모듈, 그의 제조방법 및 3차원알루미늄 패키지 모듈에 적용되는 수동소자 제작방법
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TWI453877B (zh) * 2008-11-07 2014-09-21 日月光半導體製造股份有限公司 內埋晶片封裝的結構及製程
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TWI411075B (zh) 2010-03-22 2013-10-01 日月光半導體製造股份有限公司 半導體封裝件及其製造方法
TWI442526B (zh) * 2010-09-17 2014-06-21 旭德科技股份有限公司 導熱基板及其製作方法
US8927339B2 (en) 2010-11-22 2015-01-06 Bridge Semiconductor Corporation Method of making thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitry
US9406658B2 (en) 2010-12-17 2016-08-02 Advanced Semiconductor Engineering, Inc. Embedded component device and manufacturing methods thereof
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WO2013035715A1 (ja) * 2011-09-07 2013-03-14 株式会社村田製作所 モジュールの製造方法およびモジュール
US9799627B2 (en) * 2012-01-19 2017-10-24 Semiconductor Components Industries, Llc Semiconductor package structure and method
US8912641B1 (en) 2013-09-09 2014-12-16 Harris Corporation Low profile electronic package and associated methods
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US3405442A (en) * 1964-02-13 1968-10-15 Gen Micro Electronics Inc Method of packaging microelectronic devices
US3614832A (en) * 1966-03-09 1971-10-26 Ibm Decal connectors and methods of forming decal connections to solid state devices
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US3691628A (en) * 1969-10-31 1972-09-19 Gen Electric Method of fabricating composite integrated circuits

Also Published As

Publication number Publication date
GB1426539A (en) 1976-03-03
DE2411259B2 (de) 1980-01-24
JPS49131863U (enExample) 1974-11-13
US3903590A (en) 1975-09-09
CA994004A (en) 1976-07-27
DE2411259A1 (de) 1974-09-19
DE2411259C3 (de) 1980-11-06
FR2220879A1 (enExample) 1974-10-04

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Legal Events

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