JPS52139761U - - Google Patents

Info

Publication number
JPS52139761U
JPS52139761U JP1976048339U JP4833976U JPS52139761U JP S52139761 U JPS52139761 U JP S52139761U JP 1976048339 U JP1976048339 U JP 1976048339U JP 4833976 U JP4833976 U JP 4833976U JP S52139761 U JPS52139761 U JP S52139761U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1976048339U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976048339U priority Critical patent/JPS52139761U/ja
Publication of JPS52139761U publication Critical patent/JPS52139761U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60Insulating or insulated package substrates; Interposers; Redistribution layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
JP1976048339U 1976-04-16 1976-04-16 Pending JPS52139761U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976048339U JPS52139761U (enExample) 1976-04-16 1976-04-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976048339U JPS52139761U (enExample) 1976-04-16 1976-04-16

Publications (1)

Publication Number Publication Date
JPS52139761U true JPS52139761U (enExample) 1977-10-22

Family

ID=28507549

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976048339U Pending JPS52139761U (enExample) 1976-04-16 1976-04-16

Country Status (1)

Country Link
JP (1) JPS52139761U (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49131863U (enExample) * 1973-03-10 1974-11-13

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49131863U (enExample) * 1973-03-10 1974-11-13

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