GB1315510A - Fabrication of electrical circuit devices - Google Patents

Fabrication of electrical circuit devices

Info

Publication number
GB1315510A
GB1315510A GB4739470A GB4739470A GB1315510A GB 1315510 A GB1315510 A GB 1315510A GB 4739470 A GB4739470 A GB 4739470A GB 4739470 A GB4739470 A GB 4739470A GB 1315510 A GB1315510 A GB 1315510A
Authority
GB
United Kingdom
Prior art keywords
conductive
substrate
conductive member
carrier
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4739470A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of GB1315510A publication Critical patent/GB1315510A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5381—Crossover interconnections, e.g. bridge stepovers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Combinations Of Printed Boards (AREA)
  • Multi-Conductor Connections (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

1315510 Welding by pressure WESTERN ELECTRIC CO Inc 6 Oct 1970 [8 Oct 1969] 47394/70 Heading B3R [Also in Division Hl] An assembly of a substrate carrying a plurality of conductive areas and a conductive member connected to one of the areas and overlying but insulated from another of the areas is made by forming the conductive member on a carrier, registering the carrier with the substrate and pressing the carrier against the substrate to bond ultrasonically or by thermo compression welding the conductive member to the conductive area the conductive member being deformed prior to or during the bonding. Cross-overs.-An aluminium plate 10 is coated with adhesive 12 and a gold layer which is photoetched to leave conductive members 16, 18. Members 16, 18 are punched to recess them into the aluminium which is then registered with the conductive tracks 22 on a substrate 20, Fig. 1D. The members 16, 18 are bonded to the tracks 22 by heat and pressure applied to the substrate 20 and/or plate 10. In a modification, Figs. 2A-2E (not shown), the aluminium plate is replaced by a steel plate apertured or recessed to receive the conductive member and also an integrated circuit. The adhesive layer is replaced by a polyimide film. The film may be copper coated, in which case the conductive member may be produced using a gold etch resist position using a negatively exposed photoresist. The conductive member may comprise several layers of conductor and polyimide to provide power planes, ground planes, &c. In another embodiment, Figs. 4A-4C (not shown) a solid material is applied over the conductive track to be crossed before the crossover is bonded in place. The solid material may then be etched away or if a dielectric left in place. Capacitors.-A thin film capacitor, Fig. 5C produced by forming a bottom electrode 66 and a conductive portion 64 on a substrate 62. The top electrode 72 is formed on a carrier, which after the dielectric 70 has been applied to top or bottom electrode is registered with the substrate and the top electrode is bonded to the conductive portion 64.
GB4739470A 1969-10-08 1970-10-06 Fabrication of electrical circuit devices Expired GB1315510A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86485669A 1969-10-08 1969-10-08

Publications (1)

Publication Number Publication Date
GB1315510A true GB1315510A (en) 1973-05-02

Family

ID=25344227

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4739470A Expired GB1315510A (en) 1969-10-08 1970-10-06 Fabrication of electrical circuit devices

Country Status (10)

Country Link
JP (1) JPS509342B1 (en)
BE (1) BE757162A (en)
CH (1) CH528148A (en)
DE (1) DE2049163C3 (en)
ES (1) ES384535A1 (en)
FR (1) FR2065090A5 (en)
GB (1) GB1315510A (en)
IE (1) IE34642B1 (en)
NL (1) NL145718B (en)
SE (1) SE365068B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0015100A1 (en) * 1979-02-26 1980-09-03 National Research Development Corporation Method of incorporating a distributed microwave circuit element in a microwave integrated circuit
GB2306782A (en) * 1995-10-25 1997-05-07 Rohm Co Ltd Thick film capacitor and chip component

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5377737U (en) * 1976-11-26 1978-06-28
DE2823881C3 (en) * 1978-05-31 1982-03-18 Siemens AG, 1000 Berlin und 8000 München Process for the production of electrical thin-film circuits for the production of integrated conductor track crossings
CN107086095B (en) * 2017-06-22 2023-05-16 中国船舶重工集团公司第七0三研究所 Resistance load kuppe

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0015100A1 (en) * 1979-02-26 1980-09-03 National Research Development Corporation Method of incorporating a distributed microwave circuit element in a microwave integrated circuit
GB2306782A (en) * 1995-10-25 1997-05-07 Rohm Co Ltd Thick film capacitor and chip component
US5699224A (en) * 1995-10-25 1997-12-16 Rohm Co., Ltd. Thick-film capacitor and chip-type composite electronic component utilizing the same
GB2306782B (en) * 1995-10-25 1998-05-27 Rohm Co Ltd Thick-film capacitor and chip-type composite electronic component utilizing the same

Also Published As

Publication number Publication date
IE34642B1 (en) 1975-07-09
JPS509342B1 (en) 1975-04-11
FR2065090A5 (en) 1971-07-23
DE2049163A1 (en) 1971-04-22
BE757162A (en) 1971-03-16
ES384535A1 (en) 1974-06-01
NL7014581A (en) 1971-04-14
IE34642L (en) 1971-04-08
CH528148A (en) 1972-09-15
SE365068B (en) 1974-03-11
DE2049163B2 (en) 1977-11-10
DE2049163C3 (en) 1978-07-06
NL145718B (en) 1975-04-15

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee